CN116715528B - 高韧性陶瓷研磨介质的制备方法 - Google Patents
高韧性陶瓷研磨介质的制备方法 Download PDFInfo
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- CN116715528B CN116715528B CN202310543305.6A CN202310543305A CN116715528B CN 116715528 B CN116715528 B CN 116715528B CN 202310543305 A CN202310543305 A CN 202310543305A CN 116715528 B CN116715528 B CN 116715528B
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- 238000000227 grinding Methods 0.000 title claims abstract description 88
- 239000000919 ceramic Substances 0.000 title claims abstract description 43
- 238000002360 preparation method Methods 0.000 title claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 103
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 38
- 238000005245 sintering Methods 0.000 claims abstract description 37
- 238000005260 corrosion Methods 0.000 claims abstract description 32
- 238000001035 drying Methods 0.000 claims abstract description 31
- 239000011248 coating agent Substances 0.000 claims abstract description 30
- 238000000576 coating method Methods 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 25
- 239000011812 mixed powder Substances 0.000 claims abstract description 25
- 238000007747 plating Methods 0.000 claims abstract description 25
- 239000000126 substance Substances 0.000 claims abstract description 25
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 17
- 239000000956 alloy Substances 0.000 claims abstract description 17
- 239000002048 multi walled nanotube Substances 0.000 claims abstract description 17
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910001096 P alloy Inorganic materials 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims description 53
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 33
- 230000007797 corrosion Effects 0.000 claims description 31
- 238000002156 mixing Methods 0.000 claims description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 28
- 238000007772 electroless plating Methods 0.000 claims description 23
- 238000004140 cleaning Methods 0.000 claims description 21
- 230000001050 lubricating effect Effects 0.000 claims description 21
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 20
- 239000002296 pyrolytic carbon Substances 0.000 claims description 19
- 206010070834 Sensitisation Diseases 0.000 claims description 17
- 239000012535 impurity Substances 0.000 claims description 17
- 230000008313 sensitization Effects 0.000 claims description 17
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 16
- 239000012043 crude product Substances 0.000 claims description 16
- 229920005668 polycarbonate resin Polymers 0.000 claims description 16
- 239000004431 polycarbonate resin Substances 0.000 claims description 16
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 15
- 238000001694 spray drying Methods 0.000 claims description 15
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 14
- 230000004913 activation Effects 0.000 claims description 14
- 238000000498 ball milling Methods 0.000 claims description 14
- 229910052580 B4C Inorganic materials 0.000 claims description 11
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 11
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 11
- 238000003756 stirring Methods 0.000 claims description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 10
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 10
- 239000010439 graphite Substances 0.000 claims description 10
- 229910002804 graphite Inorganic materials 0.000 claims description 10
- 230000008595 infiltration Effects 0.000 claims description 10
- 238000001764 infiltration Methods 0.000 claims description 10
- DUNKXUFBGCUVQW-UHFFFAOYSA-J zirconium tetrachloride Chemical compound Cl[Zr](Cl)(Cl)Cl DUNKXUFBGCUVQW-UHFFFAOYSA-J 0.000 claims description 10
- 239000012153 distilled water Substances 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 8
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 8
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 8
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 7
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 7
- 239000001095 magnesium carbonate Substances 0.000 claims description 7
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims description 7
- 238000005406 washing Methods 0.000 claims description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 6
- 229910021641 deionized water Inorganic materials 0.000 claims description 6
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 5
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 claims description 5
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 239000006185 dispersion Substances 0.000 claims description 5
