CN108291879A - Base board defect detecting device and utilize its detection method - Google Patents
Base board defect detecting device and utilize its detection method Download PDFInfo
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- CN108291879A CN108291879A CN201780004216.7A CN201780004216A CN108291879A CN 108291879 A CN108291879 A CN 108291879A CN 201780004216 A CN201780004216 A CN 201780004216A CN 108291879 A CN108291879 A CN 108291879A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0106—General arrangement of respective parts
- G01N2021/0112—Apparatus in one mechanical, optical or electronic block
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0187—Mechanical sequence of operations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8835—Adjustable illumination, e.g. software adjustable screen
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N2021/9513—Liquid crystal panels
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- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
Base board defect detecting device according to an embodiment of the invention includes：Platform is used to place substrate；Bracket is movably attached to the platform along X-direction；Main movable block is located at the top of the substrate and is movably attached to the bracket along Y direction；First auxiliary movable block is movably attached to the main movable block along X-direction；Probe is arranged on first auxiliary movable block with positioned at the top of the substrate, the defect for detecting the substrate；And control unit, so that the bracket is persistently moved along X-direction and controls the relative velocity of the auxiliary movable block relative to the bracket.
Description
Technical field
The present invention relates to a kind of base board defect detecting device and utilize its detection method.More particularly it relates to
A kind of base board defect detecting device and pass through contracting for detecting the defect generated on substrate (glass) using its detection method
The time required to short base board defect detection, technique pitch time (tact-time) and yield can be improved.
Background technology
In general, optical display is made of substrate and liquid crystal layer, counter substrate etc., LCD display is logical in optical display
Multiple manufacturing process are crossed to manufacture.Typical manufacturing process has exposure etching (Photo) technique, chromatic filter (Color
Filter) processing technology, unit (Cell) assembly technology, module (Module) assembly technology, wherein circuit pattern is engraved in base
Exposure etch process on plate is implemented repeatedly so that circuit stacking, is the technique required to precision.
After this exposure etch process, optical detection apparatus (AOI, Automatic Optical is utilized
Inspection) whether detection circuit pattern is formed on substrate well, when the open circuit by detecting discovery circuit pattern
(Open) or when short-circuit (Short), pass through reparation (Repair) technique reparation open circuit or short circuit.
In order to improve this defects detection speed, it is important that looked for using optical detection apparatus within the limited process time
Go out defect as much as possible, accelerates in particular with the speed of batch production product, detected within the operation stage shortest time
Base board defect becomes more and more important.
Fig. 1 is the schematic diagram of the base board defect detecting device 10 as optical detection apparatus (AOI) according to prior art,
Illustrate base board defect detecting device 10 according to prior art referring to Fig.1.
Base board defect detecting device 10 includes platform 30, bracket (gantry) 20, movable block 21, visits according to prior art
First 23.Substrate 33 to be detected is placed on platform 30, bracket 20 is movably attached to platform 30 along X-direction and according to detection
Technique is moved along X-direction.Movable block 21 is movably attached to bracket 20 along Y direction and with probe 23, based on movement
Probe 23 is set to be located above the defect of substrate 33.Probe 23 is moved to by bracket 20 and movable block 21 in the defect of substrate 33
Side, the probe 23 for being moved to test point detect defect.
Specifically, explanation detects multiple lack using base board defect detecting device 10 according to prior art referring to Figures 1 and 2
Sunken method is as follows：By bracket 20 along X-direction move after stop, 1. using 23 detection defects of probe, then pass through movable block 21
Probe 23 is set to be moved along Y direction, to detect defect 2..Then, by bracket 20 along X-direction move after stop, then pass through shifting
Motion block 21 makes probe 23 be moved along Y direction, to detect defect 3., thereafter through the shifting that bracket 20 and movable block 21 is repeated
Dynamic and stopping action successively detection defect 4. with defect 5..
There are the following problems for existing base board defect detecting device as described above.
First, in carrier structure according to prior art, movable block can only be moved along Y direction, therefore popping one's head in can only
The identical defect (defect on X-axis line) of X axis coordinate is detected, for the different defect of X axis coordinate, is only moved bracket along X-axis
After dynamic, then it is detected.Therefore, increase along the number that Y direction moves with probe, can increase the time required to defects detection
(referring to Fig. 2).
Second, in order to detect defect, need to move and stop big weight cradle at any time, it is as described above dynamic when being repeated
When making, due to the weight of bracket, detection device can be damaged, and repair (maintenance), which increases, causes expense to increase, and
Since mobile and stopping action being repeated, can increase the time required to defects detection.
