CN115863197A - Bonded wafer bubble detection device and sorting system - Google Patents
Bonded wafer bubble detection device and sorting system Download PDFInfo
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- CN115863197A CN115863197A CN202211524975.5A CN202211524975A CN115863197A CN 115863197 A CN115863197 A CN 115863197A CN 202211524975 A CN202211524975 A CN 202211524975A CN 115863197 A CN115863197 A CN 115863197A
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Abstract
The invention relates to the technical field of semiconductor manufacturing, and particularly discloses a bonded wafer bubble detection device and a sorting system. The device is used for detecting the bonded wafer and comprises a platform and a wafer carrying platform; the platform is provided with an infrared light source and a detection module, the infrared light source is used for irradiating the bonded wafer positioned at the detection position, the detection module comprises an upright post, a first visual detection unit fixedly arranged on the upright post and a second visual detection unit movably arranged on the upright post, the first visual detection unit is over against the detection position, the second visual detection unit is selectively arranged between a connecting line of the first visual detection unit and the detection position, and the platform is provided with at least two bearing positions; the wafer carrying platforms and the carrying positions are the same in number and correspond to each other, and the wafer carrying platforms and the carrying positions are used for moving the bonded wafer between the detection position and one carrying position. The device has optimized the detection flow through the design that a plurality of wafer microscope carriers share same detection module, has improved detection efficiency, simultaneously with the help of detection module's improvement, makes things convenient for the switching of visual detection mode.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a bonded wafer bubble detection device and a sorting system.
Background
With the advent of post-moore's law, the size of transistors in semiconductor manufacturing processes has approached physical limits, posing significant challenges to chip fabrication. In order to ensure the integration degree per unit area, a wafer bonding method may be used to bond different wafers to improve the integration degree. In the wafer bonding process, two wafers are usually bonded face to face, and a certain pressure, temperature, voltage, etc. are applied to the two wafers to generate covalent bonds, metallic bonds, molecular bonds, etc. at the interface of the two wafers, so that the two wafers are combined into a bonded wafer. During the bonding process of the wafer, when air at the bonding interface is not discharged in time or fine particles exist at the bonding interface, bubble (Bubble) defects are often formed at the bonding interface.
At present, the bubble defect of the bonding interface of the bonded wafer is mainly detected by using an ultrasonic detection mode. The ultrasonic detection method requires that the bonded wafer is placed in a liquid medium, so that the detection speed is slow and the bonded wafer is easily polluted. Meanwhile, after any bonded wafer is detected, the conventional detection device needs to stop to wait for blanking of the current bonded wafer and feeding of the next pair of bonded wafers, so that a large amount of time is wasted in the blanking and feeding processes of the bonded wafers.
Therefore, it is desirable to provide a detection apparatus capable of detecting the bubble defect of the bonded wafer in batch and fast.
Disclosure of Invention
The invention aims to provide a bonded wafer bubble detection device and a sorting system, so as to optimize the detection flow of the bubble defect of the bonded wafer, facilitate the switching of a visual detection mode and improve the detection efficiency.
In order to achieve the purpose, the invention adopts the following technical scheme:
the bonded wafer bubble detection device is used for detecting a bonded wafer and comprises a platform and a wafer carrying platform; the platform is provided with an infrared light source and a detection module, the infrared light source is used for irradiating the bonded wafer at a detection position, the detection module comprises an upright post, a first visual detection unit fixedly arranged on the upright post and a second visual detection unit movably arranged on the upright post, the first visual detection unit is over against the detection position, the second visual detection unit is selectively arranged between a connecting line of the first visual detection unit and the detection position, and the platform is provided with at least two bearing positions; the wafer carrying platforms are the same in number and correspond to the bearing positions one by one, and the wafer carrying platforms are used for moving the bonded wafer between the detection position and one bearing position.
As a preferred technical solution of the bonded wafer bubble detection apparatus, the detection module further includes a linear actuator, and the linear actuator is used for controlling the second visual detection unit to switch between a shielding position and an avoiding position; when the second visual detection unit is located at the shielding position, the second visual detection unit receives the light of the infrared light source passing through the bonded wafer located at the detection position, and when the second visual detection unit is located at the avoiding position, the first visual detection unit receives the light of the infrared light source passing through the bonded wafer located at the detection position.
As a preferred technical solution of the bonded wafer bubble detection apparatus, the second visual detection unit is fixedly connected to the linear actuator, the upright column is provided with an actuator slide rail, the linear actuator is slidably disposed on the actuator slide rail, and the linear actuator can drive the second visual detection unit to move between the shielding position and the avoiding position.
As a preferred technical solution of the bonded wafer bubble detection apparatus, the platform is provided with first slide rails, the first slide rails are the same in number as the wafer carrying stages and correspond to the wafer carrying stages one by one, and the first slide rails enable the wafer carrying stages to slide between the detection position and one of the bearing positions.
As an optimal technical scheme of the bonded wafer bubble detection device, the wafer carrier comprises a first sliding table, a second sliding table and a carrier main body, the first sliding table is slidably arranged on the first sliding rail, the first sliding table is provided with a second sliding rail, the extending direction of the second sliding rail and the corresponding extending direction of the first sliding rail form an included angle, the second sliding table is slidably arranged on the second sliding rail, the carrier main body is fixedly connected to the second sliding table, and the carrier main body is used for bearing the bonded wafer.
As a preferred technical scheme of the bonded wafer bubble detection device, the number of the bearing positions is two, the two first sliding rails are connected end to end and extend along a first direction, and the detection position is located between the two bearing positions.
As a preferable technical solution of the bonded wafer bubble detection apparatus, the second slide rail extends along a second direction, and the first direction and the second direction are perpendicular to each other and both located in a horizontal plane.
As a preferred technical solution of the bonded wafer bubble detecting device, the infrared light source, the detecting position, and the first visual detecting unit are arranged from bottom to top along a third direction, and the third direction is perpendicular to the first direction and the second direction.
The bonded wafer sorting system comprises a mechanical arm, a first loading and unloading module, a second loading and unloading module and the bonded wafer bubble detection device, wherein one of the first loading and unloading module and the second loading and unloading module is used for collecting the bonded wafer qualified in detection, and the other one of the first loading and unloading module and the second loading and unloading module is used for collecting the bonded wafer unqualified in detection; the mechanical arm can place the bonded wafer at the bearing position or take the bonded wafer at the bearing position.
As an optimal technical scheme of a bonded wafer sorting system, the first loading and unloading module is used for collecting the bonded wafers which are unqualified in detection, and the second loading and unloading module is used for collecting the bonded wafers to be detected and the bonded wafers which are qualified in detection; the mechanical arm can convey the bonded wafer to be detected to the bonded wafer bubble detection device from the second loading and unloading module, convey the bonded wafer qualified in detection to the second loading and unloading module, and convey the bonded wafer unqualified in detection to the first loading and unloading module.
The invention has the beneficial effects that:
according to the bonded wafer bubble detection device, the second visual detection unit is arranged, so that an operator can select whether the first visual detection unit or the second visual detection unit receives detection light formed after infrared monochromatic light passes through a bonded wafer and obtains a detection image, the detection mode of the detection module can be freely switched, the detection capability of the bonded wafer bubble detection device is improved, and the detection efficiency of the bonded wafer bubble detection device is improved. And a plurality of wafer bearing platforms share the layout of the same detection module, so that the detection module is fully utilized, the condition that the detection module is stopped and waits is avoided, the working process of the bonded wafer bubble detection device is optimized, and the reasonable layout of the detection operation is realized, so that the time for feeding and discharging the bonded wafer is saved, the detection efficiency is improved, the cost of the bonded wafer bubble detection device is reduced by only arranging one detection module, and the occupied space is reduced.
Drawings
Fig. 1 is a schematic structural diagram of a bonded wafer sorting system according to an embodiment of the present invention;
FIG. 2 is a side view of a bonded wafer bubble detection apparatus in a fast detection mode according to an embodiment of the present invention;
fig. 3 is a side view of a bonded wafer bubble detection apparatus in a high-precision detection mode according to an embodiment of the present invention.
In the figure:
100. a platform; 200. a mechanical arm; 300. a wafer carrier; 310. a first sliding table; 320. a second sliding table; 330. a stage main body; 400. an infrared light source; 500. a detection module; 510. a column; 520. a first visual detection unit; 530. a second vision detection unit; 540. a linear actuator; 550. an actuator sled; 600. a first loading and unloading module; 610. a first FOUP; 620. a first wafer handler; 700. a second loading and unloading module; 710. a second FOUP; 720. a second wafer loader; 900. bonding the wafer;
x, a first direction; y, a second direction; z, third direction.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Where the terms "first position" and "second position" are two different positions, and where a first feature is "over", "above" and "on" a second feature, it is intended that the first feature is directly over and obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
As shown in fig. 1-3, the present embodiment provides a bonded wafer bubble detection apparatus for detecting a bonded wafer 900, including a stage 100 and a wafer stage 300; the platform 100 is provided with an infrared light source 400 and a detection module 500, the infrared light source 400 is used for irradiating the bonded wafer 900 located at a detection position, the detection module 500 comprises a column 510, a first visual detection unit 520 fixedly arranged on the column 510 and a second visual detection unit 530 movably arranged on the column 510, the first visual detection unit 520 is over against the detection position, the second visual detection unit 530 is selectively arranged between a connecting line of the first visual detection unit 520 and the detection position, and the platform 100 is provided with at least two bearing positions; the number of the wafer stages 300 is the same as that of the carrying positions, and the wafer stages 300 correspond to each other one by one, and the bonded wafer 900 is moved between the detection position and one carrying position by the wafer stages 300.
According to the bonded wafer bubble detection device, the second visual detection unit 530 is arranged, so that an operator can select the detection light formed by the first visual detection unit 520 or the second visual detection unit 530 after the infrared monochromatic light passes through the bonded wafer 900 and obtain a detection image, the detection mode of the detection module 500 can be freely switched, the detection capability of the bonded wafer bubble detection device is improved, and the detection efficiency of the bonded wafer bubble detection device is improved. And a plurality of wafer carriers 300 share the layout of the same detection module 500, so that the detection module 500 is fully utilized, the condition that the detection module 500 is stopped and waits is avoided, the working flow of the bonded wafer bubble detection device is optimized, and the reasonable layout of the detection operation is realized, thereby saving the time for feeding and discharging the bonded wafer 900, improving the detection efficiency, reducing the cost of the bonded wafer bubble detection device by only arranging one detection module 500, and reducing the occupied space.
In the present embodiment, the first visual inspection unit 520 is a fast vision lens, which is used for fast inspection of the bonded wafer 900 and supports bubble inspection with a diameter greater than 1000 μm; the second vision inspection unit 530 is a high-precision vision lens for performing high-precision inspection on the bonded wafer 900, and supports bubble inspection with a minimum diameter of 50 μm.
Specifically, when the detection module 500 receives the detection light by using the first visual detection unit 520, the bonded wafer bubble detection apparatus is in the fast detection mode; when the inspection module 500 receives the inspection light using the second visual inspection unit 530, the bonded wafer bubble inspection apparatus is in a high-precision inspection mode.
The degree of damage due to the bonded wafer 900 is directly related to the size of the bubble diameter. Therefore, the flow of the inspection operation requires a fast mode that can support high-speed batch inspection of the bonded wafers 900 and a high-precision mode that can support an operator to study minute defects in the bonding process.
The fast detection mode differs from the high-precision detection mode in that the detection field of view of the fast detection mode is five to ten times that of the high-precision detection mode, but correspondingly, the visual resolution of the high-precision detection mode is five to ten times that of the fast detection mode. Therefore, the detection rate in the fast detection mode is greater than that in the high-precision detection mode, and the resolution in the fast detection mode is lower than that in the high-precision detection mode.
In this embodiment, the detection module 500 further comprises a linear actuator 540, the linear actuator 540 being configured to control the second vision detection unit 530 to switch between the shielding position and the avoidance position; when the second vision inspection unit 530 is in the shielding position, the second vision inspection unit 530 receives the light of the infrared light source 400 passing through the bonded wafer 900 located at the inspection position, and when the second vision inspection unit 530 is in the avoiding position, the first vision inspection unit 520 receives the light of the infrared light source 400 passing through the bonded wafer 900 located at the inspection position.
The mode of shielding the first vision detection unit 520 by using the vision software system is simple and reliable in design for preventing the first vision detection unit 520 from receiving light, so that the detection result of the second vision detection unit 530 is ensured not to be interfered, and the smooth operation of the detection module 500 is ensured. Above design is simple reliable, and occupation space is little and job stabilization nature is high, has ensured that detection module 500's detection mode can be selected by operating personnel, has reduced the degree of difficulty of mode switch, has still improved detection module 500's work flexibility simultaneously, has guaranteed the accuracy of testing result.
Further, the second vision detecting unit 530 is fixedly connected to the linear actuator 540, the upright column 510 is provided with an actuator slide rail 550, the linear actuator 540 is slidably disposed on the actuator slide rail 550, and the linear actuator 540 can drive the second vision detecting unit 530 to move between the shielding position and the avoiding position. The design is simple and reliable, the second visual detection unit 530 can be ensured to be smoothly switched between the shielding position and the avoiding position, the switching difficulty of the detection mode is further reduced, and therefore the working efficiency of the bonded wafer bubble detection device is further improved.
In this embodiment, the platform 100 has a first slide rail, the number of the first slide rail is the same as that of the wafer stage 300, and the first slide rail corresponds to the wafer stage 300 one by one, and the first slide rail enables the wafer stage 300 to slide between the detection position and a carrying position. The design is simple and reliable, the occupied space is small, the production cost is low, the action that the wafer carrying platform 300 drives the bonded wafer 900 to move between the detection position and the bearing position can be smoothly and efficiently finished, and the working efficiency of the bonded wafer bubble detection device is further improved.
Further, the wafer carrier 300 includes a first sliding table 310, a second sliding table 320, and a carrier main body 330, the first sliding table 310 is slidably disposed on a first sliding rail, the first sliding table 310 is provided with a second sliding rail, an extending direction of the second sliding rail forms an included angle with an extending direction of the corresponding first sliding rail, the second sliding table 320 is slidably disposed on the second sliding rail, the carrier main body 330 is fixedly connected to the second sliding table 320, and the carrier main body 330 is used for bearing the bonded wafer 900.
The design that the second sliding table 320 slides relative to the first sliding table 310 can be matched with the design that the first sliding table 310 slides relative to the platform 100, so that the fine adjustment of the position of the bonded wafer 900 is facilitated, the complete collection operation of the detection image of the bonded wafer 900 by the detection module 500 is facilitated, and the subsequent work is further facilitated. The detection effect is further improved by the improvement, and the accuracy of the detection result is guaranteed.
Preferably, the bearing positions are two, the two first sliding rails are connected end to end and extend along the first direction X, and the detection position is located between the two bearing positions. The design is simple and reliable, the occupied space is small, the layout is easy, the risk of position conflict among the wafer carrying platforms 300 is low, and the working efficiency of the bonded wafer bubble detection device is further improved.
In this embodiment, the loading and unloading process of one wafer stage 300 and the inspection process of the other wafer stage 300 are performed in synchronization. In practical engineering, the two wafer stages 300 can ensure that the detection module 500 can continuously operate without stopping, thereby meeting the design objective of the present embodiment.
Furthermore, the second slide rail extends along a second direction Y, and the first direction X and the second direction Y are mutually vertical and are both positioned in a horizontal plane; the infrared light source 400, the sensing position, and the first visual sensing unit 520 are arranged from bottom to top along a third direction Z, which is perpendicular to the first direction X and the second direction Y. The design is simple and reliable, the reasonable layout of the bonded wafer bubble detection device is realized, the occupied space of the bonded wafer bubble detection device is reduced, the risk of position conflict among all components is reduced, the influence of the weight of all components and the bonded wafer 900 on the wafer carrying platform 300 on the detection operation is avoided, and the working stability of the bonded wafer bubble detection device is greatly improved.
The present embodiment further provides a bonded wafer sorting system, which includes a robot 200, a first handling module 600, a second handling module 700, and the above-mentioned bonded wafer bubble detection apparatus, wherein one of the first handling module 600 and the second handling module 700 is used for collecting bonded wafers 900 that are qualified for detection, and the other is used for collecting bonded wafers 900 that are unqualified for detection; the robot 200 can place the bonded wafer 900 at the loading position or take the bonded wafer 900 at the loading position. The arrangement of the bonded wafer sorting system is beneficial to improving the working efficiency of the bonded wafer bubble detection device, ensures smooth feeding and discharging of the bonded wafer 900, improves the automation degree of carrying and sorting the bonded wafer 900, reduces the problem caused by misoperation, and improves the sorting accuracy of the bonded wafer 900.
In this embodiment, the first handling module 600 is configured to collect the bonded wafer 900 that is not qualified for detection, and the second handling module 700 is configured to collect the bonded wafer 900 to be detected and the bonded wafer 900 that is qualified for detection; the robot 200 can transfer the bonded wafer 900 to be detected from the second handling module 700 to the bonded wafer bubble detecting apparatus, transfer the bonded wafer 900 that is qualified for detection to the second handling module 700, and transfer the bonded wafer 900 that is unqualified for detection to the first handling module 600. The cost of the bonded wafer sorting system is reduced and the occupied space is reduced by locating the collection space of the qualified bonded wafer 900 and the storage space of the bonded wafer 900 to be detected in the second handling module 700.
In this embodiment, the first handler module 600 includes a first FOUP610 and a first wafer handler 620, the first wafer handler 620 communicatively coupled to the first FOUP610; the second handling module 700 includes a second FOUP710 and a second wafer handler 720. The second wafer handler 720 is communicatively coupled to the second FOUP710. A Front Opening Unified Pod (FOUP) is used to collect the bonded wafer 900, and a wafer handler can control Opening and closing of the corresponding FOUP.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. Bonded wafer bubble detection apparatus for detecting a bonded wafer (900), comprising:
the bonding wafer detection device comprises a platform (100), an infrared light source (400) and a detection module (500) are installed on the platform, the infrared light source (400) is used for irradiating a bonding wafer (900) located at a detection position, the detection module (500) comprises a stand column (510), a first visual detection unit (520) fixedly arranged on the stand column (510) and a second visual detection unit (530) movably arranged on the stand column (510), the first visual detection unit (520) is over against the detection position, the second visual detection unit (530) is selectively arranged between a connecting line of the first visual detection unit (520) and the detection position, and the platform (100) is provided with at least two bearing positions;
the wafer carrying stages (300) are the same in number and correspond to the carrying positions one by one, and the wafer carrying stages (300) are used for moving the bonded wafer (900) between the detection position and one carrying position.
2. The bonded wafer bubble detection apparatus of claim 1, wherein the detection module (500) further comprises a linear actuator (540), the linear actuator (540) being configured to control the second visual detection unit (530) to switch between a blocking position and an escape position; when the second vision detection unit (530) is in the shielding position, the second vision detection unit (530) receives the light of the infrared light source (400) passing through the bonded wafer (900) in the detection position, and when the second vision detection unit (530) is in the avoiding position, the first vision detection unit (520) receives the light of the infrared light source (400) passing through the bonded wafer (900) in the detection position.
3. The bonded wafer bubble detecting apparatus according to claim 2, wherein the second vision detecting unit (530) is fixed to the linear actuator (540), the column (510) is provided with an actuator slide rail (550), the linear actuator (540) is slidably disposed on the actuator slide rail (550), and the linear actuator (540) can drive the second vision detecting unit (530) to move between the shielding position and the avoiding position.
4. The bonded wafer bubble detection apparatus according to claim 1, wherein the platform (100) has a first slide rail, the first slide rail corresponds to the wafer stages (300) in the same number, and the first slide rail enables the wafer stages (300) to slide between the detection position and one of the carrying positions.
5. The bonded wafer bubble detection device according to claim 4, wherein the wafer stage (300) comprises a first sliding table (310), a second sliding table (320), and a stage main body (330), the first sliding table (310) is slidably disposed on the first sliding rail, the first sliding table (310) is provided with a second sliding rail, an extending direction of the second sliding rail forms an included angle with an extending direction of the corresponding first sliding rail, the second sliding table (320) is slidably disposed on the second sliding rail, the stage main body (330) is fixedly connected to the second sliding table (320), and the stage main body (330) is configured to bear the bonded wafer (900).
6. The bonded wafer bubble detection apparatus according to claim 5, wherein there are two of the carrying positions, two of the first slide rails are connected end to end and both extend along the first direction (X), and the detection position is located between the two carrying positions.
7. The bonded wafer bubble detection apparatus of claim 6, wherein the second slide rail extends along a second direction (Y), and the first direction (X) and the second direction (Y) are perpendicular to each other and both lie in a horizontal plane.
8. The bonded wafer bubble detection apparatus of claim 7, wherein the infrared light source (400), the detection position, and the first visual detection unit (520) are arranged from bottom to top along a third direction (Z) that is perpendicular to the first direction (X) and the second direction (Y).
9. A bonded wafer sorting system, comprising a robot (200), a first handling module (600), a second handling module (700), and the bonded wafer bubble detection apparatus of any one of claims 1-8, wherein one of the first handling module (600) and the second handling module (700) is configured to collect the bonded wafer (900) that is qualified for inspection, and the other is configured to collect the bonded wafer (900) that is unqualified for inspection; the mechanical arm (200) can place the bonded wafer (900) at the carrying position or take the bonded wafer (900) at the carrying position.
10. The bonded wafer sorting system of claim 9, wherein the first handling module (600) is configured to collect the bonded wafers (900) that are not qualified for inspection, and the second handling module (700) is configured to collect the bonded wafers (900) to be inspected and the bonded wafers (900) that are qualified for inspection; the mechanical arm (200) can convey the bonded wafer (900) to be detected to the bonded wafer bubble detection device from the second loading and unloading module (700), convey the bonded wafer (900) qualified in detection to the second loading and unloading module (700), and convey the bonded wafer (900) unqualified in detection to the first loading and unloading module (600).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211524975.5A CN115863197A (en) | 2022-11-30 | 2022-11-30 | Bonded wafer bubble detection device and sorting system |
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| CN202211524975.5A CN115863197A (en) | 2022-11-30 | 2022-11-30 | Bonded wafer bubble detection device and sorting system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116913797A (en) * | 2023-07-14 | 2023-10-20 | 无锡九霄科技有限公司 | Wafer bonding quality detection device |
| CN117690820A (en) * | 2024-02-04 | 2024-03-12 | 无锡星微科技有限公司 | Bonded wafer bubble detection device and sorting method |
-
2022
- 2022-11-30 CN CN202211524975.5A patent/CN115863197A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116913797A (en) * | 2023-07-14 | 2023-10-20 | 无锡九霄科技有限公司 | Wafer bonding quality detection device |
| CN116913797B (en) * | 2023-07-14 | 2024-02-13 | 无锡九霄科技有限公司 | Wafer bonding quality detection device |
| CN117690820A (en) * | 2024-02-04 | 2024-03-12 | 无锡星微科技有限公司 | Bonded wafer bubble detection device and sorting method |
| CN117690820B (en) * | 2024-02-04 | 2024-04-09 | 无锡星微科技有限公司 | Bonded wafer bubble detection device and sorting method |
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