- 239000012065 filter cake Substances 0.000 claims description 5
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 5
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 5
- 238000004321 preservation Methods 0.000 claims description 5
- 239000001509 sodium citrate Substances 0.000 claims description 5
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 5
- SIGUVTURIMRFDD-UHFFFAOYSA-M sodium dioxidophosphanium Chemical compound [Na+].[O-][PH2]=O SIGUVTURIMRFDD-UHFFFAOYSA-M 0.000 claims description 5
- GCLGEJMYGQKIIW-UHFFFAOYSA-H sodium hexametaphosphate Chemical compound [Na]OP1(=O)OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])O1 GCLGEJMYGQKIIW-UHFFFAOYSA-H 0.000 claims description 5
- 235000019982 sodium hexametaphosphate Nutrition 0.000 claims description 5
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 5
- 239000011684 sodium molybdate Substances 0.000 claims description 5
- 235000015393 sodium molybdate Nutrition 0.000 claims description 5
- TVXXNOYZHKPKGW-UHFFFAOYSA-N sodium molybdate (anhydrous) Chemical compound [Na+].[Na+].[O-][Mo]([O-])(=O)=O TVXXNOYZHKPKGW-UHFFFAOYSA-N 0.000 claims description 5
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 claims description 5
- 238000009210 therapy by ultrasound Methods 0.000 claims description 5
- 238000007158 vacuum pyrolysis Methods 0.000 claims description 5
- 239000011230 binding agent Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 235000019353 potassium silicate Nutrition 0.000 claims description 4
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 4
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 claims description 3
- MTEZSDOQASFMDI-UHFFFAOYSA-N 1-trimethoxysilylpropan-1-ol Chemical compound CCC(O)[Si](OC)(OC)OC MTEZSDOQASFMDI-UHFFFAOYSA-N 0.000 claims description 3
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims description 3
- 238000007605 air drying Methods 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 3
- -1 palladium ions Chemical class 0.000 claims description 3
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 3
- 239000001119 stannous chloride Substances 0.000 claims description 3
- 235000011150 stannous chloride Nutrition 0.000 claims description 3
- 238000000967 suction filtration Methods 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 abstract description 4
