CN101995672A - Photoelectric integrated testing system and photoelectric testing method - Google Patents
Photoelectric integrated testing system and photoelectric testing method Download PDFInfo
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- CN101995672A CN101995672A CN2009100919068A CN200910091906A CN101995672A CN 101995672 A CN101995672 A CN 101995672A CN 2009100919068 A CN2009100919068 A CN 2009100919068A CN 200910091906 A CN200910091906 A CN 200910091906A CN 101995672 A CN101995672 A CN 101995672A
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Abstract
The invention discloses a photoelectric integrated testing system and a photoelectric testing method. The system comprises a testing base station supporting a test sample, wherein a switching component, an integrated control component and a plurality of testing components are arranged inside the testing base station; each testing component is connected with the switching component and the integrated control component; and the integrated control component is used for controlling the switching component and the testing components in a centralized manner. The invention also provides a photoelectric testing method. The invention realizes that a system can complete various photics tests and electrics tests of the same test sample at various stages, solves the problem that the test sample is required to continuously move between various testing equipment or driving equipment in the prior art, ensures the state of the test sample and the stability of the testing environment during testing, reduces the floor areas of the testing equipment or the driving equipment, saves cost and realizes intensification and efficiency of the equipment.
Description
Technical field
The present invention relates to the photoelectricity test technology, relate in particular to a kind of photoelectric integral type test macro and photoelectric test method.
Background technology
Along with the continuous development of science and technology, display panels is compact based on it, significantly saves advantages such as placing space, has obtained application more and more widely.In the production run of display panels, the testing procedure of display panels is most important, wherein the test to display panels comprises electrical testing and optic test, tests, lights test, the test of voltage transmittance curve or the like as characteristic of semiconductor test, optic test, signal waveform.Usually, the test phase of display panels is divided into module (Module) test, unit (Cell) test and array (Array) test three phases.
In the prior art, the optic test of display panels and electrical testing are independently to carry out, and need use different optical test equipments or electrical testing equipment to finish test to display panels respectively.Because the project difference of test, employed testing apparatus is also different, and the test of finishing the sample of a display panels usually need be between different testing apparatuss continuous mobile test sample, cause the state and the test environment of specimen in every test all inequality, have a negative impact for the vertical contrast and the collective analysis of the test result of same specimen.In addition, because every pairing testing apparatus of test is all inequality, and each testing apparatus all has independent matching component, and floor area is bigger, and especially for the test of large scale product, the usable floor area of equipment can be bigger, makes whole cost increase.
Summary of the invention
The object of the present invention is to provide a kind of photoelectric integral type test macro and photoelectric test method, make the optic test and the electrical testing of display panels are all finished on an equipment, when carrying out every test, need not mobile liquid crystal display panel specimen, guarantee the stability of specimen and test mode in the different test phases, reduce the floor area of testing apparatus, save whole cost.
To achieve these goals, the invention provides a kind of photoelectric integral type test macro, the test base station that comprises support test specimens, be provided with exchange assembly, integrated Control Component and a plurality of test suite in described test base station inside, each described test suite links to each other with described integrated Control Component with described exchange assembly, and described integrated Control Component is used for the described exchange assembly of centralized control and described a plurality of test suite.
Further, photoelectric integral type test macro provided by the invention also comprises:
Be arranged on the lip-deep mechanical guide rail of described test base station;
The mechanical arm pull that is slidingly connected with described mechanical guide rail;
Be movably housed in optical lens and microlens on the described mechanical arm pull, be used for described specimen is carried out optic test;
Be arranged on the monitor on the described mechanical arm pull, be used for cooperating and finish optic test with described optical lens and microlens.
Further, photoelectric integral type test macro provided by the invention also comprises many Low Voltage Differential Signal lines and several probes, is connected with described a plurality of test suites respectively, is used for described specimen is surveyed.
Further, photoelectric integral type test macro provided by the invention also comprises the external control interface that links to each other with described integrated Control Component, is used for cooperating the control of finishing described a plurality of test suites and described exchange assembly with described integrated Control Component.
Particularly, described integrated Control Component is a computer host system, and described external control interface is calculator display organization and computer peripheral equipment system.
Particularly, described a plurality of test suite comprises current/voltage test suite, signal generating assembly, the thermomechanical components of lighting a lamp, oscillograph assembly and direct supply assembly.
Particularly, the switch of described exchange assembly for constituting by multilayer board and control device, the number of plies of described printed circuit board (PCB) is by the number decision of described test suite.
Particularly, described exchange component internal comprises a plurality of on-off circuits, lays respectively on the described multilayer board, is used for respectively described a plurality of test suites being controlled.
Present embodiment provides a kind of photoelectric test method, comprising:
By be movably housed in the optical lens on the mechanical arm pull and microlens in the photoelectric integral type test macro, be arranged on the monitor on the described mechanical arm pull, the thermomechanical components of lighting a lamp, signal generating assembly, exchange assembly and the Low Voltage Differential Signal line and the probe that are connected with specimen, described specimen is carried out the test of module stage;
By the described exchange assembly in the described photoelectric integral type test macro, integrated Control Component, direct supply assembly, described signal generating assembly and described Low Voltage Differential Signal line and probe, described specimen is carried out the test in unit stage;
By the described exchange assembly in the described photoelectric integral type test macro, current/voltage test suite, oscillograph assembly, described thermomechanical components and described Low Voltage Differential Signal line and the probe of lighting a lamp, described specimen is carried out the test in array stage.
A kind of photoelectric integral type test macro provided by the invention and photoelectric test method, by various testing apparatuss or driving arrangement are integrated into a plurality of test suites, and be arranged in the photoelectric integral type test macro, by under integrated Control Component and the control of exchange assembly, realization just can be finished multiple optic test and the electrical testing that same specimen is carried out each stage to utilizing a system, having solved needs in the prior art specimen continuous problem that moves between a plurality of testing apparatuss or driving arrangement, the state of specimen and the stability of test environment in the test process have been guaranteed, reduced the floor area of testing apparatus or driving arrangement, also saved the probe when specimen tested, processor, the quantity of test platform etc., save cost, realized the intensification and the high efficiency of equipment; Overcome the defective that to test, to monitor all photoelectric parameters simultaneously in the prior art simultaneously, can understand the inner link between each photoelectric parameter of same specimen by photoelectric integral type test macro provided by the invention and photoelectric test method, there are the relation of supporting mutually, the easier like this reason that causes that specimen is bad that finds between the photoelectric parameter that test obtains.
Description of drawings
Fig. 1 is the one-piece construction synoptic diagram of photoelectric integral type test macro embodiment of the present invention;
Fig. 2 is the concrete structure synoptic diagram of photoelectric integral type test macro embodiment of the present invention;
Fig. 3 is the structural representation of the ground floor printed circuit board (PCB) of the exchange assembly among the photoelectric integral type test macro embodiment of the present invention;
Fig. 4 is the structural representation of the second layer printed circuit board (PCB) of the exchange assembly among the photoelectric integral type test macro embodiment of the present invention;
Fig. 5 is the structural representation of the 3rd layer printed circuit board of the exchange assembly among the photoelectric integral type test macro embodiment of the present invention;
Fig. 6 is the structural representation of the 4th layer printed circuit board of the exchange assembly among the photoelectric integral type test macro embodiment of the present invention;
Fig. 7 is the structural representation of the layer 5 printed circuit board (PCB) of the exchange assembly among the photoelectric integral type test macro embodiment of the present invention;
Fig. 8 is the inner structure synoptic diagram of specimen among the photoelectric integral type test macro embodiment of the present invention;
Fig. 9 is the process flow diagram of photoelectric test method embodiment of the present invention.
Embodiment
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
Fig. 1 is the one-piece construction synoptic diagram of photoelectric integral type test macro embodiment of the present invention, as shown in Figure 1, present embodiment provides a kind of photoelectric integral type test macro, the test base station 1 that specifically can comprise support test specimens 2, test base station 1 inside is provided with exchange assembly 3, integrated Control Component 4 and a plurality of test suite 5.Each test suite 5 of test base station 1 inside links to each other with integrated Control Component 4 with exchange assembly 3 respectively, integrated Control Component 4 is used for centralized control exchange assembly 3 and a plurality of test suite 5, specifically realizes control to a plurality of test suites 5 by control exchange assembly 3.Wherein, test suite 5 can be each testing apparatus or the driving arrangement in the technical field of liquid crystal display, a plurality of testing apparatuss or driving arrangement are integrated in a plurality of test suites 5 settings photoelectric integral type test macro in the present embodiment, utilize native system that specimen is carried out optic test and electrical testing, issue steering order by integrated Control Component 4 to exchange assembly 3, exchange assembly 3 is controlled a plurality of test suites 5 according to control instruction corresponding, can specifically control the operating switch of one or more test suites 5, utilize in running order one or more test suites 5 to finish test specimen.Therefore, the photoelectric integral type test macro that present embodiment provides is by being integrated in various testing apparatuss or driving arrangement in the same test macro, by the integrated Control Component in the system exchange assembly is controlled, the exchange assembly is controlled being switched on or switched off of test suite, realization utilizes a system just can finish multiple optic test and the electrical testing that same specimen is carried out each stage, having solved needs in the prior art specimen continuous problem that moves between a plurality of testing apparatuss or driving arrangement, the state of specimen and the stability of test environment in the test process have been guaranteed, reduced the floor area of testing apparatus or driving arrangement, save cost, realized the intensification and the high efficiency of equipment.
