CN116710224A - Processing device - Google Patents

Processing device Download PDF

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Publication number
CN116710224A
CN116710224A CN202180087519.6A CN202180087519A CN116710224A CN 116710224 A CN116710224 A CN 116710224A CN 202180087519 A CN202180087519 A CN 202180087519A CN 116710224 A CN116710224 A CN 116710224A
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CN
China
Prior art keywords
groove
resin layer
width
regeneration
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180087519.6A
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Chinese (zh)
Inventor
筱原武宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yasunaga Corp
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Yasunaga Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yasunaga Corp filed Critical Yasunaga Corp
Publication of CN116710224A publication Critical patent/CN116710224A/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B5/00—Turning-machines or devices specially adapted for particular work; Accessories specially adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
    • B23H7/02—Wire-cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
    • B23H7/02—Wire-cutting
    • B23H7/08—Wire electrodes
    • B23H7/10—Supporting, winding or electrical connection of wire-electrode
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Turning (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Rolls And Other Rotary Bodies (AREA)

Abstract

The processing device (2) is provided with a main roller (6) in which a plurality of grooves (26) in which a wire (1) is spirally wound are formed at predetermined intervals (P) along the circumferential direction and in the axial direction (X), and the main roller (6) is provided with: a shaft part (20); a resin layer (22) that covers the outer peripheral surface (20 a) of the shaft (20) and that forms a plurality of grooves (26); and a holding section (24) for holding the resin layer (22) in the axial direction (X), wherein the resin layer (22) allows the plurality of regeneration grooves (26) to be formed by peeling the surface layer of the resin layer (22) along the outer periphery thereof by the groove regeneration means (30), wherein the plurality of grooves (26) are formed in the resin layer (22) and the groove formation width (L1) in the axial direction (X) of the regeneration grooves (26) is smaller than the resin formation width (L) in the axial direction (X) of the resin layer (22).