- 238000005253 cladding Methods 0.000 abstract description 3
- 239000013078 crystal Substances 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 238000000197 pyrolysis Methods 0.000 description 4
- 238000002679 ablation Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- 238000009501 film coating Methods 0.000 description 2
- 239000007888 film coating Substances 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000003828 vacuum filtration Methods 0.000 description 2
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- DNXNYEBMOSARMM-UHFFFAOYSA-N alumane;zirconium Chemical compound [AlH3].[Zr] DNXNYEBMOSARMM-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003837 high-temperature calcination Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 238000010606 normalization Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- C04B35/5805—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on borides
- C04B35/58064—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on borides based on refractory borides
- C04B35/58078—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on borides based on refractory borides based on zirconium or hafnium borides
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Abstract
本发明公开了一种高韧性陶瓷研磨介质的制备方法,涉及陶瓷研磨材料技术领域。本发明通过高长径比的棒状硼化锆混合粉末复配化学性能稳定、导热系数高、热膨胀系数小、耐磨性能好的碳化硅,经过主料预处理、化学镀覆、粘结干燥、高温烧结、涂覆膜层的步骤,得到具备光滑耐腐蚀膜层的高韧性抗屏蔽陶瓷研磨介质;棒状硼化锆由于高表面能在高温烧结过程中会提高致密性以增加韧性,Ni‑Mo‑P合金在预处理主料外围形成均匀致密的包覆镀层,含Ni合金晶体取向性和高强韧性进一步提高了陶瓷研磨介质的韧性;成分中加入的多壁碳纳米管,比表面积高易且分散,具有良好的导电、抗静电性,显著提高陶瓷研磨介质对抗外界电磁干扰的能力。
Description
技术领域
本发明属于陶瓷研磨材料技术领域,具体涉及高韧性陶瓷研磨介质的制备方法。
背景技术
陶瓷研磨介质主要有氧化铝陶瓷球、氧化锆陶瓷球、碳化硅陶瓷球和氮化硅陶瓷球。氧化铝陶瓷研磨介质采用氧化铝粉末经过等静压成型、高温煅烧而成,硬度可以达到莫氏9级,但是质地较脆,不适合高能量密度的研磨,通常情况下只适合用在球磨机当中或者速度较慢的立式搅拌磨。氧化锆陶瓷研磨介质是由氧化锆粉末经过滴制成型或者压制成型,硬度和氧化铝相近,但是韧性要远远高于氧化铝,适合高能量密度的研磨机械类似于立式或者卧室砂磨机。
授权公告号CN107226686B的发明专利公开了一种矿物深加工用高强度原位增韧氧化铝研磨球及其制作方法,以氧化铝为主原料,以硅酸锆、氧化锆、氧化钇、碳酸钙、碳酸镁、碳酸钾、碳酸钠为烧结助剂,按合适的配比,经球磨后喷雾干燥,获得原料粉;经滚球机成形为微球后,烧结获得高强度高韧性的氧化铝研磨球。利用硅酸锆原位分解产生的氧化锆对氧化铝进行增韧,同时通过纳米氧化铝粉体的引入,完全清除分解所产生的二氧化硅,从而达到提高材料韧性,大幅度提高研磨介质的抗压强度的目的。但是研究发现,没有通过镀覆和膜层的多重方式来对研磨介质的成分、结构进行改进,以提高研磨介质的韧性、抗静电性和耐磨性能。
发明内容
本发明的目的在于提供一种高韧性陶瓷研磨介质的制备方法,用于解决现有技术中没有通过镀覆和膜层的多重方式来对研磨介质的成分、结构进行改进,以提高研磨介质的韧性、抗静电性和耐磨性能的技术问题。
为了实现上述目的,本发明采用了如下技术方案:
一种高韧性陶瓷研磨介质的制备方法,包括以下步骤:
主料预处理:将棒状硼化锆混合粉末和碳化硅粉末按照质量比6~8:1混合均匀得到预混主料,依次经过清洗除杂、敏化处理、活化处理得到预处理主料;
