CN212180652U - Jack detection device - Google Patents
Jack detection device Download PDFInfo
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- CN212180652U CN212180652U CN202020271863.3U CN202020271863U CN212180652U CN 212180652 U CN212180652 U CN 212180652U CN 202020271863 U CN202020271863 U CN 202020271863U CN 212180652 U CN212180652 U CN 212180652U
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Abstract
The utility model discloses a consent detection device, include: a machine platform; the displacement mechanism is fixedly arranged on the machine table; the adsorption platform is slidably arranged on the displacement mechanism and used for placing the circuit board to be detected; the imaging mechanism is movably arranged on the displacement mechanism, is positioned above the adsorption platform and is used for scanning the plug hole on the circuit board and imaging; and the 3D scanning system is arranged on the imaging mechanism and is used for acquiring the plug hole images acquired by the imaging mechanism and obtaining the 3D information of the plug hole defects after the plug hole images are analyzed by an algorithm. The utility model provides a consent detection device aims at solving current circuit board consent detection efficiency and the low problem of detection precision.
Description
Technical Field
The utility model relates to a circuit board detects technical field, in particular to consent detection device.
Background
In order to meet the actual application requirements, when a Printed Circuit Board (PCB for short) is produced, resin ink is required to fill part of holes on the Board to manufacture resin plug holes, and as the resin plug hole technology is gradually processed and applied by more and more Circuit boards, and various defects of the resin plug holes can cause the rejection of the PCB, the detection of the PCB resin plug holes is more and more strict; at present, manual detection is mainly adopted for PCB resin hole plugging, so that the detection efficiency is low, the detection precision is low, and the problems of missing detection and error detection often exist, therefore, the detection device for PCB resin hole plugging needs to be researched and developed to improve the detection efficiency and the detection precision, and further the quality reduction rejection rate of products is ensured.
The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a consent detection device aims at solving current circuit board consent detection efficiency and the low problem of detection precision.
In order to achieve the above object, the utility model provides a consent detection device, include:
a machine platform;
the displacement mechanism is fixedly arranged on the machine table;
the adsorption platform is slidably arranged on the displacement mechanism and used for placing the circuit board to be detected;
the imaging mechanism is movably arranged on the displacement mechanism, is positioned above the adsorption platform and is used for scanning the plug hole on the circuit board and imaging;
and the 3D scanning system is arranged on the imaging mechanism and is used for acquiring the 3D information of the hole plugging defect.
Optionally, the 3D scanning system comprises:
the fixed seat is fixed on the outer side of the imaging mechanism;
the angle control module is arranged on one side, away from the imaging mechanism, of the fixed seat;
the angle adapter plate is mounted on the angle control module, and the angle control module is used for adjusting the angle of the angle adapter plate;
and the 3D measuring component is arranged on the surface of the angle adapter plate deviating from the angle control module.
Optionally, the 3D measurement assembly comprises:
the shell is arranged on the surface, deviating from the angle control module, of the angle adapter plate, and a cavity is formed inside the shell;
the laser device is arranged in the cavity, the shell is provided with a laser emitting hole communicated with the cavity, and a light beam of the laser device is emitted to the hole plugging defect position from the laser emitting hole;
the measuring head, the measuring head is located in the cavity, and with the laser instrument sets up side by side, the light receiving hole with the cavity intercommunication is still seted up to the casing, the measuring head orientation the light receiving hole sets up, in order to receive the laser instrument launches the light that reflects to the laser of consent defective position.
Optionally, the 3D measurement assembly further includes two laser clamping blocks, and the two laser clamping blocks are disposed in the cavity and located at two ends of the laser respectively to clamp and fix the laser.
Optionally, the displacement mechanism includes an X-axis component, a Y-axis component and a Z-axis component, the Y-axis component is fixedly mounted on the machine platform and extends along the length direction of the machine platform, and the adsorption platform is slidably mounted on the Y-axis component; the X-axis component is arranged on the machine table and positioned above the Y-axis component, and the X-axis component and the Y-axis component are arranged at an included angle; the Z-axis component is connected to the X-axis component in a sliding mode and extends along the height direction of the machine table; the imaging mechanism is slidably mounted to the Z-axis component.
Optionally, the imaging mechanism includes a camera component, a lens component and a light source module, and the camera component, the lens component and the light source module are sequentially slidably mounted on the Z-axis component from top to bottom; the center of the lighting hole of the camera component and the axis of the lens component are positioned on the same straight line, and the straight line is superposed with the reflected light of the light source module irradiating the plug hole to be detected.
Optionally, the light source module includes:
the light source lifting frame is arranged on the Z-axis part in a sliding manner;
the two fixed side plates are oppositely arranged and fixedly connected to the light source lifting frame, angle adjusting grooves are formed in the two fixed side plates, and the 3D scanning system is installed on one fixed side plate;
the lighting source is at least provided with two groups, the two lighting sources are both arranged between the two fixed side plates, and the included angle between the illumination direction of at least one group of lighting sources and the adsorption platform is 0-60 degrees, and the included angle is defined as alpha; the included angle between the illumination direction of at least one group of the illumination light sources and the adsorption platform is 60-85 degrees, and the included angle is defined as beta;
and the cooling fan is arranged on the fixed side plate and is positioned behind the illumination light source so as to cool the illumination light source.
Optionally, the camera assembly includes a camera mount, a camera, and a camera isolation structure, the camera mount is slidably disposed on the Z-axis member, the camera is mounted on the camera mount, and the camera isolation structure is disposed between the camera and the camera mount.
Optionally, the lens assembly includes a lens mount, a lens and a lens shock isolation structure, the lens mount is slidably disposed on the Z-axis, the lens shock isolation structure is mounted on the lens mount, the lens is connected to the lens shock isolation structure and located below the lens shock isolation structure, and a lighting center of the camera and an axis of the lens are located on the same straight line.
Optionally, the adsorption platform includes two vacuum regions, the two vacuum regions can be close to and far away from each other, and the two vacuum regions are respectively connected with a vacuum control pipeline, and the vacuum control pipeline is used for enabling the adsorption platform to generate negative pressure to adsorb the circuit board.
The utility model discloses technical scheme includes displacement mechanism, adsorption platform, imaging mechanism and 3D scanning system, and imaging mechanism sets up on displacement mechanism, and the circuit board that will wait to detect is laid on adsorption platform, makes the circuit board resin consent that waits to detect on the adsorption platform be in imaging mechanism's best formation of image position through adjusting displacement mechanism, can follow the concrete position of observing the consent that has the defect in the formation of image to this has replaced the manual work, has realized the high-efficient detection. Specifically, after the imaging mechanism scans and images the plug hole of the circuit board, the plug hole with the defect on the circuit board can be detected, the displacement mechanism moves the 3D scanning system to the position above the detected plug hole area with the defect, the plug hole defect is accurately measured through the 3D scanning system, the 3D information of the plug hole with the defect is obtained, the fine defect can be accurately confirmed, and therefore the purpose of improving the detection accuracy is achieved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of the 3D inspection system of FIG. 1;
FIG. 3 is another view of FIG. 2;
FIG. 4 is an internal structural view of FIG. 3;
FIG. 5 is an enlarged view of the light source module shown in FIG. 1;
FIG. 6 is a schematic view of the structure of FIG. 5 and the adsorption platform;
FIG. 7 is an enlarged view taken at A in FIG. 6;
FIG. 8 is an enlarged view of the camera assembly of FIG. 1;
fig. 9 is an enlarged view of the lens assembly of fig. 1.
The reference numbers illustrate:
the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a consent detection device.
As shown in fig. 1 to 9, in an embodiment of the present invention, the plug hole detecting device 100 includes:
a machine table 10;
the displacement mechanism 20, the displacement mechanism 20 is fixedly installed on the machine table 10;
the adsorption platform 30 is slidably arranged on the displacement mechanism 20, and is used for placing a circuit board to be detected;
the imaging mechanism 40 is movably arranged on the displacement mechanism 20, is positioned above the adsorption platform 30, and is used for scanning the plug hole on the circuit board and imaging;
and the 3D scanning system 50 is arranged on the imaging mechanism 40 and used for acquiring the 3D information of the hole plugging defect.
Specifically, the displacement mechanism 20 is disposed above the machine 10, and the displacement mechanism 20 includes a moving component moving along the X-axis direction (the width direction of the machine 10), a moving component moving along the Y-axis direction (the length direction of the machine 10), and a moving component moving along the Z-axis direction (the height direction of the machine 10), the Y-axis moving component is disposed above the machine 10, the X-axis moving component is disposed above the machine 10, and is located above the Y-axis moving part, the Z-axis moving part is arranged on the X-axis moving part and can reciprocate along the X-axis direction on the X-axis moving part, the adsorption platform 30 is arranged on the Y-axis moving part, it is to be understood that the adsorption stage 30 is capable of reciprocating in the Y-axis direction, the imaging mechanism 40 is provided on the Z-axis moving part, and can reciprocate on the Z-axis moving member in the Z-axis direction and also reciprocate along the X-axis direction along with the Z-axis member 23.
The imaging mechanism 40 is disposed above the adsorption platform 30, and the product (circuit board) to be detected is disposed on the adsorption platform 30, so that the imaging mechanism 40 is used for imaging the product on the adsorption platform 30 to detect the defect of the plug hole on the circuit board, and in order to ensure the imaging accuracy, the displacement mechanism 20 is disposed to drive the imaging mechanism 40 to move, so that the imaging mechanism 40 displaces the optimal imaging position. In addition, the 3D scanning system 50 is installed in the imaging mechanism 40 for further detecting the imaged image, that is, after the imaging mechanism 40 images the plugged holes, the location of the plugged hole defect can be determined quickly, at this time, the 3D scanning system 50 is moved to the area of the plugged hole defect, the location of the plugged hole defect is further accurately detected by the 3D scanning system 50, and 3D information is formed, that is, the depth, size and the like of the plugged hole defect are accurately judged, so as to improve the detection accuracy.
The utility model discloses technical scheme includes displacement mechanism 20, adsorption platform 30, imaging mechanism 40 and 3D scanning system 50, imaging mechanism 40 sets up on displacement mechanism 20, the circuit board that will wait to detect is laid on adsorption platform 30, make the circuit board resin consent that waits to detect on the adsorption platform 30 be in imaging mechanism 40's below through adjusting displacement mechanism 20, and according to the position of circuit board thickness adjustment imaging mechanism 40, make it be in the best formation of image position, can follow the defect that logical operation through detection algorithm removed the detection consent in the image that the formation of image obtained, thereby replaced the manual work, high-efficient detection has been realized. Specifically, after the imaging mechanism 40 scans and images the plug holes of the circuit board, the plug holes with defects on the circuit board can be detected, the displacement mechanism 20 moves the 3D scanning system 50 to the position above the detected plug hole region with defects, and the plug hole defects are accurately measured by the 3D scanning system 50 to obtain the 3D information of the plug holes with defects, so that the fine defects can be accurately confirmed, and the purpose of improving the detection accuracy is achieved.
As shown in fig. 2 to 3, in the present embodiment, the 3D scanning system 50 includes:
a fixed seat 51, wherein the fixed seat 51 is fixed on the outer side of the imaging mechanism 40;
the angle control module 52 is installed on one side, away from the imaging mechanism 40, of the fixed seat 51;
the angle adapter plate 53 is mounted on the angle adjusting module, and the angle control module 52 is used for adjusting the angle of the angle adapter plate 53;
a 3D measuring assembly 54, wherein the 3D measuring assembly 54 is mounted on the surface of the angle adapter plate 53 facing away from the angle control module 52.
The 3D scanning system 50 includes a fixing base 51, an angle control module 52, an angle adapter plate 53 and a 3D measurement module 54. The fixed seat 51 is of a plate-shaped structure, the surface of the fixed seat 51 is fixed on the outer side of the imaging mechanism 40, the angle control module 52 is installed on one side of the fixed seat 51, which is far away from the imaging mechanism 40, the angle adapter plate 53 is installed on one side of the angle control module 52, which is far away from the fixed seat 51, and the angle control module 52 is used for controlling the angle adjustment of the angle adapter plate 53; 3D measuring component 54 fixed connection deviates from one side of angle control module 52 in angle keysets 53, and angle control module 52 drive angle keysets 53 rotates to the drive is located 3D measuring component 54 on angle keysets 53 and is rotated, thereby realizes the accurate adjustment of 3D measuring component 54 measurement contained angle, thereby improves measurement accuracy.
Further, the 3D measurement assembly 54 includes:
the housing 541 is installed on a surface, away from the angle control module 52, of the angle adapter plate 53, and a cavity is formed inside the housing 541;
the laser 542 is arranged in the cavity, the shell 541 is provided with a laser emitting hole 5411 communicated with the cavity, and a light beam of the laser 542 is emitted to a hole plugging defect position from the laser emitting hole 5411;
measuring head 543, measuring head 543 is located in the cavity, and with laser 542 sets up side by side, light receiving hole 5412 has still been seted up to casing 541, measuring head 543 orientation light receiving hole 5412, in order to receive the light that laser 542 launches the laser reflection to the consent defective position.
The housing 541 is installed on the surface of the angle adapter plate 53, and a cavity for accommodating the laser 542 and the measuring head 543 is formed inside the housing 541. The housing 541 specifically includes a housing 541 cover and a housing 541 top cover, and the housing 541 top cover covers the housing 541 cover to form the cavity. Casing 541 closing cap offers the laser emission hole 5411 with the cavity intercommunication, the light beam of laser instrument 542 by laser emission hole 5411 launches to the consent defect position, and measuring head 543 sets up side by side with laser instrument 542, and casing 541 top cap has offered light receiving hole 5412, and measuring head 543 sets up towards light receiving hole 5412 to receive the light that laser instrument 542 launches to the laser reflection of consent defect position. It can be understood that, the laser 542 emits a high brightness laser beam at a specific angle, the laser beam irradiates the surface of the object to be measured to generate a specific reflection, the measuring head 543 measures the reflected laser, and because the positions of the irradiating points of the laser beam irradiating the surface of the object are different in height, the angles of the scattered or reflected light received by the measuring head 543 are different, so that the positions of different spot images at the detecting position are detected by the measuring head 543, and the position height of the irradiating point of the laser beam on the surface of the object is obtained by processing data with system algorithm software, thereby obtaining the 3D information of the measured area.
In this embodiment, the 3D measurement assembly 54 further includes two laser clamping blocks 542, and the two laser clamping blocks 544 are disposed in the cavity and located at two ends of the laser 542 respectively to clamp and fix the laser 542.
Two laser clamping blocks 544 are arranged in the cavity and are respectively located at two ends of the laser 542 for clamping the laser 542, so that the laser 542 is prevented from shaking in the moving process of the 3D measuring assembly 54, the detection data is prevented from being affected, and the accuracy of the detection data is further ensured.
In this embodiment, the displacement mechanism 20 includes a Z-axis component 22, a Y-axis component 21 and a Z-axis component 23, the Y-axis component 21 is fixedly mounted on the machine 10 and extends along the length direction of the machine 10, and the adsorption platform 30 is slidably mounted on the Y-axis component 21; the Z-axis component 22 is mounted on the machine table 10 and located above the Y-axis component 21, and the Z-axis component 22 and the Y-axis component 21 form an included angle; the Z-axis component 23 is slidably connected to the Z-axis component 22 and extends along the height direction of the machine 10; the imaging mechanism 40 is slidably mounted on the Z-axis member 23.