Fig. 2 is the concrete structure synoptic diagram of photoelectric integral type test macro embodiment of the present invention, as shown in Figure 2, and in conjunction with Fig. 1, the photoelectric integral type test macro that present embodiment provides specifically can comprise test base station 1,1 pair of specimen 2 of test base station supports, be provided with exchange assembly 3, integrated Control Component 4 and a plurality of test suite 5 in test base station 1 inside, each test suite 5 links to each other with integrated Control Component 4 with exchange assembly 3, and integrated Control Component 4 is used for centralized control exchange assembly 3 and a plurality of test suite 5.Further, the photoelectric integral type test macro that provides of present embodiment can also comprise mechanical guide rail 6, mechanical arm pull 7, optical lens 8, microlens 9 and monitor 10.Wherein, mechanical guide rail 6 is arranged on the surface of test base station 1, can be positioned at the two ends on test base station 1 surface, and an end is provided with a mechanical guide rail 6; Machinery arm pull 7 is arranged on the top of test base station 1, one end and mechanical guide rail 6 are slidingly connected, make mechanical arm pull 7 on mechanical guide rail 6, to be free to slide, the other end is used to settle optical lens 8 and microlens 9, be free to slide on mechanical guide rail 6 by mechanical arm pull 7, and then make optical lens 8 and microlens 9 carry out moving of front and back position, realize optic test to the different angles of specimen 2; Optical lens 8 and microlens 9 are placed on the mechanical arm pull 7, wherein, optical lens 8 and microlens 9 can be arranged on the mechanical arm pull 7 versatilely, free movable on mechanical arm pull 7, optical lens 8 and microlens 9 are used for specimen 2 is carried out optic test, as utilize 8 pairs of test zones of optical lens to expose, utilize microlens 9 observation specimen 2 whether to have microcosmic situations such as light leak; Monitor 10 is arranged on the mechanical arm pull 7, monitor 10 is used for cooperating with optical lens 8 and microlens 9, finishing optic test, obtain the optic test data of each state of the specimen 2 that optical lens 8 and microlens 9 observed by monitor 10 to specimen 2.
Further, the photoelectric integral type test macro that provides of present embodiment can also comprise many Low Voltage Differential Signals (Low Voltage Differential Signaling; Hereinafter to be referred as: LVDS) line 11 and several probes 12, be connected with a plurality of test suites 5 respectively, be used for specimen 2 is surveyed.One end of LVDS line 11 or probe 12 is connected on each test suite 5, the other end is connected with specimen 2, when test suite 5 is connected under the control of integrated Control Component 4 and exchange assembly 3 when entering duty, survey by LVDS line 11 or 12 pairs of specimen 2 of probe of being connected with this test suite 5, realize the test of 5 pairs of specimen 2 of this test suite.
In the present embodiment, integrated Control Component 4 can be computer host system, in addition, the photoelectric integral type test macro that present embodiment provides also comprises the external control interface 13 that links to each other with integrated Control Component 4, this external control interface 13 can be specially calculator display organization and computer peripheral equipment system, as display, mouse and keyboard, be used for cooperating with integrated Control Component 4, finish centralized control to test suite 5 and exchange assembly 3.Operating personnel are by external control interface 13 input operations instruction, and integrated Control Component 4 is converted into concrete steering order with the operational order that receives, and by this steering order exchange assembly 3 is controlled, and then realization are to the control of each test suite 5.
Particularly, the test suite 5 in the photoelectric integral type test macro in the present embodiment can specifically comprise current/voltage test suite 51, signal generating assembly 52, the thermomechanical components of lighting a lamp 53, oscillograph assembly 54 and direct supply assembly 55 etc.Wherein, current/voltage test suite 51 can specifically use the high-accuracy voltage current flow devices, is used for semiconductor is carried out the current with high accuracy voltage tester; Signal generating assembly 52 can specifically use signal generator, is used to produce the AC signal of certain frequency; The thermomechanical components of lighting a lamp 53 can specifically be used the machine of lighting a lamp, and is used to export the drive signal of various signal testing samples 2; Oscillograph assembly 54 can specifically use oscillograph, is used to detect the signal waveform that shows certain bandwidth; Direct supply assembly 55 can specifically use D.C. regulated power supply, is used to provide direct drive.It is to be noted, test suite 5 in the photoelectric integral type test macro that present embodiment provides can include but not limited to above-mentioned five types testing apparatus or driving arrangement, can also be in this system integrated remaining be used for specimen is carried out other testing apparatuss or the driving arrangement of optic test or electrical testing.
Particularly, the switch of exchange assembly 3 in the present embodiment for constituting by multilayer board and control device, wherein, the number of plies of multilayer board is decided by the number of test suite 5, promptly a test suite is corresponding to a layer printed circuit board, if comprise 5 test suites in this test macro, then exchanging assembly 3 is made of five layer printed circuit boards and control device, each layer printed circuit board in the multilayer board corresponds respectively to each test suite, respectively each test suite is controlled.Particularly, when test macro comprises 5 test suites, exchange assembly 3 can be specially 5 port switch, 5 ports that are switch are corresponding with 5 test suites respectively, each port connects a test suite, and the quantity of the port of switch is also decided by the quantity of test suite in the test macro.Wherein, exchange assembly 3 inside comprise a plurality of on-off circuits, these on-off circuits are positioned on the multilayer board, be used for respectively a plurality of test suites 5 being controlled, because exchange assembly 3 adopts the PCB design of layering, so does not disturb mutually between the on-off circuit in each layer printed circuit board.Suppose to comprise 5 test suites in the test macro that present embodiment provides, the port number that then exchanges assembly 3 is 5, exchange assembly 3 comprises 5 layer printed circuit boards, be illustrated in figure 3 as the structural representation of the ground floor printed circuit board (PCB) of the exchange assembly among the photoelectric integral type test macro embodiment of the present invention, A1 wherein, A2, A3, A4 and A5 represent 5 ports of five layer printed circuit board correspondences of a side that exchanges assembly 3 respectively, B1, B2, B3,5 ports of five layer printed circuit board correspondences of the opposite side of B4 and B5 representative exchange assembly 3, be that A1 is the A port of the ground floor printed circuit board (PCB) of exchange assembly 3, B1 is the B port of the ground floor printed circuit board (PCB) of exchange assembly 3, A2 is the A port of the second layer printed circuit board (PCB) of exchange assembly 3, and B2 is the B port of the second layer printed circuit board (PCB) of exchange assembly 3.On-off circuit among Fig. 3 comprises 6 switches, one end of one of them switch is connected with A1, the other end is connected on the bus switches, one end of all the other 5 switches also is connected on the bus switches, the other end then is connected with B1, B2, B3, B4 and B5 respectively, like this can be under the control of integrated Control Component 4, can optionally connect A1-B1 port, A1-B2 port, A1-B3 port, A1-B4 port and the A1-B5 port of exchange assembly 3, and then realize connection the test suite 5 that is connected with these ports.Similarly, the on-off circuit in the remainder layer printed circuit board (PCB) of exchange assembly 3 and the similar of ground floor printed circuit board (PCB), the port that just switch connected is not A1, and be respectively among the A2-A5 one, as Fig. 4-Fig. 7 is respectively the structure of the second layer, the 3rd layer, the 4th layer and the layer 5 printed circuit board (PCB) of the exchange assembly among the photoelectric integral type test macro embodiment of the present invention, the on-off circuit of each layer printed circuit board by Fig. 3-shown in Figure 4 can be implemented between the port of both sides of exchange assembly 3 and realizes path arbitrarily.
Fig. 8 is the inner structure synoptic diagram of specimen among the photoelectric integral type test macro embodiment of the present invention, wherein, zone (1) is a pixel region, zone (2) is the PCB circuit board, zone (3) is the zone of coated with conductive medium, zone (4) is the external drive power supply, and a1, a2 and a4 are the source drive solder joint (Pad) of specimen, and b1, b2 and b3 are the gate driving solder joint of specimen.When the photoelectric integral type test macro that utilizes present embodiment to provide carries out actual test to specimen, specimen as shown in Figure 8 can be positioned on the test base station, before test, the source driving COF at the 3rd Pad place of specimen removes in elder generation, at the metal wire place coating electrically conductive elargol that exposes, shown in (3) zone among Fig. 8.In conjunction with last Fig. 2, at first, when carrying out the test in Module stage, need to utilize light a lamp thermomechanical components 53, direct supply assembly 55 and signal generating assembly 52, the A end that then exchanges the ground floor printed circuit board (PCB) of assembly 3 connects the LVDS line, and the B end of the ground floor printed circuit board (PCB) of exchange assembly 3 connects the D3 thermomechanical components of lighting a lamp; The A end of the second layer printed circuit board (PCB) of exchange assembly 3 connects a signal and drives probe, and the B end of the second layer printed circuit board (PCB) of exchange assembly 3 connects the direct supply assembly; The A end of the second layer printed circuit board (PCB) of exchange assembly 3 connects another signal and drives probe, and the B end of the second layer printed circuit board (PCB) of exchange assembly 3 connects the signal generating assembly.
At first carry out the optic test of specimen 2, by mechanically moving arm pull 7 on mechanical guide rail 6, optical lens 8 is moved to the test zone of A2 correspondence, under the control of exchange assembly 3, control the 53 pairs of specimen of thermomechanical components of lighting a lamp and carry out driven, show specific image, use microlens 9 to observe the microcosmic situation, promptly whether there is light leak etc., exposes by 8 pairs of test zones of exchange assembly 3 control optical lens, in monitor 10, to obtain optical data.Carry out the test of module V-T (voltage transmitance) curve of sample then, optical lens 8 is moved to the corresponding test zone in zone (3), the zone (3) that the driving probe of second layer printed circuit board (PCB) is placed into the coating elargol is located, direct supply assembly 55 is delivered to the direct drive signal on the driving probe by the control of exchange assembly 3, realizes the direct drive to black region among Fig. 8.In addition, cooperate optical lens 8 to carry out the test of direct current V-T curve, locate if the driving probe of the 3rd layer printed circuit board is placed into zone (3), start signal generating assembly 52 under the control of exchange assembly 3 then realizes exchanging the test of V-T curve simultaneously.In the test process of routine, often be first measuring optical characteristic, if the result of Gamma curve can not meet the demands, then need to carry out the test of V-T curve, carry out PCB and go up readjusting of resistance, carry out the test of optical characteristics again, till can meeting the demands.In the present embodiment, whole test process does not need mobile example and changes the state of sample, has guaranteed that not only test result is subjected to interference few, and the carrying out of having accelerated whole process.
After the test of finishing the Module stage, remove the backlight part of specimen, specimen is separated into the Cell state, promptly keep the printed circuit board (PCB) in the specimen, with carry out the Cell stage optic test and the test of V-T curve.When carrying out the test in Module stage, need utilize direct supply assembly 55 and signal generating assembly 52, the specimen in Cell stage is positioned on the test base station 1, the A end of the ground floor printed circuit board (PCB) of exchange assembly 3 connects a signal and drives probe, and the B end of the ground floor printed circuit board (PCB) of exchange assembly 3 connects direct supply assembly 55; The A end of the second layer printed circuit board (PCB) of exchange assembly 3 connects another signal and drives probe, and the B end of the second layer printed circuit board (PCB) of exchange assembly 3 connects signal generating assembly 52.Signal is driven probe placement locate,, the direct drive signal is delivered to signal drives on the probe, realize the direct drive of black region among Fig. 8, carry out the test of direct current V-T curve by exchange assembly 3 control direct supply assemblies 55 to zone (3).It is pointed out that if signal is driven probe placement to be located to (3) simultaneously the start signal generating assembly 52, what then carry out is optic test such as response time, visual angle and the test that exchanges the V-T curve.
After the test of finishing the Cell stage, the color membrane substrates of specimen is separated with the TFT substrate, and keep the printed circuit board (PCB) of specimen, the residual substance on the flush away TFT substrate (as PI liquid etc.), observe with the electrical testing and the pixel waveforms that carry out the Array stage.The specimen in Array stage is positioned on the test base station 1, the characteristic test of semiconductor electricity needs 3 probes, then the A of the ground floor printed circuit board (PCB) of switch component 3 end connects a signal driving syringe needle, and the B end of the ground floor printed circuit board (PCB) of switch component 3 connects current/voltage test suite 51; The A end of the second layer printed circuit board (PCB) of switch component 3 connects another signal and drives syringe needle, and the B end of the second layer printed circuit board (PCB) of switch component 3 connects current/voltage test suite 51; The A end of the 3rd layer printed circuit board of switch component 3 connects a signal probe, and the B end of the 3rd layer printed circuit board of switch component 3 connects current/voltage test suite 51; The A end of the 4th layer printed circuit board of switch component 3 connects another signal probe, and the B end of the 4th layer printed circuit board of switch component 3 connects oscillograph assembly 54; The A end of the 4th layer printed circuit board of switch component 3 connects the LVDS signal wire, and the B end of the 4th layer printed circuit board of switch component 3 connects the thermomechanical components 53 of lighting a lamp.At first carry out the test of TFT electrology characteristic, under the help of microlens 9, the signal driving syringe needle that the ground floor printed circuit board (PCB) is connected is placed on the pairing gate driving line in Array tester substrate position; The signal that second layer printed circuit board (PCB) connects drives syringe needle and is placed on the pairing source drive line; The signal probe that the 3rd layer printed circuit board connects is placed on the pixel region of test position.Current/voltage test suite 51 passes to two by switch component 3 with drive signal and drives syringe needle, the grid source electrode is opened, pixel region has the electric current process, the signal probe that the 3rd layer printed circuit board connects feeds back to current/voltage test suite 51 with the signal that detects by exchange assembly 3, finishes test.Carry out obtaining of pixel and other regional waveforms then, present embodiment is an example with the pixel region waveform only, the probe that the layer 5 printed circuit board (PCB) is connected is connected on the zone (2) among Fig. 8, driven Array substrate, under the help of microlens 9, the probe placement that the 4th layer printed circuit board is connected passes to the thermomechanical components 53 of lighting a lamp by exchange assembly 3 with the signal that obtains, the real-time waveform of acquisition pixel region current/voltage on the thermomechanical components 53 of lighting a lamp to the pixel region that will survey waveform.
Because test of TFT electrology characteristic and real-time waveform are surveyed contact is closely arranged on test result, usually need vertically contrast, but in test process in the past,, seldom can access the contrast of two kinds of test results of same sample owing to equipment and sample managing.In the present embodiment, under the situation of the state that does not need mobile example and change sample, obtained two test results of same sample, not only realized the feasibility of data contrasts, guaranteed that also test result is subjected to other disturbing factors minimum.
Present embodiment provides a kind of photoelectric integral type test macro, by various testing apparatuss or driving arrangement are integrated into a plurality of test suites, and be arranged in the photoelectric integral type test macro, by under integrated Control Component and the control of exchange assembly, realization just can be finished multiple optic test and the electrical testing that same specimen is carried out each stage to utilizing a system, having solved needs in the prior art specimen continuous problem that moves between a plurality of testing apparatuss or driving arrangement, the state of specimen and the stability of test environment in the test process have been guaranteed, also saved the probe when specimen tested, processor, the quantity of test platform etc., save cost, realized the intensification and the high efficiency of equipment; Overcome the defective that to test, to monitor all photoelectric parameters simultaneously in the prior art simultaneously, can understand the inner link between each photoelectric parameter of same specimen by photoelectric integral type test macro provided by the invention and photoelectric test method, there are the relation of supporting mutually, the easier like this reason that causes that specimen is bad that finds between the photoelectric parameter that test obtains.
Fig. 9 is the process flow diagram of photoelectric test method embodiment of the present invention, as shown in Figure 9, present embodiment provides a kind of photoelectric test method, and the method for present embodiment for by the photoelectric integral type test macro that provides in the foregoing description specimen being tested specifically can comprise the steps:
This step is to utilize the photoelectric integral type test macro specimen to be carried out the test in Module stage, in conjunction with above-mentioned Fig. 2 and shown in Figure 8, specimen is positioned on the test base station, before test, the metal wire place coating electrically conductive elargol that is exposing is removed with the source driving COF at the 3rd Pad place of specimen by elder generation.When carrying out the test in Module stage, need to utilize light a lamp thermomechanical components 53, direct supply assembly 55 and signal generating assembly 52, the A end that then exchanges the ground floor printed circuit board (PCB) of assembly 3 connects the LVDS line, and the B end of the ground floor printed circuit board (PCB) of exchange assembly 3 connects the D3 thermomechanical components of lighting a lamp; The A end of the second layer printed circuit board (PCB) of exchange assembly 3 connects a signal and drives probe, and the B end of the second layer printed circuit board (PCB) of exchange assembly 3 connects the direct supply assembly; The A end of the second layer printed circuit board (PCB) of exchange assembly 3 connects another signal and drives probe, and the B end of the second layer printed circuit board (PCB) of exchange assembly 3 connects the signal generating assembly.At first carry out the optic test of specimen 2, by mechanically moving arm pull 7 on mechanical guide rail 6, optical lens 8 is moved to the test zone of A2 correspondence, under the control of exchange assembly 3, control the 53 pairs of specimen of thermomechanical components of lighting a lamp and carry out driven, show specific image, use microlens 9 to observe the microcosmic situation, promptly whether there is light leak etc., exposes by 8 pairs of test zones of exchange assembly 3 control optical lens, in monitor 10, to obtain optical data.Carry out the test of the module V-T curve of sample then, optical lens 8 is moved to the corresponding test zone in zone (3), the zone (3) that the driving probe of second layer printed circuit board (PCB) is placed into the coating elargol is located, direct supply assembly 55 is delivered to the direct drive signal on the driving probe by the control of exchange assembly 3, realizes the direct drive to black region among Fig. 8.In addition, cooperate optical lens 8 to carry out the test of direct current V-T curve, locate if the driving probe of the 3rd layer printed circuit board is placed into zone (3), start signal generating assembly 52 under the control of exchange assembly 3 then realizes exchanging the test of V-T curve simultaneously.In the test process of routine, often be first measuring optical characteristic, if the result of Gamma curve can not meet the demands, then need to carry out the test of V-T curve, carry out PCB and go up readjusting of resistance, carry out the test of optical characteristics again, till can meeting the demands.In the present embodiment, whole test process does not need mobile example and changes the state of sample, has guaranteed that not only test result is subjected to interference few, and the carrying out of having accelerated whole process.
This step is to utilize the photoelectric integral type test macro specimen to be carried out the test in Cell stage, continuation is in conjunction with above-mentioned Fig. 2 and shown in Figure 8, after the test of finishing the Module stage, remove the backlight part of specimen, specimen is separated into the Cell state, promptly keep the printed circuit board (PCB) in the specimen, with carry out the Cell stage optic test and V-T curve test.When carrying out the test in Module stage, need utilize direct supply assembly 55 and signal generating assembly 52, the specimen in Cell stage is positioned on the test base station 1, the A end of the ground floor printed circuit board (PCB) of exchange assembly 3 connects a signal and drives probe, and the B end of the ground floor printed circuit board (PCB) of exchange assembly 3 connects direct supply assembly 55; The A end of the second layer printed circuit board (PCB) of exchange assembly 3 connects another signal and drives probe, and the B end of the second layer printed circuit board (PCB) of exchange assembly 3 connects signal generating assembly 52.Signal is driven probe placement locate,, the direct drive signal is delivered to signal drives on the probe, realize the direct drive of black region among Fig. 8, carry out the test of direct current V-T curve by exchange assembly 3 control direct supply assemblies 55 to zone (3).It is pointed out that if signal is driven probe placement to be located to (3) simultaneously the start signal generating assembly 52, what then carry out is optic test such as response time, visual angle and the test that exchanges the V-T curve.
This step is to utilize the photoelectric integral type test macro specimen to be carried out the test in Array stage, continuation is in conjunction with above-mentioned Fig. 2 and shown in Figure 8, after the test of finishing the Cell stage, the color membrane substrates of specimen is separated with the TFT substrate, and the printed circuit board (PCB) of reservation specimen, residual substance on the flush away TFT substrate is observed with the electrical testing and the pixel waveforms that carry out the Array stage.The specimen in Array stage is positioned on the test base station 1, the characteristic test of semiconductor electricity needs 3 probes, then the A of the ground floor printed circuit board (PCB) of switch component 3 end connects a signal driving syringe needle, and the B end of the ground floor printed circuit board (PCB) of switch component 3 connects current/voltage test suite 51; The A end of the second layer printed circuit board (PCB) of switch component 3 connects another signal and drives syringe needle, and the B end of the second layer printed circuit board (PCB) of switch component 3 connects current/voltage test suite 51; The A end of the 3rd layer printed circuit board of switch component 3 connects a signal probe, and the B end of the 3rd layer printed circuit board of switch component 3 connects current/voltage test suite 51; The A end of the 4th layer printed circuit board of switch component 3 connects another signal probe, and the B end of the 4th layer printed circuit board of switch component 3 connects oscillograph assembly 54; The A end of the 4th layer printed circuit board of switch component 3 connects the LVDS signal wire, and the B end of the 4th layer printed circuit board of switch component 3 connects the thermomechanical components 53 of lighting a lamp.At first carry out the test of TFT electrology characteristic, under the help of microlens 9, the signal driving syringe needle that the ground floor printed circuit board (PCB) is connected is placed on the pairing gate driving line in Array tester substrate position; The signal that second layer printed circuit board (PCB) connects drives syringe needle and is placed on the pairing source drive line; The signal probe that the 3rd layer printed circuit board connects is placed on the pixel region of test position.Current/voltage test suite 51 passes to two by switch component 3 with drive signal and drives syringe needle, the grid source electrode is opened, pixel region has the electric current process, the signal probe that the 3rd layer printed circuit board connects feeds back to current/voltage test suite 51 with the signal that detects by exchange assembly 3, finishes test.Carry out obtaining of pixel and other regional waveforms then, present embodiment is an example with the pixel region waveform only, the probe that the layer 5 printed circuit board (PCB) is connected is connected on the zone (2) among Fig. 8, driven Array substrate, under the help of microlens 9, the probe placement that the 4th layer printed circuit board is connected passes to the thermomechanical components 53 of lighting a lamp by exchange assembly 3 with the signal that obtains, the real-time waveform of acquisition pixel region current/voltage on the thermomechanical components 53 of lighting a lamp to the pixel region that will survey waveform.
Present embodiment provides a kind of photoelectric test method, realization utilizes a system just can finish multiple optic test and the electrical testing that same specimen is carried out each stage, having solved needs in the prior art specimen continuous problem that moves between a plurality of testing apparatuss or driving arrangement, the state of specimen and the stability of test environment in the test process have been guaranteed, also saved the quantity of probe when specimen tested, processor, test platform etc., save cost, realized the intensification and the high efficiency of equipment; Overcome the defective that to test, to monitor all photoelectric parameters simultaneously in the prior art simultaneously, can understand the inner link between each photoelectric parameter of same specimen by photoelectric integral type test macro provided by the invention and photoelectric test method, there are the relation of supporting mutually, the easier like this reason that causes that specimen is bad that finds between the photoelectric parameter that test obtains.
It should be noted that at last: above embodiment only in order to technical scheme of the present invention to be described, is not intended to limit; Although with reference to previous embodiment the present invention is had been described in detail, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that previous embodiment is put down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the spirit and scope of embodiment of the invention technical scheme.
Claims (9)
1. photoelectric integral type test macro, it is characterized in that, the test base station that comprises support test specimens, be provided with exchange assembly, integrated Control Component and a plurality of test suite in described test base station inside, each described test suite links to each other with described integrated Control Component with described exchange assembly, and described integrated Control Component is used for the described exchange assembly of centralized control and described a plurality of test suite.
2. system according to claim 1 is characterized in that, also comprises:
Be arranged on the lip-deep mechanical guide rail of described test base station;
The mechanical arm pull that is slidingly connected with described mechanical guide rail;
Be movably housed in optical lens and microlens on the described mechanical arm pull, be used for described specimen is carried out optic test;
Be arranged on the monitor on the described mechanical arm pull, be used for cooperating and finish optic test with described optical lens and microlens.
3. system according to claim 2 is characterized in that, also comprises many Low Voltage Differential Signal lines and several probes, is connected with described a plurality of test suites respectively, is used for described specimen is surveyed.
4. system according to claim 1 is characterized in that, also comprises the external control interface that links to each other with described integrated Control Component, is used for cooperating the control of finishing described a plurality of test suites and described exchange assembly with described integrated Control Component.
5. system according to claim 4 is characterized in that, described integrated Control Component is a computer host system, and described external control interface is calculator display organization and computer peripheral equipment system.
6. system according to claim 1 is characterized in that, described a plurality of test suites comprise current/voltage test suite, signal generating assembly, the thermomechanical components of lighting a lamp, oscillograph assembly and direct supply assembly.
7. system according to claim 6 is characterized in that, the switch of described exchange assembly for constituting by multilayer board and control device, and the number of plies of described printed circuit board (PCB) is by the number decision of described test suite.
8. system according to claim 7 is characterized in that, described exchange component internal comprises a plurality of on-off circuits, lays respectively on the described multilayer board, is used for respectively described a plurality of test suites being controlled.
9. a photoelectric test method is characterized in that, comprising:
By be movably housed in the optical lens on the mechanical arm pull and microlens in the photoelectric integral type test macro, be arranged on the monitor on the described mechanical arm pull, the thermomechanical components of lighting a lamp, signal generating assembly, exchange assembly and the Low Voltage Differential Signal line and the probe that are connected with specimen, described specimen is carried out the test of module stage;
By the described exchange assembly in the described photoelectric integral type test macro, integrated Control Component, direct supply assembly, described signal generating assembly and described Low Voltage Differential Signal line and probe, described specimen is carried out the test in unit stage;
By the described exchange assembly in the described photoelectric integral type test macro, current/voltage test suite, oscillograph assembly, described thermomechanical components and described Low Voltage Differential Signal line and the probe of lighting a lamp, described specimen is carried out the test in array stage.
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| CN2009100919068A CN101995672B (en) | 2009-08-28 | 2009-08-28 | Photoelectric integrated testing system and photoelectric testing method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104516132A (en) * | 2014-11-21 | 2015-04-15 | 京东方科技集团股份有限公司 | Testing fixture |
| US9880407B2 (en) | 2014-11-21 | 2018-01-30 | Boe Technology Group Co., Ltd. | Test fixture for electrical function test of product to be tested |
| CN110763988A (en) * | 2019-10-14 | 2020-02-07 | 国营芜湖机械厂 | Automatic detection device of airborne exchange assembly |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5432461A (en) * | 1991-06-28 | 1995-07-11 | Photon Dynamics, Inc. | Method of testing active matrix liquid crystal display substrates |
| JP2009539112A (en) * | 2006-05-31 | 2009-11-12 | アプライド マテリアルズ インコーポレイテッド | Small prober for TFT-LCD inspection |
| JP4911761B2 (en) * | 2006-08-31 | 2012-04-04 | 武蔵エンジニアリング株式会社 | Deformable gantry working device |
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2009
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104516132A (en) * | 2014-11-21 | 2015-04-15 | 京东方科技集团股份有限公司 | Testing fixture |
| US9880407B2 (en) | 2014-11-21 | 2018-01-30 | Boe Technology Group Co., Ltd. | Test fixture for electrical function test of product to be tested |
| CN104516132B (en) * | 2014-11-21 | 2018-02-06 | 京东方科技集团股份有限公司 | A kind of measurement jig |
| CN110763988A (en) * | 2019-10-14 | 2020-02-07 | 国营芜湖机械厂 | Automatic detection device of airborne exchange assembly |
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| CN101995672B (en) | 2012-07-18 |
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Owner name: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY Effective date: 20150616 Owner name: JINGDONGFANG SCIENCE AND TECHNOLOGY GROUP CO., LTD Free format text: FORMER OWNER: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20150616 |
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Effective date of registration: 20150616 Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee after: BOE Technology Group Co., Ltd. Patentee after: Beijing BOE Photoelectricity Science & Technology Co., Ltd. Address before: 100176 Beijing economic and Technological Development Zone, West Central Road, No. 8 Patentee before: Beijing BOE Photoelectricity Science & Technology Co., Ltd. |