化学镀覆:采用化学镀覆的方法,在预处理主料的外围包覆Ni-Mo-P合金,得到合金包覆主料;
粘结干燥:将合金包覆主料与多壁碳纳米管、粘结剂、烧结助剂按照质量比85~96:3~5:0.2~0.5:1~3混合均匀,经球磨、喷雾干燥得到研磨粉;喷雾干燥时的入口温度为140~150℃,出口温度为80~90℃;
高温烧结:将研磨粉在1450~1500℃下烧结10~20小时,得到研磨介质粗品;
涂覆膜层:在研磨介质粗品的外围涂覆润滑耐腐蚀膜料,50~60℃干燥24小时后形成具备光滑耐腐蚀膜层的高韧性抗屏蔽陶瓷研磨介质。
作为本发明进一步改进的方案,所述棒状硼化锆混合粉末的制备过程包括以下步骤:
步骤一,将聚碳酸酯树脂在90~100℃下干燥至恒重,再放置于化学气相渗透炉内,1700~1800℃下真空热解,粉碎,400~600rpm转速球磨20min得到热解碳粉;
步骤二,将氯化锆粉体放置于坩埚内,以5~8℃/min的速率升温至900~1000℃,保温加热10min,趁热倒入20vt%的氨水溶液中,置于20℃的恒温水浴锅内,搅拌30min后减压抽滤,滤饼使用蒸馏水清洗,60℃干燥得到棒状氧化锆粉末;
步骤三,将棒状氧化锆粉末与碳化硼、三氧化二硼、硼酸铝粉以及热解碳粉按照质量比7~9:1:2:3:10~12混合均匀,放入石墨坩埚中,置于化学气相渗透炉内,以10℃/min速率升温至1700~1800℃,真空保温反应1~2小时,得到棒状硼化锆混合粉末。
作为本发明进一步改进的方案,所述润滑耐腐蚀膜料的制备方法如下:将四乙氧基硅烷和γ-缩水甘油醚氧丙基三甲氧基硅烷按照摩尔比5~8:1混合均匀后,超声处理20min形成分散液,加入乙醇、水,滴加1mol/L的盐酸溶液,调节pH至4,加入聚碳酸酯树脂热解、粉碎得到的热解碳粉,搅拌均匀,真空脱泡,得到溶胶状的润滑耐腐蚀膜料。
作为本发明进一步改进的方案,所述四乙氧基硅烷与乙醇、水的用量比为1g:2.2~2.5g:1.8~2.1g,热解碳粉的用量为四乙氧基硅烷重量的0.6~0.8倍。
作为本发明进一步改进的方案,化学镀覆的具体过程如下:按照质量浓度,将含有20~30g/L硫酸镍、15~20g/L钼酸钠、20~30g/L次膦酸钠、70~90g/L柠檬酸钠的化学镀液,在pH为10~11、温度为40~50℃的条件下,以每80~100g预处理主料搭配180~220mL化学镀液的方式进行镀覆,每隔20~30min更换一次镀液,镀覆持续5~6小时。
作为本发明进一步改进的方案,清洗除杂、敏化处理、活化处理的具体处理过程为:
步骤一,将预混主料依次通过丙酮清洗、乙醇清洗、去离子水清洗,90~110℃干燥至恒重,得到除杂主料;
步骤二,将除杂主料浸渍在浓度15g/L的氯化亚锡溶液中进行敏化处理,再使用去离子水清洗得到敏化主料;
步骤三,将敏化主料浸渍在浓度10wt%的氯化钯溶液中还原钯离子,蒸馏水清洗,风干得到预处理主料。
作为本发明进一步改进的方案,所述多壁碳纳米管的平均直径为9.5nm,平均长度为1.5μm,比表面积为260~280m2/g;粘结剂为六偏磷酸钠、水玻璃中的一种或两种;烧结助剂为碳化硼、碳酸钙、碳酸钾、碳酸镁中的一种或多种的混合物。
综上所述,由于采用了上述技术方案,本发明的有益效果是:
1、本发明的陶瓷研磨介质,考虑到硼化锆具有良好的耐高温性、强度、耐热震性和抗氧化性,但是由于存在强共价键和扩散系数低的原因使得难以烧结致密,通过高长径比的棒状硼化锆混合粉末复配化学性能稳定、导热系数高、热膨胀系数小、耐磨性能好的碳化硅,经过主料预处理、化学镀覆、粘结干燥、高温烧结、涂覆膜层的步骤,得到具备光滑耐腐蚀膜层的高韧性抗屏蔽陶瓷研磨介质;棒状硼化锆由于高表面能在高温烧结过程中会提高致密性以增加韧性,Ni-Mo-P合金在预处理主料外围形成均匀致密的包覆镀层,含Ni合金晶体取向性和高强韧性进一步提高了陶瓷研磨介质的韧性;成分中加入的多壁碳纳米管,比表面积高易且分散,具有良好的导电、抗静电性,显著提高陶瓷研磨介质对抗外界电磁干扰的能力。
2、本发明的棒状硼化锆混合粉末,通过将聚碳酸酯树脂热解、粉碎、球磨得到的致密碳粉,与氯化锆水淬生成的棒状氧化锆粉体,以及多种硼化物在真空高温条件下,发生氧化还原反应,生成棒状的硼化锆和氧化铝,并释放一氧化碳和水蒸气;生成的棒状硼化锆混合粉末促进硼化锆的烧结致密化,作为增韧相提高了研磨介质的抗氧化烧蚀性能,复配的碳化硅在高温下氧化生成二氧化硅玻璃相,能够与氧化硼生成硼硅玻璃层包覆在表面,进一步提高了抗氧化烧蚀性能。
3、本发明通过在研磨介质粗品的外围涂覆润滑耐腐蚀膜料形成光滑耐腐蚀膜层,润滑耐腐蚀膜料通过将四乙氧基硅烷水解产生硅羟基,和γ-缩水甘油醚氧丙基三甲氧基硅烷进行缩聚交联形成大分子网络结构,调节pH后生成透明且黏度较高的凝胶;热解碳粉具有良好的片层结构,在大分子网络结构内均匀分散,牢固的交联作用使得膜层光滑致密,与研磨介质粗品稳定结合,提高了研磨介质产品的耐磨、耐腐蚀性能。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图做简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1示出了实施例1制备的合金包覆主料的扫描电子显微镜图;
图2示出了实施例1制备的陶瓷研磨介质的断裂面扫描电子显微镜图。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。
