CN116710224A - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- CN116710224A CN116710224A CN202180087519.6A CN202180087519A CN116710224A CN 116710224 A CN116710224 A CN 116710224A CN 202180087519 A CN202180087519 A CN 202180087519A CN 116710224 A CN116710224 A CN 116710224A
- Authority
- CN
- China
- Prior art keywords
- groove
- resin layer
- width
- regeneration
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 108
- 229920005989 resin Polymers 0.000 claims abstract description 108
- 239000010410 layer Substances 0.000 claims abstract description 90
- 230000008929 regeneration Effects 0.000 claims abstract description 46
- 238000011069 regeneration method Methods 0.000 claims abstract description 46
- 230000002093 peripheral effect Effects 0.000 claims abstract description 19
- 239000002344 surface layer Substances 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims description 55
- 238000003754 machining Methods 0.000 claims description 11
- 230000001172 regenerating effect Effects 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 abstract description 9
- 238000006073 displacement reaction Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 239000002826 coolant Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011162 core material Substances 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B5/00—Turning-machines or devices specially adapted for particular work; Accessories specially adapted therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
- B23H7/02—Wire-cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
- B23H7/02—Wire-cutting
- B23H7/08—Wire electrodes
- B23H7/10—Supporting, winding or electrical connection of wire-electrode
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Turning (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Rolls And Other Rotary Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-008141 | 2021-01-21 | ||
| JP2021008141A JP2022112339A (ja) | 2021-01-21 | 2021-01-21 | 加工装置 |
| PCT/JP2021/047154 WO2022158215A1 (ja) | 2021-01-21 | 2021-12-21 | 加工装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116710224A true CN116710224A (zh) | 2023-09-05 |
Family
ID=82548183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180087519.6A Pending CN116710224A (zh) | 2021-01-21 | 2021-12-21 | 加工装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2022112339A (ja) |
| CN (1) | CN116710224A (ja) |
| WO (1) | WO2022158215A1 (ja) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11277399A (ja) * | 1998-03-31 | 1999-10-12 | Nippei Toyama Corp | ワイヤソーの加工用ローラ及びその製造方法 |
| JP6371681B2 (ja) * | 2014-11-10 | 2018-08-08 | トーヨーエイテック株式会社 | ワイヤソ−用ガイドローラの樹脂層再生方法 |
-
2021
- 2021-01-21 JP JP2021008141A patent/JP2022112339A/ja active Pending
- 2021-12-21 WO PCT/JP2021/047154 patent/WO2022158215A1/ja active Application Filing
- 2021-12-21 CN CN202180087519.6A patent/CN116710224A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2022112339A (ja) | 2022-08-02 |
| WO2022158215A1 (ja) | 2022-07-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |