CN114535841A - Bearing platform and processing equipment - Google Patents
Bearing platform and processing equipment Download PDFInfo
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- CN114535841A CN114535841A CN202210190190.2A CN202210190190A CN114535841A CN 114535841 A CN114535841 A CN 114535841A CN 202210190190 A CN202210190190 A CN 202210190190A CN 114535841 A CN114535841 A CN 114535841A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
An embodiment of the present invention provides a load-bearing platform and a processing apparatus, wherein the load-bearing platform has a first side and a second side opposite to each other, and comprises: a support plate, comprising: at least two hold the board portion, the first side that holds the board portion is equipped with the recess, and the second side is equipped with vacuum gas circuit, and vacuum gas circuit and recess intercommunication are located the recess nonconnection on the different carrier plate portion, and the backup pad is equipped with first heavy groove that subtracts. According to the technical scheme, the number of the bearing plate parts is set to be at least two, namely the number of the bearing plate parts can be two or more, the bearing plate parts are flexibly used in consideration of the size, the quality and other factors of workpieces so as to meet different use requirements, the same bearing platform can bear the workpieces with large sizes and the workpieces with small sizes, the application range of the bearing platform is favorably widened, and the bearing platform can be applied to different processing equipment. In addition, the weight reduction groove is arranged, so that the weight of the bearing platform is reduced, and the waste of materials and driving power is reduced.
Description
Technical Field
The embodiment of the invention relates to the technical field of processing equipment, in particular to a bearing platform and processing equipment.
Background
In the laser micro-nano processing equipment in the related art, the bearing platform can only support and fix one or more workpieces to be processed, and the same bearing platform can not bear both large-size workpieces and small-size workpieces. In addition, when the carrying platform needs to carry a large-sized workpiece, the carrying platform may also have a large size, and the carrying platform needs to be rotated or moved in the processing equipment, which may cause a reduction in the ratio of the workpiece load to the driving power, thereby causing a waste of the driving power.
Disclosure of Invention
In order to solve or improve at least one of the above technical problems, an object of an embodiment of the present invention is to provide a load-bearing platform.
Another object of an embodiment of the present invention is to provide a processing apparatus having the above-mentioned carrying platform.
To achieve the above object, an embodiment of a first aspect of the present invention provides a load-bearing platform for bearing a workpiece, having a first side and a second side disposed oppositely, the load-bearing platform including: a support plate, comprising: at least two bear the board portion, the first side that bears the board portion is equipped with the recess, and the work piece can carry out the shutoff to the recess to make the recess form airtight space, the second side that bears the board portion is equipped with vacuum gas circuit, and vacuum gas circuit and recess intercommunication are located the recess nonconnection on the different carrier plate portions, and the backup pad is equipped with first heavy groove that subtracts.
According to the embodiment of the bearing platform provided by the invention, the number of the bearing plate parts is set to be at least two, namely the bearing plate parts can be two or more, the bearing plate parts are flexibly used in consideration of the size, the quality and other factors of workpieces so as to meet different use requirements, the same bearing platform can bear the workpieces with large size and the workpieces with small size, the application range of the bearing platform is favorably improved, and the bearing platform can be applied to different processing equipment. In addition, the weight reduction groove is arranged, so that the weight of the bearing platform is reduced, the waste of materials and driving power is reduced, and the movement performance of the processing equipment is improved.
In particular, the carrying platform is used for carrying a workpiece to be processed, such as a flexible circuit board, a wafer or a flexible sheet material. The load-bearing platform has a first side and a second side which are oppositely arranged, namely the first side of the load-bearing platform is oppositely arranged with the second side of the load-bearing platform. The load-bearing platform includes the backup pad. Wherein, the support plate comprises at least two bearing plate parts. The first side that holds the board portion is equipped with the recess, and the work piece is placed in the first side of carrier plate portion, and the work piece and the first side direct contact who holds the board portion promptly, the work piece of treating processing can carry out the shutoff to the opening of recess to make the recess form airtight space. Further, the second side of bearing the board portion is equipped with the vacuum gas circuit, the one end and the recess intercommunication of vacuum gas circuit, the other end and the vacuum source intercommunication of vacuum gas circuit. The vacuum source can be used for pumping out the gas in the closed space formed by the workpiece and the groove and the vacuum gas circuit, and negative pressure is formed in the groove, so that the air pressure in the closed space is lower than the atmospheric pressure, the workpiece to be processed can be adsorbed on the first side of the bearing plate part, and the vacuum source is a vacuum generator or a vacuum pump and the like. In other words, the workpiece is arranged on the bearing platform and completely covers the groove, and the bearing platform adopts a vacuum adsorption mode and adsorbs and fixes the workpiece by means of negative pressure.
Further, in the carrier plate portion, the number of recess is at least one, and the recess can be one, two or more, considers the surface area of the first side of carrier plate portion, adsorption affinity size and other factors, carries out the flexibility according to actual demand to the number of recess and sets up. When the number of the grooves in the same bearing plate part is multiple, the grooves can be crisscrossed to form a checkerboard shape or form other arbitrary shapes. In addition, in the backup pad, the quantity of carrier plate portion is at least two, and carrier plate portion can be two or a plurality of promptly, and the backup pad of a plurality of specifications can be constituteed to the carrier plate portion of different quantity, considers work piece size, adsorption affinity size and other factors, carries out nimble use to different carrier plate portions according to actual demand. Specifically, if the size of the workpiece to be processed is small, such as a flexible circuit board or a wafer, the size of which is usually less than 500mm × 500mm, a supporting plate with a small specification is required to support the workpiece, and then a bearing plate portion may be considered; if the size of the workpiece to be processed is large, such as a flexible plate (AMOLED flexible substrate, resin plate, plastic plate, metal thin plate, etc.), the size of the workpiece is usually larger than 1000mm × 1000mm, and a large support plate is required to support the workpiece, and in this case, it is considered to use a plurality of support plate portions. In other words, the load-bearing platform can be adapted to different sizes of sheet material by varying the number of load-bearing plate sections used. Different chess grid areas are adopted for different sizes, and the on-off of the vacuum gas path of the subareas is controlled by an electromagnetic valve. When the number of the bearing plate portions is plural, the shapes of the plurality of bearing plate portions may be the same or different.
Furthermore, the grooves on different bearing plate parts are not communicated, and it can be understood that after the workpiece is placed on the bearing platform, the grooves on the same bearing plate part and the closed space formed by the workpiece are relatively independent, and because the bearing platform is used for bearing the workpieces with different sizes, when the size of the workpiece is small, the workpiece is only propped against one or a limited number of bearing plate parts, and the grooves on the bearing plate parts which are not propped against the workpiece at the moment can not influence the negative pressure environment which is already built.
Furthermore, the supporting plate is provided with the first weight reduction groove, so that the weight reduction design of the bearing platform is facilitated, the driving load is reduced, and the movement performance is improved by arranging the first weight reduction groove while the structural strength of the bearing platform is ensured. In other words, the weight reduction grooves are arranged on the bearing platform, so that the weight is reduced, a certain number of ribs are reserved to enhance the rigidity, and the overall weight is controlled within 100 kg.
It is worth noting that in order to improve the sealing performance and machining accuracy of vacuum adsorption, the surface flatness of the first side of the load-bearing platform is in the micron level. Laser or semiconductor micro-nano processing has high requirements on processing precision (micron or hundred nanometer level), and the rigidity of the bearing platform is ensured while the bearing platform is lightened, so that small deformation is allowed to be generated, but large deformation cannot be generated.
In the related art laser micro-nano processing equipment, the bearing platform can only support and fix one or more workpieces to be processed, and the same bearing platform can not bear both large-size workpieces and small-size workpieces. In addition, when the carrying platform needs to carry a large-sized workpiece, the carrying platform may also have a large size, and the carrying platform needs to be rotated or moved in the processing equipment, which may cause a reduction in the ratio of the workpiece load to the driving power, thereby causing a waste of the driving power.
In the technical scheme defined by the invention, the number of the bearing plate parts is set to be at least two, namely two or more bearing plate parts are adopted, the bearing plate parts are flexibly used in consideration of the size, the quality and other factors of workpieces so as to meet different use requirements, the same bearing platform can bear both large-size workpieces and small-size workpieces, the application range of the bearing platform is favorably widened, and the bearing platform can be applied to different processing equipment. In addition, the weight reduction groove is arranged, so that the weight of the bearing platform is reduced, the waste of materials and driving power is reduced, and the movement performance of the processing equipment is improved.
In addition, the technical scheme provided by the invention can also have the following additional technical characteristics:
in above-mentioned technical scheme, the quantity of carrier plate portion is two, and at least one bearing plate portion is L shape, and two carrier plate portions constitute squarely.
In the technical scheme, the number of the bearing plate parts is two, at least one bearing plate part is L-shaped, and the bearing plate parts form a square shape, so that on one hand, the bearing plate parts with different numbers can form supporting plates with multiple specifications, and the different bearing plate parts can be flexibly used according to actual requirements by considering the size of a workpiece, the magnitude of adsorption force and other factors; on the other hand, be favorable to controlling the quantity of carrier plate portion, avoid the quantity of carrier plate portion too much to cause the structure complicacy and operate inconveniently. It is worth mentioning that at least one of the bearing plate portions is L-shaped, it can be understood that only one of the bearing plate portions is L-shaped, or both of the bearing plate portions are L-shaped, and one or both of the two bearing plate portions are selected for use according to actual requirements.
In the above technical scheme, the number of the bearing plate parts is four, and the four bearing plate parts form a square.
In the technical scheme, the number of the bearing plate parts is four, and the four bearing plate parts form a square shape, so that on one hand, different numbers of bearing plate parts can form supporting plates with multiple specifications, and different bearing plate parts can be flexibly used according to actual requirements in consideration of the size of a workpiece, the magnitude of adsorption force and other factors; on the other hand, be favorable to controlling the quantity of carrier plate portion, avoid the quantity of carrier plate portion too much to cause the structure complicated and operate inconveniently.
In the above technical solution, the number of the first lightening grooves is plural, and the center of one of the first lightening grooves coincides with the center of the support plate.
In the technical scheme, the number of the first weight reducing grooves is set to be multiple, the center of one first weight reducing groove is overlapped with the center of the support plate, and the other first weight reducing grooves are arranged around the edge of the support plate, so that the weight of the bearing platform is further reduced, and the first weight reducing grooves are prevented from being excessively concentrated on a certain position of the support plate. It is to be noted that the center here is a geometric center.
In the above technical solution, further comprising: the widening plate is wound on the bearing plate part.
In the technical scheme, the bearing platform further comprises a widening plate. Specifically, the widening plate is wound around the bearing plate portion. It will be appreciated that the carrier plate is located at or near the middle of the load-bearing platform and the spreader plate is located at the edge of the load-bearing platform. On one hand, the supporting plate is combined with the widening plate, so that the area of the bearing platform is increased, and the bearing platform can support a large-size workpiece; on the other hand, under the unchangeable condition of load-bearing platform's overall dimension, through setting up the widening board, be favorable to controlling the quantity of carrier plate portion, the quantity of carrier plate portion can not be too much to simplify load-bearing platform's structure.
In the above technical solution, the support plate further includes: a positioning structure comprising: the positioning hole is arranged on the first side of the bearing plate part; the positioning piece penetrates through the workpiece and the positioning hole to realize the relative fixation of the workpiece and the bearing plate part.
In this technical solution, the supporting plate further includes a positioning structure. Specifically, the positioning structure comprises a positioning hole and a positioning piece. The positioning hole is arranged on the first side of the bearing plate part, and the positioning hole can be in a through hole structure or a blind hole structure. The positioning hole can be arranged at the edge of the bearing plate part and can also be arranged at any other position of the bearing plate part. Furthermore, the positioning piece penetrates through the positioning holes of the workpiece and the bearing plate part, so that the workpiece and the bearing plate part are fixed relatively. It is worth mentioning that the positioning piece is a positioning pin.
In the technical scheme, the elastic modulus of the bearing platform is not lower than 90GPa, and the thermal expansion coefficient of the bearing platform is not higher than 4.5 multiplied by 10-6/K。
In the technical scheme, the elastic modulus of the bearing platform is set to be not lower than 90GPa, so that the elastic modulus of the bearing platform is large enough, when a processing head of the processing equipment cuts a workpiece, particularly a small-size workpiece (such as a flexible circuit board or a wafer) the bearing platform can generate slight elastic deformation to meet the processing requirement, protect the workpiece, and greatly reduce the possibility that the processing head damages the workpiece in the processing process.
Further, the thermal expansion coefficient of the bearing platform is not higher than 4.5 multiplied by 10-6The accuracy of micro-nano processing is greatly influenced by the temperature change of the environment, so that the thermal expansion coefficient of the bearing platform is enoughSmall to meet the use requirement.
In the technical scheme, the bearing platform is made of granite or silicon carbide ceramic.
In the technical scheme, the material of the bearing platform is set to be granite, the elastic modulus of the granite is 94.7GPa, and the thermal expansion coefficient of the granite is 3 multiplied by 10-6And the specific modulus of the granite is large, the linear expansion coefficient is small, and the use requirement of the bearing platform is met.
Or the material of the bearing platform is silicon carbide ceramic, the elastic modulus of the silicon carbide is more than 350GPa, and the thermal expansion coefficient of the silicon carbide is 4 multiplied by 10-6And the silicon carbide ceramic has large specific modulus and small linear expansion coefficient, and meets the use requirement of the bearing platform.
It is worth mentioning that in order to improve the sealing performance and the processing accuracy of the vacuum adsorption, the surface flatness of the first side of the load-bearing platform is in the micrometer level. The granite material can reach the surface precision by a manual grinding mode; the silicon carbide can be cast to achieve surface accuracy.
In the technical scheme, the length of the bearing platform is 1000mm, the width of the bearing platform is 1000mm, and the mass of the bearing platform is not more than 100 kg.
In the technical scheme, the size and the mass of the bearing platform are limited, the length of the bearing platform is 1000mm, the width of the bearing platform is 1000mm, and the mass of the bearing platform is not more than 100kg, so that the waste of driving power and the waste of materials can be reduced as far as possible.
In the technical scheme, the supporting plate and the widening plate are of an integrated structure.
In this technical scheme, through setting up the backup pad and widening the board to the integral type structure, for the mode of post-processing, mechanical properties is good, is favorable to improving the backup pad and widens the joint strength between the board. Because the supporting plate and the widening plate are of an integrated structure, the number of parts is reduced, and the assembly efficiency of workers is improved.
In the above technical solution, the notch of the first weight-reduction groove may be any one of a circle, a triangle, a square, and an ellipse.
In the technical scheme, the shape of the first weight reduction groove is set to be any one of a circular shape, a triangular shape, a square shape and an oval shape, so that the light weight design of the bearing platform is facilitated, the driving load is reduced, and the movement performance is improved. And the first weight reduction grooves are flexibly arranged according to actual requirements in consideration of the structural strength of the support plate, the total mass of the bearing platform and other factors.
In the above technical solution, the number of the first lightening grooves is plural, and the plural first lightening grooves are arranged in a circumferential array.
In the technical scheme, the number of the first weight-reducing grooves is set to be multiple, and the first weight-reducing grooves are arranged in a circumferential array manner, so that on one hand, the weight of the bearing platform is further reduced; on the other hand, local over-stress of the bearing platform can be avoided to a great extent.
In the above technical solution, the second side of the supporting plate is provided with a supporting area, and the first lightening groove is formed in the supporting area.
In this technical solution, by providing the support area at the second side of the support plate, the support area can be connected with the mounting base of the processing apparatus. Further, the first lightening groove is formed in the supporting area, and it can be understood that the first lightening groove is not a lightening groove penetrating through the supporting plate, the supporting plate and the workpiece can have a sufficient contact area, the supporting plate is ensured to stably support the workpiece, in addition, the mass of the supporting plate can be reduced, the waste of materials and driving power is reduced, and the motion performance of the processing equipment is improved.
In the above technical solution, the widening plate is provided with a plurality of second lightening grooves.
In the technical scheme, the second weight reduction grooves are formed in the widening plate, so that the overall mass of the bearing platform can be further reduced, the waste of materials and driving power is reduced, and the movement performance of the processing equipment is improved.
In the above technical solution, a plurality of second lightening grooves are circumferentially arrayed.
In the technical scheme, the plurality of second weight-reducing grooves are arranged in a circumferential array, so that on one hand, the weight of the bearing platform is further reduced; on the other hand, local over-stress of the bearing platform can be avoided to a great extent.
In the above technical solution, the notches of the second lightening grooves are triangular, and the symmetry lines of at least two second lightening grooves are overlapped or perpendicular.
In the technical scheme, the shape of the notch of the second weight reducing groove is set to be triangular, and the symmetry lines of at least two second weight reducing grooves are overlapped or perpendicular, so that the arrangement of the second weight reducing grooves is more orderly, in addition, the second weight reducing grooves can be prevented from being excessively concentrated on a certain position of the widening plate, and the possibility of overlarge local stress of the widening plate is reduced.
An embodiment of a second aspect of the invention provides a processing apparatus comprising: a frame body; the mounting base is arranged on the frame body; the bearing platform in any embodiment is arranged on the mounting base, can move relative to the frame body and is used for bearing a workpiece; the processing head is arranged on the frame body, can move relative to the frame body and is positioned above the workpiece.
According to an embodiment of the processing equipment, the processing equipment comprises a frame body, a mounting base, a bearing platform and a processing head. Wherein, the support body is located to the mounting base, and load-bearing platform's support region is connected with the mounting base, and load-bearing platform can remove by the support body relatively, can understand that load-bearing platform can carry out translation or rotation according to the demand. The bearing platform is used for bearing a workpiece to be processed, such as a flexible circuit board, a wafer or a flexible sheet material.
Furthermore, the processing head is arranged on the frame body, the processing head can move relative to the frame body, and the processing head is positioned above the workpiece. After a workpiece to be machined is placed on the bearing platform by a worker, the position of the bearing platform or the position of the machining head are changed, so that the machining head is close to the workpiece and machines the workpiece.
The processing equipment includes any one of the bearing platforms in the first aspect, so that the beneficial effects of any one of the embodiments are achieved, and are not described herein again.
Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
FIG. 1 illustrates a first schematic view of a load-bearing platform according to one embodiment of the present invention;
FIG. 2 illustrates a second schematic view of a load-bearing platform according to one embodiment of the present invention;
FIG. 3 illustrates a third schematic view of a load-bearing platform according to one embodiment of the present invention;
FIG. 4 shows a schematic view of a processing apparatus according to one embodiment of the invention;
FIG. 5 illustrates a fourth schematic view of a load-bearing platform according to one embodiment of the present invention;
figure 6 illustrates a fifth schematic view of a load-bearing platform according to one embodiment of the present invention.
Wherein, the correspondence between the reference numbers and the part names in fig. 1 to 6 is:
100: a load-bearing platform; 111: a first side; 112: a second side; 120: a support plate; 121: a bearing plate portion; 122: a groove; 123: a vacuum gas circuit; 124: a first weight-reducing slot; 125: a positioning structure; 126: a support region; 1251: positioning holes; 1252: a positioning member; 130: widening the board; 131: a second weight-reducing slot; 200: processing equipment; 210: a frame body; 220: a machining head; 230: mounting a base; 300: and (5) a workpiece.
Detailed Description
In order that the above objects, features and advantages of the embodiments of the present invention can be more clearly understood, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and detailed description. It should be noted that the embodiments of the present invention and features of the embodiments may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, embodiments of the present invention may be practiced in other ways than those described herein, and therefore the scope of the present invention is not limited to the specific embodiments disclosed below.
A load-bearing platform 100 and a processing tool 200 provided according to some embodiments of the present invention are described below with reference to fig. 1-6.
Example one
As shown in fig. 1, 2 and 3, a loading platform 100 according to an embodiment of the present invention is provided for loading a workpiece 300 to be processed, such as a flexible circuit board, a wafer or a flexible sheet material. The load-bearing platform 100 has a first side 111 and a second side 112 that are oppositely disposed, i.e., the first side 111 of the load-bearing platform 100 is disposed opposite the second side 112 of the load-bearing platform 100. The load-bearing platform 100 includes a support plate 120. Wherein the support plate 120 includes at least two bearing plate portions 121. The first side 111 of the bearing plate part 121 is provided with a groove 122, the workpiece 300 is placed on the first side 111 of the bearing plate part 121, namely, the workpiece 300 is in direct contact with the first side 111 of the bearing plate part 121, and the opening of the groove 122 can be sealed by the workpiece 300 to be processed, so that the groove 122 forms a closed space. Further, the second side 112 of the carrier plate portion 121 is provided with a vacuum path 123, one end of the vacuum path 123 is communicated with the groove 122, and the other end of the vacuum path 123 is communicated with a vacuum source. The vacuum source can extract the air in the vacuum path 123 and the sealed space formed by the workpiece 300 and the groove 122, and the negative pressure is formed in the groove 122, and it can be understood that the air pressure in the sealed space is lower than the atmospheric pressure, so that the workpiece 300 to be processed can be adsorbed on the first side 111 of the bearing plate part 121, and the vacuum source is a vacuum generator or a vacuum pump. In other words, the workpiece 300 is placed on the supporting platform 100 and completely covers the groove 122, and the supporting platform 100 adopts a vacuum absorption manner to absorb and fix the workpiece 300 by means of negative pressure.
Further, in the carrier plate part 121, the number of the grooves 122 is at least one, that is, the number of the grooves 122 may be one, two or more, and the number of the grooves 122 is flexibly set according to actual requirements in consideration of the surface area of the first side 111 of the carrier plate part 121, the magnitude of the suction force and other factors. When the number of the grooves 122 located in the same bearing plate portion 121 is plural, the plural grooves 122 may be criss-cross to form a checkered pattern, or may be formed in any other shape. In addition, in the supporting plate 120, the number of the supporting plate parts 121 is at least two, that is, the number of the supporting plate parts 121 may be two or more, different numbers of the supporting plate parts 121 may constitute the supporting plate 120 with multiple specifications, and different supporting plate parts 121 are flexibly used according to actual requirements in consideration of the size of the workpiece 300, the magnitude of the suction force, and other factors. Specifically, if the workpiece 300 to be processed is small in size, such as a flexible circuit board or a wafer, the size of which is usually less than 500mm × 500mm, a supporting plate 120 with a small size is required to support the workpiece 300, and it is considered that a supporting plate portion 121 is used; if the workpiece 300 to be processed has a large size, such as a flexible plate (AMOLED flexible substrate, resin plate, plastic plate, metal thin plate, etc.), the size of which is usually larger than 1000mm × 1000mm, a large-sized support plate 120 is required to support the workpiece 300, and it is considered to use a plurality of support plate portions 121. In other words, the load-bearing platform 100 can be adapted to different sizes of sheet material by changing the number of load-bearing plate portions 121 used. Different chess grid areas are adopted for different sizes, and the on-off of the vacuum gas path 123 of the subareas is controlled by an electromagnetic valve. When the number of the carrier plate parts 121 is plural, the shapes of the plurality of carrier plate parts 121 may be the same or different.
Further, the grooves 122 on different bearing plate portions 121 are not communicated, and it can be understood that, after the workpiece 300 is placed on the bearing platform 100, the closed space formed by the grooves 122 on the same bearing plate portion 121 and the workpiece 300 is relatively independent, and because the bearing platform 100 is used for bearing workpieces 300 of different sizes, when the size of the workpiece 300 is small, only one or a limited number of bearing plate portions 121 are abutted, and the grooves 122 on the bearing plate portion 121 which are not abutted against the workpiece 300 at this time do not affect the negative pressure environment which has been created.
Further, the support plate 120 is provided with the first weight-reducing groove 124, so that the weight-reducing design of the load-bearing platform 100 is facilitated, the driving load is reduced, and the movement performance is improved by providing the first weight-reducing groove 124 while the structural strength of the load-bearing platform 100 is ensured. In other words, the weight reduction grooves are arranged on the bearing platform 100, so that the weight is reduced, a certain number of ribs are reserved to enhance the rigidity, and the overall weight is controlled within 100 kg.
It is worth noting that in order to improve the sealing performance and machining accuracy of vacuum suction, the surface flatness of the first side 111 of the load-bearing platform 100 is in the order of micrometers. Laser or semiconductor micro-nano processing has high requirements on processing precision (micron or hundred nanometer level), and needs to reduce the weight of the bearing platform 100, ensure the rigidity of the bearing platform 100, allow small deformation, but not allow large deformation.
In the laser micro-nano machining apparatus 200 in the related art, the bearing platform 100 can only support and fix one or more workpieces 300 to be machined, and the same bearing platform 100 cannot bear both a large-sized workpiece 300 and a small-sized workpiece 300. In addition, when the carrying platform 100 needs to carry a large-sized workpiece 300, the size of the carrying platform may be large, which may cause the ratio of the load of the workpiece 300 to the driving power to be reduced due to the need of rotating or moving the carrying platform 100 in the processing equipment 200, thereby causing waste of the driving power.
In the technical solution defined in the present invention, the number of the bearing plate portions 121 is set to be at least two, that is, the bearing plate portions 121 may be two or more, and the bearing plate portions 121 are flexibly used to meet different use requirements in consideration of the size, the quality and other factors of the workpiece 300, and the same bearing platform 100 can bear both a large-sized workpiece 300 and a small-sized workpiece 300, which is beneficial to improving the application range of the bearing platform 100, and the bearing platform 100 can be applied to different processing apparatuses 200. In addition, the weight reduction grooves are arranged, so that the mass of the bearing platform 100 is reduced, the waste of materials and driving power is reduced, and the movement performance of the processing equipment 200 is improved.
In another embodiment, as shown in fig. 2 and 3, the second side 112 of the load-bearing platform 100 is provided with a second weight-reducing slot 131, which is beneficial to further reduce the overall mass of the load-bearing platform 100 and improve the motion performance of the processing apparatus 200.
In another embodiment, the second side 112 of the support plate 120 is provided with a support region 126, the support region 126 being capable of coupling with a mounting base 230 of the processing tool 200. Further, the first lightening grooves 124 are disposed in the support region 126, and it is understood that the first lightening grooves 124 do not penetrate through the support plate 120, the support plate 120 and the workpiece 300 can have a sufficient contact area, so as to ensure that the support plate 120 stably supports the workpiece 300, and in addition, the mass of the support plate 120 can be reduced, the waste of materials and driving power can be reduced, and the motion performance of the processing equipment can be improved.
Example two
The number of the bearing plate parts 121 is four, the four bearing plate parts 121 form a square shape, on one hand, the bearing plate parts 121 with different numbers can form the support plates 120 with multiple specifications, and different bearing plate parts 121 can be flexibly used according to actual requirements in consideration of the size of the workpiece 300, the magnitude of the adsorption force and other factors; on the other hand, be favorable to controlling the quantity of carrier plate portion 121, avoid the too much structure complicacy and the inconvenient operation that causes of the quantity of carrier plate portion 121.
In another embodiment, the number of the bearing plates 121 is two, at least one bearing plate 121 is L-shaped, and the two bearing plates 121 form a square shape, on one hand, different numbers of bearing plates 121 can form a plurality of specifications of the support plate 120, and in consideration of the size of the workpiece 300, the magnitude of the adsorption force and other factors, different bearing plates 121 can be flexibly used according to actual requirements; on the other hand, be favorable to controlling the quantity of carrier plate portion 121, avoid the too much structure complicacy and the inconvenient operation that causes of the quantity of carrier plate portion 121. It should be noted that at least one of the bearing plate portions 121 is L-shaped, and it is understood that only one bearing plate portion 121 may be L-shaped, or both bearing plate portions 121 may be L-shaped, and one or two of the two bearing plate portions 121 may be selected for use according to actual requirements.
EXAMPLE III
The elastic modulus of the bearing platform 100 is not lower than 90GPa, the elastic modulus of the bearing platform 100 is large enough, when the processing head 220 of the processing equipment 200 cuts the workpiece 300, especially a small-sized workpiece 300 (such as a flexible circuit board or a wafer), the bearing platform 100 can generate slight elastic deformation to meet the processing requirement, protect the workpiece 300, and greatly reduce the possibility that the processing head 220 damages the workpiece 300 in the processing process.
Further, the thermal expansion coefficient of the load-bearing platform 100 is not higher than 4.5 × 10-6K, precision of micro-nano processingThe temperature change of the environment has a large influence, so the thermal expansion coefficient of the load-bearing platform 100 is small enough to meet the use requirement.
The material of the carrying platform 100 is granite, the elastic modulus of the granite is 94.7GPa, and the thermal expansion coefficient of the granite is 3 x 10-6And the specific modulus of granite is large, the linear expansion coefficient is small, and the use requirement of the bearing platform 100 is met.
Or, the material of the bearing platform 100 is silicon carbide ceramic, the elastic modulus of the silicon carbide is greater than 350GPa, and the thermal expansion coefficient of the silicon carbide is 4 × 10-6And the silicon carbide ceramic has large specific modulus and small linear expansion coefficient, and meets the use requirement of the bearing platform 100.
It should be noted that, in order to improve the sealing performance and the processing precision of the vacuum suction, the surface flatness of the first side 111 of the supporting platform 100 is in the micrometer level. The granite material can reach the surface precision by a manual grinding mode; the silicon carbide can be cast to achieve surface accuracy.
Example four
The length of the bearing platform 100 is 1000mm, the width of the bearing platform 100 is 1000mm, and the mass of the bearing platform 100 is not more than 100 kg. By limiting the size and mass of the load-bearing platform 100, the waste of driving power and the waste of materials can be reduced as much as possible.
EXAMPLE five
As shown in fig. 3, 5, and 6, the load-bearing platform 100 further includes a widening plate 130. Specifically, the widening plate 130 is wound around the bearing plate portion 121 of the supporting plate 120, it can be understood that the bearing plate portion 121 is located at or near the middle of the bearing platform 100, and the widening plate 130 is located at an edge of the bearing platform 100. On one hand, the support plate 120 is combined with the widening plate 130, which is beneficial to increasing the area of the bearing platform 100 and ensuring that the bearing platform 100 can support the large-sized workpiece 300; on the other hand, under the condition that the overall size of the bearing platform 100 is not changed, the widening plate 130 is arranged, so that the number of the bearing plate parts 121 is favorably controlled, the number of the bearing plate parts 121 is not excessive, and the structure of the bearing platform 100 is simplified.
Further, the supporting plate 120 and the widening plate 130 are of an integral structure. Through setting up backup pad 120 and widening board 130 to the integral type structure, for the mode of post-processing, mechanical properties is good, is favorable to improving the joint strength between backup pad 120 and the board 130 of widening. Because the supporting plate 120 and the widening plate 130 are of an integrated structure, the number of parts is reduced, and the assembly efficiency of workers is improved.
EXAMPLE six
As shown in fig. 1 and 4, the support plate 120 further includes a positioning structure 125. Specifically, the positioning structure 125 includes a positioning hole 1251 and a positioning member 1252. The positioning hole 1251 is disposed on the first side 111 of the bearing plate portion 121, where the positioning hole 1251 may be a through hole structure or a blind hole structure. The positioning hole 1251 may be provided at an edge position of the plate portion 121, or may be provided at any other position of the plate portion 121. Further, the positioning member 1252 is inserted into the positioning hole 1251 of the workpiece 300 and the bearing plate portion 121, so that the workpiece 300 and the bearing plate portion 121 are relatively fixed. It is noted that the positioning member 1252 is a positioning pin.
EXAMPLE seven
As shown in fig. 3, the number of the first weight-reducing slots 124 is multiple, wherein the center of one first weight-reducing slot 124 coincides with the center of the support plate 120, and the other first weight-reducing slots 124 are disposed around the edge of the support plate 120, which is beneficial to further reducing the mass of the load-bearing platform 100 and avoiding that the first weight-reducing slots 124 are too concentrated at a certain position of the support plate 120. It is worth noting that the center here is the geometric center.
In another embodiment, as shown in fig. 3 and 5, the notch of the first weight-reducing slot 124 has any one of a circular shape, a triangular shape, a square shape and an oval shape, which is beneficial to realizing a light-weight design of the load-bearing platform 100, reducing the driving load and improving the motion performance. The first lightening slots 124 are flexibly arranged according to practical requirements in consideration of the structural strength of the support plate 120, the overall mass of the load-bearing platform 100 and other factors.
In another embodiment, as shown in fig. 3, 5 and 6, the widening plate 130 is provided with a plurality of second lightening slots 131. By arranging the second weight-reducing grooves 131 on the widening plate 130, the overall mass of the bearing platform 100 can be further reduced, which is beneficial to reducing the waste of materials and driving power and improving the motion performance of the processing equipment.
In another embodiment, as shown in fig. 3, 5 and 6, the second weight-reduction groove 131 is in any one of a circular shape, a triangular shape, a square shape and an oval shape, which is beneficial to realizing a light-weight design of the load-bearing platform 100, reducing a driving load and improving a motion performance. The first lightening slots 124 are flexibly arranged according to practical requirements in consideration of the structural strength of the widening plate 130, the overall mass of the load bearing platform 100 and other factors.
In another embodiment, as shown in fig. 5, the shape of the notches of the second weight-reducing slots 131 is triangular, and the symmetry lines of at least two second weight-reducing slots 131 are overlapped or perpendicular, which is beneficial to neater arrangement of the second weight-reducing slots 131, and in addition, the second weight-reducing slots 131 can be prevented from being excessively concentrated on a certain position of the widening plate, so that the possibility of excessive local stress of the widening plate 130 is reduced.
In another embodiment, as shown in fig. 3 and 5, the number of the first lightening slots 124 is multiple, and the multiple first lightening slots 124 are arranged in a circumferential array, which is beneficial to further reducing the mass of the load bearing platform 100; on the other hand, local overstressing of the load-bearing platform 100 can be largely avoided.
In another embodiment, as shown in fig. 3, 5 and 6, the number of the second lightening slots 131 is multiple, and the multiple second lightening slots 131 are arranged in a circumferential array, which is beneficial to further reducing the mass of the load bearing platform 100; on the other hand, local overstressing of the load-bearing platform 100 can be largely avoided.
Example eight
As shown in fig. 4, an embodiment of the invention provides a processing apparatus 200, where the processing apparatus 200 includes a frame body 210, a mounting base 230, a processing head 220, and the carrying platform 100 in any of the above embodiments. The mounting base 230 is disposed on the frame body 210, the supporting region 126 of the supporting platform 100 is connected to the mounting base 230, and the supporting platform 100 can move relative to the frame body 210, which can be understood that the supporting platform 100 can move in a horizontal movement or a rotational movement as required. The carrier platform 100 is used for carrying a workpiece 300 to be processed, such as a flexible circuit board, a wafer, a flexible plate material, or the like.
Further, the processing head 220 is disposed on the frame 210, the processing head 220 can move relative to the frame 210, and the processing head 220 is located above the workpiece 300. After the worker places the workpiece 300 to be processed on the carrier platform 100, the worker brings the processing head 220 close to the workpiece 300 and processes the workpiece 300 by changing the position of the carrier platform 100 or the processing head 220.
According to the embodiment of the bearing platform and the processing equipment, the number of the bearing plate parts is set to be at least two, namely the bearing plate parts can be two or more, the bearing plate parts are flexibly used in consideration of the size, the quality and other factors of workpieces so as to meet different use requirements, the same bearing platform can bear the workpieces with large sizes and the workpieces with small sizes, the application range of the bearing platform is favorably widened, and the bearing platform can be applied to different processing equipment. In addition, the supporting plate and the widening plate are divided, and the supporting plate and the widening plate are provided with the weight reduction grooves, so that the weight of the bearing platform is reduced, the waste of materials and driving power is reduced, and the movement performance of the processing equipment is improved.
In the present invention, the terms "first", "second", and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless explicitly defined otherwise. The terms "mounted," "connected," "fixed," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a removable connection, or an integral connection; "coupled" may be direct or indirect through an intermediary. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "left", "right", "front", "rear", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or unit must have a specific direction, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description herein, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (17)
1. A load-bearing platform (100) for bearing a workpiece (300) having a first side (111) and a second side (112) arranged opposite to each other, the load-bearing platform (100) comprising:
a support plate (120) comprising:
at least two bearing plate parts (121), wherein a groove (122) is formed in the first side (111) of each bearing plate part (121), the workpiece (300) can seal the groove (122) to enable the groove (122) to form a closed space, a vacuum air path (123) is formed in the second side (112) of each bearing plate part (121), and the vacuum air path (123) is communicated with the groove (122),
the grooves (122) on different bearing plate parts (121) are not communicated, and the support plate (120) is provided with a first weight-reducing groove (124).
2. The load-bearing platform (100) according to claim 1, wherein said load-bearing plate portions (121) are two in number, at least one of said load-bearing plate portions (121) being L-shaped, two of said load-bearing plate portions (121) forming a square.
3. The load-bearing platform (100) according to claim 1, wherein said plate-bearing portions (121) are four in number, four of said plate-bearing portions (121) forming a square.
4. The load-bearing platform (100) according to any one of claims 1 to 3, wherein said first weight-reducing slots (124) are plural in number, wherein a center of one of said first weight-reducing slots (124) coincides with a center of said support plate (120).
5. The load carrying platform (100) according to any one of claims 1 to 3, further comprising:
and the widening plate (130) is wound on the bearing plate part (121).
6. The load carrying platform (100) according to any one of claims 1 to 3, wherein the support plate (120) further comprises:
a positioning structure (125) comprising:
a positioning hole (1251) provided on the first side (111) of the bearing plate section (121);
and the positioning piece (1252) is arranged in the workpiece (300) and the positioning hole (1251) in a penetrating manner so as to realize the relative fixation of the workpiece (300) and the bearing plate part (121).
7. The load-bearing platform (100) according to any of claims 1 to 3, wherein the load-bearing platform (100) has a modulus of elasticity of not less than 90GPa and a coefficient of thermal expansion of not more than 4.5 x 10 of the load-bearing platform (100)-6/K。
8. The load carrying platform (100) according to any one of claims 1 to 3, wherein the material of the load carrying platform (100) is granite or silicon carbide ceramic.
9. The load-bearing platform (100) according to any of claims 1 to 3, wherein the load-bearing platform (100) has a length of 1000mm, the load-bearing platform (100) has a width of 1000mm, and the load-bearing platform (100) has a mass of no more than 100 kg.
10. The load-bearing platform (100) of claim 5, wherein said support plate (120) is a unitary structure with said widening plate (130).
11. The load-bearing platform (100) according to any of claims 1 to 3, wherein the slot opening of the first weight-reduction slot (124) is in the shape of any one of a circle, a triangle, a square and an ellipse.
12. The load-bearing platform (100) according to any one of claims 1 to 3, wherein said first lightening slots (124) are plural in number, said plurality of first lightening slots (124) being arranged in a circumferential array.
13. The load carrying platform (100) according to any one of claims 1 to 3, wherein said second side (112) of said support plate (120) is provided with a support area (126), said first weight-reducing slot (124) being provided in said support area (126).
14. The load carrying platform (100) according to claim 5, wherein the extension plate (130) is provided with a plurality of second lightening slots (131).
15. The load-bearing platform (100) of claim 14, wherein a plurality of said second lightening slots (132) are arranged in a circumferential array.
16. The load-bearing platform (100) of claim 14, wherein said second weight-reducing slots (132) have a triangular notch shape, and wherein the symmetry lines of at least two of said second weight-reducing slots (132) coincide or are perpendicular.
17. A processing apparatus (200), comprising:
a frame body (210);
a mounting base (230) provided to the frame body (210);
the load-bearing platform (100) according to any one of claims 1 to 16, being provided on the mounting base (230), wherein the load-bearing platform (100) is capable of moving relative to the frame body (210), and the load-bearing platform (100) is used for bearing a workpiece (300);
processing head (220), locate support body (210), processing head (220) can be relative support body (210) removes, processing head (220) are located the top of work piece (300).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210190190.2A CN114535841A (en) | 2022-02-28 | 2022-02-28 | Bearing platform and processing equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210190190.2A CN114535841A (en) | 2022-02-28 | 2022-02-28 | Bearing platform and processing equipment |
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| CN114535841A true CN114535841A (en) | 2022-05-27 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116609336A (en) * | 2023-04-26 | 2023-08-18 | 晶诺微(上海)科技有限公司 | Defect detection apparatus |
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