实施例1
本实施例的一种高韧性陶瓷研磨介质的制备方法,包括以下步骤:
主料预处理:将65g棒状硼化锆混合粉末和10g碳化硅粉末混合均匀得到预混主料,依次经过清洗除杂、敏化处理、活化处理得到预处理主料;
化学镀覆:采用化学镀覆的方法,在预处理主料的外围包覆Ni-Mo-P合金,得到合金包覆主料;参阅图1所示,化学镀覆后的粉体表面较光滑,粉体包覆量高,表面胞状结构的尺寸增大;
粘结干燥:将89g合金包覆主料与3.8g多壁碳纳米管、0.3g六偏磷酸钠、1.8g烧结助剂混合均匀,经球磨、喷雾干燥得到研磨粉;喷雾干燥时的入口温度为145℃,出口温度为87℃;多壁碳纳米管的平均直径为9.5nm,平均长度为1.5μm,比表面积为260~280m2/g;烧结助剂由碳化硼、碳酸钙、碳酸钾按照质量比2:1:1混合而成;
高温烧结:将研磨粉在1480℃下烧结18小时,得到研磨介质粗品;
涂覆膜层:在研磨介质粗品的外围涂覆润滑耐腐蚀膜料,56℃干燥24小时后形成具备光滑耐腐蚀膜层的高韧性抗屏蔽陶瓷研磨介质。参阅图2所示,本实施例制备的陶瓷研磨介质成分之间排列紧密,具有致密度高的连续相。
具体地,棒状硼化锆混合粉末的制备过程包括以下步骤:
步骤一,将聚碳酸酯树脂在96℃下干燥至恒重,再放置于化学气相渗透炉内,1730℃下真空热解,粉碎,560rpm转速球磨20min得到热解碳粉;
步骤二,将氯化锆粉体放置于坩埚内,以6.5℃/min的速率升温至950℃,保温加热10min,趁热倒入20vt%的氨水溶液中,置于20℃的恒温水浴锅内,搅拌30min后减压抽滤,滤饼使用蒸馏水清洗,60℃干燥得到棒状氧化锆粉末;
步骤三,将80g棒状氧化锆粉末与10g碳化硼、20g三氧化二硼、30g硼酸铝粉以及110g热解碳粉混合均匀,放入石墨坩埚中,置于化学气相渗透炉内,以10℃/min速率升温至1760℃,真空保温反应1.8小时,得到棒状硼化锆混合粉末。
润滑耐腐蚀膜料的制备方法如下:将12.5g四乙氧基硅烷和2.4g γ-缩水甘油醚氧丙基三甲氧基硅烷混合均匀后,超声处理20min形成分散液,加入30g乙醇、25g水,滴加1mol/L的盐酸溶液,调节pH至4,加入8.8g聚碳酸酯树脂热解、粉碎得到的热解碳粉,搅拌均匀,真空脱泡,得到溶胶状的润滑耐腐蚀膜料。热解碳粉的制备方法与棒状硼化锆混合粉末的制备过程的步骤一相同。
化学镀覆的具体过程如下:按照质量浓度,将含有27g/L硫酸镍、20g/L钼酸钠、28g/L次膦酸钠、88g/L柠檬酸钠的化学镀液,在pH为10.5、温度为47℃的条件下,以每100g预处理主料搭配185mL化学镀液的方式进行镀覆,每隔26min更换一次镀液,镀覆持续6小时。
清洗除杂、敏化处理、活化处理的具体处理过程为:
步骤一,将预混主料依次通过丙酮清洗、乙醇清洗、去离子水清洗,95℃干燥至恒重,得到除杂主料;
步骤二,将除杂主料浸渍在浓度15g/L的氯化亚锡溶液中进行敏化处理,再使用去离子水清洗得到敏化主料;
步骤三,将敏化主料浸渍在浓度10wt%的氯化钯溶液中还原钯离子,蒸馏水清洗,风干得到预处理主料。
实施例2
本实施例的一种高韧性陶瓷研磨介质的制备方法,包括以下步骤:
主料预处理:将73g棒状硼化锆混合粉末和10g碳化硅粉末混合均匀得到预混主料,依次经过清洗除杂、敏化处理、活化处理得到预处理主料;清洗除杂、敏化处理、活化处理的具体处理过程与实施例1相同;
化学镀覆:采用化学镀覆的方法,在预处理主料的外围包覆Ni-Mo-P合金,得到合金包覆主料;
粘结干燥:将92g合金包覆主料与4.2g多壁碳纳米管、0.2g水玻璃、1.8g烧结助剂混合均匀,经球磨、喷雾干燥得到研磨粉;喷雾干燥时的入口温度为150℃,出口温度为90℃;多壁碳纳米管的平均直径为9.5nm,平均长度为1.5μm,比表面积为260~280m2/g;烧结助剂由碳化硼、碳酸钙、碳酸钾、碳酸镁按照质量比1:1:1:1混合而成;
高温烧结:将研磨粉在1460℃下烧结18小时,得到研磨介质粗品;
涂覆膜层:在研磨介质粗品的外围涂覆润滑耐腐蚀膜料,53℃干燥24小时后形成具备光滑耐腐蚀膜层的高韧性抗屏蔽陶瓷研磨介质。
具体地,棒状硼化锆混合粉末的制备过程包括以下步骤:
步骤一,将聚碳酸酯树脂在98℃下干燥至恒重,再放置于化学气相渗透炉内,1800℃下真空热解,粉碎,600rpm转速球磨20min得到热解碳粉;
步骤二,将氯化锆粉体放置于坩埚内,以7℃/min的速率升温至990℃,保温加热10min,趁热倒入20vt%的氨水溶液中,置于20℃的恒温水浴锅内,搅拌30min后减压抽滤,滤饼使用蒸馏水清洗,60℃干燥得到棒状氧化锆粉末;
步骤三,将88g棒状氧化锆粉末与10g碳化硼、20g三氧化二硼、30g硼酸铝粉以及117g热解碳粉混合均匀,放入石墨坩埚中,置于化学气相渗透炉内,以10℃/min速率升温至1800℃,真空保温反应2小时,得到棒状硼化锆混合粉末。
润滑耐腐蚀膜料的制备方法如下:将15.6g四乙氧基硅烷和2.4g γ-缩水甘油醚氧丙基三甲氧基硅烷混合均匀后,超声处理20min形成分散液,加入39g乙醇、32.8g水,滴加1mol/L的盐酸溶液,调节pH至4,加入12.5g聚碳酸酯树脂热解、粉碎得到的热解碳粉,搅拌均匀,真空脱泡,得到溶胶状的润滑耐腐蚀膜料。热解碳粉的制备方法与棒状硼化锆混合粉末的制备过程的步骤一相同。