It can be understood that the Z-axis component 22 and the Y-axis component 21 are disposed on the machine 10 at an included angle, and the imaging mechanism 40 and the 3D scanning system 50 are displaced relative to the adsorption platform 30 on the Y-axis component 21 on the Z-axis component 23, so as to achieve the best imaging and detecting effect. The Y-axis component 21 is two linear modules, the two linear modules are disposed at two sides of the table top of the machine table 10 at intervals, and the adsorption platform 30 is disposed on the Y-axis component 21 and reciprocates on the Y-axis component 21. The Z-axis component 22 is a fixed structure with a gantry as a main body, and the gantry is installed on the machine 10 through 4X-axis fixing seats 51. Two X-axis guide rails are arranged on the portal frame, and a positioning pin hole is formed below the installation position of the lower guide rail and used for positioning during installation of the guide rails. An electric installation plate is arranged behind the portal frame and used for installing an electric part, and the space is fully utilized. The Z-axis component 23 is fixed by connecting an X-axis guide rail seat (not marked) and an X-axis screw nut. The motor driving device drives the X-axis screw rod to rotate through the coupler to enable the Z-axis component 23 to move left and right, when the Z-axis component 22 drives the Z-axis component 23 to move left and right, the Y-axis component 21 enables the circuit board to be detected to move relative to the Y direction, and therefore the whole circuit board is detected. The gantry is provided with a sensor (not marked) at the limit position of the X-axis lead screw displacement and is prevented from colliding with the Z-axis part 23 excessively due to anti-collision glue. A wiring groove (not marked) is arranged at one end of the portal frame and is used for installing electrical appliance wires in a standard way. The X axis uses a servo motor to control the rotation of the lead screw to determine the amount of displacement of the Z axis member 23.
Specifically, the Z-axis component 23 is a structure that uses a Z-axis module base as a main body, two Z-axis guide rails are installed and fixed in front of the Z-axis module base, and a Z-axis module adapter plate is connected and fixed behind the Z-axis module base. The Z-axis part 23 is connected to the Z-axis part 22 by taking a Z-axis module base as a main body, two Z-axis guide rails and three Z-axis screw rods are mounted on the Z-axis module base, three sliding blocks are mounted on each guide rail, an adjusting nut seat is connected and fixed on each Z-axis screw rod nut, and each adjusting nut seat and each group of sliding blocks are independently connected with one component. An inductor mounting plate is installed at the right end of the Z-axis module base, and an inductor is installed at the limiting position of each component. And a Z-axis flag pole is arranged on the Z-axis module base, so that the sensor can perform sensing feedback when the Z-axis part 23 reaches the limit.
In this embodiment, the imaging mechanism 40 includes a camera component 42, a lens component 43 and a light source module 41, and the camera component 42, the lens component 43 and the light source module 41 are sequentially slidably mounted on the Z-axis component 23 from top to bottom; the center of the lighting hole of the camera component 42 and the axis of the lens component 43 are located on the same straight line, and the straight line coincides with the reflected light of the light source module 41 irradiating the plug hole to be detected.