Invention content
Technical problem
One aspect of the present invention provides a kind of base board defect detecting device and utilizes its detection method, is lacked by shortening substrate
The time required to falling into detection, technique pitch time (tact-time) and yield can be improved.
Technical solution
A kind of base board defect detecting device is provided according to an aspect of the present invention, which includes：Platform is used
In placement substrate；Bracket is movably attached to the platform along X-direction；Main movable block is located at the upper of the substrate
The bracket is attached to just and movably along Y direction；First auxiliary movable block is movably attached to institute along X-direction
State main movable block；Probe is arranged on first auxiliary movable block with positioned at the top of the substrate, for detecting the base
The defect of plate；And control unit, so that the bracket is persistently moved along X-direction and controls relative to described in the bracket
The relative velocity of auxiliary movable block.
First auxiliary movable block may include：Horizontal auxiliary movable block is opposite with the substrate and removable along X-direction
Ground is attached to the main movable block；And vertical auxiliary movable block, it is bent along Z-direction and is attached to the horizontal pair and moves
Block.
The base board defect detecting device may also include：Second auxiliary movable block is movably attached to institute along Z-direction
Vertical auxiliary movable block is stated, the probe can be coupled to second auxiliary movable block to be located above the substrate.
The bracket is controlled and is moved at preset constant speed by described control unit, and controls the detection of the probe
Action, and by the first auxiliary movable block control at speed identical with the movement speed of the bracket along with the bracket
The opposite X-direction movement of moving direction can detect the substrate when the probe tip suspends the defect of the substrate
Defect.
The bracket may include：A pair of brackets is moved along X-direction and is spaced apart in the both sides of the platform；With
And bracket main body, the top of the platform is supported and is located at by the holder.
The main movable block include movably be attached to along Y direction the bracket main body the first main movable block and with
The first main movable block separates and is movably attached to along Y direction the second main movable block of the bracket main body, described
First auxiliary movable block is movably attached to the described first main movable block and second along X-direction by link mechanism and main moved
Block, the link mechanism may include：First link arm, one end are rotatably connected to the described first main movable block, and another
End is attached to first auxiliary movable block；And the second connecting rod limb, one end are rotatably connected to the described second main movable block,
And the other end is attached to first auxiliary movable block.
The main movable block is movably attached to the bracket main body along Y direction, and first auxiliary movable block passes through
Link mechanism is movably attached to the main movable block along X-direction, and the link mechanism may include：Third connecting rod arm,
One end is rotatably connected to the main movable block；Fourth link arm, is arranged to separate with the third connecting rod arm and one end
It is rotatably connected to the main movable block；5th link arm, one end are rotatably connected to the another of the third connecting rod arm
One end, and the other end is attached to first auxiliary movable block；And six-bar linkage arm, one end are rotatably connected to described
The other end of double leval jib arm, and the other end is attached to first auxiliary movable block.
A kind of base board defect detection using the base board defect detecting device is provided according to another aspect of the present invention
Method, detection method includes the following steps for this：The defect coordinate of the substrate on the platform is placed in input；It is defeated according to institute
The Coordinate generation mobile route entered；Make the bracket along X-axis with preset constant speed according to the mobile route generated
It moves in direction；Make the probe close to described by least one of the movement main movable block and described first auxiliary movable block
Defect；Make first auxiliary movable block with speed identical with the movement speed of the bracket along the side of movement with the bracket
It is moved to opposite X-direction, so that the probe tip suspends the defect of the substrate；And when the probe tip is to described
When the defect pause of substrate, the defect of the substrate is detected.
In the step of generating mobile route according to the defect coordinate inputted, it is removable first auxiliary movable block can will to be located at
The defect coordinate being located at the shortest distance from the defect coordinate of current detection in the coordinate of the defects of dynamic region is set as next
Object is detected, to generate most short mobile route.
After the step of detecting the defect of the substrate, it may also include and judge whether the defect coordinate of current detection is final
The step of defect coordinate, can be such that the probe is moved to if the defect coordinate of current detection is not final defect coordinate
It is located at the defect coordinate at the shortest distance from the defect coordinate of current detection.Invention effect
According to an embodiment of the invention, the detection device for detecting the defect generated on substrate (glass) and detection side
Method, by the way that the time required to shortening base board defect detection, technique pitch time (tact-time) and yield can be improved.
Description of the drawings
Fig. 1 is the schematic diagram of base board defect detecting device according to prior art.