Description

Processing device
Technical Field
The present invention relates to a processing device, and more particularly to a processing device such as a wire saw or a wire electric discharge machine that performs cutting processing on a workpiece with a wire.
Background
Wire saw and wire electric discharge machining apparatuses are machining apparatuses that cut a workpiece with a wire. The processing device described above includes a main roller in which a plurality of grooves in which a wire rod is spirally wound are formed at predetermined intervals in the circumferential direction and in the axial direction. The main roller has a shaft portion (core material) and a resin layer covering the outer peripheral surface of the shaft portion and forming the plurality of grooves.
Patent document 1 discloses a processing roller for a wire saw in which a resin layer is formed on the outer periphery of a shaft portion, and a plurality of grooves for hanging wires are formed on the outer periphery of the resin layer. A metal ring to be detected for detecting thermal expansion displacement of a resin layer is fixed to an end face of the resin layer by integral molding.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 11-277399
Disclosure of Invention
Problems to be solved by the invention
Since the wire is wound around a groove formed in the resin layer of the main roller and is in sliding contact with the groove, the resin layer is easily expanded by processing heat or the like accompanying operation of the processing device. Therefore, the resin layer thermally expands, so that the positions of the grooves in the resin layer change, and the thickness and warpage of the wafer, which is a processed product after dicing, change, which may affect the quality of the wafer. However, in patent document 1, although a ring to be detected for detecting the thermal expansion displacement of the resin layer is provided, the ring to be detected does not suppress the thermal expansion displacement itself of the resin layer.
Further, since the wire is wound around and in sliding contact with the groove of the resin layer formed on the main roller, the groove formed on the resin layer is worn and deformed by the operation of the processing device. Therefore, the surface layer of the resin layer is peeled off along the outer periphery thereof by the tank regenerating unit, and the tank is periodically regenerated.
However, in patent document 1, the ring to be detected interferes with the tank regeneration unit, and the surface layer of the resin layer may be difficult to peel off. In addition, in order to perform the step of peeling the surface layer of the resin layer by the tank reclamation assembly, it is necessary to detach the ring to be inspected and to assemble it again after the completion of the operation, so that the production efficiency of the wafer is lowered.
The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a processing apparatus capable of improving the quality of a processed product by suppressing a change in the position of a groove due to thermal expansion of a resin layer of a main roller, and improving the production efficiency of the processed product by efficiently regenerating the groove.
Solution for solving the problem
In order to achieve the above object, a machining device according to claim 1 is a machining device for cutting a workpiece with a wire, the machining device including a main roller in which a plurality of grooves in which the wire is spirally wound are formed at predetermined intervals in an axial direction along a circumferential direction, the main roller including: a shaft portion; a resin layer covering an outer peripheral surface of the shaft portion and forming a plurality of grooves; and a holding portion that holds the resin layer in the axial direction, the resin layer allowing a plurality of regeneration grooves to be formed by peeling off a surface layer of the resin layer along an outer periphery thereof by the groove regeneration assembly, the grooves formed in the resin layer and the grooves formed in the axial direction of the regeneration grooves having a smaller groove forming width than the resin forming width in the axial direction of the resin layer.
In addition, the invention described in claim 2 is characterized in that, in claim 1, the difference in width between the groove forming width and the resin forming width is a size that the groove regenerating unit does not interfere with the holding portion.
In addition, the invention described in claim 3 is characterized in that in claim 2, the groove regeneration means forms a plurality of regeneration grooves by cooperation of a rotation means for rotating the main roller, a horizontal movement means for moving the cutting tool in the axial direction, and a lifting movement means for lifting the cutting tool toward the resin layer, and the difference between the groove formation width and the resin formation width is the size that the cutting tool does not contact the holding portion when the regeneration groove is formed by the groove regeneration means.
In addition, the invention described in claim 4 is characterized in that, in claim 3, the difference between the groove forming width and the resin forming width is set in accordance with at least one of the edge angle of the edge of the cutting tool, the edge width, and the lowering angle of the cutting tool.
Effects of the invention
Therefore, according to the processing apparatus of claim 1, the quality of the processed product can be improved by suppressing the change in the position of the groove due to the thermal expansion of the resin layer of the main roller, and the production efficiency of the processed product can be improved by efficiently regenerating the groove.
Further, according to the invention described in claim 2, the thermal expansion displacement of the resin layer is suppressed by the holding portion, and further, the positional change of the groove is suppressed, and the desired regeneration groove can be reliably formed without detaching the holding portion.
Further, according to the invention described in claim 3, the thermal expansion displacement of the resin layer and further the positional change of the groove can be suppressed by the holding portion, and the groove to be regenerated can be reliably formed by the cutting tool without detaching the holding portion.
Further, according to the invention described in claim 4, the groove regeneration can be reliably performed in a state where the main roller is equipped with the holding portion.
Drawings
Fig. 1 is a schematic view of a wire saw according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view of the main roller.
Fig. 3 is an enlarged cross-sectional view of a groove formed in a resin layer.
Fig. 4 is a schematic view of the groove processing apparatus.
Fig. 5A is a diagram showing a stage before the tank regeneration in the tank regeneration step.
Fig. 5B is a diagram showing a step of peeling the resin layer.
Fig. 5C is a diagram showing a tank regeneration process.
Fig. 5D is a diagram showing a state in which the stripping process and the tank regeneration process are performed three times, respectively.
Detailed Description
Hereinafter, a processing apparatus according to an embodiment of the present invention will be described with reference to the drawings.
Fig. 1 is a schematic view of a wire saw 2 as an example of a processing device for cutting a workpiece W with a wire 1. The wire saw 2 includes a roller unit 4, and the roller unit 4 includes a pair of main rollers 6. The pair of main rollers 6 are disposed separately from each other on the wire path 8, and are fastened to rotating shafts, not shown, of the roller units 4. By driving these rotation shafts with a motor, not shown, the main rollers 6 can be rotated in the forward and reverse directions.
The wire saw 2 includes a pair of bobbins 10 and a pair of guide rollers 12. The bobbins 10 are disposed on the wire path 8 so as to be separated from each other at positions sandwiching the roller unit 4 and the guide rollers 12, and can be rotated in the forward and reverse directions by motors, not shown. Each spool 10 is used as a payout spool or a take-up spool depending on the direction of rotation.
The wire 1 is paid out by the spool 10 serving as a payout spool accompanying rotation thereof, and the paid out wire 1 is guided along the wire path 8 toward the roller unit 4 via one guide roller 12. The guide rollers 12 are direction-switching rollers, and are disposed on the wire path 8 so as to be separated from each other at positions that sandwich the roller unit 4.
The wire material fed from the spool 10 is guided to the roller unit 4 via one guide roller 12. After the wire 1 guided to the roller unit 4 is wound between the pair of main rollers 6 a predetermined number of times, the wire is guided out of the roller unit 4 and wound around the spool 10 serving as a winding reel via the other guide roller 12.
Each spool 10 is connected to a traverse control mechanism (not shown), and each traverse control mechanism reciprocates the connected spool 10 in the axial direction thereof. Thereby, the wire 1 in the wire path 8 can be stably paid out or wound. A lift table 14 is disposed between the pair of main rollers 6 above the roller unit 4. An adhesive portion 16 is provided on the lower surface of the lift table 14, and a workpiece W to be cut is mounted on the adhesive portion 16.
During the travel of the wire 1 through the roller unit 4, the workpiece W gradually descends together with the elevating table 14, and is cut into a plurality of cut pieces by the wire 1 located between the pair of main rollers 6. At this time, coolant is supplied to the wire located between the main rollers 6.
The coolant is used as a coolant for cooling the wire 1 and each main roller 6, and in the case where the coolant contains abrasive grains, it may also be used as a grinding fluid for cutting the workpiece W. In the case where the coolant does not contain abrasive grains, the abrasive grains are fixedly connected to the wire 1 itself. The coolant is supplied to the wire 1 between the main rollers 6, and then recovered and reused in the recovery tank 18.
Fig. 2 shows a cross-sectional view of the main roller 6. The main roller 6 includes a hollow shaft portion 20 as a core, a resin layer 22 covering an outer peripheral surface 20a of the shaft portion 20, and a pair of annular holding portions 24 holding the resin layer 22 on both sides of the shaft portion 20 in the axial direction X. The rotation shaft of the roller unit 4 is fitted into and fastened to the inner peripheral surface 20b of the shaft portion 20.
A plurality of grooves 26 in which the wire 1 is spirally wound a predetermined number of times are formed in the resin layer 22 along the circumferential direction of the shaft 20 at predetermined intervals (groove pitch) in the axial direction X. The groove forming width L1 in the axial direction X of the resin layer 22 in which the plurality of grooves 26 are formed is smaller than the resin forming width L in the axial direction X of the resin layer 22. Further, a width difference Δl between the groove forming width L1 and the resin forming width L is ensured at both ends of the resin layer 22 in the axis direction X, respectively.
Fig. 3 shows an enlarged cross-sectional view of the groove 26 formed in the resin layer. Each groove has an inverted trapezoid shape in cross section having a predetermined groove depth D, a predetermined groove angle θ, and a predetermined groove bottom width Wa, and a plurality of grooves each having a predetermined groove pitch P and a predetermined tip width Wb are formed on the outer peripheral surface 22a of the resin layer 22. These predetermined values are set appropriately according to the specifications of the main roller 6. As also shown in fig. 2, corners 28 are formed at the boundaries between the outermost ends (left and right ends) of the grooves 26 on both sides in the axial direction X of the resin layer 22 and the outer peripheral surface 22a of the resin layer 22. That is, the groove forming width L1 is defined as the distance between the corners 28 at the outermost ends of the grooves 26 in the axis direction X.
Since the wire 1 is wound around the plurality of grooves 26 formed in the resin layer 22 of the main roller 6 and is in sliding contact with the grooves, the resin layer 22 is easily expanded by processing heat or the like accompanying the operation of the wire saw 2. The thermal expansion of the resin layer 22 changes the position of the groove 26 in the resin layer 22, and thus the thickness and warpage of the wafer, which is a processed product after dicing, may change, which may affect the quality of the wafer. However, in the present embodiment, the pair of holding portions 24 suppresses thermal expansion of the resin layer 22, particularly in the axial direction X, and the positional change of the grooves 26 in the resin layer 22 is suppressed.
Fig. 4 shows a schematic view of a groove processing device 30 for forming grooves 26 in a main roller 6. The groove processing apparatus 30 includes a rotating unit (rotating means) 32, a cutting tool 34, a fixed table 36, a horizontal moving unit (horizontal moving means) 38, a lifting moving unit (lifting moving means) 40, and the like. The rotation unit 32 centers the shaft portion 20 of the main roller 6 and rotatably supports the shaft portion 20 of the main roller 6. The cutting tool 34 has an edge 34a at the tip for forming the groove 26 in the resin layer 22 of the main roller 6.
The cutting tool 34 is fixed to the fixing base 36 with the cutting edge of the blade 34a facing downward in the longitudinal direction Y (axial-radial direction). The horizontal movement unit 38 has a rail 38a, and the rail 38a supports the fixed table 36 so as to be movable in the horizontal direction (axis direction X), and moves the fixed table 36 along the rail 38a to move the cutting tool 34 along the axis direction X. The lifting/lowering movement means 40 supports the fixed table 36 and the cutting tool 34 so as to be capable of lifting and lowering relative to the main roller 6. The plurality of grooves 26 can be formed in the resin layer 22 of the main roller 6 by cooperation of the rotating unit 32, the horizontal moving unit 38, and the elevating moving unit 40.
Here, since the wire 1 is wound around the groove 26 of the resin layer 22 formed on the main roller 6 and is in sliding contact with the groove 26, the groove 26 formed on the resin layer 22 is worn and deformed by the operation of the wire saw 2. Therefore, the tank 26 is periodically regenerated by using the tank processing device 30. That is, in the wire saw 2 of the present embodiment, the resin layer 22 of the main roller 6 is restrained from thermal expansion by the pair of holding portions 24, and the regeneration groove is allowed to be formed by the groove regeneration assembly using the groove processing device 30.
Fig. 5A to 5D are schematic diagrams illustrating a step of regenerating a groove in stages using an upper cross section of the main roller 6. Fig. 5A shows a stage before the cell regeneration. The grooves 26 of the resin layer 22 formed in the groove forming region 42 of the groove forming width L1 are worn out and deformed. Fig. 5B shows a step of peeling the resin layer 22 as a preceding stage of the tank regeneration step. First, by driving the horizontal movement means 38, as shown by the one-dot chain line, the edge of the edge 34a of the cutting tool 34 is positioned above the corner 28 on one end side (left end side in fig. 5B) of the groove forming width L1 and slightly outside (slightly left side in fig. 5B) of the corner 28 in the axial direction.
Next, the lifting/lowering means 40 is driven to lower the cutting tool 34 vertically, and as shown by a broken line, the edge of the edge 34a of the cutting tool 34 is positioned at the peeling start position 44 on the outer peripheral surface 22a of the resin layer 22, at which the edge bites into the peeling depth D1 of the resin layer. The peeling start position 44 is a position where the cutting tool 34 does not contact the holding portion 24, and is located within the range of the width difference Δl in the axis direction X. The separation depth D1 is equal to or greater than the groove depth D.
Next, the rotation unit 32 and the horizontal movement unit 38 are driven to horizontally move the cutting tool 34 while rotating the main roller 6, and as shown in solid lines, the cutting edge of the cutting tool 34 is positioned at a peeling end position 46 on the other end side (right side in fig. 5B) of the groove width L1 and slightly outside (slightly right side in fig. 5B) of the corner 28 in the axial direction X. Next, the lifting/lowering means 40 is driven to raise and retract the cutting tool 34 vertically upward as indicated by the two-dot chain line.
Thereby, the surface layer of the resin layer 22 in which the plurality of grooves 26 are formed is peeled off along the outer periphery thereof, and the peeled-off region 48 is formed in the resin layer 22. The peeling region 48 is formed in an inverted trapezoidal cross section by the peeling peripheral surface 48a without the groove 26 and the peeling side surfaces 48b formed on both sides in the axial direction X of the peeling region 48.
The peeling peripheral surface 48a is recessed from the outer peripheral surface 22a of the resin layer 22 by the peeling depth D1 over the entire periphery of the resin layer 22. The separation side surface 48b is an inclined surface formed from the separation peripheral surface 48a to the outer peripheral surface 22a, and the inclination angle α with respect to the axial direction X thereof is an angle corresponding to the cutting angle β and the cutting width Wc of the cutting edge 34a of the cutting tool 34.
Further, even after the peeling region 48 is formed, the width difference Δl is ensured at both ends of the outer peripheral surface 22a of the resin layer 22 in the axial direction of the resin layer, respectively. The width difference Δl is set to a value at which the groove processing device 30 does not interfere with the holding portion 24, that is, a value at which the cutting tool 34 does not contact the holding portion 24, based on at least one of the edge angle β of the edge 34a of the cutting tool 34, the edge width Wc, and an element such as a lowering angle (0 ° in the case of fig. 5B) of the cutting tool 34 with respect to the vertical direction Y.
Specifically, in order to perform the groove regeneration so that the cutting tool 34 does not come into contact with the holding portion 24, when the cutting angle β and the cutting width Wc of the edge 34a of the cutting tool 34 are relatively large, a large width difference Δl needs to be secured in advance. In addition, when the lowering angle of the cutting tool 34 with respect to the vertical direction is larger than 0 °, that is, when the cutting tool 34 is lowered obliquely downward along the peeling side surface 48b, a large width difference Δl needs to be secured in advance.
Next, fig. 5C shows a tank regeneration step performed after the stripping step. By driving the rotation unit 32, the horizontal movement unit 38, and the lifting movement unit 40, the cutting tool 34 is gradually moved in the axial direction X while rotating the main roller 6, and a plurality of grooves 26 are formed in the peeling region 48. Then, the lifting/lowering means 40 is driven to raise and retract the cutting tool 34. Thereby, the groove forming region 42 is formed on the peeling peripheral surface 48a of the resin layer 22.
The groove formation width L1 formed in the groove formation region 42 of the peeling peripheral surface 48a is the same as the groove formation width L1 in the initial stage before the groove regeneration. Further, a width difference Δl equal to the initial size is ensured between the groove forming width L1 and the resin forming width L at both ends in the axis direction X of the resin layer 22, respectively. The regenerated grooves 26 are formed at the same groove pitch P as before wear, in the same shape.
Fig. 5D shows a state in which the stripping process and the tank regeneration process have been performed three times. In the peeling region 48, the peeling peripheral surface 48a is formed recessed to a peeling depth D3, and the peeling depth D3 is 3 times the peeling depth D1 in the first tank regeneration. In the second and third peeling steps, the peeling start position 44 and the peeling end position 46 are shifted to positions close to each other in the axial direction X.
Thus, the peeling side surface 48b formed in the third peeling step is formed as a continuous inclined surface maintaining the inclined angle α from the peeling side surface 48b formed in the first peeling step. By repeating the stripping process shown in fig. 5B and the groove regeneration process shown in fig. 5C, the groove regeneration can be periodically repeated until the thickness t of the remaining resin layer 22 becomes a predetermined thickness (for example, the thickness of the resin layer that can ensure the strength of the groove 26) or the groove width L cannot be ensured in the groove forming region 42.
As described above, the wire saw 2 of the present embodiment includes the holding portion 24 for holding the resin layer 22 of the main roller 6 in the axial direction X. The groove formation width L1 in the axial direction X of the plurality of grooves 26 and the regenerated grooves 26 formed in the resin layer 22 is set smaller than the resin formation width L in the axial direction X of the resin layer 22.
In this way, the thermal expansion displacement of the resin layer 22 and the positional change of the groove 26 are suppressed by the holding portion 24, and the groove can be regenerated by using the groove regeneration unit of the groove processing device 30 without detaching the holding portion 24. Therefore, in the wire saw 2, the quality of the wafer as a processed product can be improved, and the groove regeneration can be efficiently performed, thereby improving the production efficiency of the wafer as a processed product.
The width difference Δl between the groove forming width L1 and the resin forming width L is set to a value at which no interference occurs in the groove regeneration unit using the groove processing device 30. This suppresses the thermal expansion displacement of the resin layer 22 by the holding portion 24, thereby suppressing the positional change of the groove 26, and reliably forming a desired regeneration groove without detaching the holding portion.
More specifically, a plurality of regenerated grooves 26 can be formed by cooperation of the rotating unit 32, the horizontal moving unit 38, and the lifting moving unit 40 using the groove regeneration unit of the groove processing apparatus 30. The width difference Δl between the groove forming width L1 and the resin forming width L is set to a value at which the cutting tool 34 does not contact the holding portion 24 when the groove 26 is formed by using the groove regenerating unit of the groove processing device 30. This suppresses the thermal expansion displacement of the resin layer 22 by the holding portion 24, thereby suppressing the positional change of the groove 26, and reliably forms the groove 26 to be regenerated by the cutting tool 34 without detaching the holding portion 24.
The width difference Δl between the groove forming width L1 and the resin forming width L is set according to at least one of the cutting angle β of the edge 34a of the cutting tool 34, the cutting width Wc, and the lowering angle of the cutting tool 34. By securing the width difference Δl to be large in advance in accordance with these elements, the groove regeneration can be reliably performed in a state where the main roller 6 is fitted with the holding portion 24.
The description of one embodiment of the present invention has been completed above, but the present invention is not limited to the above embodiment, and various modifications can be made without departing from the gist of the present invention. For example, if the thermal expansion displacement of the resin layer 22 and the positional change of the groove 26 can be suppressed, only one holding portion 24 may be provided according to the configuration of the main roller 6 and the roller unit 4, and the resin layer 22 may be held only on one side in the axial direction X.
Further, the width difference Δl between the groove forming width L1 and the resin forming width L may have different magnitudes at both ends in the axial direction X of the resin layer 22 as long as the groove regeneration is not hindered. Further, as long as an appropriate width difference Δl is ensured in which the cutting tool 34 does not contact the holding portion 24, the groove forming width L1 may be changed at the time of groove regeneration by changing the specifications of the wire saw 2 and the main roller 6.
In the present embodiment, the groove regeneration can be performed without removing the holding portion 24, and therefore the holding portion 24 and the shaft portion 20 may be integrally formed. As shown in fig. 2 and 5A to 5D, the holding portion 24 is formed to have a smaller axial diameter than the resin layer 22. However, the present invention is not limited thereto, and the axial diameter of the holding portion 24 may be made larger than the axial diameter of the resin layer 22 as long as the holding portion 24 suppresses the thermal expansion displacement of the resin layer 22, further suppresses the positional change of the groove 26, and performs groove regeneration.
In the state shown in fig. 5D, the peeling start position and the peeling end position may not be shifted to positions close to each other in the axial direction X each time the peeling process is performed, as long as an appropriate width difference Δl is ensured in which the cutting tool 34 does not contact the holding portion 24. The present invention is not limited to the wire saw 2 described in the above embodiment, and can be widely applied to a machining device that performs cutting machining of a workpiece with a wire rod, including a wire electric discharge machining device.
Description of the reference numerals
1: a wire rod;
2: wire saw (processing device);
6: a main roller;
20: a shaft portion;
20a: an outer peripheral surface;
22: a resin layer;
24: a holding section;
26: a tank (regeneration tank);
30: groove processing device (groove regenerating component);
32: a rotation unit (rotation assembly);
34: a cutting tool;
34a: a blade;
38: a horizontal moving unit (horizontal moving assembly);
40: a lifting moving unit (lifting moving assembly);
w: a workpiece;
x: an axial direction;
p: groove spacing (interval);
l1: forming a groove into a width;
l: forming a width of the resin;
Δl: a width difference;
beta: a blade angle;
wc: the blade width.

Claims (4)

1. A machining device that performs cutting machining of a workpiece with a wire, the machining device comprising:
a main roller in which a plurality of grooves are formed at predetermined intervals along the circumferential direction and in the axial direction, the grooves being formed so that the wire is spirally wound,
the main roller has:
a shaft portion;
a resin layer covering an outer peripheral surface of the shaft portion and forming the plurality of grooves; and
a holding portion that holds the resin layer in the axial direction,
the resin layer allows a plurality of regeneration tanks to be formed by the tank regeneration assembly by peeling the surface layer of the resin layer along the outer periphery thereof,
the groove forming width in the axial direction of the plurality of grooves and the regeneration groove formed in the resin layer is smaller than the resin forming width in the axial direction of the resin layer.
2. The processing apparatus according to claim 1, wherein,
the difference in width between the groove forming width and the resin forming width is a value at which the groove regenerating unit does not interfere with the holding portion.
3. The processing apparatus according to claim 2, wherein,
the groove regeneration means forms the plurality of regeneration grooves by cooperation of a rotation means for rotating the main roller, a horizontal movement means for moving the cutting tool in the axial direction, and a lifting movement means for lifting the cutting tool toward the resin layer,
the difference in width between the groove forming width and the resin forming width is a size that the cutting tool does not contact the holding portion when the regeneration groove is formed by the groove regeneration assembly.
4. The processing apparatus according to claim 3, wherein,
the width difference between the groove forming width and the resin forming width is set according to at least any one of an edge angle of an edge of the cutting tool, an edge width, and a lowering angle of the cutting tool.
CN202180087519.6A 2021-01-21 2021-12-21 Processing device Pending CN116710224A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-008141 2021-01-21
JP2021008141A JP2022112339A (en) 2021-01-21 2021-01-21 Processing device
PCT/JP2021/047154 WO2022158215A1 (en) 2021-01-21 2021-12-21 Machining device

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Publication Number Publication Date
CN116710224A true CN116710224A (en) 2023-09-05

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Application Number Title Priority Date Filing Date
CN202180087519.6A Pending CN116710224A (en) 2021-01-21 2021-12-21 Processing device

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