CN116609336A - Defect detection apparatus - Google Patents
Defect detection apparatus Download PDFInfo
- Publication number
- CN116609336A CN116609336A CN202310464688.8A CN202310464688A CN116609336A CN 116609336 A CN116609336 A CN 116609336A CN 202310464688 A CN202310464688 A CN 202310464688A CN 116609336 A CN116609336 A CN 116609336A
- Authority
- CN
- China
- Prior art keywords
- sample
- adsorption
- adsorption zone
- optical module
- defect detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007547 defect Effects 0.000 title claims abstract description 41
- 238000001514 detection method Methods 0.000 title claims description 32
- 230000003287 optical effect Effects 0.000 claims abstract description 78
- 238000001179 sorption measurement Methods 0.000 claims description 165
- 230000009977 dual effect Effects 0.000 claims description 8
- 230000008859 change Effects 0.000 claims description 3
- 238000005070 sampling Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000012360 testing method Methods 0.000 description 9
- 238000005192 partition Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N35/0099—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor comprising robots or similar manipulators
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N35/10—Devices for transferring samples or any liquids to, in, or from, the analysis apparatus, e.g. suction devices, injection devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0106—General arrangement of respective parts
- G01N2021/0112—Apparatus in one mechanical, optical or electronic block
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The present application provides a defect detecting apparatus comprising: a sample stage; the sample platform is arranged on the first motion platform, and the first motion platform comprises a Y-axis motion part, a Z-axis motion part and a T-axis motion part: the dual-optical system comprises a first optical module and a second optical module and is used for carrying out image recognition on a sample on the sample stage; the double optical system is arranged on the second motion platform and comprises an X-axis scanning motion part and a Y-axis interval motion part. The application greatly enriches the measurable product range of the equipment on the production line, greatly improves the measuring speed of the equipment and further improves the throughput.
Description
Technical Field
The application belongs to the field of semiconductor integrated circuit manufacturing equipment, and particularly relates to high-throughput defect detection equipment compatible with variable-size samples.
Background
The semiconductor industry is a high investment and long return period industry, and based on this industry feature, sample throughput (thoutput) is a factor of great concern in the semiconductor industry. In addition, the variety of samples and processes from the front end manufacturing to the back end packaging is also varied. From the viewpoint of equipment investment, the on-line equipment needs to have high compatibility so as to run more samples on the production line and exert the greatest value. Currently, the defect detection equipment on the market is basically fixed and compatible with single and multiple optical systems, but cannot achieve variable compatibility with multiple optical systems. The application provides a brand new system solution. The method has advantages in panel, package and defect detection in the semiconductor industry.
The conventional architecture is divided into two types, one is a conventional single optical system architecture, which accomplishes defect detection of the entire sample surface by moving the sample multiple times in the X-axis and Y-axis directions. The other is a fixed multi-optical system architecture, the optical system is arranged along the X axis, and the sample moves along the Y axis to finish the whole sample surface scanning at one time.
The single optical system architecture is shown in fig. 1, and comprises a sample stage 11, a motion device 10 and a single optical lens 12 positioned above the sample stage, wherein after a sample is placed on a film bearing stage, the image scanning detection of the whole sample surface is completed by one step and one scanning of the X axis and the Y axis of the motion device 10. The method has the advantages of simple structure, maturity and stability, and the defects that the occupied area of the system is increased along with the increase of the product, the scanning speed is slower, and the defects are more prominent especially in the state of a large sample.
The multi-optical system architecture is shown in fig. 2, and includes a sample stage 11, a motion device 10, and a plurality of optical lenses 13 located above the sample stage, where the plurality of optical lenses 13 cover the image imaging area to the whole X-axis, so that the sample can complete the surface defect detection of the sample only by scanning along the Y-axis. This solution requires relatively simple motion platforms, but the multiple optical systems are relatively complex to process in software and algorithms because of field of view overlap. Because the full detection is done in a single scan, the depth of focus cannot be too high, so the system can only detect defects with low accuracy (e.g., greater than 10 microns). The defect detection requirements of the micron order and below cannot be met. If the precision is required to be improved, the multi-optical system needs to have a self-focusing system, and the difficulty is increased for the algorithm and software to control.
It should be noted that the foregoing description of the background art is only for the purpose of providing a clear and complete description of the technical solution of the present application and is presented for the convenience of understanding by those skilled in the art. The above-described solutions are not considered to be known to the person skilled in the art simply because they are set forth in the background of the application section.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present application is to provide a defect detecting device, which is used for solving the problems of slow scanning speed or excessively complex algorithm of the defect detecting device in the prior art.
To achieve the above and other related objects, the present application provides a defect detecting apparatus comprising: a sample stage; the sample platform is arranged on the first motion platform, and the first motion platform comprises a Y-axis motion part, a Z-axis motion part and a T-axis motion part: the Y-axis movement part is used for carrying out up-and-down sample operation on the sample table and stepping movement on the sample table, the Z-axis movement part is used for adjusting the height of the sample table in the vertical direction, and the T-axis movement part is used for adjusting the angle between the sample table and the horizontal plane so as to adapt to the image recognition of the sample; the dual-optical system comprises a first optical module and a second optical module and is used for carrying out image recognition on the sample table; the second motion platform, the second motion platform set up in on the sample platform, dual optical system set up in on the second motion platform, including X axle scanning motion and Y axle interval motion on the second motion platform, X axle scanning motion is used for driving dual optical system is scanning motion, Y axle interval motion is used for through moving first optical module and second optical module with change the interval between first optical module and the second optical module.
Alternatively, the first optical module and the second optical module may be independently turned on or turned off to independently scan the sample, or may be simultaneously turned on or turned off to simultaneously scan the sample.
Optionally, the first optical module and the second optical module respectively include more than two lenses with different precision.
Optionally, the first optical module and the second optical module respectively include more than two lenses with different magnifications.
Optionally, the sample stage includes a first adsorption zone, around in the peripheral second adsorption zone of first adsorption zone and around in the peripheral third adsorption zone of second adsorption zone, first adsorption zone the second adsorption zone with third adsorption zone is provided with a plurality of adsorption gas pockets, first adsorption zone the second adsorption zone with the adsorption gas pockets in the third adsorption zone are respectively through first solenoid valve, second solenoid valve and third solenoid valve independent control break-make.
Optionally, the first adsorption zone is located in a corner region of the sample stage, the second adsorption zone surrounds the first adsorption zone in an L shape, and the third adsorption zone surrounds the second adsorption zone in an L shape.
Optionally, the first adsorption hole of the first adsorption zone is connected with a first air pipe through a first rotary joint from below the sample table, the second adsorption hole of the second adsorption zone is connected with a second air pipe through a second rotary joint from below the sample table, the third adsorption hole of the third adsorption zone is connected with a third air pipe through a third rotary joint from below the sample table, and the first electromagnetic valve, the second electromagnetic valve and the third electromagnetic valve respectively control on-off of air flows of the first air pipe, the second air pipe and the third air pipe.
Optionally, positioning pins are disposed at outer edges of the first, second and third adsorption regions, and no positioning pins are disposed at adjacent edges between the first, second and third adsorption regions.
Optionally, when the area of the sample is smaller than the area of the first adsorption zone, the sample is placed in the first adsorption zone, and the first electromagnetic valve is opened to control the first adsorption hole to adsorb the sample; when the area of the sample is larger than the sum of the areas of the first adsorption area and the second adsorption area, the sample is placed in the first adsorption area and the second adsorption area, the first electromagnetic valve and the second electromagnetic valve are opened to control the first adsorption hole and the second adsorption hole to adsorb the sample simultaneously; when the area of the sample is larger than the sum of the areas of the first adsorption zone and the second adsorption zone and smaller than the sum of the areas of the first adsorption zone, the second adsorption zone and the third adsorption zone, the sample is placed in the first adsorption zone, the second adsorption zone and the third adsorption zone, and the first electromagnetic valve, the second electromagnetic valve and the third electromagnetic valve are opened to control the first adsorption hole, the second adsorption hole and the third adsorption hole to adsorb the sample at the same time.
Optionally, the defect detection device is provided with a station to be detected and a detected station on two sides, and the defect detection device further comprises a double-arm robot arm, wherein the distance between the double-arm robot arm and the station to be detected is equal to the distance between the sample stage and the detected station, so that the simultaneous sampling from the station to be detected and the sample stage is realized, or the samples are simultaneously placed on the sample stage and the detected station.
Optionally, the station to be detected and the detected station are further provided with a first lifting device and a second lifting device respectively, so that the station to be detected and the detected station are kept at the same height with the sample platform.
As described above, the defect detecting apparatus of the present application has the following advantageous effects:
according to the scheme, the dual-optical system is adopted, each optical module can be provided with lenses with different precision or/and different multiples, the distance between the two optical modules can be changed through the motion system, the high-low test precision can be compatible under the condition of being compatible with the requirements of samples with different sizes, and the measurable product range of equipment on a production line is greatly enriched. Meanwhile, the two optical modules can work simultaneously, which is equivalent to testing double areas at the same time, thereby improving throughput.
The application corresponds to the size variation of the sample, the sample stage adopts a partition mechanism, and each partition can independently start and close the adsorption function for samples with different sizes so as to cope with the adsorption work of the samples with different sizes and further meet the detection requirements of the samples with different sizes.
In the application, three stations (a station to be detected, a sample stage and a detected station) are adopted for automatic operation during loading and unloading, so that the waiting time is reduced to the maximum extent.
Drawings
The accompanying drawings, which are included to provide a further understanding of embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is apparent that the drawings in the following description are only some embodiments of the application.
FIG. 1 is a schematic diagram of a single optical system architecture.
FIG. 2 is a schematic diagram of a multi-optical head system architecture.
Fig. 3 is a schematic diagram of a defect detecting apparatus according to an embodiment of the present application.
Fig. 4 is a schematic diagram showing a structure of a sample stage of the defect detecting apparatus according to the embodiment of the present application.
Fig. 5 is a schematic station structure of a defect detecting apparatus according to an embodiment of the present application.
Description of element reference numerals
201. First optical module
202. Second optical module
211 X-axis scanning movement part
212 Y-axis distance movement part
221 Y-axis movement part
222 Z-axis movement part
223 T-axis motion
23. Sample stage
231. First adsorption zone
232. First adsorption hole
233. Second adsorption zone
234. Second adsorption hole
235. Third adsorption zone
236. Third adsorption hole
237. Positioning pin
24. Station to be inspected
241. First lifting device
25. Inspected station
251. Second lifting device
Detailed Description
Other advantages and effects of the present application will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present application with reference to specific examples. The application may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present application.
It should be emphasized that the term "comprises/comprising" when used herein is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps or components.
Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments in combination with or instead of the features of the other embodiments.
As described in detail in the embodiments of the present application, the cross-sectional view of the device structure is not partially enlarged to a general scale for convenience of explanation, and the schematic drawings are only examples, which should not limit the scope of the present application. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
For ease of description, spatially relative terms such as "under", "below", "beneath", "above", "upper" and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Furthermore, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or one or more intervening layers may also be present.
In the context of the present application, a structure described as a first feature being "on" a second feature may include embodiments where the first and second features are formed in direct contact, as well as embodiments where additional features are formed between the first and second features, such that the first and second features may not be in direct contact.
It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present application by way of illustration, and only the components related to the present application are shown in the drawings rather than the number, shape and size of the components in actual implementation, and the form, number and proportion of each component in actual implementation may be arbitrarily changed, and the layout of the components may be more complex.
As shown in fig. 3, the present embodiment provides a defect detection apparatus including: a sample stage 23, a first motion stage, a dual optical system and a second motion stage.
As shown in fig. 4, the sample stage 23 includes a first adsorption area 231, a second adsorption area 233 surrounding the periphery of the first adsorption area 231, and a third adsorption area 235 surrounding the periphery of the second adsorption area 233, where the first adsorption area 231, the second adsorption area 233, and the third adsorption area 235 are provided with a plurality of adsorption pores, and the adsorption pores in the first adsorption area 231, the second adsorption area 233, and the third adsorption area 235 are independently controlled to be opened and closed by a first electromagnetic valve, a second electromagnetic valve, and a third electromagnetic valve, respectively.
As shown in fig. 4, in one embodiment, the first adsorption area 231 is located at a corner area of the sample stage 23, which may be rectangular or square, the second adsorption area 233 is L-shaped around the first adsorption area 231, and the third adsorption area 235 is L-shaped around the second adsorption area 233. In this embodiment, the outer edges of the first, second and third adsorption regions 231, 233 and 235 are provided with the positioning pins 237, and the adjacent edges between the first, second and third adsorption regions 231, 233 and 235 are not provided with the positioning pins 237. The first adsorption region 231 is arranged in the corner region of the sample stage 23, the second adsorption region 233 and the third adsorption region 235 are L-shaped, the positioning pins 237 can be more reasonably arranged, the positioning pins 237 do not influence the combination between adjacent adsorption regions, so that adsorption regions with different sizes can be more reasonably formed, and samples with different sizes can be more firmly adsorbed on the sample stage 23.
Of course, in some other embodiments, the first adsorption zone 231 may be disposed in a central region of the sample stage 23, which may be rectangular, square, or circular, etc., the second adsorption zone 233 may be annular around the first adsorption zone 231, and the third adsorption zone 235 may be annular around the second adsorption zone 233, and is not limited to the examples illustrated herein.
In one embodiment, the first adsorption hole 232 of the first adsorption zone 231 is connected to the first air pipe from below the sample stage 23 through a first rotary joint, the second adsorption hole 234 of the second adsorption zone 233 is connected to the second air pipe from below the sample stage 23 through a second rotary joint, the third adsorption hole 236 of the third adsorption zone 235 is connected to the third air pipe from below the sample stage 23 through a third rotary joint, and the first solenoid valve, the second solenoid valve and the third solenoid valve respectively control the on-off of the air flows of the first air pipe, the second air pipe and the third air pipe.
In this embodiment, when the sample area is smaller than the first adsorption area 231, the sample is placed in the first adsorption area 231 and the first solenoid valve is opened to control the first adsorption hole 232 to adsorb the sample; when the sample area is greater than the first adsorption area 231 and less than the sum of the areas of the first adsorption area 231 and the second adsorption area 233, the sample is placed in the first adsorption area 231 and the second adsorption area 233 and the first solenoid valve and the second solenoid valve are opened to control the first adsorption hole 232 and the second adsorption hole 234 to simultaneously adsorb the sample; when the sample area is greater than the sum of the areas of the first adsorption zone 231 and the second adsorption zone 233 and less than the sum of the areas of the first adsorption zone 231, the second adsorption zone 233 and the third adsorption zone 235, the sample is placed in the first adsorption zone 231, the second adsorption zone 233 and the third adsorption zone 235 and the first solenoid valve, the second solenoid valve and the third solenoid valve are opened to control the first adsorption hole 232, the second adsorption hole 234 and the third adsorption hole 236 to simultaneously adsorb the sample. The application corresponds to the sample size variation, the sample stage 23 adopts a partition mechanism, and each partition can independently start and stop the adsorption function for samples with different sizes so as to cope with the adsorption work of the samples with different sizes and further meet the detection requirements of the samples with different sizes.
As shown in fig. 3, the sample stage 23 is disposed on a first motion stage, and the first motion stage includes a Y-axis motion part 221, a Z-axis motion part 222, and a T-axis motion part 223: the Y-axis moving part 221 is used for up-down sample operation of the sample stage 23 and step movement of the sample stage 23, the Y-axis moving part 221 may be implemented by a horizontal guide rail and a step motor, the Z-axis moving part 222 is used for adjusting the height of the sample stage 23 in the vertical direction, the Z-axis moving part 222 may be implemented by a vertical guide rail and a motor, the T-axis moving part 223 is used for adjusting the angle between the sample stage 23 and the horizontal plane to adapt to image recognition of the sample, and the T-axis moving part 223 may be implemented by a push-pull thimble and a motor, for example.
As shown in fig. 3, the dual optical system includes a first optical module 201 and a second optical module 202 for performing image recognition on the sample stage 23.
In one embodiment, the first optical module 201 and the second optical module 202 may be independently turned on or off to independently scan the sample, or may be turned on or off simultaneously to scan the sample at the same time.
In one embodiment, the first optical module 201 and the second optical module 202 respectively include more than two lenses with different precision.
In one embodiment, the first optical module 201 and the second optical module 202 respectively include more than two lenses with different magnifications.
According to the scheme, the dual-optical system is adopted, each optical module can be provided with lenses with different precision or/and different multiples, the distance between the two optical modules can be changed through the motion system, the high-low test precision can be compatible under the condition of being compatible with the requirements of samples with different sizes, and the measurable product range of equipment on a production line is greatly enriched. Meanwhile, the two optical modules can work simultaneously, which is equivalent to testing double areas at the same time, thereby improving throughput.
As shown in fig. 3, the second motion platform is disposed on the sample stage 23, the dual optical system is disposed on the second motion platform, the second motion platform includes an X-axis scanning motion portion 211 and a Y-axis distance motion portion 212, the X-axis scanning motion portion 211 is configured to drive the dual optical system to perform scanning motion, and the Y-axis distance motion portion 212 is configured to change a distance between the first optical module 201 and the second optical module 202 by moving the first optical module 201 and the second optical module 202, for example, by using a guide rail and a motor, the first optical module 201 and the second optical module 202 can move back to back or move back to back, so as to adjust the distance between the first optical module 201 and the second optical module 202. In one embodiment, the pitch of the first optical module 201 and the second optical module 202 may be set to be between 100 mm and the target pitch. In one embodiment, the distance between the first optical module 201 and the second optical module 202 is set according to the size of the sample, so that the last row (or column) of the scanning area of the first optical module 201 is connected with the first row (or column) of the scanning area of the second optical module 202, and a finished image is formed, which can shorten half of the scanning time and greatly improve the detection efficiency.
As shown in fig. 3 and 5, the defect detecting device is provided with a station 24 to be detected and a station 25 to be detected at both sides, and the defect detecting device further comprises a double-arm robot arm, wherein the distance between the double-arm robot arm and the station 24 to be detected and the sample stage 23 is equal to the distance between the sample stage 23 and the station 25 to be detected, so as to realize simultaneous sampling from the station 24 to be detected and the sample stage 23 or simultaneous placing of samples on the sample stage 23 and the station 25 to be detected. Specifically, after the sample stage 23 moves to the lower position after the test is finished, the two-arm robot can simultaneously take the to-be-tested piece and the test piece from the to-be-tested station 24 and the sample stage 23, and simultaneously place the to-be-tested piece on the sample stage 23 and the test piece on the tested station 25 after the piece is taken, so that the time and the flow required for loading and unloading the piece are greatly shortened.
As shown in fig. 3 and 5, the station 24 and the inspected station 25 are further provided with a first lifting device 241 and a second lifting device 251, respectively, so that the station 24 and the inspected station 25 are maintained at the same height as the sample stage 23.
In the application, three stations (a station 24 to be detected, a sample stage 23 and a detected station 25) are adopted for automatic operation during loading and unloading, so that the waiting time is reduced to the maximum extent.
As described above, the defect detecting apparatus of the present application has the following advantageous effects:
according to the scheme, the dual-optical system is adopted, each optical module can be provided with lenses with different precision or/and different multiples, the distance between the two optical modules can be changed through the motion system, the high-low test precision can be compatible under the condition of being compatible with the requirements of samples with different sizes, and the measurable product range of equipment on a production line is greatly enriched. Meanwhile, the two optical modules can work simultaneously, which is equivalent to testing double areas at the same time, thereby improving throughput.
The application corresponds to the sample size variation, the sample stage 23 adopts a partition mechanism, and each partition can independently start and stop the adsorption function for samples with different sizes so as to cope with the adsorption work of the samples with different sizes and further meet the detection requirements of the samples with different sizes.
In the application, three stations (a station 24 to be detected, a sample stage 23 and a detected station 25) are adopted for automatic operation during loading and unloading, so that the waiting time is reduced to the maximum extent.
Therefore, the application effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present application and its effectiveness, and are not intended to limit the application. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the application. Accordingly, it is intended that all equivalent modifications and variations of the application be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (11)
1. A defect detection apparatus, characterized in that the defect detection apparatus comprises:
a sample stage;
the sample platform is arranged on the first motion platform, and the first motion platform comprises a Y-axis motion part, a Z-axis motion part and a T-axis motion part: the Y-axis movement part is used for carrying out up-and-down sample operation on the sample table and stepping movement on the sample table, the Z-axis movement part is used for adjusting the height of the sample table in the vertical direction, and the T-axis movement part is used for adjusting the angle between the sample table and the horizontal plane so as to adapt to the image recognition of the sample;
the dual-optical system comprises a first optical module and a second optical module and is used for carrying out image recognition on the sample table;
the second motion platform, the second motion platform set up in on the sample platform, dual optical system set up in on the second motion platform, including X axle scanning motion and Y axle interval motion on the second motion platform, X axle scanning motion is used for driving dual optical system is scanning motion, Y axle interval motion is used for through moving first optical module and second optical module with change the interval between first optical module and the second optical module.
2. The defect detection apparatus of claim 1, wherein: the first optical module and the second optical module can be independently turned on or turned off to independently scan the sample, or can be simultaneously turned on or turned off to simultaneously scan the sample.
3. The defect detection apparatus of claim 1, wherein: the first optical module and the second optical module respectively comprise more than two lenses with different precision.
4. The defect detection apparatus of claim 1, wherein: the first optical module and the second optical module respectively comprise more than two lenses with different multiplying powers.
5. The defect detection apparatus of claim 1, wherein: the sample stage comprises a first adsorption zone, a second adsorption zone surrounding the periphery of the first adsorption zone and a third adsorption zone surrounding the periphery of the second adsorption zone, wherein a plurality of adsorption air holes are formed in the first adsorption zone, the second adsorption zone and the third adsorption zone, and the adsorption air holes in the first adsorption zone, the second adsorption zone and the third adsorption zone are respectively controlled to be on-off through a first electromagnetic valve, a second electromagnetic valve and a third electromagnetic valve independently.
6. The defect detection apparatus of claim 5, wherein: the first adsorption zone is located in a corner area of the sample table, the second adsorption zone surrounds the first adsorption zone in an L shape, and the third adsorption zone surrounds the second adsorption zone in an L shape.
7. The defect detection apparatus of claim 5, wherein: the first adsorption hole of the first adsorption zone is connected with a first air pipe through a first rotary joint from the lower part of the sample table, the second adsorption hole of the second adsorption zone is connected with a second air pipe through a second rotary joint from the lower part of the sample table, the third adsorption hole of the third adsorption zone is connected with a third air pipe through a third rotary joint from the lower part of the sample table, and the first electromagnetic valve, the second electromagnetic valve and the third electromagnetic valve respectively control the on-off of the air flows of the first air pipe, the second air pipe and the third air pipe.
8. The defect detection apparatus of claim 5, wherein: the outer side edges of the first adsorption zone, the second adsorption zone and the third adsorption zone are provided with positioning pins, and the adjacent edges among the first adsorption zone, the second adsorption zone and the third adsorption zone are not provided with the positioning pins.
9. The defect detection apparatus of claim 5, wherein: when the area of the sample is smaller than that of the first adsorption zone, the sample is placed in the first adsorption zone, and the first electromagnetic valve is started to control the first adsorption hole to adsorb the sample; when the area of the sample is larger than the sum of the areas of the first adsorption area and the second adsorption area, the sample is placed in the first adsorption area and the second adsorption area, the first electromagnetic valve and the second electromagnetic valve are opened to control the first adsorption hole and the second adsorption hole to adsorb the sample simultaneously; when the area of the sample is larger than the sum of the areas of the first adsorption zone and the second adsorption zone and smaller than the sum of the areas of the first adsorption zone, the second adsorption zone and the third adsorption zone, the sample is placed in the first adsorption zone, the second adsorption zone and the third adsorption zone, and the first electromagnetic valve, the second electromagnetic valve and the third electromagnetic valve are opened to control the first adsorption hole, the second adsorption hole and the third adsorption hole to adsorb the sample at the same time.
10. The defect detection apparatus of claim 1, wherein: the defect detection equipment is characterized in that stations to be detected and detected stations are arranged on two sides of the defect detection equipment, the defect detection equipment further comprises double-arm mechanical arms, the distance between the double-arm mechanical arms and the distance between the stations to be detected and the sample stage is equal to the distance between the sample stage and the detected stations, so that simultaneous sampling from the stations to be detected and the sample stage is achieved, or samples are placed on the sample stage and the detected stations at the same time.
11. The defect detection apparatus of claim 10, wherein: the station to be detected and the detected station are also respectively provided with a first lifting device and a second lifting device, so that the station to be detected and the detected station are kept at the same height with the sample table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310464688.8A CN116609336A (en) | 2023-04-26 | 2023-04-26 | Defect detection apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310464688.8A CN116609336A (en) | 2023-04-26 | 2023-04-26 | Defect detection apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116609336A true CN116609336A (en) | 2023-08-18 |
Family
ID=87684502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310464688.8A Pending CN116609336A (en) | 2023-04-26 | 2023-04-26 | Defect detection apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116609336A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101852744A (en) * | 2009-03-30 | 2010-10-06 | 松下电器产业株式会社 | Imaging check device and imaging check method |
| CN107607138A (en) * | 2016-07-12 | 2018-01-19 | Hb技术有限公司 | Ultrahigh speed with both ends support arm structure repeats detection means |
| CN108291879A (en) * | 2016-05-18 | 2018-07-17 | 韩国机械研究院 | Base board defect detecting device and utilize its detection method |
| CN110658201A (en) * | 2019-09-30 | 2020-01-07 | 苏州精濑光电有限公司 | Optical detection mechanism of diaphragm |
| CN212180652U (en) * | 2020-03-06 | 2020-12-18 | 深圳市鹰眼在线电子科技有限公司 | Jack detection device |
| CN113390896A (en) * | 2021-05-14 | 2021-09-14 | 北京兆维智能装备有限公司 | Defect detection device and method for large-format miniLED panel |
| CN114535841A (en) * | 2022-02-28 | 2022-05-27 | 中钞印制技术研究院有限公司 | Bearing platform and processing equipment |
| CN217638709U (en) * | 2021-12-16 | 2022-10-21 | 苏州镁伽科技有限公司 | Detection platform subassembly and panel detection device |
| CN218213600U (en) * | 2022-09-09 | 2023-01-03 | 纳克微束(北京)有限公司 | Ultrafast jumbo size scanning system |
| WO2023004786A1 (en) * | 2021-07-28 | 2023-02-02 | 上海悦肤达生物科技有限公司 | Feeding system |
-
2023
- 2023-04-26 CN CN202310464688.8A patent/CN116609336A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101852744A (en) * | 2009-03-30 | 2010-10-06 | 松下电器产业株式会社 | Imaging check device and imaging check method |
| CN108291879A (en) * | 2016-05-18 | 2018-07-17 | 韩国机械研究院 | Base board defect detecting device and utilize its detection method |
| CN107607138A (en) * | 2016-07-12 | 2018-01-19 | Hb技术有限公司 | Ultrahigh speed with both ends support arm structure repeats detection means |
| CN110658201A (en) * | 2019-09-30 | 2020-01-07 | 苏州精濑光电有限公司 | Optical detection mechanism of diaphragm |
| CN212180652U (en) * | 2020-03-06 | 2020-12-18 | 深圳市鹰眼在线电子科技有限公司 | Jack detection device |
| CN113390896A (en) * | 2021-05-14 | 2021-09-14 | 北京兆维智能装备有限公司 | Defect detection device and method for large-format miniLED panel |
| WO2023004786A1 (en) * | 2021-07-28 | 2023-02-02 | 上海悦肤达生物科技有限公司 | Feeding system |
| CN217638709U (en) * | 2021-12-16 | 2022-10-21 | 苏州镁伽科技有限公司 | Detection platform subassembly and panel detection device |
| CN114535841A (en) * | 2022-02-28 | 2022-05-27 | 中钞印制技术研究院有限公司 | Bearing platform and processing equipment |
| CN218213600U (en) * | 2022-09-09 | 2023-01-03 | 纳克微束(北京)有限公司 | Ultrafast jumbo size scanning system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4501527A (en) | Device for automatically transporting disk shaped objects | |
| US9851645B2 (en) | Device and method for aligning substrates | |
| TWI411773B (en) | Visual inspection apparatus, visual inspection methdo, and circumference inspection unit attachable to visual inspection apparatus | |
| KR101144593B1 (en) | Wafer Prober for Semiconductor Inspection and Inspection Method | |
| CN101517424B (en) | Wafer inspection system and a method for translating wafers | |
| KR950033489A (en) | Probe System and Probe Method | |
| CN107966458A (en) | A kind of half board checking device of substrate | |
| JP2008311618A (en) | Probe apparatus | |
| JP4214265B2 (en) | Optical measuring device and substrate holding device | |
| CN113488403B (en) | Method for automatically testing wafer based on turntable type testing machine | |
| CN115863197A (en) | Bonded wafer bubble detection device and sorting system | |
| KR102393237B1 (en) | Conductive ball inspection and repair device | |
| KR20000035764A (en) | Visual inspecting method and apparatus | |
| WO2017219448A1 (en) | Detection device and detection method | |
| CN116609336A (en) | Defect detection apparatus | |
| US7400392B2 (en) | Apparatus for handling of a disklike member, especially for handling of a wafer | |
| KR20060093287A (en) | Holder apparatus | |
| US6650769B1 (en) | Review station and appearance inspection device for checking semiconductor wafers | |
| KR101751801B1 (en) | Defect inspecting device for substrate and inspecting method using the same | |
| KR100261325B1 (en) | Method and apparatus for probe testing substrate | |
| US7035003B2 (en) | Microscope arrangement for inspecting a substrate | |
| JP2010261915A (en) | Substrate inspection device | |
| CN220819861U (en) | Automatic chip checking structure | |
| JP7386725B2 (en) | Method for checking the status of electronic component transport equipment, electronic component inspection equipment, and electronic component transport equipment | |
| KR20000031904A (en) | Method and device for inspecting bonding wire |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |