CN220761339U - Laser processing equipment and wafer production line - Google Patents

Abstract

The utility model relates to laser processing equipment and a wafer production line, which are suitable for carrying out laser processing on a wafer through a laser device; the laser device is arranged at the tail end of the feeding device in the feeding direction and at the head end of the discharging device in the discharging direction; the feeding device is suitable for conveying the workpiece for the laser device; the blanking device is suitable for conveying the workpiece processed by the laser device; the laser device comprises at least two lasers, one corresponding to each workpiece, and the lasers are suitable for emitting laser light to the workpiece below the lasers; the device has the advantages that through the two combined transmission modes of the workpiece conveying direct-current flow channel and the laser processing station turntable, the wafer can be reduced to a certain extent and is frequently adsorbed, hidden cracks, unfilled corners and other physical injuries are easily caused, the advantages of stability, high speed and small inertia of the direct-current flow channel are combined, the turntable is combined with direct-current conveying, and the efficiency is improved while the equipment stability is ensured.

Description

Laser processing equipment and wafer production line

Technical Field

The utility model belongs to the technical field of laser processing, and particularly relates to laser processing equipment and a wafer production line.

Background

Solar energy is one of the best schemes for replacing traditional energy sources because of its cleanliness and reproducibility. With research and technical development for many years, the price of solar photovoltaic modules has been greatly reduced, and the solar energy conversion efficiency has also been improved. In the prior art, laser processing is performed in a mode that one laser is matched with two table tops of a large field lens; however, if the laser or the laser fails or the precision shifts, the half-side machine needs to be shut down, maintained and adjusted, and the running productivity of the whole equipment is lowered; the existing automation equipment runs ct which is insufficient to cover the capacity of a host computer; the number of the flow passage flower baskets is small, and frequent replacement is needed; the operator is required to manually carry the empty flower basket, and labor and time of a production line are wasted; the solid mesa is used before the processing mesa of doping, for the stability of equipment and the consideration of mesa weight, but now use high-power laser, the focus of laser is probably in the solid part of mesa, and long-term laser focusing can lead to metal mesa to generate heat, send out scalding on the mesa, produces deformation, inflation, then influences mesa level, influences processing effect and precision, also has very big potential safety hazard simultaneously.

Therefore, a new laser processing apparatus and wafer production line are required to be designed based on the above technical problems.

Disclosure of Invention

The utility model aims to provide laser processing equipment and a wafer production line so as to solve the technical problems of low laser processing productivity and stability.

In order to solve the above technical problems, the present utility model provides a laser processing apparatus comprising:

the device comprises a feeding device, a laser device and a discharging device;

the laser device is suitable for carrying out laser processing on a workpiece; the laser device is arranged at the tail end of the feeding direction of the feeding device and the head end of the discharging direction of the discharging device; the feeding device is suitable for conveying the workpiece to the laser device; the blanking device is suitable for conveying the workpiece processed by the laser device; the laser device comprises at least two lasers, one corresponding to each of the workpieces, the lasers being adapted to emit laser light onto the workpieces located therebelow.

Further, the laser device is provided with a processing station, a conversion station and a turntable, the turntable rotates to alternate the workpiece on the processing station and the conversion station, and the laser is positioned above the processing station.

Further, the turntable alternates the work pieces on the processing station and the converting station by rotating 180 °.

Further, an image acquisition device is arranged above the conversion station and used for acquiring the workpiece information, and the number of the image acquisition devices is in one-to-one correspondence with the number of the lasers.

Further, the turntable includes two ends, at least two pallets being provided at either end, the pallets on one end being located on the converting station when the pallets on the other end are located on the processing station; the laser is used for carrying out laser processing on the workpiece on the supporting table on the processing station, and the workpiece carried on the supporting table on the conversion station is a workpiece to be processed or a workpiece after processing.

Further, a cold water channel is formed in the tray.

Further, the device is arranged close to the feeding device, the laser device and the discharging device, and the device transfers the workpiece from the feeding device to the conversion station and/or transfers the workpiece from the conversion station to the discharging station.

The device is arranged close to the feeding device, the laser device and the discharging device, and can drive at least two workpieces to be transported between the feeding device and the laser device and/or between the laser device and the discharging device.

Further, the ion air knife device is arranged on the feeding device and/or the discharging device.

Further, loading attachment still includes: the first detection mechanism, the first carrying device and the first NG material box; the first detection mechanism is arranged in the feeding direction of the feeding flow channel and is suitable for detecting the workpiece; the first carrying device is arranged on one side of the first detection mechanism; the first handling device is adapted to place the damaged workpiece in the first NG magazine when the first detection mechanism detects the workpiece damage; and/or

The loading attachment still includes: the first detection mechanism, the first carrying device and the first NG material box;

the second detection mechanism is arranged in the blanking direction of the blanking flow channel and is suitable for detecting a workpiece; the second handling device is arranged on one side of the second detection mechanism, and the second handling device detection mechanism is suitable for placing the damaged workpiece in the second NG material box when the second detection mechanism detects the workpiece damage.

In a second aspect, the present utility model also provides a wafer production line using the above laser processing apparatus, including:

the base is symmetrically arranged on the two sets of laser processing equipment on the base, and a separation plate is arranged between the laser processing equipment.

The workpiece can be a silicon wafer, a battery piece or a wafer waiting workpiece.

The utility model has the beneficial effects that the feeding device, the laser device and the blanking device are adopted; the laser device is suitable for carrying out laser processing on the wafer; the laser device is arranged at the tail end of the feeding direction of the feeding device and the head end of the discharging direction of the discharging device; the feeding device is suitable for conveying the wafer for the laser device; the blanking device is suitable for conveying the wafer processed by the laser device; the laser device comprises at least two lasers, one corresponding to each of the wafers, the lasers being adapted to emit laser light onto the wafer below; the wafer conveying direct-current runner and laser processing station turntable combined conveying mode is achieved, the wafer can be reduced to a certain extent and is frequently adsorbed, hidden cracks, unfilled corners and other physical injuries are easily caused, the advantages of stable direct-current runner, high speed and small inertia are combined, the turntable is combined with direct-current conveying, and the efficiency is improved while the equipment stability is guaranteed.

Additional features and advantages of the utility model will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model. The objectives and other advantages of the utility model will be realized and attained by the structure particularly pointed out in the written description and drawings.

In order to make the above objects, features and advantages of the present utility model more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural view of a laser processing apparatus of the present utility model;

FIG. 2 is a schematic diagram of a wafer fabrication line according to the present utility model;

fig. 3 is a top view of the wafer fabrication line of the present utility model.

In the figure:

1 a laser device, 11 a laser device, 12 a turntable, 13 a saddle, 14 a dust hood and 15 an image acquisition device;

2 a feeding device, 21 a first feeding runner, 22 a feeding ion air knife, 23 a detection mechanism, 24 a first carrying device, 25 a first NG material box, 26 a second feeding runner and 27 a carrying device;

3 blanking device, 31 first blanking runner, 32 second ion air knife, 33 second blanking runner, 34 whole plate arranging mechanism, 35 buffer mechanism, 36 third blanking runner, 37 second detecting mechanism, 38 second carrying device, 39 second NG material box;

41 separator, 42 upper base, 43 lower base.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Embodiment 1 as shown in fig. 1 to 3, the present embodiment 1 provides a laser processing apparatus including: a feeding device 2, a laser device 1 and a discharging device 3; the laser device 1 is arranged at the tail end of the feeding direction of the feeding device 2, and the laser device 1 is arranged at the head end of the discharging direction of the discharging device 3; the loading device 2 is suitable for transporting a wafer to the laser device 1; the laser device 1 is suitable for carrying out laser processing on a wafer; the blanking device 3 is suitable for blanking the wafer after laser processing; the rotary laser processing equipment for realizing simultaneous processing of four-station lasers is simultaneously matched with the capacity of the existing PERC production line, and has low reconstruction and upgrading cost, short time consumption and high equipment compatibility; and realized through having set up the transport mode that two kinds of combination of wafer transportation direct current runner (realize the transportation of direct current through loading attachment 2 and unloader 3) and laser processing station carousel (through), can reduce the wafer to a certain extent by frequent absorption, cause hidden crack, unfilled corner etc. physical injury easily, combined the advantage that direct current runner is stable, high-speed, inertia is little again, combined carousel processing and direct current transportation, promoted efficiency in the time of guaranteeing equipment stability.

In this embodiment, the laser device 1 is disposed at a tail end of the feeding direction of the feeding device 2 and a head end of the discharging direction of the discharging device 3; the feeding device 2 is suitable for conveying the wafer for the laser device 1; the blanking device 3 is suitable for conveying the wafer processed by the laser device 1; the laser device 1 comprises at least two lasers 11, said one laser 11 corresponding to one of said wafers, said laser 11 being adapted to emit laser light onto said wafer located therebelow; the dust hood 14 is arranged below the laser 11, so that the influence of dust on the laser effect of the laser 11 is avoided.

The laser device 1 is provided with a processing station, a conversion station and a turntable 12, the turntable 12 alternates the wafers on the processing station and the conversion station by rotating, and the laser 11 is positioned above the processing station.

The turntable alternates the wafers on the processing station and the converting station by rotating 180 °.

An image acquisition device 15 is arranged above the conversion station and is used for acquiring the wafer information, and the number of the image acquisition devices 15 is in one-to-one correspondence with the number of the lasers.

The turntable 12 comprises two ends, at least two pallets 13 are arranged at any one end, and when the pallet 13 on one end is positioned at the processing station, the pallet 13 on the other end is positioned at the conversion station; the laser 11 performs laser processing on the wafer on the supporting table 13 at the processing station, and the wafer carried on the supporting table 13 at the converting station is a wafer to be processed or a wafer after processing.

Further, in other embodiments, a cold water channel is formed inside the tray table 13.

The supporting table 13 comprises a table top fixing piece and a table top body arranged at the end part of the table top fixing piece; the whole rectangle form that is of mesa body, the inside cold water passageway of having seted up of mesa body, the both ends of cold water passageway are connected and are linked together with two water ports respectively, and two water ports set up in one side of mesa body, can realize the circulation of water in mesa main part 2 through above-mentioned setting, keep the water that has the low temperature continuously to get into in the mesa body.

When a high-power laser is used, the focus of laser is possibly at the solid part of the table top, long-term laser focusing on the table top can lead to the problems of metal table top heating, scalding, deformation and expansion, and then the table top level, the processing effect and the processing precision are affected. If the metal table top is adopted, the metal table top can not be cooled independently, creep deformation, fracture, stress relaxation and other denaturation processes are easy to occur after the metal is expanded with heat and contracted with cold, the flatness of the table top is affected, the precision is deteriorated, the stability of the processing effect is deteriorated and the like. The cold water channel is arranged in the supporting table 13, so that the problems can be avoided, the temperature of the supporting table 13 can be effectively reduced through the water cooling channel in the table top, and the influence on the machining precision is avoided.

The independent lasers 11 are independently controlled, the independent lasers are provided with independent light paths, optical components such as vibrating mirrors and field lenses, and the single light path is independently controlled, so that the design is simpler to install and debug, the laser stability is high, the lasers of each station are not interfered with each other, if one laser 11 fails or the precision is offset, only 1/4 of equipment is required to be stopped for adjustment, the equipment opening rate is greatly improved, and the productivity of a production line is maintained; the plurality of pallets 13 can transport and receive a plurality of wafers, and improve the efficiency of laser processing.

In fig. 1, a feeding direction, which is a direction in which the wafer is conveyed by the feeding device 2, and a discharging direction, which is a direction in which the wafer is conveyed by the discharging device 3, are shown. The processing station is located below the laser and used for carrying out laser processing on an area, the conversion station is located below the image acquisition device 15 and used for carrying out information acquisition on a wafer, the image acquisition device 15 acquires the position information of the wafer and transmits the information to the laser so that the laser can finish laser processing.

In this embodiment, the handling device 27 is disposed near the feeding device 2, the laser device 1 and the discharging device 3, and the handling device 27 transfers the wafer from the feeding device 2 to the converting station and/or transfers the wafer from the converting station to the discharging station. At least two wafers can be driven to be transported between the feeding device 2 and the laser device 1 and/or between the laser device 1 and the discharging device 3.

In this embodiment, the feeding device 2 includes: a first feeding runner 21 and a feeding ion air knife 22; the first feeding flow channel 21 is suitable for transporting wafers; the feeding ion air knife 22 is arranged on the first feeding flow channel 21, and the feeding ion air knife 22 is suitable for removing dust and static electricity on the wafer on the first feeding flow channel 21; through setting up material loading ion air knife 22 on first material loading runner 21, can last to remove dust and destatics to all wafers on the first material loading runner 21, ensure laser processing's effect.

In this embodiment, the feeding device 2 further includes: a first detection mechanism 23, a first handling device 24 and a first NG magazine 25; the first detecting mechanism 23 is arranged at the tail end of the first feeding runner 21 in the conveying direction, and the first detecting mechanism 23 is suitable for detecting wafers; the first carrying device 24 is arranged at one side of the first detection mechanism 23; the first handling means 24 is adapted to place damaged wafers in the first NG magazine 25 when the first detection mechanism 23 detects a wafer damage; the wafer can be detected at the first detection mechanism 23 after the dust removal and static removal of the wafer by the feeding ion air knife 22, the first detection mechanism 23 has aoi functions and is responsible for detecting the functions of edge breakage, unfilled corner and the like of the incoming wafer, when the wafer is damaged, the damaged wafer is moved into the first NG material box 25 by the first carrying device 24, the first carrying device 24 can adopt a manipulator sucker, and the damaged wafer can be stably and accurately moved into the first NG material box 25.

In this embodiment, the feeding device 2 further includes: a second loading channel 26; the transportation direction of the second feeding runner 26 is the same as the transportation direction of the first feeding runner 21; the second feeding flow passage 26 and the first feeding flow passage 21 are positioned on the same straight line; the first carrying device 24 is arranged between the first feeding runner 21 and the second feeding runner 26; the moving device 27 is arranged at one side of the second feeding runner 26; the second feeding flow channel 26 is adapted to receive a normal wafer on the first feeding flow channel 21; the moving device 27 is adapted to move the wafer on the second loading channel 26 onto the turntable 12; the completed wafers are continuously transported to the direction of the laser device 1 through the second feeding flow channel 26, when approaching the laser device 1, two wafers are placed on corresponding stations of the turntable 12 at one time through the moving device 27, so that the transportation efficiency is improved, the wafers can be photographed through a camera after being transported to the turntable 12, the wafers are determined, and after photographing is finished, the wafers are rotated (for example, rotated 180 DEG) to the irradiation range of laser through the rotation of the turntable 12 to perform laser processing. The first loading channel 21 and the second loading channel 26 form a loading channel, and the loading channel is used for conveying wafers.

In this embodiment, the discharging device 3 includes: a first blanking flow path 31 and a second ion air knife 32; the first blanking flow channel 31 is disposed at one side of the moving device 27, and the first blanking flow channel 31 is disposed parallel to the second feeding flow channel 26; the transporting direction of the first blanking runner 31 is opposite to the transporting direction of the second feeding runner 26; the moving device 27 is adapted to place the wafer after laser processing on the first blanking runner 31; the second ion air knife 32 is arranged on the first blanking runner 31, and the second ion air knife 32 is suitable for removing dust and static electricity on the wafer after laser processing; after the laser processing of the wafer is finished, the processed wafer can be grasped by the moving device 27 through the rotation of the turntable 12, and the wafer after the laser is grasped by the moving device 27 can be placed on the first blanking flow channel 31 for blanking; at this time, the second ion air knife 32 can remove dust and static electricity on the wafer.

In this embodiment, the blanking device 3 further includes: a second blanking flow passage 33, a whole sheet arranging mechanism 34 and a buffer mechanism 35; the second blanking flow channel 33 is connected with the first blanking flow channel 31, and the transportation directions of the second blanking flow channel 33 and the first blanking flow channel 31 are the same; the whole sheet arranging mechanism 34 is arranged on the second blanking runner 33, and the whole sheet arranging mechanism 34 is suitable for carrying out whole sheet arrangement on the wafer on the second blanking runner 33; the buffer mechanism 35 is disposed at one side of the whole wafer arranging mechanism 34, and the buffer mechanism 35 is adapted to buffer the whole wafer; the whole sheet arranging mechanism 34 can arrange the wafers on the second blanking channel, so that the wafers are arranged on the second blanking channel 33 in a whole way, and the subsequent process treatment is convenient.

In this embodiment, the blanking device 3 further includes: a third blanking flow channel 36 and a second detection mechanism 37; the third blanking flow passage 36 is connected with the second blanking flow passage 33; the second detection mechanism 37 is arranged on the third blanking runner 36; the third discharging flow channel 36 is adapted to transport the wafer transported by the second discharging flow channel 33 or transport the wafer in the buffer mechanism 35; the second detecting mechanism 37 is adapted to detect the wafer on the third blanking runner 36; when the buffer is needed, the redundant wafer can be buffered on the buffer mechanism 35, and the wafer reaches the second detecting mechanism 37 for blanking detection under the condition that the buffer wafer is not required to be called. The first blanking flow channel 31, the second blanking flow channel 33 and the third blanking flow channel 36 form a complete blanking flow channel, and the blanking flow channels are used for conveying wafers.

In this embodiment, the blanking device 3 further includes: a second handling device 38 and a second NG magazine 39; the second carrying device 38 is arranged on the third blanking runner 36; the second NG magazine 39 is arranged at one side of the third blanking flow channel 36; the second handling device 38 is adapted to move the reject wafers detected by the second detecting means 37 into the second NG magazine 39; if the second inspection mechanism 37 detects a damaged wafer, the second handling device 38 moves the damaged wafer into the second NG magazine 39, and the completed wafer is transported to the blanking machine by the third blanking flow channel 36.

In this embodiment, each device is provided with a matched control block to control.

With reference to fig. 1, a specific workflow of the laser processing apparatus is described: the first feeding runner 21 starts to feed, removes dust and static electricity through the feeding ion air knife 22, and reaches the next runner station. The first detecting mechanism 23 can realize the function of incoming material detection aoi and is responsible for detecting the functions of edge breakage, unfilled corner and the like of incoming material wafers. The first handling device 24 may specifically adopt a manipulator chuck structure to pick up the wafer, and if the first detecting mechanism 23 detects a broken wafer, if there is a broken edge or a broken corner, the manipulator chuck structure sucks the broken wafer and moves the broken wafer to the first NG magazine 25. The normal wafer can be through reaching second material loading runner 26, be equipped with two positions of placing the wafer on the second material loading runner 26, can satisfy and move device 27 and get the piece on loading attachment, handling device 27 can adopt swing arm structure, the sucking disc of swing arm structure absorbs the wafer on the second material loading runner 26 simultaneously, place on carousel 12 is located the saddle 13 on the conversion station after rotating 90, wait to be located the camera in the image acquisition device 15 of conversion station top and shoot the completion back to the wafer on saddle 13, carousel 12 rotates 180, turn the processing station of carousel 12 with the wafer of conversion station, namely laser processing station, the top is equipped with laser device, concretely including optical elements such as scanning head, galvanometer. After the laser processing is finished, the turntable 12 rotates 180 degrees again, the processed wafer is sent to a rotary conversion station, and the wafer to be processed positioned on the conversion station reaches the processing station, namely, the movement of four wafers is performed on the turntable 12 at the same time. The processed wafer positioned on the conversion station is driven by the swing arm structure to rotate 90 degrees and is sent to the first blanking flow channel 31, the wafer after laser processing starts to enter the blanking process, the second ion air knife 32 removes dust and static electricity, the second blanking flow channel 33 is reached, the whole piece typesetting structure 34 is used for arranging the pieces, the buffer mechanism 35 is reached, and the wafer reaches the third blanking flow channel 36 under the condition that the buffer storage piece is not required to be called. After the blanking detection, the wafer is transported to the second transporting device 38, and the second transporting device 38 can adopt a manipulator sucking disc structure, if a bad piece is detected on the second detecting mechanism, the bad piece can be sucked by the manipulator sucking disc structure and moved to the second NG material box 39. The normal wafer is continuously transported to a subsequent station by the second transporting device.

Embodiment 2 as shown in fig. 2, on the basis of embodiment 1, embodiment 2 further provides a wafer production line using the laser processing apparatus in embodiment 1, including: a base, two sets of laser processing equipment symmetrically arranged on the base, and a separation plate 41 arranged between the laser processing equipment.

Laser processing components such as laser 11 may be mounted on an upper mount 42 of the mounts, and the remainder may be mounted on a lower mount 43 of the mounts; the base adopts marble platform, for metal platform, more stable, be difficult for taking place deformation because of ambient temperature's change, whole quality is favorable to antagonizing carousel pivoted inertia more, can improve equipment stability, reduces the transportation skew. The whole machine is provided with a symmetrical wafer transmission (a feeding device 2 and a discharging device 3) and a laser processing structure (a laser device 1), so that the structure is compact, the equipment space utilization rate is high, the layout of each flow channel and each manipulator is optimized while the laser processing technology of a battery piece (a battery piece wafer) is finished, the size of equipment is reduced, and the manufacturing cost of the equipment is reduced.

The laser processing equipment is bilaterally symmetrical, the functions are completely the same, and the mirror images are repeated; the device comprises various flow channels, wherein the flow channels are sequentially arranged along the vertical direction of the wafer laser processing technology and are used for conveying wafers in equipment; the whole-film shooting mechanisms are used for calibrating the position accuracy of the wafer in the flow passage conveying process; and the manipulators are used for shunting and converging the wafers in the flow passage conveying process or realizing the shunting and converging of the wafers in the flow passage conveying process in a vacuum belt conveying mode.

The wafer transmission and the laser processing of the battery pieces on two sides of the symmetry are controlled completely independently and are not influenced by each other, the isolation plate 41 is required to be arranged in the center of the symmetrical structure, the laser transmission is isolated, and the laser strong light injury caused by the normal laser processing on the other side when the production personnel deal with abnormality is protected.

The rotary type four-station laser processing equipment also comprises a marble laser processing table top, a dust removal system, an industrial personal computer, an optical system and other matched system control modules. The wafer transmission and laser processing of the battery pieces at the two sides of the symmetry are controlled completely independently and are not affected mutually.

The above embodiments 1 and 2 illustrate a laser processing apparatus and a wafer production line using a wafer as a workpiece, and are equally applicable to a silicon wafer or a battery piece.

In summary, the utility model passes through the feeding device 2, the laser device 1 and the discharging device 3; the laser device 1 is arranged at the tail end of the feeding direction of the feeding device 2, and the laser device 1 is arranged at the head end of the discharging direction of the discharging device 3; the loading device 2 is suitable for transporting a wafer to the laser device 1; the laser device 1 is suitable for carrying out laser processing on a wafer; the blanking device 3 is suitable for blanking the wafer after laser processing; the wafer conveying direct-current runner and laser processing station turntable combined conveying mode is achieved, the wafer can be reduced to a certain extent and is frequently adsorbed, hidden cracks, unfilled corners and other physical injuries are easily caused, the advantages of stable direct-current runner, high speed and small inertia are combined, the turntable is combined with direct-current conveying, and the efficiency is improved while the equipment stability is guaranteed. The wafer transfer flow channel adopts a direct current type, the laser processing procedure adopts a turntable, and the occupied area of equipment can be effectively saved and the space configuration of the equipment can be optimized while the high productivity, the high precision and the high stability laser processing of the four-station laser processing system are maintained.

The components (components not illustrating specific structures) selected in the application are all common standard components or components known to those skilled in the art, and the structures and principles of the components are all known to those skilled in the art through technical manuals or through routine experimental methods.

In the description of embodiments of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the several embodiments provided in this application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, the division of the units is merely a logical function division, and there may be other manners of division in actual implementation, and for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some communication interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form.

The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional unit in the embodiments of the present utility model may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.

With the above-described preferred embodiments according to the present utility model as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present utility model. The technical scope of the present utility model is not limited to the description, but must be determined according to the scope of claims.

Claims (11)

1. A laser processing apparatus, comprising:

the device comprises a feeding device, a laser device and a discharging device;

the laser device is suitable for carrying out laser processing on a workpiece; the laser device is arranged at the tail end of the feeding direction of the feeding device and the head end of the discharging direction of the discharging device; the feeding device is suitable for conveying the workpiece to the laser device; the blanking device is suitable for conveying the workpiece processed by the laser device; the laser device comprises at least two lasers, one corresponding to each of the workpieces, the lasers being adapted to emit laser light onto the workpieces located therebelow.

2. The laser processing apparatus according to claim 1, wherein,

the laser device is provided with a processing station, a conversion station and a rotary table, the rotary table rotates to alternately process the workpiece on the processing station and the conversion station, and the laser is positioned above the processing station.

3. The laser processing apparatus according to claim 2, wherein,

the turntable alternates the work pieces on the processing station and the converting station by rotating 180 °.

4. The laser processing apparatus according to claim 2, wherein,

the image acquisition device is arranged above the conversion station and used for acquiring the workpiece information, and the number of the image acquisition devices is in one-to-one correspondence with the number of the lasers.

5. The laser processing apparatus according to claim 2, wherein,

the turntable comprises two end parts, wherein at least two pallets are arranged at any one end part, and when the pallet on one end part is positioned at the processing station, the pallet on the other end part is positioned at the conversion station; the laser is used for carrying out laser processing on the workpiece on the supporting table on the processing station, and the workpiece carried on the supporting table on the conversion station is a workpiece to be processed or a workpiece after processing.

6. The laser processing apparatus as claimed in claim 5, wherein,

a cold water channel is formed in the support.

7. The laser processing apparatus according to claim 2, wherein,

the device is arranged close to the feeding device, the laser device and the discharging device, and the device transfers the workpiece from the feeding device to the conversion station and/or transfers the workpiece from the conversion station to the discharging device.

8. The laser processing apparatus according to claim 1, wherein,

the device is arranged close to the feeding device, the laser device and the discharging device, and can drive at least two workpieces to be transported between the feeding device and the laser device and/or between the laser device and the discharging device.

9. The laser processing apparatus according to claim 1, wherein,

the ion air knife device is arranged on the feeding device and/or the discharging device.

10. The laser processing apparatus according to claim 1, wherein,

the loading attachment still includes: the first detection mechanism, the first carrying device and the first NG material box;

the first detection mechanism is arranged in the feeding direction of the feeding runner and is suitable for detecting the workpiece; the first carrying device is arranged on one side of the first detection mechanism; the first handling device is adapted to place the damaged workpiece in the first NG magazine when the first detection mechanism detects the workpiece damage; and/or

The loading attachment still includes: the first detection mechanism, the first carrying device and the first NG material box;

the second detection mechanism is arranged in the blanking direction of the blanking runner and is suitable for detecting a workpiece; the second handling device is arranged on one side of the second detection mechanism and is adapted to place the damaged workpiece in the second NG magazine when the second detection mechanism detects that the workpiece is damaged.

11. A wafer production line employing the laser processing apparatus according to any one of claims 1 to 10, comprising:

the base is symmetrically arranged on the two sets of laser processing equipment on the base, and a separation plate is arranged between the laser processing equipment.