CN116746012A - 半导体激光器元件 - Google Patents
半导体激光器元件 Download PDFInfo
- Publication number
- CN116746012A CN116746012A CN202180091975.8A CN202180091975A CN116746012A CN 116746012 A CN116746012 A CN 116746012A CN 202180091975 A CN202180091975 A CN 202180091975A CN 116746012 A CN116746012 A CN 116746012A
- Authority
- CN
- China
- Prior art keywords
- layer
- semiconductor
- type
- semiconductor laser
- laser device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0287—Facet reflectivity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/16—Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface
- H01S5/162—Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface with window regions made by diffusion or disordening of the active layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/16—Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface
- H01S5/168—Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface with window regions comprising current blocking layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/17—Semiconductor lasers comprising special layers
- H01S2301/176—Specific passivation layers on surfaces other than the emission facet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/18—Semiconductor lasers with special structural design for influencing the near- or far-field
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/0014—Measuring characteristics or properties thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04252—Electrodes, e.g. characterised by the structure characterised by the material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04254—Electrodes, e.g. characterised by the structure characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3201—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures incorporating bulkstrain effects, e.g. strain compensation, strain related to polarisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34313—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163143463P | 2021-01-29 | 2021-01-29 | |
| US63/143,463 | 2021-01-29 | ||
| PCT/JP2021/047705 WO2022163237A1 (ja) | 2021-01-29 | 2021-12-22 | 半導体レーザ素子 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116746012A true CN116746012A (zh) | 2023-09-12 |
Family
ID=82654378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180091975.8A Pending CN116746012A (zh) | 2021-01-29 | 2021-12-22 | 半导体激光器元件 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230387662A1 (https=) |
| JP (1) | JP7720334B2 (https=) |
| CN (1) | CN116746012A (https=) |
| WO (1) | WO2022163237A1 (https=) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6414976B1 (en) * | 1998-07-15 | 2002-07-02 | Sony Corporation | Semiconductor light emitting device |
| JP2006269526A (ja) * | 2005-03-22 | 2006-10-05 | Fuji Photo Film Co Ltd | 半導体レーザ装置および光通信装置 |
| JP2010114202A (ja) * | 2008-11-05 | 2010-05-20 | Sony Corp | 半導体レーザ素子 |
| CN102097746A (zh) * | 2009-12-11 | 2011-06-15 | 松下电器产业株式会社 | 半导体激光装置及其制造方法 |
| JP2011159673A (ja) * | 2010-01-29 | 2011-08-18 | Jvc Kenwood Holdings Inc | 半導体レーザ素子及び半導体レーザアレイ |
| JP2017139319A (ja) * | 2016-02-03 | 2017-08-10 | 浜松ホトニクス株式会社 | 半導体レーザ素子 |
| JP2018152430A (ja) * | 2017-03-10 | 2018-09-27 | 住友電気工業株式会社 | 半導体レーザ |
| CN115362609A (zh) * | 2020-04-06 | 2022-11-18 | 新唐科技日本株式会社 | 半导体激光装置以及半导体激光装置的制造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2222307B (en) * | 1988-07-22 | 1992-04-01 | Mitsubishi Electric Corp | Semiconductor laser |
| JPH06302906A (ja) * | 1993-04-12 | 1994-10-28 | Mitsubishi Electric Corp | 半導体レーザ及びその製造方法 |
| JPH1168231A (ja) * | 1997-08-25 | 1999-03-09 | Mitsubishi Electric Corp | 半導体レーザ,及びその製造方法 |
| EP1583187B1 (en) * | 2000-10-12 | 2007-07-04 | FUJIFILM Corporation | Semiconductor laser device with a current non-injection region near a resonator end face |
| JP4504610B2 (ja) * | 2002-03-01 | 2010-07-14 | 株式会社日立製作所 | リッジ型半導体レーザ素子 |
| KR20060122615A (ko) * | 2005-05-27 | 2006-11-30 | 삼성전자주식회사 | 질화물계 반도체 레이저 다이오드 및 그 제조방법 |
| JP2010074131A (ja) * | 2008-08-21 | 2010-04-02 | Panasonic Corp | 半導体発光素子及びその製造方法 |
| JP2010123674A (ja) * | 2008-11-18 | 2010-06-03 | Panasonic Corp | 半導体レーザ装置 |
| JP2010278131A (ja) * | 2009-05-27 | 2010-12-09 | Panasonic Corp | 半導体レーザ素子及びその製造方法 |
| JP6943570B2 (ja) * | 2015-02-12 | 2021-10-06 | 古河電気工業株式会社 | 半導体レーザ素子およびレーザ光照射装置 |
| JP6801416B2 (ja) * | 2016-12-08 | 2020-12-16 | 住友電気工業株式会社 | 量子カスケード半導体レーザ |
-
2021
- 2021-12-22 CN CN202180091975.8A patent/CN116746012A/zh active Pending
- 2021-12-22 JP JP2022578164A patent/JP7720334B2/ja active Active
- 2021-12-22 WO PCT/JP2021/047705 patent/WO2022163237A1/ja not_active Ceased
-
2023
- 2023-07-25 US US18/358,610 patent/US20230387662A1/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6414976B1 (en) * | 1998-07-15 | 2002-07-02 | Sony Corporation | Semiconductor light emitting device |
| JP2006269526A (ja) * | 2005-03-22 | 2006-10-05 | Fuji Photo Film Co Ltd | 半導体レーザ装置および光通信装置 |
| JP2010114202A (ja) * | 2008-11-05 | 2010-05-20 | Sony Corp | 半導体レーザ素子 |
| CN102097746A (zh) * | 2009-12-11 | 2011-06-15 | 松下电器产业株式会社 | 半导体激光装置及其制造方法 |
| JP2011159673A (ja) * | 2010-01-29 | 2011-08-18 | Jvc Kenwood Holdings Inc | 半導体レーザ素子及び半導体レーザアレイ |
| JP2017139319A (ja) * | 2016-02-03 | 2017-08-10 | 浜松ホトニクス株式会社 | 半導体レーザ素子 |
| JP2018152430A (ja) * | 2017-03-10 | 2018-09-27 | 住友電気工業株式会社 | 半導体レーザ |
| CN115362609A (zh) * | 2020-04-06 | 2022-11-18 | 新唐科技日本株式会社 | 半导体激光装置以及半导体激光装置的制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022163237A1 (ja) | 2022-08-04 |
| JPWO2022163237A1 (https=) | 2022-08-04 |
| JP7720334B2 (ja) | 2025-08-07 |
| US20230387662A1 (en) | 2023-11-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |