CN210128944U - Substrate surface detection device - Google Patents
Substrate surface detection device Download PDFInfo
- Publication number
- CN210128944U CN210128944U CN201821892291.XU CN201821892291U CN210128944U CN 210128944 U CN210128944 U CN 210128944U CN 201821892291 U CN201821892291 U CN 201821892291U CN 210128944 U CN210128944 U CN 210128944U
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- substrate
- camera
- edge portion
- unit
- detecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The embodiment of the utility model provides an in substrate surface detection device includes: a transfer unit for transferring the substrate; a 1 st detecting unit for detecting a lower surface of the substrate; and a 2 nd detecting unit for detecting an edge portion of the substrate.
Description
Technical Field
The utility model relates to a substrate surface detection device for detect substrate surface.
Background
In general, a liquid crystal display panel, an organic electroluminescence display panel, an inorganic electroluminescence display panel, a transmissive projection substrate, a reflective projection substrate, and the like used for a flat panel display use a unit glass panel (hereinafter referred to as "unit substrate") obtained by cutting a brittle mother glass panel (hereinafter referred to as "substrate") such as glass into a predetermined size.
Before applying these substrates to products, a process of inspecting the surfaces of the substrates needs to be performed. In order to inspect the surface of the substrate, various substrate surface inspection apparatuses are used. The substrate surface inspection apparatus includes a camera disposed opposite to the substrate surface, and detects a defect on the substrate surface based on an image of the substrate surface captured by the camera.
Such a substrate surface inspection apparatus uses a single type of camera to take images of the lower surface of the substrate and the edge portion of the substrate. Since an expensive high-speed camera is used to inspect the entire surface of the substrate, the cost required for manufacturing the substrate surface inspection apparatus increases.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a solve above-mentioned prior art problem, the utility model aims to provide a substrate surface detection device detects the edge part of following and the base plate of base plate through 1 st detecting element and the 2 nd detecting element that uses the specification difference to reduce and make the required expense of substrate surface detection device, accelerate the testing process on substrate surface.
The embodiment of the utility model provides an in substrate surface detection device can include: a transfer unit for transferring the substrate; a 1 st detecting unit for detecting a lower surface of the substrate; and a 2 nd detection unit for detecting an edge portion of the substrate.
The 1 st detection unit includes a 1 st light source for irradiating light to a lower surface of the substrate, and a 1 st camera for photographing the lower surface of the substrate, the 1 st camera being disposed such that an angle of the 1 st camera facing the substrate is adjustable.
The 2 nd detection unit includes a 2 nd light source for irradiating light to an edge portion of the substrate, and a 2 nd camera for photographing the edge portion of the substrate, the 2 nd camera being disposed such that an angle of the 2 nd camera facing the substrate is adjustable.
The 1 st detection unit includes a 1 st camera photographing a lower surface of the substrate, and the 2 nd detection unit includes a 2 nd camera photographing an edge portion of the substrate, the 1 st camera operating at a higher speed than the 2 nd camera.
The 1 st detection unit includes a 1 st camera that photographs a lower surface of the substrate, and the 2 nd detection unit includes a 2 nd camera that photographs an edge portion of the substrate, the 1 st camera photographing a wide area as compared to the 2 nd camera.
Effect of the utility model
The device comprises a 1 st detection unit and a 2 nd detection unit, wherein the 1 st detection unit carries out detection items requiring high precision on the lower surface of a substrate; the 2 nd detection unit performs detection items that do not require high precision on the edge portion of the substrate. The specification of the 2 nd camera constituting the 2 nd detection unit is lower than that of the 1 st camera constituting the 1 st detection unit. Therefore, the cost required for manufacturing the substrate surface inspection apparatus is reduced as compared with the case where a single type of expensive high-speed camera is used for inspecting the lower surface and the edge portion of the substrate.
Further, since the substrate passes through the 1 st detection unit and the 2 nd detection unit in this order and the lower surface of the substrate and the edge portion of the substrate are sequentially subjected to detection, the detection process of the substrate surface can be speeded up.
Drawings
Fig. 1 is a side view schematically showing a substrate surface detection apparatus according to an embodiment of the present invention.
Fig. 2 is a plan view schematically showing a substrate surface detection apparatus according to an embodiment of the present invention.
Fig. 3 is a side view schematically showing the 1 st transfer unit of the substrate surface inspection apparatus according to the embodiment of the present invention.
Fig. 4 is a control block diagram of the substrate surface inspection apparatus according to the embodiment of the present invention.
Fig. 5 to 9 are schematic diagrams sequentially showing the operation of the substrate surface detection apparatus according to the embodiment of the present invention.
Reference numerals:
10 load table
20: 1 st transfer unit
30: 1 st detecting unit
40: 2 nd transfer unit
50: 2 nd detection unit
60 control unit
Detailed Description
Hereinafter, a substrate surface detection apparatus according to an embodiment of the present invention will be described with reference to the drawings.
In the inspection of the substrate surface, a direction in which the substrate is transferred is defined as a Y-axis, and a direction intersecting the direction in which the substrate is transferred (Y-axis direction) is defined as an X-axis. And a direction perpendicular to an X-Y plane on which the substrate is placed is defined as a Z-axis.
As shown in fig. 1 to fig. 3, the substrate surface detection apparatus according to the embodiment of the present invention includes: a loading table 10 on which a substrate S is loaded from the outside; a 1 st transfer unit 20 that transfers the substrate S loaded on the loading table 10; a 1 st detection unit 30 that detects a lower surface of the substrate S transferred by the 1 st transfer unit 20; a 2 nd transfer unit 40 for transferring the substrate S detected by the 1 st detection unit 30; a 2 nd detection unit 50 for detecting the edge of the substrate S transferred by the 2 nd transfer unit; and a control unit 60 controlling the operation of the substrate surface detection apparatus.
The loading stage 10 may include a conveyor belt 11 supporting the substrate S conveyed from the outside. The conveyor belt 11 is supported by a plurality of pulleys 12, and at least one of the plurality of pulleys 12 is a driving pulley for providing a driving force for rotating the conveyor belt 11.
The 1 st transfer unit 20 includes: a gripping module 21 for supporting and transferring the substrate S; a support frame 22 for supporting the grip module 21 so that the grip module 21 can move in the Y-axis direction; a moving module 23 for moving the grasping module 21 along the Y-axis direction with the support frame 22; and a lifting module 24 for moving the grasping module 21 in the Z-axis direction.
The moving module 23 and the lifting module 24 may be actuators operated by air pressure or oil pressure, linear motors operated by electromagnetic interaction, or linear moving mechanisms such as ball screws.
As shown in fig. 1 and 3, the grasping module 21 includes: a plurality of suction pads 213 connected to the vacuum source 90 through vacuum lines 212; a pad height adjuster 214 connected to each of the plurality of suction pads 213 and configured to lift and lower the suction pads 213; and a pressure sensor 215 connected to each of the plurality of suction pads 213 and measuring a pressure in the suction pad 213.
The pad height adjuster 214 may be configured such that a user can manually adjust the height of the plurality of suction pads 213. In addition, in order to automatically adjust the heights of the plurality of adsorption pads 213, the pad height adjuster 214 may be an actuator operated by air pressure or oil pressure, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw.
As shown in another embodiment, the plurality of pad height adjusters 214 and the plurality of suction pads 213 are not connected to each other, and two or more suction pads 213 may be designated as one group, a plurality of groups of suction pads 213 may be designated, and the height of each group of suction pads 213 may be adjusted.
At this time, the control unit 60 controls the pad height adjuster 214 based on the pressure change in the suction pads 213 measured by the pressure sensor 215, and moves the plurality of suction pads 213 up and down.
The substrate S is transferred onto the conveyor belt 11 of the loading table 10, the substrate S is adsorbed by the gripper module 21, and the substrate S is transferred to the 1 st inspection unit 30 by the vertical movement and the horizontal movement of the gripper module 21.
In this process, the substrate S needs to be uniformly adsorbed by all of the plurality of adsorption pads 213 of the gripper module 21. However, due to the change in the flatness of the substrate S and the change in the vertical positions of the plurality of suction pads 213 of the gripper module 21, not all of the plurality of suction pads 213 of the gripper module 21 can uniformly suck the substrate S. In a state where the substrate S is not uniformly adsorbed by all of the plurality of adsorption pads 213 of the gripper module 21, when the gripper module 21 moves vertically or horizontally, a problem occurs in that the substrate S is separated from the plurality of adsorption pads 213.
Therefore, in the first transfer unit 20 according to the embodiment of the present invention, before the gripper module 21 does not completely adsorb the substrate S, the gripper module 21 is moved gradually toward the substrate S, and the pressure in the adsorption pad 213 is measured by the pressure sensor 215.
As the gripper module 21 moves slowly toward the substrate S, the substrate S is adsorbed on the adsorption pad 213. When the flatness of the substrate S is uniform and the vertical positions of the plurality of suction pads 213 are uniform, the substrate S is sucked by the plurality of suction pads 213 and the internal pressures of the plurality of suction pads 213 are simultaneously changed.
However, when the flatness of the substrate S is not uniform or the vertical positions of the plurality of suction pads 213 are not uniform, a part of the substrate S is sucked by a part of the suction pads 213 among the plurality of suction pads 213 and the other part of the substrate S is not sucked by the suction pads 213. In this case, the pressure of a part of the suction pads 213 among the plurality of suction pads 213 changes, but the pressure of the pads 213 which do not suck the substrate S does not change.
As a result, a height difference with respect to the substrate S is present between the suction pad 213 in which the pressure change occurs and the suction pad 213 in which the pressure change does not occur. Such a relative height difference can be eliminated by adjusting the height of the adsorption pad 213 where a pressure change occurs, or adjusting the height of the adsorption pad 213 where no pressure change occurs.
The control unit 60 controls the pad height adjuster 214 to adjust the height of the suction pad 213 in which a pressure change occurs or to adjust the height of the suction pad 213 in which a pressure change does not occur, based on the pressures (pressure changes) of the suction pads 213 measured by the pressure sensors 215.
According to the above, the height difference between the plurality of suction pads 213 with respect to the substrate S can be eliminated, and the entire surface of the substrate S can be uniformly sucked onto the plurality of suction pads 213.
According to this structure, the entire surface of the substrate S can be uniformly adsorbed on the adsorption pad 213, and thus the substrate S is transferred to the 1 st inspection unit 30 while being stably maintained by the gripper module 21.
The 1 st detection unit 30 includes: a 1 st light source 31 for irradiating light to the lower surface of the substrate S, and a 1 st camera 32 for photographing the lower surface of the substrate S.
The 1 st light source 31 may emit a light beam of, for example, a linear type.
The detection items detected by the 1 st detection unit 30 include: the shape, depth, size, width, and width of scratches or stains formed on the surface of the substrate S are equal to the surface defects of the substrate S. Such surface defects of the substrate S need to be accurately measured by a high-specification camera.
Therefore, the 1 st camera 32 preferably uses a high-speed camera that can acquire a large-capacity image and perform high-speed shooting. Further, the 1 st camera 32 is preferably capable of photographing a wide area of the substrate S.
The 1 st cameras 32 are arranged at predetermined intervals in the X-axis direction so as to conform to the width of the substrate S in the X-axis direction. Therefore, the whole area of the substrate S in the X-axis direction can be shot at one time, and the time required for detecting the surface of the substrate S is reduced.
In addition, the detection precision of the surface defect of the substrate S is different according to the angle of the 1 st camera 32 facing the surface of the substrate S. That is, the image characteristics such as the sharpness and brightness of the surface defect captured by the 1 st camera 32 vary depending on the angle at which the 1 st camera 32 faces the surface of the substrate S.
As an example, in order to detect a plurality of surface defects at once, a plurality of 1 st cameras 32 may be arranged at a predetermined pitch in the Y-axis direction. The 1 st cameras 32 arranged along the Y-axis direction may face the lower surface of the substrate S at different angles. Since the 1 st cameras 32 are disposed facing the lower surface of the substrate S at different angles, various defects that may exist on the lower surface of the substrate S can be detected at one time.
As an example, in order to detect various surface defects, the angle of the 1 st camera 32 facing the substrate S may be adjusted. For this, the 1 st camera 32 may be connected to a camera rotation module 33, and the camera rotation module 33 rotates the 1 st camera 32 around a central axis (or horizontal axis) parallel to the X-axis or the Y-axis. The 1 st camera 32 is rotated by the camera rotating module 33 to adjust an angle of the 1 st camera 32 facing the substrate S, thereby detecting various surface defects. As described above, when the 1 st camera 32 is rotated to adjust the angle at which the 1 st camera 32 faces the substrate S, the number of the 1 st cameras 32 can be reduced as compared with the case where a plurality of the 1 st cameras 32 are arranged to face the lower surface of the substrate S at different angles, and the cost required for manufacturing the substrate surface inspection apparatus can be reduced.
The 2 nd transfer unit 40 includes: a support plate 41 for supporting the substrate S; a guide rail 42 extending in the Y-axis direction; a moving module 43 for moving the support plate 41 along the guide rail 42 in the Y-axis direction; and a rotation module 44 for rotating the support plate 41 around a central axis parallel to the Z-axis direction.
The support plate 41 has vacuum holes connected to a vacuum source, and can firmly adsorb the substrate S.
The moving module 43 is connected to the support plate 41, and may be an actuator operated by air pressure or oil pressure, a linear motor operated by electromagnetic interaction, or a linear moving mechanism such as a ball screw.
The rotation module 44 may be composed of a stepping motor, a servo motor, or the like for rotating the supporting plate 41.
The 2 nd detecting unit 50 detects an edge portion of the substrate S. The 2 nd detecting unit 50 includes: a 2 nd light source 51 for irradiating light to the edge portion of the substrate S, and a 2 nd camera 52 for photographing the edge portion of the substrate S.
The 2 nd light source may emit a light beam of, for example, a linear type.
In order to simultaneously detect the upper and lower sides of the edge portion of the substrate S, a pair of 2 nd cameras 52 are disposed to face each other. In addition, a plurality of the 2 nd cameras 52 may be arranged at a predetermined pitch in the X-axis direction so as to simultaneously detect both side edge portions in the width direction (X-axis direction) of the substrate S perpendicular to the transfer direction (Y-axis direction) of the substrate S. Here, the plurality of 2 nd cameras 52 may be moved in the X-axis direction along the rails 54. The plurality of 2 nd cameras 52 are moved in the X-axis direction in an adjacent or spaced manner from each other, whereby the intervals between the plurality of 2 nd cameras 52 are adjustable. Therefore, the 2 nd cameras 52 may be disposed at positions corresponding to both side edge portions in the width direction of the substrate S perpendicular to the transfer direction of the substrate S.
In addition, the angle of the 2 nd camera 52 facing the edge portion of the substrate S is adjustable, as with the 1 st camera 32. For example, the 2 nd camera 52 rotates around a central axis (or horizontal axis) parallel to the X axis or the Y axis.
The edge of the substrate S includes a long side (1 st edge) and a short side (2 nd edge). The 2 nd detecting means 50 detects the presence or absence of a defect or a burr in the edge portion of the substrate S, the size (the width in the X-axis direction and the Y-axis direction) of the substrate S, and the like, and items detected by the 2 nd detecting means 50 are different from those detected by the 1 st detecting means 30, and the items detected by the 2 nd detecting means 50 do not require precision.
Therefore, the 2 nd camera 52 preferably uses a low-speed camera that acquires a small-capacity image and performs low-speed shooting, as compared with the 1 st camera 32. In addition, the 2 nd camera 52 is preferably a low-specification camera that can photograph a narrow area compared to the 1 st camera 32.
As described above, the 1 st detecting unit 30 and the 2 nd detecting unit 50 are provided, respectively, and the 1 st detecting unit 30 performs the detection items requiring high precision on the lower surface of the substrate S; the 2 nd inspection unit 50 performs inspection items not requiring high precision on the edge portion of the substrate S. The 2 nd detecting unit 50 is constituted by a 2 nd camera 52 having a lower specification than the 1 st camera 32 constituting the 1 st detecting unit 30. Therefore, the cost required for manufacturing the substrate surface inspection apparatus is reduced as compared with the case where only the lower surface of the substrate S and the edge portion of the substrate S are inspected by using an expensive single-type high-speed camera.
Further, the substrate S passes through the 1 st detecting unit 30 and the 2 nd detecting unit 50 in order to detect the lower surface of the substrate S and the edge portion of the substrate S in order, and the detection process of the surface of the substrate S can be accelerated.
As shown in fig. 4, the substrate surface inspecting apparatus according to the embodiment of the present invention includes an input unit 80 connected to the control unit 60, for inputting the type of the surface defect of the substrate S by a user.
The input unit 80 may use various input methods such as a computer. The input unit 80 may input various kinds of surface defects. The types of surface defects include: such as the size, shading, length, amplitude, depth, width, shape of the surface defect. The control unit 60 stores the kinds of the plurality of surface defects input through the input unit 80. In the process of detecting the surface defect of the substrate S, when at least one of the types of the surface defects of the substrate S is detected, the control unit 60 determines that the substrate S is defective.
In another example, the input unit 80 may input the types of the allowed surface defects among the surface defects of the substrate S. Here, the allowable indication defect is a scratch or the like existing on the surface of the substrate S, but may be considered as a surface defect whose size, brightness, length, width, or shape does not affect the performance of the substrate S. The control unit 60 stores the kind of the allowed surface defect input through the input unit 80. In addition, when a surface defect other than the types of the allowable surface defects is detected in the process of detecting the surface defect of the substrate S, the control unit 60 determines that the substrate S is defective. When the control unit 60 determines that the substrate S is not qualified, the operator detects whether the surface defect of the substrate S is an allowable surface defect. When the surface defect of the substrate S is an allowable surface defect, the kind of the corresponding surface defect is input through the input unit 80. If the substrates S have the same allowable surface defects in the subsequent inspection process, the substrates S are no longer determined to be defective due to the surface defects. As described above, the types of the allowable surface defects among the surface defects of the substrate S are input and stored in advance, and the substrate S is determined to be defective only when the surface defects other than the types of the allowable surface defects are detected in the process of detecting the surface defects of the substrate S. Thus, the surface defect of the substrate S can be detected quickly, and the qualification of the substrate S can be judged. In addition, when a new type of performance defect is detected, the substrate S having the new type of surface defect is also determined to be defective, so that the new type of surface defect which has not been detected before can be accurately detected.
The operation of the substrate surface detection apparatus according to the embodiment of the present invention will be described below with reference to fig. 5 to 9.
First, as shown in fig. 1, when the loading table 10 loads the substrate S, the substrate S is held by the gripper module 21 of the first transfer unit 20, and the height of the substrate S is adjusted as the gripper module 21 is moved up and down.
As shown in fig. 5, the gripper module 21 moves in the Y-axis direction toward the 1 st inspection unit 30, and the substrate S passes over the 1 st camera 32 of the 1 st inspection unit 20. At this time, the 1 st camera 32 photographs the lower surface of the substrate S, and the control unit 60 determines whether or not the lower surface of the substrate S has a surface defect based on the image of the lower surface of the substrate S photographed by the 1 st camera 32.
As an embodiment, if a plurality of types of surface defects are input and stored through the input unit 80, the control unit 60 determines that the substrate S is defective when the control unit 60 detects at least one of the types of surface defects of the substrate S.
As another example, if the kind of the allowed surface defect is input and stored through the input unit 80, the control unit 60 may judge that the substrate S is defective only when the surface defect other than the kind of the allowed surface defect is detected.
After the inspection by the 1 st inspection unit 30 is completed, as shown in fig. 6, the gripper module 21 is positioned above the support plate 41 of the 2 nd transfer unit 40 and lowered, and the substrate S is transferred from the gripper module 21 to the support plate 41.
As shown in fig. 7, the supporting plate 41 is moved in the Y-axis direction toward the 2 nd detecting unit 60, and the 1 st edge portion (long side) of the substrate S passes between the 2 nd cameras 52 arranged in the up-and-down direction. At this time, the 2 nd camera 52 is located at a position opposed to the 1 st edge portion of the substrate S. Meanwhile, the 2 nd camera 52 photographs the 1 st edge portion of the substrate S, and the control unit 60 determines whether there is a defect or burr (burr) in the first edge portion of the substrate S or whether there is a problem in the width of the substrate S based on the 1 st edge portion image of the substrate S photographed by the 2 nd camera 52.
After the process of detecting the 1 st edge of the substrate S is completed, as shown in fig. 8, the support plate 41 is rotated by the rotation module 44, and the substrate S is rotated around the central axis parallel to the Z axis. So that the 2 nd edge portion (short side) of the substrate S is opposed to the 2 nd camera 52. Further, the plurality of 2 nd cameras 52 are moved in the adjacent direction or the spaced direction, and accordingly, the distance between the plurality of 2 nd cameras 52 can be adjusted to correspond to the width of the substrate S.
As shown in fig. 9, the supporting plate 41 is moved in the Y-axis direction toward the 2 nd detecting unit 50, and the 2 nd edge portion of the substrate S passes between the 2 nd cameras 52 arranged vertically. The 2 nd camera 52 photographs the 2 nd edge portion of the substrate S, and the control unit 60 determines whether the 2 nd edge portion of the substrate S has a defect or burr (burr) or whether the width of the substrate S has a problem based on the 2 nd edge portion image of the substrate S photographed by the 2 nd camera 52.
As described above, in the substrate surface inspecting apparatus according to the embodiment of the present invention, the substrate sequentially passes through the 1 st inspecting unit 30 and the 2 nd inspecting unit 50, and the lower surface of the substrate S and the edge portion of the substrate S are sequentially subjected to inspection, so that the inspection process of the substrate surface can be accelerated.
Although the preferred embodiments of the present invention have been described, the scope of the present invention is not limited to the specific embodiments, and may be appropriately modified within the scope described in the claims.
Claims (4)
1. A substrate surface inspection apparatus, comprising:
a transfer unit for transferring the substrate;
a 1 st detection unit including a 1 st camera photographing a lower surface of the substrate to detect the lower surface of the substrate; and
a 2 nd detection unit that photographs the 2 nd camera of the edge portion of the substrate to detect the edge portion of the substrate,
the 1 st camera operates at a higher speed than the 2 nd camera.
2. A substrate surface inspection apparatus, comprising:
a transfer unit for transferring the substrate;
a 1 st detection unit including a 1 st camera photographing a lower surface of the substrate to detect the lower surface of the substrate; and
a 2 nd detection unit that photographs the 2 nd camera of the edge portion of the substrate to detect the edge portion of the substrate,
the 1 st camera photographs a wide field compared to the 2 nd camera.
3. The substrate surface inspection apparatus according to claim 1 or 2,
the 1 st detecting unit further includes:
a 1 st light source for irradiating light to the lower surface of the substrate,
the 1 st camera is provided so that an angle to the substrate is adjustable.
4. The substrate surface inspection apparatus according to claim 1 or 2,
the 2 nd detecting unit further includes:
a 2 nd light source for irradiating light to the edge portion of the substrate,
the 2 nd camera is provided so that an angle to the substrate is adjustable.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170184513A KR102657517B1 (en) | 2017-12-29 | 2017-12-29 | Apparatus and method for inspecting surface of substrate |
| KR10-2017-0184513 | 2017-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210128944U true CN210128944U (en) | 2020-03-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821892291.XU Expired - Fee Related CN210128944U (en) | 2017-12-29 | 2018-11-16 | Substrate surface detection device |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102657517B1 (en) |
| CN (1) | CN210128944U (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4589101B2 (en) * | 2003-12-25 | 2010-12-01 | 昭和電工株式会社 | Surface inspection method and apparatus |
| KR20070050803A (en) | 2006-08-28 | 2007-05-16 | 주식회사 대우일렉트로닉스 | Method for inspecting the surface of substrate |
| JP2013093389A (en) * | 2011-10-24 | 2013-05-16 | Hitachi High-Technologies Corp | Optical inspection device and edge inspection device |
| KR101704473B1 (en) * | 2015-06-16 | 2017-02-09 | 삼익티에이치케이 주식회사 | Window Glass Inspection Equipment |
-
2017
- 2017-12-29 KR KR1020170184513A patent/KR102657517B1/en active IP Right Grant
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- 2018-11-16 CN CN201821892291.XU patent/CN210128944U/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| KR20190081754A (en) | 2019-07-09 |
| KR102657517B1 (en) | 2024-04-16 |
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