WO2017200324A1 - Substrate defect inspection device and inspection method using same - Google Patents

Abstract

According to one embodiment of the present invention, a substrate defect inspection device comprises: a stage on which a substrate is mounted; a gantry movably coupled to the stage in the X-axis direction; a main moving block located on an upper part of the substrate, and coupled to the gantry so as to be movable in the Y-axis direction; a first auxiliary moving block movably coupled to the main moving block in the X-axis direction; a probe provided in the first auxiliary moving block so as to be located on an upper part of the substrate, and measuring a defect of the substrate; and a control unit for controlling the relative speed of the auxiliary moving block with respect to the gantry while continuously moving the gantry in the X-axis direction.

Description

Board defect inspection device and inspection method using the same

The present invention relates to a substrate defect inspection apparatus and an inspection method using the same. More specifically, in the inspection apparatus and inspection method for measuring the defects generated in the glass (glass), the time required for the measurement of the defects of the substrate is shortened to improve process tact time and production yield The present invention relates to a substrate defect inspection apparatus and an inspection method using the same.

In general, an optical display includes a substrate, a liquid crystal layer, an opposing substrate, and the like, and an LCD display of the optical display is made through various manufacturing processes. Representative manufacturing processes include the exposure and etching process, the photo filter, the color filter process, the cell process, and the module process. Is a process which is repeatedly performed to stack circuits and requires precision.

After the exposure and etching process, the optical inspection equipment (AOI, Automatic Optical Inspection) is used to check whether the electrical circuit pattern is well formed on the substrate, and the inspection results in open or short circuit of the circuit pattern. If found, a repair or repair is performed to repair the disconnection or short circuit.

In order to improve the speed of defect inspection, it is important to find as many defects as possible using optical inspection equipment within a limited process time. In particular, as the mass production of products is accelerated, a technique for measuring defects of a substrate at a fast stage in the process stage This is becoming more important.

FIG. 1 is a schematic diagram of a substrate defect inspection apparatus 10 as an optical inspection apparatus AOI according to the prior art, and a substrate defect inspection apparatus 10 according to the prior art will be described with reference to FIG. 1.

The substrate defect inspection apparatus 10 according to the related art is composed of a stage 30, a gantry 20, a gantry 20, a moving block 21, and a probe 23. The substrate 33 for inspection is mounted on the stage 30, and the gantry 20 is coupled to the stage 30 so as to be movable in the X-axis direction and moves in the X-axis direction as the inspection process proceeds. The moving block 21 is movably coupled to the gantry 20 in the Y-axis direction, and the probe 23 is positioned on the defect top of the substrate 33 as the probe 23 moves. The probe 23 is moved above the defect of the substrate 33 by the gantry 20 and the moving block 21, and the probe 23 moved to the measurement point measures the defect.

Specifically, referring to FIGS. 1 and 2, a method for measuring a plurality of defects using the substrate defect inspection apparatus 10 according to the related art will be described. The gantry 20 may be moved by stopping in the X-axis direction. After measuring the defect ① by using the probe 23, and moving the probe 23 in the Y-axis direction through the moving block 21 to measure the defect ②. Thereafter, the gantry 20 is moved by stopping in the X-axis direction, and then the probe 23 is moved in the Y-axis direction through the moving block 21 to measure defects ③. Then, the gantry 20 and the moving block are measured. The defect ④ and defect ⑤ are measured sequentially by repeating the movement and stop operation of (21).

According to the conventional board | substrate defect inspection apparatus comprised in this way, there existed the following problems.

First, in the gantry structure according to the prior art, since the moving block is movable only in the Y-axis direction, the probe can measure only defects having the same coordinates of the X axis (defects on the X axis) and X in the case of defects having different X axis coordinates. There was no choice but to move it to the axis. Therefore, as the number of movements of the probe in the Y-axis direction increases, there is a problem in that the time required for defect measurement increases (see FIG. 2).

Second, in order to measure defects, the gantry under heavy load must be moved and stopped from time to time. If such an operation is repeated, the inspection device may be damaged by the load of the gantry, resulting in increased cost due to increased maintenance. There was a problem, and there was a problem in that the time required for defect measurement was increased with repetition of the moving and stopping operations.

One aspect of the present invention is to provide a substrate defect inspection apparatus and an inspection method using the same which can shorten the time required for the measurement of substrate defects, thereby improving process tact-time and production yield.

According to an aspect of the invention, the stage is the substrate is seated; A gantry movably coupled to the stage in an X-axis direction; A main moving block positioned on the substrate and coupled to the gantry to be movable in the Y-axis direction; A first auxiliary moving block movably coupled to the main moving block in an X-axis direction; A probe installed at the first auxiliary moving block to be positioned above the substrate, the probe measuring a defect of the substrate; And a control unit controlling a relative speed of the auxiliary moving block with respect to the gantry while continuously moving the gantry in the X-axis direction.

The first auxiliary moving block may include a horizontal auxiliary moving block coupled to the main moving block so as to face the substrate and move in an X-axis direction; And a vertical auxiliary moving block bent and coupled to the horizontal auxiliary moving block in a Z-axis direction.

The apparatus may further include a second auxiliary moving block movably coupled to the vertical auxiliary moving block in a Z-axis direction, and the probe may be coupled to the second auxiliary moving block to be positioned on the substrate.

The control unit controls the gantry to move at a predetermined constant speed, controls the measurement operation of the probe, and the first auxiliary moving block is opposite to the moving direction of the gantry at the same speed as the moving speed of the gantry. By controlling to move in the axial direction, the defect of the substrate can be measured when the probe is temporarily stopped with respect to the defect of the substrate.

The gantry is moved in the X-axis direction, a pair of supports provided on both sides of the stage spaced apart; And a gantry body supported by the support and positioned above the stage.

The main moving block is a first main moving block movably coupled to the gantry body in the Y axis direction and a second main movement spaced apart from the first main moving block and movably coupled to the gantry body in the Y axis direction. And a first auxiliary movable block movably coupled to the first and second main movable blocks in an X-axis direction by a link structure, and one end of which is connected to the first main movable block. A first link arm rotatably connected and the other end coupled to the first auxiliary moving block; And a second link arm having one end rotatably connected to the second main moving block and the other end coupled to the first auxiliary moving block.

The main moving block is movably coupled to the gantry body in the Y-axis direction, the first auxiliary moving block is movably coupled to the main moving block in the X-axis direction by a link structure, and the link structure is: A third link arm having one end rotatably connected to the main moving block; A fourth link arm spaced apart from the third link arm and having one end rotatably connected to the main moving block; A fifth link arm, one end of which is rotatably connected to the other end of the third link arm and the other end of which is coupled to the first auxiliary moving block; And a sixth link arm one end of which is rotatably connected to the other end of the fourth link arm and the other end of which is coupled to the first auxiliary moving block.

According to another aspect of the present invention, a defect inspection method using the substrate defect apparatus, comprising: inputting coordinates of a defect of the substrate seated on the stage; Generating a movement route according to the input coordinates; Moving the gantry in the X axis direction at a predetermined constant speed according to the generated movement path; Moving at least one of the main moving block and the first auxiliary moving block to position the probe in proximity to the defect; Moving the first auxiliary moving block in an X-axis direction opposite to the moving direction of the gantry at the same speed as the moving speed of the gantry such that the probe is temporarily stopped against a defect of the substrate; And measuring a defect of the substrate when the probe is temporarily stopped with respect to the defect of the substrate.

The generating of the movement path according to the input defect coordinates may include setting the defect coordinates located at the shortest distance from the defect coordinates currently measured among the defect coordinates located in the movable area of the first auxiliary moving block as the next measurement target. You can create a route.

After measuring a defect of the substrate, determining whether the currently measured defect coordinate is a final defect coordinate, and if the currently measured defect coordinate is not the final defect coordinate, the defect currently measured by the probe It can be moved to the defect coordinate located at the shortest distance from the coordinate.

According to an embodiment of the present invention, in the inspection apparatus and inspection method for measuring the defects generated in the glass (glass), the process time and production by reducing the time required for the measurement of the defects of the substrate (tact-time) Yield can be improved.

1 is a schematic diagram of a substrate defect inspection apparatus according to the prior art.

2 is a reference diagram for explaining a method of measuring a defect of a substrate using a substrate defect inspection apparatus.

3 is a schematic diagram of a substrate defect inspection apparatus according to an embodiment of the present invention.

4 is a reference diagram for explaining a method of measuring a defect of a substrate using the substrate defect inspection apparatus according to the present embodiment.

5 and 6 are reference views of a substrate defect inspection apparatus according to a modification of an embodiment of the present invention.

7 is a reference view of a substrate defect inspection apparatus according to another modified example of the embodiment of the present invention.

8 is a flowchart illustrating a substrate defect inspection method using a substrate defect inspection apparatus according to an embodiment of the present invention.

The present invention may be variously modified and have various embodiments, and specific embodiments will be illustrated in the drawings and described in detail with reference to the accompanying drawings. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

In describing the present invention, when it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. In addition, numerals (eg, first, second, etc.) used in the description process of the present specification are merely identification symbols for distinguishing one component from another component.

In addition, in the present specification, when one component is referred to as "connected" or "coupled" with another component, the one component may be directly connected to or directly coupled to the other component, It is to be understood that unless there is an opposing substrate, it may be connected or combined via another component in the middle.

In addition, the terms "~ unit (unit)", "~ group", "~ ruler", "~ module" described herein may mean a unit for processing at least one function or operation.

Hereinafter, a substrate defect inspection apparatus according to the present invention will be described in detail with reference to the accompanying drawings, and in the following description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and are duplicated thereto. The description will be omitted.

3 is a schematic diagram of a substrate defect inspection apparatus 100 according to an embodiment of the present invention, Figure 4 is a method for measuring a defect of the substrate 310 using the substrate defect inspection apparatus 100 according to the present embodiment. It is a reference diagram for explaining this.

3 and 4, the substrate defect inspection apparatus 100, the gantry 200 (Gantry), the support 210, the gantry body 230, the guide rails (231, 535, 537), the stage 300, the substrate ( 310, a main moving block 510, a horizontal main moving block 511, a vertical main moving block 513, a linear motion (LM) guide block 518, 519, 551, a first auxiliary moving block 530, A horizontal auxiliary moving block 531, a vertical auxiliary moving block 533, a second auxiliary moving block 550, a probe 570, and a controller 600 are illustrated.

Substrate defect inspection apparatus 100 according to an embodiment of the present invention, the stage 300 on which the substrate 310 is seated; A gantry 200 movably coupled to the stage 300 in the X-axis direction; A main moving block 510 positioned on the substrate 310 and coupled to the gantry 200 to be movable in the Y-axis direction; A first auxiliary moving block 530 movably coupled to the main moving block 510 in the X-axis direction; A probe 570 installed on the first auxiliary moving block 530 to be positioned above the substrate 310 and measuring a defect of the substrate 310; The control unit 600 controls the relative speed of the auxiliary moving block with respect to the gantry 200 while continuously moving the gantry 200 in the X-axis direction, thereby reducing the time required for defect measurement of the substrate 310. To improve process tact-time and production yield.

The substrate 310 which has undergone the exposure etching process is mounted on the stage 300.

The gantry 200 is coupled to the stage 300 to be movable in the X-axis direction. The gantry 200 may be coupled to a plurality of stages 300. The gantry 200 moves in the X-axis direction and is supported by a pair of supports 210 and a pair of supports 210 spaced apart from both sides of the stage 300 so as to be positioned above the stage 300. It may include a gantry body 230 is located. A pair of supports 210 are provided on both sides of the stage 300 to move along the X-axis direction, the gantry body 230 that is coupled to and supported by the support 210 in accordance with the movement of the support 210 is X Move in the axial direction. At this time, one side of the gantry body 230 may be provided with a guide rail 231 for the movement of the main moving block 510 to be described later. In this case, the gantry 200 may be provided in plurality in the X-axis direction in order to shorten the time required for defect measurement of the substrate 310.

The main moving block 510 is positioned above the substrate 310 and is coupled to the gantry 200 to be movable in the Y-axis direction. Specifically, the main moving block 510 may include a horizontal main moving block 511 and a vertical main moving block 513. The horizontal main moving block 511 is disposed to face the substrate 310 and has a LM guide block 519 formed on the bottom thereof so that the guide formed in the horizontal auxiliary moving block 531 of the first auxiliary moving block 530 to be described later. It is movably coupled to the rail 535. The vertical main moving block 513 is coupled to the horizontal main moving block 511 so as to be bent in the Z-axis direction, and the inner LM guide block 518 coupled to the guide rail 231 of the gantry body 230 is moved therein. It may be provided. As the LM guide block 518 provided in the vertical main moving block 513 moves along the guide rail 231 of the gantry body 230, the main moving block 510 moves in the Y-axis direction.

The first auxiliary moving block 530 is movably coupled to the main moving block 510 in the X-axis direction. In detail, the first auxiliary moving block 530 may include a horizontal auxiliary moving block 531 and a vertical auxiliary moving block 533. The horizontal auxiliary moving block 531 may be disposed to face the substrate 310, and a guide rail 535 may be formed on an upper surface thereof to correspond to the LM guide block 519 installed in the main moving block 510. At this time, the guide rail 535 may be formed in the X-axis direction, and thus the LM guide block 519 and the guide rail 535 may be coupled to each other to allow relative movement in the X-axis direction. For example, the first auxiliary moving block 530 may be moved in the X-axis direction with respect to the main moving block 510. The vertical auxiliary movement block 533 is bent and coupled to the horizontal auxiliary movement block 531 in the Z-axis direction, and on one side of the guide rail along the Z-axis direction to allow the second auxiliary movement block 550 to be described later ( 537) can be formed.

That is, the first auxiliary moving block 530 is movable in the X-axis direction by the LM guide block structure connecting the first auxiliary moving block 530 and the main moving block 510. The probe 570 coupled to the moving block 530 may also move in the X-axis direction. As described above, the probe 570 can move in the X axis direction separately from the movement of the gantry 200, so that not only defects having the same coordinates of the X axis but also defects having different coordinates of the X axis within the movement range of the probe 570 can be measured. do.

Specifically, referring to FIGS. 3 and 4, in the substrate defect inspection apparatus 100 according to the present exemplary embodiment, the probe 570 may be moved in the X-axis direction by the first auxiliary moving block 530. , Unlike the prior art (see FIG. 2), defects ①, ②, and ③ while minimizing movement in the Y-axis direction. ④ and ⑤ can be measured sequentially. Accordingly, defect measurement of the substrate 310 may be performed while minimizing movement of the probe 570 in the Y-axis direction, thereby reducing defect measurement time.

The probe 570 is installed on the first auxiliary moving block 530 to be positioned above the substrate 310, and measures a defect of the substrate 310. The probe 570 for measuring a defect of the substrate 310 according to the present exemplary embodiment may be an optical camera such as a charge coupled device (CCD). In this case, a plurality of probes 570 may be provided in the plurality of main moving blocks 510 and the first auxiliary moving blocks 530 in order to shorten the time required for defect measurement of the substrate 310.

In this case, the probe 570 may be coupled to the second auxiliary movement block 550 that is movably coupled to the vertical auxiliary movement block 533 of the first auxiliary movement block 530. Specifically, a guide rail 537 may be formed in one side of the vertical auxiliary moving block 533 of the first auxiliary moving block 530 in the Z axis direction, and the vertical auxiliary moving in the second auxiliary moving block 550. The LM guide block 551 may be provided to be movably coupled to the guide rail 537 of the block 533. When the probe 570 is coupled to the first auxiliary moving block 530 by the second auxiliary moving block 550, the probe 570 is movable in the Z-axis direction, and if necessary, the probe 570 is moved to the Z axis. The defect in the substrate 310 may be observed in detail by moving in the direction.

The controller 600 controls the relative speed of the first auxiliary moving block 530 with respect to the gantry 200 while continuously moving the gantry 200 in the X-axis direction. The controller 600 may control the gantry 200 to move at a predetermined constant speed and control the measurement operation of the probe 570.

Specifically, the controller 600 controls the gantry 200 to move in the X-axis direction at a constant speed, and the first auxiliary moving block 530 to which the probe 570 is coupled is the same as the moving speed of the gantry 200. The speed lock is controlled to move in the X axis direction opposite to the moving direction of the gantry 200. That is, when the gantry 200 moves in the positive X axis direction at a constant speed, the control unit 600 moves the first auxiliary moving block 530 at the same speed as the moving speed of the gantry 200. To move in the X-axis direction. By such a mechanism, a phenomenon in which the probe 570 temporarily stops with respect to a defect of the substrate 310 (a phenomenon in which the relative speed of the probe 570 with respect to the defect becomes zero) appears, and such a stop of the probe 570 occurs. The phenomenon is generated above the defect of the substrate 310 so that the defect of the substrate 310 can be measured while the probe 570 is stopped. In the prior art, since the gantry 200 moves together with the probe 570, the gantry 200 must be stopped for accurate measurement of the defect of the substrate 310. Measured. On the other hand, in the present embodiment, since the probe 570 is movable in the X-axis direction separately from the gantry 200, the probe 570 is moved in a direction opposite to the moving direction of the gantry 200 to prevent defects in the substrate 310. In this case, the probe 570 may be momentarily stopped. That is, the X-axis position of the probe 570 may be fixed while the gantry 200 moves in the X-axis direction. Accordingly, while the gantry 200 is moved at a constant speed without stopping the gantry 200, the defect of the substrate 310 may be measured without shaking the probe 570. Therefore, by minimizing the repeated operation of moving and stopping the gantry 200, it is possible to prevent damage to the inspection apparatus due to the load of the gantry 200 and to shorten the time required for defect measurement.

5 and 6 are reference views of a substrate defect inspection apparatus 100 according to a modification of an embodiment of the present invention, and referring to FIGS. 5 and 6, in the substrate defect inspection apparatus 100 according to the embodiment. The main moving block 510 is spaced apart from the first main moving block 510a and the first main moving block 510a to be movably coupled to the gantry body 230 in the Y-axis direction. And a second main moving block 510b movably coupled in an axial direction, and the first auxiliary moving block 530 moves in the X axis direction to the first and second main moving blocks 510b by a link structure. Possible coupling, the link structure, the first link arm 517a, one end of which is rotatably connected to the first main moving block (510a) and the other end of which is coupled to the first auxiliary moving block (530); And a second link arm 517b having one end rotatably connected to the second main moving block 510b and the other end coupled to the first auxiliary moving block 530.

This embodiment is a modification of the previous embodiment, and the configuration for moving the probe 570 in the X-axis direction is different from the previous embodiment. In the present embodiment, except for the first main moving block 510a, the second main moving block 510b, the first auxiliary moving block 530, and the link structure, the same configuration as in the previous embodiment is performed. I will replace the explanation.

In the present embodiment, the guide rail 231 is formed on the upper surface of the gantry body 230 in the Y-axis direction, and the main moving block 510 is the first main moving block 510a and the second main moving block 510b. It is formed in plural. The first main moving block 510a is movably coupled to the gantry body 230 in the Y-axis direction, and the second main moving block 510b is spaced apart from the first main moving block 510a to allow the gantry main body 230 to be moved. Is coupled to the Y axis in a movable manner.

The first auxiliary moving block 530 to which the probe 570 is coupled is movably coupled to the first and second main moving blocks 510b in the X-axis direction by a link structure. The link structure includes a first link arm 517a and a second link arm 517b. One end of the first link arm 517a is rotatably connected to the first main moving block 510a by a hinge pin 515, and the other end thereof is coupled to the first auxiliary moving block 530. One end of the second link arm 517b is rotatably connected to the second main moving block 510b and the other end thereof is coupled to the first auxiliary moving block 530. Referring to FIG. 6B, when the first main moving block 510a and the second main moving block 510b move away from each other, the first link arm 517a and the second link arm 517b rotate and thus Accordingly, the first auxiliary moving block 530 coupled to the first and second link arms 517a and 517b moves in the X-axis direction. By this link structure, the first auxiliary movement block 530 to which the probe 570 is coupled is movable in the X-axis direction, thereby minimizing the movement of the probe 570 in the Y-axis direction and gantry. While moving the 200 at a constant speed, the defect can be measured without shaking the probe 570.

7 is a reference view of a substrate defect inspection apparatus according to another modified example of the embodiment of the present invention. Referring to FIG. 7, the main moving block 510 is movably coupled to the gantry body 230 in the Y-axis direction. The first auxiliary moving block 530 is movably coupled to the main moving block 510 in the X-axis direction by a link structure, and the link structure has one end rotatably connected to the main moving block 510. Third link arm 517c; A fourth link arm 517d spaced apart from the third link arm 517c and one end of which is rotatably connected to the main moving block 510; A fifth link arm 517e having one end rotatably connected to the other end of the third link arm 517c and the other end coupled to the first auxiliary moving block 530; And a sixth link arm 517f having one end rotatably connected to the other end of the fourth link arm 517d and the other end coupled to the first auxiliary moving block 530.

This embodiment is another modification of the previous embodiment, and differs from the first embodiment in the configuration for moving the probe 570 in the X-axis direction. In the present embodiment, except for the main moving block 510, the first auxiliary moving block 530 and the link structure is the same as the configuration of the first embodiment, the same configuration will be replaced with the description of the first embodiment. do.

In the present embodiment, the guide rails 231, 535, 537 are formed in the Y-axis direction on the upper surface of the gantry body 230, and the main moving block 510 is movable in the Y-axis direction in the gantry body 230. Combined.

The first auxiliary moving block 530 to which the probe 570 is coupled is movably coupled to the main moving block 510 in the X-axis direction by a link structure. The link structure includes a third link arm 517c, a fourth link arm 517d, a fifth link arm 517e, and a sixth link arm 517f. One end of the third link arm 517c is rotatably connected to the main moving block 510 by a hinge pin 515, and the other end thereof is connected to one end of the fifth link arm 517e. The fourth link arm is provided to be spaced apart from the third link arm 517c, one end of which is rotatably connected to the main moving block 510 by a hinge pin 515, and the other end of the fourth link arm 517f It is connected to one end. One end of the fifth link arm 517e is rotatably connected to the other end of the third link arm 517c by a hinge pin 515, and the other end thereof is coupled to the first auxiliary moving block 530. One end of the sixth link arm 517f is rotatably connected to the other end of the fourth link arm 517d by a hinge pin 515, and the other end thereof is coupled to the first auxiliary moving block 530. Referring to FIG. 7B, the first auxiliary moving block is rotated as the third link arm 517c, the fourth link arm 517d, the fifth link arm 517e, and the sixth link arm 517f rotate. 530 moves in the X-axis direction. By this link structure, the first auxiliary movement block 530 to which the probe 570 is coupled is movable in the X-axis direction, thereby minimizing the movement of the probe 570 in the Y-axis direction and gantry. While moving the 200 at a constant speed, the defect can be measured without shaking the probe 570.

On the other hand, although not shown in the drawings, the two modifications described above may also include a second auxiliary movement block 550 that is movably coupled to the first auxiliary movement block 530 in the Z-axis direction, The probe 570 may be coupled to the second auxiliary moving block 550.

8 is a flowchart illustrating a substrate defect inspection method using the substrate defect inspection apparatus 100 according to an embodiment of the present invention. Referring to FIG. 8, the substrate defect inspection method according to the present embodiment may include: inputting coordinates of a defect of the substrate 310 seated on the stage 300; Generating a movement path of the substrate defect inspection apparatus 100 according to the input coordinates; Moving the gantry 200 in the X-axis direction at a predetermined constant speed according to the generated movement path; Moving at least one of the main moving block 510 and the auxiliary moving block to position the probe 570 close to a defect; X-axis opposite to the moving direction of the gantry 200 at the same speed as the moving speed of the gantry 200 so that the probe 570 temporarily stops against the defect of the substrate 310. Moving in a direction; And measuring the defect of the substrate 310 when the probe 570 is temporarily stopped with respect to the defect of the substrate 310.

The step S100 of inputting the defect coordinates of the substrate 310 is a step in which an operator inputs coordinates determined to be defective in the substrate 310. In this case, a plurality of defect coordinates input by an operator may be input.

Generating the entire movement path (S200) is a step of generating the shortest movement path between defect coordinates based on the input defect coordinates. The generating of the movement path according to the inputted defect coordinates may include generating a movement path for the probe 570 to move the shortest distance based on the defects located on the inputted coordinates. In detail, the generating of the movement path according to the inputted defect coordinates may include: performing defect coordinates located at the shortest distance from the defect coordinates currently measured among the plurality of defect coordinates located in the movable area of the first auxiliary movement block 530. Set as the measurement target to create the shortest path. In this case, the movable region of the first auxiliary movement block 530 means a distance that the first auxiliary movement block 530 can move in the X-axis direction along the guide rail 535, and the length of the guide rail 535 Or a predetermined distance within the length of the guide rail 535. In the present embodiment, since the first auxiliary movement block 530 can be moved in the X-axis direction, even if the defect is not on the same X-axis, the measurement can be performed. It can be set as a measurement object, and can generate the shortest movement path between defect coordinates (refer FIG. 4). Therefore, as the probe 570 is moved to the shortest distance, the defect measurement time of the substrate 310 may be shortened as compared with the prior art (see FIG. 2).

Thereafter, the gantry 200, the main moving block 510, and the first auxiliary moving block 530 move along the shortest moving path generated, thereby positioning the probe 570 on the input coordinates.

Moving the gantry 200 (S300) is a step of moving the gantry 200 in the X-axis direction to locate the defect. In this case, when the defect is to be measured while moving the gantry 200, the gantry 200 may be continuously moved at a predetermined constant speed.

The moving of the probe 570 (S400) is a step of moving the probe 570 close to an input defect coordinate by using at least one of the main moving block 510 and the first auxiliary moving block 530. . At this time, the probe 570 is able to move in the X-axis direction separately from the movement of the gantry 200, unlike the prior art, the coordinates of the X-axis in the X-axis movement range of the probe 570 as well as the defects of the same X-axis Other defects can also be measured (see FIG. 4). Meanwhile, when the defect is measured while moving the gantry 200 at a constant speed, the probe 570 may temporarily stop the defect by the movement of the first auxiliary moving block 530. It is preferable to be located ahead of the defect coordinates in the X-axis direction.

Measuring a defect of the substrate 310 (S500) is a step of measuring a defect of the substrate 310 using the probe 570. In this case, since the probe 570 may be moved in the X-axis direction by the first auxiliary moving block 530, a plurality of defects may be measured while minimizing the movement in the Y-axis direction unlike the prior art (see FIG. 2). (See FIG. 4). On the other hand, when the defect is measured while moving the gantry 200 at a constant speed, the probe 570 is moved in the X axis direction opposite to the moving direction of the gantry 200 at the same speed as the movement speed of the gantry 200. As a result, the phenomenon in which the probe 570 temporarily stops with respect to the defect of the substrate 310 may appear so that the defect may be measured without shaking the probe 570. That is, the position of the probe 570 may be temporarily fixed to measure the binding of the substrate 310.

Finally, the step of determining whether the measured coordinates are the final defect coordinates (S600) is a step of determining whether the defect measurement is terminated by determining whether the measured defect coordinates are the final defect coordinates among the inputted defect coordinates. In detail, when the currently measured defect coordinate is not the final defect coordinate, the defect is measured by moving the probe 570 to another defect coordinate on the shortest moving path, and the current measurement area when the currently measured coordinate is the final defect coordinate. After the measurement at, the substrate defect inspection apparatus 100 is moved to the next measurement region. The plurality of defects may be measured in a short time while the probe 570 is moved according to the shortest movement path generated through the above process.

Although the above has been described with reference to embodiments of the present invention, those skilled in the art may variously modify the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. And can be changed easily.

Description of the sign

100: substrate defect inspection apparatus 200: gantry (Gantry)

210: support 230: gantry body

231, 535, 537: guide rail 300: stage

310: substrate 510: main moving block

510a: first main moving block 510b: second main moving block

511: horizontal main moving block 513: vertical main moving block

515: hinge pin 517a: first link arm

517b: second link arm 517c: third link arm

517d: fourth link arm 517e: fifth link arm

517f: 6th link arm 518, 519, 551: LM guide block

530: first auxiliary moving block 531: horizontal auxiliary moving block

533: vertical auxiliary moving block 550: second auxiliary moving block

570: probe 600: control unit

Claims (10)

1. A stage on which the substrate is seated;

   A gantry movably coupled to the stage in an X-axis direction;

   A main moving block positioned on the substrate and coupled to the gantry to be movable in the Y-axis direction;

   A first auxiliary moving block movably coupled to the main moving block in an X-axis direction;

   A probe installed at the first auxiliary moving block to be positioned above the substrate, the probe measuring a defect of the substrate; And

   And a controller configured to control a relative speed of the first auxiliary moving block with respect to the gantry while continuously moving the gantry in the X axis direction.
2. The method of claim 1,

   The first auxiliary moving block,

   A horizontal auxiliary moving block coupled to the main moving block to face the substrate and to be movable in an X-axis direction; And

   And a vertical auxiliary moving block bent and coupled to the horizontal auxiliary moving block in a Z-axis direction.
3. The method of claim 2,

   Further comprising a second auxiliary moving block movably coupled to the vertical auxiliary moving block in the Z-axis direction,

   And the probe is coupled to the second auxiliary moving block so as to be positioned above the substrate.
4. The method of claim 1,

   The control unit,

   Controlling the gantry to move at a predetermined constant speed, controlling a measurement operation of the probe,

   The first auxiliary moving block is controlled to move in the X-axis direction opposite to the moving direction of the gantry at the same speed as the moving speed of the gantry, so that when the probe is temporarily stopped against a defect of the substrate, A board | substrate defect inspection apparatus which measures a defect.
5. The method of claim 1,

   The gantry,

   A pair of supports moving in the X-axis direction and spaced apart from both sides of the stage; And

   And a gantry body supported by the support and positioned above the stage.
6. The method of claim 5,

   The main moving block may include a first main moving block movably coupled to the gantry body in the Y axis direction and a second main spaced apart from the first main moving block and movably coupled to the gantry body in the Y axis direction. Including a moving block,

   The first auxiliary moving block is movably coupled to the first and second main moving blocks in the X-axis direction by a link structure,

   The link structure,

   A first link arm having one end rotatably connected to the first main moving block and the other end coupled to the first auxiliary moving block; And

   And a second link arm having one end rotatably connected to the second main moving block and the other end coupled to the first auxiliary moving block.
7. The method of claim 5,

   The main moving block is coupled to the gantry body to be movable in the Y axis direction,

   The first auxiliary moving block is movably coupled to the main moving block in the X-axis direction by a link structure,

   The link structure,

   A third link arm having one end rotatably connected to the main moving block;

   A fourth link arm spaced apart from the third link arm and having one end rotatably connected to the main moving block;

   A fifth link arm, one end of which is rotatably connected to the other end of the third link arm and the other end of which is coupled to the first auxiliary moving block; And

   And a sixth link arm having one end rotatably connected to the other end of the fourth link arm and the other end coupled to the first auxiliary moving block.
8. A defect inspection method using the substrate defect device according to claim 1,

   Inputting coordinates of a defect of the substrate seated on the stage;

   Generating an entire movement path according to the input coordinates;

   Moving the gantry in the X axis direction at a predetermined constant speed according to the generated movement path;

   Moving at least one of the main moving block and the first auxiliary moving block to position the probe in proximity to the defect;

   Moving the first auxiliary moving block in an X-axis direction opposite to the moving direction of the gantry at the same speed as the moving speed of the gantry such that the probe is temporarily stopped against a defect of the substrate; And

   Measuring a defect of the substrate when the probe is temporarily stopped relative to a defect of the substrate.
9. The method of claim 8,

   Generating a movement path according to the input defect coordinates,

   And generating a shortest movement path by setting a defect coordinate located at the shortest distance from the defect coordinates currently measured among the defect coordinates located in the movable area of the first auxiliary moving block as the next measurement target.
10. The method of claim 9,

    After measuring the defect of the substrate,

    Determining whether the currently measured defect coordinate is a final defect coordinate,

    And if the current measured defect coordinates are not the final defect coordinates, moving the probe to a defect coordinate located at the shortest distance from the currently measured defect coordinate.

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