化学镀覆的具体过程如下:按照质量浓度,将含有29g/L硫酸镍、19g/L钼酸钠、26g/L次膦酸钠、76g/L柠檬酸钠的化学镀液,在pH为10、温度为46℃的条件下,以每96g预处理主料搭配210mL化学镀液的方式进行镀覆,每隔27min更换一次镀液,镀覆持续5.5小时。
实施例3
本实施例的一种高韧性陶瓷研磨介质的制备方法,包括以下步骤:
主料预处理:将70g棒状硼化锆混合粉末和10g碳化硅粉末混合均匀得到预混主料,依次经过清洗除杂、敏化处理、活化处理得到预处理主料;清洗除杂、敏化处理、活化处理的具体处理过程与实施例1相同;
化学镀覆:采用化学镀覆的方法,在预处理主料的外围包覆Ni-Mo-P合金,得到合金包覆主料;
粘结干燥:将95g合金包覆主料与4.6g多壁碳纳米管、0.5g六偏磷酸钠、2.8g烧结助剂混合均匀,经球磨、喷雾干燥得到研磨粉;喷雾干燥时的入口温度为150℃,出口温度为87℃;多壁碳纳米管的平均直径为9.5nm,平均长度为1.5μm,比表面积为260~280m2/g;烧结助剂由碳化硼、碳酸钾、碳酸镁按照质量比2:1:1混合而成。
高温烧结:将研磨粉在1500℃下烧结13小时,得到研磨介质粗品;
涂覆膜层:在研磨介质粗品的外围涂覆润滑耐腐蚀膜料,60℃干燥24小时后形成具备光滑耐腐蚀膜层的高韧性抗屏蔽陶瓷研磨介质。
具体地,棒状硼化锆混合粉末的制备过程包括以下步骤:
步骤一,将聚碳酸酯树脂在92℃下干燥至恒重,再放置于化学气相渗透炉内,1710℃下真空热解,粉碎,450rpm转速球磨20min得到热解碳粉;
步骤二,将氯化锆粉体放置于坩埚内,以8℃/min的速率升温至920℃,保温加热10min,趁热倒入20vt%的氨水溶液中,置于20℃的恒温水浴锅内,搅拌30min后减压抽滤,滤饼使用蒸馏水清洗,60℃干燥得到棒状氧化锆粉末;
步骤三,将76g棒状氧化锆粉末与10g碳化硼、20g三氧化二硼、30g硼酸铝粉以及105g热解碳粉混合均匀,放入石墨坩埚中,置于化学气相渗透炉内,以10℃/min速率升温至1730℃,真空保温反应2小时,得到棒状硼化锆混合粉末。
润滑耐腐蚀膜料的制备方法如下:将11.5g四乙氧基硅烷和2.4g γ-缩水甘油醚氧丙基三甲氧基硅烷混合均匀后,超声处理20min形成分散液,加入26.5g乙醇、21.9g水,滴加1mol/L的盐酸溶液,调节pH至4,加入7.1g聚碳酸酯树脂热解、粉碎得到的热解碳粉,搅拌均匀,真空脱泡,得到溶胶状的润滑耐腐蚀膜料。热解碳粉的制备方法与棒状硼化锆混合粉末的制备过程的步骤一相同。
化学镀覆的具体过程如下:按照质量浓度,将含有26g/L硫酸镍、18g/L钼酸钠、25g/L次膦酸钠、80g/L柠檬酸钠的化学镀液,在pH为11、温度为46℃的条件下,以每90g预处理主料搭配200mL化学镀液的方式进行镀覆,每隔26min更换一次镀液,镀覆持续5.5小时。
实施例4
本实施例的一种高韧性陶瓷研磨介质的制备方法,包括以下步骤:
主料预处理:将棒状硼化锆混合粉末和碳化硅粉末按照质量比6~8:1混合均匀得到预混主料,依次经过清洗除杂、敏化处理、活化处理得到预处理主料;清洗除杂、敏化处理、活化处理的具体处理过程与实施例1相同;
化学镀覆:采用化学镀覆的方法,在预处理主料的外围包覆Ni-Mo-P合金,得到合金包覆主料;
粘结干燥:将87g合金包覆主料与4.8g多壁碳纳米管、0.5g六偏磷酸钠、2.6g烧结助剂混合均匀,经球磨、喷雾干燥得到研磨粉;喷雾干燥时的入口温度为148℃,出口温度为83℃;多壁碳纳米管的平均直径为9.5nm,平均长度为1.5μm,比表面积为260~280m2/g;烧结助剂由碳化硼、碳酸钙、碳酸钾、碳酸镁按照质量比1:1:1:1混合而成。
高温烧结:将研磨粉在1500℃下烧结17小时,得到研磨介质粗品;
涂覆膜层:在研磨介质粗品的外围涂覆润滑耐腐蚀膜料,60℃干燥24小时后形成具备光滑耐腐蚀膜层的高韧性抗屏蔽陶瓷研磨介质。
其中,棒状硼化锆混合粉末的制备过程与实施例1相同。
润滑耐腐蚀膜料的制备方法与实施例1相同。
化学镀覆的具体过程与实施例1相同。
实施例5
本实施例的一种高韧性陶瓷研磨介质的制备方法,包括以下步骤:
主料预处理:将80g棒状硼化锆混合粉末和10g碳化硅粉末混合均匀得到预混主料,依次经过清洗除杂、敏化处理、活化处理得到预处理主料;清洗除杂、敏化处理、活化处理的具体处理过程与实施例1相同;
化学镀覆:采用化学镀覆的方法,在预处理主料的外围包覆Ni-Mo-P合金,得到合金包覆主料;
粘结干燥:将93g合金包覆主料与5g多壁碳纳米管、0.5g水玻璃、2.8g烧结助剂混合均匀,经球磨、喷雾干燥得到研磨粉;喷雾干燥时的入口温度为148℃,出口温度为90℃;多壁碳纳米管的平均直径为9.5nm,平均长度为1.5μm,比表面积为260~280m2/g;烧结助剂由碳酸钙、碳酸钾、碳酸镁按照质量比1:1:1混合而成;
高温烧结:将研磨粉在1500℃下烧结18小时,得到研磨介质粗品;
涂覆膜层:在研磨介质粗品的外围涂覆润滑耐腐蚀膜料,57℃干燥24小时后形成具备光滑耐腐蚀膜层的高韧性抗屏蔽陶瓷研磨介质。
其中,棒状硼化锆混合粉末的制备过程与实施例1相同。
润滑耐腐蚀膜料的制备方法与实施例1相同。
化学镀覆的具体过程与实施例1相同。
对比例1
本对比例的一种高韧性陶瓷研磨介质的制备方法,与实施例1的区别在于,取消化学镀覆操作,直接将预处理主料参与粘结干燥步骤。
对比例2
本对比例的一种高韧性陶瓷研磨介质的制备方法,与实施例1的区别在于,粘结干燥步骤未添加多壁碳纳米管。
对比例3