As shown in fig. 5 to 7, specifically, the light source module 41 includes:
the light source lifting frame 411 is arranged on the Z-axis component 23 in a sliding mode;
two fixed side plates 412, the two fixed side plates 412 are oppositely disposed and fixedly connected to the light source lifting frame 411, an angle adjusting groove for adjusting the irradiation angle of the illumination light source 413 is disposed on each of the two fixed side plates 412, and the 3D scanning system 50 is mounted on one of the fixed side plates 412;
at least two groups of illumination light sources 413 are arranged, the two illumination light sources 413 are both arranged between the two fixed side plates 412, and the included angle between the illumination direction of at least one group of illumination light sources 413 and the adsorption platform 30 is 0-60 degrees, and the included angle is defined as alpha; the included angle between the illumination direction of at least one group of the illumination light sources 413 and the adsorption platform 30 is 60-85 degrees, and the included angle is defined as beta;
and a cooling fan 414, wherein the cooling fan 414 is disposed on the fixed side plate 412 and behind the illumination light source 413 to cool the illumination light source 413.
The lighting source 413 comprises a lamp panel mounting seat, an LED lamp panel, a diffusion plate, a turbofan, a condensing shaping lens and a reflector panel, the LED lamp panel is fixedly arranged on the lamp panel mounting seat, a heat conducting medium is arranged between the LED lamp panel and the lamp panel mounting seat and used for conducting heat generated by the LED lamp panel to the lamp panel mounting seat and then cooling the lamp panel mounting seat through a cooling fan 414 arranged at the rear part and the turbofan arranged above the heat conducting medium; the diffusion plate and the light-gathering shape-modifying lens are sequentially arranged in the illumination direction of the LED lamp panel, the diffusion plate enables light emitted by the LED lamp panel to be uniformly diffused, and then light is gathered again through the light-gathering shape-modifying lens to form a light band with a special shape; because the light that the LED lamp plate launches is the shape of gaussian distribution, in order to improve the light source utilization ratio, be provided with in the both sides of LED lamp plate the reflector panel is with partly scattered light reflects again on spotlight correction of shapping lens increases the light source utilization ratio, improves light source luminance.
In the embodiment of the present invention, the number of the illumination light sources 413 is four, and the included angle between the central line of the condensing and shape-modifying lens and the plane of the adsorption platform 30 is defined as the light source included angle. The four illumination light sources 413 are distributed in a fan shape, wherein the light source included angle of the two illumination light sources 413 close to the middle is 60-85 degrees, the light source included angle of the two illumination light sources 413 close to the two sides is 0-60 degrees, alpha is a low angle and is smaller than beta; the low-angle illumination light source 413 is utilized to expose some special defects in the plug hole on imaging, and the high-angle illumination light source 413 is matched with some supplementary effects on the special defects, so that the imaging of the special defects is further stabilized, the imaging capability of the special defects is improved, the special defects can be stably detected, and the detection efficiency and the precision of the automatic optical detection device for the plug hole defects are improved.
The cooling fan 414 is arranged on the light source lifting frame 411 and is positioned behind the illumination light source 413, and the cooling fan 414 blows out large air flow to cool the illumination light source 413; meanwhile, a turbo fan is disposed on top of the illumination light source 413, and the turbo fan further cools the illumination light source 413 to improve the service life of the illumination light source 413. Specifically, the light source module 41 further includes a reinforcing beam and a reinforcing side beam, the reinforcing beam is fixed on the two fixed side plates 412 in a crossing manner to improve the structural strength of the fixed side plates 412, further, the reinforcing side beams are respectively arranged on the two fixed side plates 412, and the reinforcing side beams are fixedly connected between the two fixed side plates 412 and the light source lifting frame 411, so as to further improve the structural strength of the light source module 41.
As shown in fig. 8, in the present embodiment, the camera assembly 42 includes a camera mounting seat 421, a camera 422, and a camera isolation structure 423, the camera mounting seat 421 is slidably disposed on the Z-axis member 23, the camera 422 is mounted on the camera mounting seat 421, and the camera isolation structure 423 is disposed between the camera 422 and the camera 422 mounting seat 421.
The camera mounting seat 421 is slidably arranged on the Z-axis component 23 and is adjusted in position by a precision lead screw nut adjusting component; so as to have an optimum imaging distance for the sockets of circuit boards of different thicknesses. Since vibration may have a great influence on the imaging quality, the camera 422 is mounted on the camera isolation structure 423 to eliminate the influence of external environment vibration and machine 10 vibration on the imaging quality. Further, the camera assembly 42 further includes a rotation adjusting block, the rotation adjusting block is disposed on the camera mounting seat 421 and connected to the camera 422, and the rotation adjusting block is used for adjusting an imaging surface angle of the camera 422. Because the position error of camera 422 installation, accessible rotation regulating block carries out the fine adjustment to camera 422, makes the light coincidence that has special shape that its camera 422's imaging plane and light source module 41 formed, improves camera 422's imaging quality.
A monitoring module fixing frame is arranged in front of the illumination light source 413, a monitoring module is fixedly mounted on the monitoring module fixing frame, the monitoring module is fixedly arranged on the fixed side plate 412 through the monitoring module fixing frame, and the monitoring module is used for confirming the detected jack defects of the PCB.
As shown in fig. 9, in the present embodiment, the lens assembly 43 includes a lens mount 431, a lens 432, and a lens shock isolation structure 433, the lens mount 431 is slidably disposed on the Z-axis member 23, the lens shock isolation structure 433 is mounted on the lens mount 431, the lens 432 is connected to the lens shock isolation structure 433 and is located below the lens shock isolation structure, and a lighting center of the camera 422 and an axial center of the lens 432 are located on the same straight line.
The lens mount 431 is slidably disposed on the Z-axis member 23 and is positionally adjusted by a fine lead screw nut adjusting assembly so as to have an optimum imaging distance for the tap holes of circuit boards of different thicknesses. Since vibration can have a great influence on the imaging quality, the lens 432 is mounted on the lens isolation structure 433 to eliminate the influence of external environment vibration and machine 10 vibration on the imaging quality.
In this embodiment, the adsorption platform 30 includes two vacuum areas, two of the vacuum areas can be close to and away from each other, and two of the vacuum areas are respectively connected with a vacuum control pipeline 31, and the vacuum control pipeline 31 is used for enabling the adsorption platform 30 to generate negative pressure to adsorb the circuit board.
When the circuit board is placed on the adsorption platform 30, the system automatically controls the opening and closing of the two groups of vacuum control pipelines 31 according to the size of the circuit board so as to control the vacuum adsorption range, the circuit board is well adsorbed and leveled, the axes of the camera 422 and the lens 432 are perpendicular to the plane of the circuit board, the camera 422 is enabled to acquire the hole plugging image of the circuit board with high precision, the hole plugging defect position is determined, the 3D information of the hole plugging defect is acquired through the 3D scanning system 50, the depth and the size of the hole plugging defect are determined, the fine defect can be accurately confirmed, and the detection precision of the circuit board is improved.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. A jack detection device, comprising:
a machine platform;
the displacement mechanism is fixedly arranged on the machine table;
the adsorption platform is slidably arranged on the displacement mechanism and used for placing the circuit board to be detected;
the imaging mechanism is movably arranged on the displacement mechanism, is positioned above the adsorption platform and is used for scanning the plug hole on the circuit board and imaging;
and the 3D scanning system is arranged on the imaging mechanism and is used for acquiring the 3D information of the hole plugging defect.
2. The jack detection device of claim 1, wherein said 3D scanning system comprises:
the fixed seat is fixed on the outer side of the imaging mechanism;
the angle control module is arranged on one side, away from the imaging mechanism, of the fixed seat;
the angle adapter plate is mounted on the angle control module, and the angle control module is used for adjusting the angle of the angle adapter plate;
and the 3D measuring component is arranged on the surface of the angle adapter plate deviating from the angle control module.
3. The jack detection device of claim 2, wherein said 3D measurement assembly includes:
the shell is arranged on the surface, deviating from the angle control module, of the angle adapter plate, and a cavity is formed inside the shell;
the laser device is arranged in the cavity, the shell is provided with a laser emitting hole communicated with the cavity, and a light beam of the laser device is emitted to the hole plugging defect position from the laser emitting hole;
the measuring head, the measuring head is located in the cavity, and with the laser instrument sets up side by side, the light receiving hole with the cavity intercommunication is still seted up to the casing, the measuring head orientation the light receiving hole sets up, in order to receive the laser instrument launches the light that reflects to the laser of consent defective position.
4. The device for testing the jack of claim 3, wherein said 3D measuring assembly further comprises two laser clamping blocks, said two laser clamping blocks are disposed in said cavity and located at two ends of said laser respectively, for clamping and fixing said laser.
5. The device for detecting the plugging hole according to claim 1, wherein said displacement mechanism includes an X-axis member, a Y-axis member and a Z-axis member, said Y-axis member being fixedly mounted on said table and extending along a longitudinal direction of said table, said suction platform being slidably mounted on said Y-axis member; the X-axis component is arranged on the machine table and positioned above the Y-axis component, and the X-axis component and the Y-axis component are arranged at an included angle; the Z-axis component is connected to the X-axis component in a sliding mode and extends along the height direction of the machine table; the imaging mechanism is slidably mounted to the Z-axis component.
6. The device according to claim 5, wherein said imaging mechanism includes a camera assembly, a lens assembly and a light source module, said camera assembly, said lens assembly and said light source module being slidably mounted on said Z-axis member in sequence from top to bottom; the center of the lighting hole of the camera component and the axis of the lens component are positioned on the same straight line, and the straight line is superposed with the reflected light of the light source module irradiating the plug hole to be detected.
7. The jack detection device of claim 6, wherein said light source module includes:
the light source lifting frame is arranged on the Z-axis part in a sliding manner;
the two fixed side plates are oppositely arranged and fixedly connected to the light source lifting frame, angle adjusting grooves are formed in the two fixed side plates, and the 3D scanning system is installed on one fixed side plate;
the lighting source is at least provided with two groups, the two lighting sources are both arranged between the two fixed side plates, and the included angle between the illumination direction of at least one group of lighting sources and the adsorption platform is 0-60 degrees; the included angle between the illumination direction of at least one group of the illumination light sources and the adsorption platform is 60-85 degrees;
and the cooling fan is arranged on the fixed side plate and is positioned behind the illumination light source so as to cool the illumination light source.
8. The jack detection device of claim 6, wherein said camera assembly includes a camera mount slidably disposed on said Z-axis member, a camera mounted on said camera mount, and a camera isolation structure disposed between said camera and said camera mount.
9. The device according to claim 7, wherein said lens assembly includes a lens mount, a lens and a lens isolation structure, said lens mount is slidably mounted on said Z-axis member, said lens isolation structure is mounted on said lens mount, said lens is connected to said lens isolation structure and located below said lens isolation structure, and a light center of said camera is aligned with a center of said lens.
10. The device for detecting plug hole according to claim 1, wherein said suction platform includes two vacuum areas, said two vacuum areas being capable of moving toward and away from each other, and a vacuum control line connected to each of said two vacuum areas, said vacuum control line being adapted to cause said suction platform to generate a negative pressure to suck the circuit board.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113567455A (en) * | 2021-08-27 | 2021-10-29 | 惠州市特创电子科技股份有限公司 | Printed circuit board front end golden finger detection device and detection method |
| CN116609336A (en) * | 2023-04-26 | 2023-08-18 | 晶诺微(上海)科技有限公司 | Defect detection apparatus |
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2020
- 2020-03-06 CN CN202020271863.3U patent/CN212180652U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113567455A (en) * | 2021-08-27 | 2021-10-29 | 惠州市特创电子科技股份有限公司 | Printed circuit board front end golden finger detection device and detection method |
| CN116609336A (en) * | 2023-04-26 | 2023-08-18 | 晶诺微(上海)科技有限公司 | Defect detection apparatus |
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