Fig. 2 is the reference chart of the method for illustrating to detect base board defect using base board defect detecting device.
Fig. 3 is the schematic diagram of base board defect detecting device according to an embodiment of the invention.
Fig. 4 is for illustrating the ginseng using the method for detecting base board defect according to the base board defect detecting device of the present embodiment
Examine figure.
Fig. 5 and Fig. 6 is the reference chart of the base board defect detecting device of variation according to an embodiment of the invention.
Fig. 7 is the reference chart of the base board defect detecting device of another variation according to an embodiment of the invention.
Fig. 8 is for illustrating the base board defect detection side using base board defect detecting device according to an embodiment of the invention
The flow chart of method.
Specific implementation mode
The present invention can be subject to various transformation and have various embodiments, therefore exemplifies specific embodiment and retouched in detail
It states.However, the present invention is not limited to particular implementation, it is all under the technological thought and technical scope of the present invention made by institute
There are transformation, equipollent or substitute, should all fall within the scope of the present invention.
In the explanation of the present invention, when thinking that illustrating for relevant known function or structure can unnecessarily obscure this
When the purport of invention, omission is repeated no more.In addition, the ordinal numbers such as used in this specification first, second are only intended to area
Divide a component and another component.
When a certain component " connection " described in this specification or " in conjunction with " arrive another component, a certain component can be straight
Another component is connect or is attached in succession, but in the case of apparent opposite record, it should be understood that it is described a certain
Component can also be connected or be attached to another component by other assemblies.
In addition, the terms such as "~portion (unit) ", "~device ", "~module " indicate to handle at least one function in this specification
Or the unit of operation.
Base board defect detecting device according to the present invention is described in detail with reference to the accompanying drawings, is being described with reference to the accompanying drawings
When, identical or corresponding component is using identical reference numeral and omits repeated explanation.
Fig. 3 is the schematic diagram of base board defect detecting device 100 according to an embodiment of the invention, and Fig. 4 is for illustrating profit
With the reference chart for the method for detecting 310 defect of substrate according to the base board defect detecting device 100 of the present embodiment.
Base board defect detecting device 100, bracket 200, holder 210, bracket main body 230, guide rail are shown in Fig. 3 and Fig. 4
231, guide rail 535, guide rail 537, platform 300, substrate 310, main movable block 510, horizontal main movable block 511, vertical main movable block
513, LM (Linear Motion) guide block 518, LM guide blocks 519, LM guide blocks 551, the first auxiliary movable block 530, horizontal auxiliary movable block
531, vertical auxiliary movable block 533, the second auxiliary movable block 550, probe (probe) 570, control unit 600.
Base board defect detecting device 100 according to an embodiment of the invention includes：Platform 300 is used to place substrate
310；Bracket 200 is movably attached to platform 300 along X-direction；Main movable block 510 is located at the top of substrate 310
And bracket 200 is movably attached to along Y direction；First auxiliary movable block 530, master is movably attached to along X-direction
Movable block 510；Probe 570 is arranged on first auxiliary movable block 530 with positioned at the top of substrate 310, for detecting base
The defect of plate 310；Control unit 600 makes bracket 200 persistently be moved along X-direction and controls relative to described in bracket 200
The relative velocity of auxiliary movable block, to by the way that the time required to shortening 310 defects detection of substrate, technique pitch time can be improved
(tact-time) and yield.
Substrate 310 through overexposure etch process is placed on platform 300.
300 upper edge X-direction of platform is movably combined with bracket 200.Multiple brackets 200 can be attached to platform
300.Bracket 200 may include：A pair of brackets 210 is moved along X-direction and is spaced apart in the both sides of platform 300；And support
Frame body 230 is supported and is located at the top of platform 300 by a pair of brackets 210.A pair of brackets 210 is arranged the two of platform 300
Side is simultaneously moved along X-direction, with the movement of holder 210, is attached to bracket main body 230 that holder 210 is supported by it along X-axis side
To movement.Following guide rails 231 can be set on the one side of bracket main body 230, be used for the movement of main movable block 510.At this point it is possible to
Multiple brackets 200 are set along X-direction, with the time required to shortening 310 defects detection of substrate.
Main movable block 510 is located at the top of substrate 310 and is movably attached to bracket 200 along Y direction.Specifically,
Main movable block 510 may include horizontal main movable block 511 and vertical main movable block 513.Horizontal main movable block 511 is configured to and substrate
310 is opposite and following with LM guide blocks 519, is thus movably attached to following water for being formed in the first auxiliary movable block 530
Guide rail 535 on flat auxiliary movable block 531.Vertical main movable block 513 can bend along Z-direction and be attached to horizontal main movable block
511 and inside have with the guide rail 231 of bracket main body 230 combine and move LM guide blocks 518.As setting is in vertical main movement
LM guide blocks 518 on block 513 are moved along the guide rail 231 of bracket main body 230, and main movable block 510 is moved along Y direction.
First auxiliary movable block 530 is movably attached to main movable block 510 along X-direction.Specifically, the first auxiliary movable block
530 may include horizontal auxiliary movable block 531 and vertical auxiliary movable block 533.Horizontal auxiliary movable block 531 is configured to opposite with substrate 310
And guide rail 535 is may be formed over corresponding to the LM guide blocks 519 being arranged on main movable block 510.At this point, guide rail 535 can be along X
Axis direction is formed, and thus LM guide blocks 519 and guide rail 535 can be combined into can relatively move each other along X-direction.For example, first
Auxiliary movable block 530 can be moved relative to main movable block 510 along X-direction.Vertical auxiliary movable block 533 bends along Z-direction and is tied
Close horizontal auxiliary movable block 531, and on one side can Z-direction form guide rail 537, so that the second auxiliary movable block 550 can be with
It is mobile.
That is, LM guide blocks the first auxiliary movable block of structure by connecting the first auxiliary movable block 530 and main movable block 510
530 can move along X-direction, are hereby incorporated into the probe 570 of the first auxiliary movable block 530 and can also be moved along X-direction.Such as
This, independently of the movement of bracket 200, probe 570 can be moved along X-direction, and then the coordinate that can not only detect X-axis is identical
Defect can also detect the different defect of the coordinate of X-axis in the moving range of probe 570.
Specifically, with reference to Fig. 3 and Fig. 4, according to the base board defect detecting device 100 of the present embodiment, probe 570 passes through the
One auxiliary movable block 530 can be moved along X-direction, therefore different from the prior art (with reference to Fig. 2), reduced to the greatest extent along Y direction
Movement in the case of, defect can be detected successively 1., 2., 3., 4., 5..Therefore, can reduce to the greatest extent probe 570 along Y-axis side
To movement and detect the defect of substrate 310, so as to reduce the defects detection time.
Probe 570 is arranged on the first auxiliary movable block 530 with positioned at the top of substrate 310, for detecting lacking for substrate 310
It falls into.Probe 570 according to the defect for detecting substrate 310 of the present embodiment can be optical camera such as CCD (Charge
Coupled Device).At this point it is possible to multiple probes 570 are set on 510 and first auxiliary movable block 530 of multiple main movable blocks,
With the time required to shortening 310 defects detection of substrate.
At this point it is possible to which probe 570 to be attached to the vertical auxiliary movable block for being movably integrated into the first auxiliary movable block 530
533 the second auxiliary movable block 550.It specifically, can be along Z axis on the one side of the vertical auxiliary movable block 533 of the first auxiliary movable block 530
Direction forms guide rail 537, and LM guide blocks 551 can be arranged on the second auxiliary movable block 550, to be movably attached to vertical secondary shifting
The guide rail 537 of motion block 533.When probe 570 is attached to the first auxiliary movable block 530 by the second auxiliary movable block 550, probe 570
It can move, probe 570 can be moved along Z-direction as needed, to examine the defect of substrate 310 along Z-direction.
Control unit 600 makes bracket 200 persistently move along X-direction and controls to move relative to the first pair of bracket 200
The relative velocity of block 530.Control unit 600 can control bracket 200 and be moved with preset constant speed, and can control spy
First 570 detection operation.
Specifically, bracket 200 is controlled and is moved along X-direction at constant speed by control unit 600, and will be combined with spy
First 570 the first auxiliary movable block 530 control at speed identical with the movement speed of bracket 200 along the shifting with bracket 200
The opposite X-direction movement in dynamic direction.That is, when bracket 200 is moved with constant speed along positive (+) X-direction, control
Unit 600 processed by the first auxiliary movable block 530 control at speed identical with the movement speed of bracket 200 along negative (-) X-axis side
To movement.Mechanism in this way will appear the phenomenon that defect pause of the probe 570 for substrate 310 (to the probe 570 of defect
Relative velocity be 0 the phenomenon that), and by make the stoppings phenomenon of probe 570 appear in substrate 310 defect upside, pop one's head in
570 can detect the defect of substrate 310 under halted state.For the prior art, in the state that bracket 200 moves, probe 570
Also it can move together, and for the accurate detection of the defect of substrate 310, it is necessary to after stopping bracket 200, recycle probe 570
Detect defect.In contrast, in the present embodiment, independently of the movement of bracket 200, probe 570 can be moved along X-direction, because
This can cause probe 570 to be directed to substrate by making probe 570 be moved along the direction opposite with the moving direction of bracket 200
The phenomenon that 310 defect moment stops.That is, during bracket 200 is moved along X-direction, probe can also be made
570 X-direction position is fixed.It is not necessarily to stop bracket 200 as a result, in the case where making bracket 200 be moved with constant speed,
Probe 570 will not shake, and can detect the defect of substrate 310.Therefore, by reducing the movement of bracket 200 to the greatest extent and stopping anti-
Double action is made, and can not only prevent the damage of the detection device caused by the weight of bracket 200, but also can shorten defects detection institute
It takes time.
Fig. 5 and Fig. 6 is the reference chart of the base board defect detecting device 100 of variation according to an embodiment of the invention, ginseng
According to Fig. 5 and Fig. 6, according in the base board defect detecting device 100 of the present embodiment, main movable block 510 includes removable along Y direction
Ground is attached to the first main movable block 510a of bracket main body 230 and is separated with the first main movable block 510a and removable along Y direction
It is attached to the second main movable block 510b of bracket main body 230 dynamicly, the first auxiliary movable block 530 is by link mechanism along X-direction
The first main main movable block 510b of movable block 510a and second are movably attached to, link mechanism may include：First link arm
517a, one end is rotatably connected to the first main movable block 510a, and the other end is attached to the first auxiliary movable block 530；And
The second connecting rod limb 517b, one end is rotatably connected to the second main movable block 510b, and the other end is attached to the first secondary movement
Block 530.
The present embodiment is the variation of previous embodiment, for making probe 570 be different from along the component that X-direction moves
Previous embodiment.For the present embodiment, in addition to the main movable block 510b of the first main movable block 510a and second, the first auxiliary movable block
530 and link mechanism except, other assemblies are identical as previous embodiment, therefore are substituted pair with the explanation of previous embodiment
The explanation of same components.
For the present embodiment, the upper surface of bracket main body 230 is formed with guide rail 231 along Y direction, and forms multiple main shiftings
Motion block 510 is made of the first main main movable block 510b of movable block 510a and second.First main movable block 510a can along Y direction
Movably it is attached to bracket main body 230, the second main movable block 510b is separated and removable along Y direction with the first main movable block 510a
It is attached to bracket main body 230 dynamicly.
First master is movably attached to along X-direction by link mechanism in conjunction with the first auxiliary movable block 530 of probe 570
The main movable block 510b of movable block 510a and second.Link mechanism includes first link arm 517a and the second connecting rod limb 517b.First
Link arm 517a one ends are rotatably connected to the first main movable block 510a by joint pin 515, and the other end is attached to
One auxiliary movable block 530.The second connecting rod limb 517b one ends are rotatably connected to the second main movable block 510b, and the other end combines
To the first auxiliary movable block 530.With reference to Fig. 6 (b), when the first main main movable block 510b of movable block 510a and second away from each other
When, first link arm 517a and the second connecting rod limb 517b can rotate, and be hereby incorporated into first link arm 517a and the second connecting rod limb
The first auxiliary movable block 530 of 517b is along X-direction.Link mechanism in this way, in conjunction with the first auxiliary movable block of probe 570
530 can move along X-direction, it is possible thereby to reduce to the greatest extent probe 570 moving along Y direction, make bracket 200 with constant
In the case that speed moves, probe 570 will not shake, and can detect defect.
Fig. 7 is the reference chart of the base board defect detecting device of another variation according to an embodiment of the invention, reference
Fig. 7, main movable block 510 are movably attached to bracket main body 230 along Y direction, and the first auxiliary movable block 530 passes through link mechanism
Main movable block 510 is movably attached to along X-direction, link mechanism may include：Third connecting rod arm 517c, one end are rotatable
Ground is connected to main movable block 510；Fourth link arm 517d, be arranged to separate with third connecting rod arm 517c and one end rotatably
It is connected to main movable block 510；5th link arm 517e, one end are rotatably connected to the other end of third connecting rod arm 517c,
And the other end is attached to the first auxiliary movable block 530；And six-bar linkage arm 517f, one end are rotatably connected to fourth link
The other end of arm 517d, and the other end is attached to the first auxiliary movable block 530.
The present embodiment is another variation of most previous embodiment, the group for making probe 570 be moved along X-direction
Part is different from foregoing first embodiment.For the present embodiment, in addition to main movable block 510, the first auxiliary movable block 530 and connecting rod machine
Except structure, other assemblies are identical as one embodiment, therefore are substituted to identical group with the explanation of foregoing first embodiment
The explanation of part.
For the present embodiment, the upper surface of bracket main body 230 forms guide rail 231 along Y direction, and main movable block 510 is along Y-axis side
To being movably attached to bracket main body 230.
Main move movably is attached to along X-direction by link mechanism in conjunction with the first auxiliary movable block 530 of probe 570
Block 510.Link mechanism includes third connecting rod arm 517c, fourth link arm 517d, the 5th link arm 517e and six-bar linkage arm
517f.Third connecting rod arm 517c one ends are rotatably connected to main movable block 510 by joint pin 515, and the other end connects
To one end of the 5th link arm 517e.Fourth link arm 517d is arranged to separate with third connecting rod arm 517c and one end passes through hinge
Pin 515 is rotatably connected to main movable block 510, and the other end is connected to one end of six-bar linkage arm 517f.5th link arm
517e one ends are rotatably connected to the other end of third connecting rod arm 517c by joint pin 515, and the other end is attached to
One auxiliary movable block 530.Six-bar linkage arm 517f one ends are rotatably connected to fourth link arm 517d's by joint pin 515
The other end, and the other end is attached to the first auxiliary movable block 530.With reference to (b) of Fig. 7, with third connecting rod arm 517c, fourth link
Arm 517d, the 5th link arm 517e and the 517f rotations of six-bar linkage arm, the first auxiliary movable block 530 is along X-direction.In this way
Link mechanism can be moved in conjunction with the first auxiliary movable block 530 of probe 570 along X-direction, it is possible thereby to reduce probe 570 to the greatest extent
Moving along Y direction, in the case where making bracket 200 be moved with constant speed, probe 570 will not shake, and can detect
Defect.
In addition, though it is not shown, but two kinds of variations above-mentioned can also include that is movably attached to along Z-direction
Second auxiliary movable block 550 of one auxiliary movable block 530, probe 570 can be incorporated into the second auxiliary movable block 550.
Fig. 8 is for illustrating that the base board defect using base board defect detecting device 100 according to an embodiment of the invention is examined
The flow chart of survey method.With reference to Fig. 8, according to the base board defect of the present embodiment, detection method includes the following steps：Input is placed in
The defect coordinate of substrate 310 on platform 300；According to the mobile road of the Coordinate generation base board defect detecting device 100 inputted
Diameter；Make bracket 200 along X-direction with preset constant speed according to the mobile route generated；Pass through the main movable block of movement 510
Make probe 570 close to defect at least one of auxiliary movable block；Make the first auxiliary movable block 530 with the mobile speed with bracket 200
It spends identical speed to move along the X-direction opposite with the moving direction of bracket 200, so that probe 570 is for substrate 310
Defect is suspended；And when the defect that 570 are directed to substrate 310 of popping one's head in is suspended, detect the defect of substrate 310.
The step S100 of the defect coordinate of input substrate 310 is that defective seat on substrate 310 is thought in operating personnel's input
Target step.At this point it is possible to input multiple defect coordinates inputted by operating personnel.
The step S200 for generating entire mobile route is according to most short between the defect coordinate generation defect coordinate inputted
The step of mobile route.The step of generating mobile route according to the defect coordinate inputted is according to positioned at the multiple seats inputted
The defect put on generates the step of for making probe 570 move the mobile route of the shortest distance.Specifically, according to being inputted
Defect coordinate generates the step of mobile route, will be in multiple defect coordinates in 530 moving area of the first auxiliary movable block
It is located at the defect coordinate at the shortest distance from the defect coordinate of current detection and is set as next detection object, generates most short shifting
Dynamic path.At this point, 530 moving area of the first auxiliary movable block refers to 530 follows track 535 of the first auxiliary movable block along X-direction
Moveable distance, the length or the preset distance in the length of guide rail 535 that can be guide rail 535.For this reality
Example is applied, it, can also even if not being the defect in same X-axis due to can be moved along X-direction using the first auxiliary movable block 530
It is detected, therefore the defect coordinate being located at from the defect coordinate of current detection at the shortest distance can be set as next detection
Object, so as to generate the most short mobile route between defect coordinate (with reference to Fig. 4).Therefore, with the prior art (with reference to Fig. 2)
It compares, due to the 570 movement shortest distance of probe, the defects detection time of substrate 310 can be shortened.
Then, bracket 200, main movable block 510 and the first auxiliary movable block 530 are moved along the most short mobile route generated
It is dynamic, so that probe 570 is located on inputted coordinate.
Make the step S300 that bracket 200 moves be that bracket 200 is made to be moved along X-direction, is located at and thinks existing defects
Region the step of.At this point, to make bracket 200 move and detecting defect, bracket 200 can be made to be held with preset constant speed
Continuous movement.
It is to utilize at least one of main movable block 510 and the first auxiliary movable block 530 to make the step S400 that probe 570 moves
The step of making probe 570 move close to inputted defect coordinate.At this point, independently of the movement of bracket 200, probe 570 can be along X
Axis direction moves, therefore is different from the prior art, can not only detect the identical defect of coordinate of X-axis, can also be in probe 570
X-axis moving range in detection X-axis the different defect of coordinate (with reference to Fig. 4).In addition, bracket 200 is made to be moved with constant speed
And when detecting defect, preferred probes 570 are located at defect coordinate in advance along X-direction, to pass through the movement of the first auxiliary movable block 530
The phenomenon that causing to suspend defect.
The step of step S500 for detecting the defect of substrate 310 is the defect using 570 detection substrate 310 of probe.At this point,
Probe 570 can be moved by the first auxiliary movable block 530 along X-direction, therefore different from the prior art (with reference to Fig. 2), Ke Yijin
Amount reduces moving and detect multiple defects (with reference to Fig. 4) along Y direction.In addition, making bracket 200 with constant speed movement and examining
When surveying defect, by making probe 570 with speed identical with the movement speed of bracket 200 along the moving direction with bracket 200
Opposite X-direction movement is not shaken with generating the phenomenon that probe 570 suspends for the defect of substrate 310 in probe 570
In the case of, defect can be detected.That is, by the position of temporarily fixed probe 570, the defect of substrate 310 can be detected.
Finally, judge that the coordinate detected whether be the step S600 of final defect coordinate is to judge that the defect that detects is sat
The step of whether mark is final defect coordinate in inputted defect coordinate and judges whether to terminate detection defect.Specifically,
If the defect coordinate of current detection is not final defect coordinate, probe 570 is moved to other on most short mobile route
Defect coordinate simultaneously detects defect, if the coordinate of current detection is final defect coordinate, terminates the inspection in current detection region
It surveys, and base board defect detecting device 100 is moved to next detection zone.The most short shifting generated according to process in this way
Mobile probe 570 is carried out in dynamic path, can detect multiple defects in a relatively short period of time.
It is illustrated above by reference to the embodiment of the present invention, but those of ordinary skill in the art are readily appreciated that not
Be detached from the present invention described in claim design and field in the range of various modifications and change can be done to the present invention.
Symbol description
100：Base board defect detecting device 200：Bracket
210：Holder 230：Bracket main body
231、535、537：Guide rail 300：Platform
310：Substrate 510：Main movable block
510a：First main movable block 510b：Second main movable block
511：Horizontal main movable block 513：Vertical main movable block
515：Joint pin 517a：First link arm
517b：The second connecting rod limb 517c：Third connecting rod arm
517d：Fourth link arm 517e：5th link arm
517f：Six-bar linkage arm 518,519,551：LM guide blocks
530：First auxiliary movable block 531：Horizontal auxiliary movable block
533：Vertical auxiliary movable block 550：Second auxiliary movable block
570：Probe 600：Control unit
Claims (10)
1. a kind of base board defect detecting device comprising：
Platform is used to place substrate；
Bracket is movably attached to the platform along X-direction；
Main movable block is located at the top of the substrate and is movably attached to the bracket along Y direction；
First auxiliary movable block is movably attached to the main movable block along X-direction；
Probe is arranged on first auxiliary movable block with positioned at the top of the substrate, for detecting lacking for the substrate
It falls into；And
Control unit makes the bracket persistently be moved along X-direction and controls relative to described the first of the bracket the secondary shifting
The relative velocity of motion block.
2. base board defect detecting device according to claim 1, wherein
First auxiliary movable block includes：
Horizontal auxiliary movable block is opposite with the substrate and the main movable block is movably attached to along X-direction；And
Vertical auxiliary movable block bends along Z-direction and is attached to the horizontal auxiliary movable block.
3. base board defect detecting device according to claim 2, further includes：
Second auxiliary movable block is movably attached to the vertical auxiliary movable block along Z-direction,
The probe incorporated is located to second auxiliary movable block above the substrate.
4. base board defect detecting device according to claim 1, wherein
The bracket is controlled and is moved at preset constant speed by described control unit, and the detection for controlling the probe is dynamic
Make, and by first auxiliary movable block control at speed identical with the movement speed of the bracket along with the bracket
The opposite X-direction movement of moving direction detect the substrate when the probe tip suspends the defect of the substrate
Defect.
5. base board defect detecting device according to claim 1, wherein
The bracket includes：
A pair of brackets is moved along X-direction and is spaced apart in the both sides of the platform；And
Bracket main body is supported and is located at the top of the platform by the holder.
6. base board defect detecting device according to claim 5, wherein
The main movable block include movably be attached to along Y direction the bracket main body the first main movable block and with it is described
First main movable block separates and is movably attached to along Y direction the second main movable block of the bracket main body,
First auxiliary movable block is movably attached to the described first main movable block and second by link mechanism along X-direction
Main movable block,
The link mechanism includes：
First link arm, one end is rotatably connected to the described first main movable block, and the other end is attached to first pair
Movable block；And
The second connecting rod limb, one end is rotatably connected to the described second main movable block, and the other end is attached to first pair
Movable block.
7. base board defect detecting device according to claim 5, wherein
The main movable block is movably attached to the bracket main body along Y direction,
First auxiliary movable block is movably attached to the main movable block by link mechanism along X-direction,
The link mechanism includes：
Third connecting rod arm, one end are rotatably connected to the main movable block；
Fourth link arm is arranged to separate with the third connecting rod arm and one end is rotatably connected to the main movable block；
5th link arm, one end are rotatably connected to the other end of the third connecting rod arm, and the other end be attached to it is described
First auxiliary movable block；And
Six-bar linkage arm, one end are rotatably connected to the other end of the fourth link arm, and the other end be attached to it is described
First auxiliary movable block.
8. a kind of base board defect detection method, using base board defect detecting device according to claim 1, this method includes
Following steps：
The defect coordinate of the substrate on the platform is placed in input；
According to the Coordinate generation whole mobile route inputted；
The bracket is set to be moved along X-direction with preset constant speed according to the mobile route generated；
Make the probe close to the defect by least one of the movement main movable block and described first auxiliary movable block；
Make first auxiliary movable block with speed identical with the movement speed of the bracket along the side of movement with the bracket
It is moved to opposite X-direction, so that the probe tip suspends the defect of the substrate；And
When the probe tip suspends the defect of the substrate, the defect of the substrate is detected.
9. base board defect detection method according to claim 8, wherein
It, will be positioned at the removable area of first auxiliary movable block in the step of generating mobile route according to the defect coordinate inputted
The defect coordinate being located at the shortest distance from the defect coordinate of current detection in the coordinate of the defects of domain is set as next detection
Object, to generate most short mobile route.
10. base board defect detection method according to claim 9, wherein
Further include judging whether the defect coordinate of current detection is that final defect is sat after the step of detecting the defect of the substrate
Target step,
If the defect coordinate of current detection is not final defect coordinate, the probe is made to be moved to the defect from current detection
Coordinate is located at the defect coordinate at the shortest distance.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160060990A KR101751801B1 (en) | 2016-05-18 | 2016-05-18 | Defect inspecting device for substrate and inspecting method using the same |
| KR10-2016-0060990 | 2016-05-18 | ||
| PCT/KR2017/005186 WO2017200324A1 (en) | 2016-05-18 | 2017-05-18 | Substrate defect inspection device and inspection method using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108291879A true CN108291879A (en) | 2018-07-17 |
| CN108291879B CN108291879B (en) | 2020-12-08 |
Family
ID=59280335
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780004216.7A Active CN108291879B (en) | 2016-05-18 | 2017-05-18 | Substrate defect detecting device and detecting method using the same |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101751801B1 (en) |
| CN (1) | CN108291879B (en) |
| WO (1) | WO2017200324A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116609336A (en) * | 2023-04-26 | 2023-08-18 | 晶诺微(上海)科技有限公司 | Defect detection apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102308226B1 (en) * | 2020-11-24 | 2021-11-04 | 디아이티 주식회사 | Substrate surface defect review apparatus |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN108291879B (en) | 2020-12-08 |
| WO2017200324A1 (en) | 2017-11-23 |
| KR101751801B1 (en) | 2017-06-29 |
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