本对比例的一种高韧性陶瓷研磨介质的制备方法,与实施例1的区别在于,取消涂覆膜层操作,高温烧结即得到研磨介质产品。
对比例4
本对比例的一种高韧性陶瓷研磨介质的制备方法,与实施例1的区别在于,主料预处理步骤将棒状硼化锆混合粉末替换为纯度99.9%的微米级颗粒状硼化锆。
性能测试
按照实施例1-5、对比例1-4制备得到粒径介于0.6~0.8mm的陶瓷研磨介质,参照行业标准JC/T 2522-2019《锆铝复合研磨介质球》对体积密度、自磨耗率、压碎强度归一值、维氏硬度和球形度进行了测试,具体测试结果见下表:
从上表的测试结果可以看出,本发明实施例制备的陶瓷研磨介质,体积密度均匀,自磨耗率、压碎强度归一值、维氏硬度和球形度均高于对比例,说明耐磨性能优异、强度高、成分致密均匀。对比例1由于取消化学镀覆操作,无法通过Ni-Mo-P合金在预处理主料外围形成均匀致密的包覆镀层,使得耐磨性能、强度均有一定的降低;对比例3由于取消涂覆膜层操作,无法通过牢固的交联作用得到与研磨介质粗品稳定结合的光滑膜层,降低了研磨介质的耐磨和耐腐蚀性能;对比例4由于主料预处理步骤采用了微米级颗粒状的硼化锆,不具备棒状硼化锆混合粉末促进硼化锆的烧结致密化,作为增韧相提高研磨介质的抗氧化烧蚀性能的功能,使得体积密度有一定的降低,球形度有明显降低。
以上所述,仅为本发明较佳的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,根据本发明的技术方案及其发明构思加以等同替换或改变,都应涵盖在本发明的保护范围之内。
以上公开的本发明优选实施例只是用于帮助阐述本发明。优选实施例并没有详尽叙述所有的细节,也不限制该发明仅为的具体实施方式。显然,根据本说明书的内容,可做很多的修改和变化。本说明书选取并具体描述这些实施例,是为了更好地解释本发明的原理和实际应用,从而使所属技术领域技术人员能很好地理解和利用本发明。本发明仅受权利要求书及其全部范围和等效物的限制。
Claims (3)
1.高韧性陶瓷研磨介质的制备方法,其特征在于,包括以下步骤:
主料预处理:将棒状硼化锆混合粉末和碳化硅粉末按照质量比6~8:1混合均匀得到预混主料,依次经过清洗除杂、敏化处理、活化处理得到预处理主料;
化学镀覆:采用化学镀覆的方法,在预处理主料的外围包覆Ni-Mo-P合金,得到合金包覆主料;
粘结干燥:将合金包覆主料与多壁碳纳米管、粘结剂、烧结助剂按照质量比85~96:3~5:0.2~0.5:1~3混合均匀,经球磨、喷雾干燥得到研磨粉;喷雾干燥时的入口温度为140~150℃,出口温度为80~90℃;
高温烧结:将研磨粉在1450~1500℃下烧结10~20小时,得到研磨介质粗品;
涂覆膜层:在研磨介质粗品的外围涂覆润滑耐腐蚀膜料,50~60℃干燥24小时后形成具备光滑耐腐蚀膜层的高韧性抗屏蔽陶瓷研磨介质;
所述棒状硼化锆混合粉末的制备过程包括以下步骤:
步骤一,将聚碳酸酯树脂在90~100℃下干燥至恒重,再放置于化学气相渗透炉内,1700~1800℃下真空热解,粉碎,400~600rpm转速球磨20min得到热解碳粉;
步骤二,将氯化锆粉体放置于坩埚内,以5~8℃/min的速率升温至900~1000℃,保温加热10min,趁热倒入20vt%的氨水溶液中,置于20℃的恒温水浴锅内,搅拌30min后减压抽滤,滤饼使用蒸馏水清洗,60℃干燥得到棒状氧化锆粉末;
步骤三,将棒状氧化锆粉末与碳化硼、三氧化二硼、硼酸铝粉以及热解碳粉按照质量比7~9:1:2:3:10~12混合均匀,放入石墨坩埚中,置于化学气相渗透炉内,以10℃/min速率升温至1700~1800℃,真空保温反应1~2小时,得到棒状硼化锆混合粉末;
所述润滑耐腐蚀膜料的制备方法如下:将四乙氧基硅烷和γ-缩水甘油醚氧丙基三甲氧基硅烷按照摩尔比5~8:1混合均匀后,超声处理20min形成分散液,加入乙醇、水,滴加1mol/L的盐酸溶液,调节pH至4,加入聚碳酸酯树脂热解、粉碎得到的热解碳粉,搅拌均匀,真空脱泡,得到溶胶状的润滑耐腐蚀膜料,其中,所述四乙氧基硅烷与乙醇、水的用量比为1g:2.2~2.5g:1.8~2.1g,热解碳粉的用量为四乙氧基硅烷重量的0.6~0.8倍;
化学镀覆的具体过程如下:按照质量浓度,将含有20~30g/L硫酸镍、15~20g/L钼酸钠、20~30g/L次膦酸钠、70~90g/L柠檬酸钠的化学镀液,在pH为10~11、温度为40~50℃的条件下,以每80~100g预处理主料搭配180~220mL化学镀液的方式进行镀覆,每隔20~30min更换一次镀液,镀覆持续5~6小时。
2.根据权利要求1所述的高韧性陶瓷研磨介质的制备方法,其特征在于,清洗除杂、敏化处理、活化处理的具体处理过程为:
步骤一,将预混主料依次通过丙酮清洗、乙醇清洗、去离子水清洗,90~110℃干燥至恒重,得到除杂主料;
步骤二,将除杂主料浸渍在浓度15g/L的氯化亚锡溶液中进行敏化处理,再使用去离子水清洗得到敏化主料;
步骤三,将敏化主料浸渍在浓度10wt%的氯化钯溶液中还原钯离子,蒸馏水清洗,风干得到预处理主料。
3.根据权利要求1所述的高韧性陶瓷研磨介质的制备方法,其特征在于,所述多壁碳纳米管的平均直径为9.5nm,平均长度为1.5μm,比表面积为260~280m2/g;粘结剂为六偏磷酸钠、水玻璃中的一种或两种;烧结助剂为碳化硼、碳酸钙、碳酸钾、碳酸镁中的一种或多种的混合物。
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