CN1165385C - 半导体晶片载架的清洗装置和方法 - Google Patents
半导体晶片载架的清洗装置和方法 Download PDFInfo
- Publication number
- CN1165385C CN1165385C CNB998037109A CN99803710A CN1165385C CN 1165385 C CN1165385 C CN 1165385C CN B998037109 A CNB998037109 A CN B998037109A CN 99803710 A CN99803710 A CN 99803710A CN 1165385 C CN1165385 C CN 1165385C
- Authority
- CN
- China
- Prior art keywords
- fluid
- wafer carrier
- hole
- cleaning
- door
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005406 washing Methods 0.000 title 1
- 239000012530 fluid Substances 0.000 claims abstract description 267
- 238000004140 cleaning Methods 0.000 claims abstract description 136
- 239000000758 substrate Substances 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 27
- 238000002955 isolation Methods 0.000 claims description 19
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 8
- 238000007599 discharging Methods 0.000 claims description 7
- 238000012864 cross contamination Methods 0.000 abstract 1
- 239000007921 spray Substances 0.000 description 43
- 239000007788 liquid Substances 0.000 description 17
- 238000001035 drying Methods 0.000 description 16
- 239000000969 carrier Substances 0.000 description 8
- 239000007789 gas Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 230000001360 synchronised effect Effects 0.000 description 5
- 239000003344 environmental pollutant Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 231100000719 pollutant Toxicity 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000014509 gene expression Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000002242 deionisation method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 description 1
- 208000036829 Device dislocation Diseases 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/093—Cleaning containers, e.g. tanks by the force of jets or sprays
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning In General (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US7245898P | 1998-01-09 | 1998-01-09 | |
US60/072,458 | 1998-01-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1356930A CN1356930A (zh) | 2002-07-03 |
CN1165385C true CN1165385C (zh) | 2004-09-08 |
Family
ID=22107714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB998037109A Expired - Lifetime CN1165385C (zh) | 1998-01-09 | 1999-01-08 | 半导体晶片载架的清洗装置和方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6248177B1 (zh) |
EP (1) | EP1075337B1 (zh) |
JP (1) | JP4447165B2 (zh) |
KR (1) | KR100560077B1 (zh) |
CN (1) | CN1165385C (zh) |
HK (1) | HK1046660B (zh) |
WO (1) | WO1999034939A1 (zh) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3563789B2 (ja) * | 1993-12-22 | 2004-09-08 | キヤノン株式会社 | 電子写真感光体の製造方法及び該製造方法に用いられる治具 |
US6432214B2 (en) | 1998-07-10 | 2002-08-13 | Semitool, Inc. | Cleaning apparatus |
US6904920B2 (en) * | 1998-07-10 | 2005-06-14 | Semitool, Inc. | Method and apparatus for cleaning containers |
US6412502B1 (en) * | 1999-07-28 | 2002-07-02 | Semitool, Inc. | Wafer container cleaning system |
US6810887B2 (en) * | 2000-08-11 | 2004-11-02 | Chemtrace Corporation | Method for cleaning semiconductor fabrication equipment parts |
WO2003006183A2 (en) * | 2001-07-12 | 2003-01-23 | Semitool, Inc. | Method and apparatus for cleaning semiconductor wafers and other flat media |
US6635409B1 (en) | 2001-07-12 | 2003-10-21 | Advanced Micro Devices, Inc. | Method of strengthening photoresist to prevent pattern collapse |
US20040000327A1 (en) * | 2002-06-26 | 2004-01-01 | Fabio Somboli | Apparatus and method for washing quartz parts, particularly for process equipment used in semiconductor industries |
CN1694803A (zh) * | 2002-09-03 | 2005-11-09 | 诚实公司 | 用于电子加工应用的高温、高强度、可着色的材料 |
US20070026171A1 (en) * | 2002-09-03 | 2007-02-01 | Extrand Charles W | High temperature, high strength, colorable materials for use with electronics processing applications |
JP2006507994A (ja) * | 2002-10-09 | 2006-03-09 | エンテグリス・インコーポレーテッド | デバイス処理システム用の高温高強度の着色可能な材料 |
US6830057B2 (en) * | 2002-11-01 | 2004-12-14 | Semitool, Inc. | Wafer container cleaning system |
US6923188B2 (en) * | 2003-04-29 | 2005-08-02 | Powerchip Semiconductor Corp. | Method of sampling contaminants of semiconductor wafer carrier |
CN1324647C (zh) * | 2003-04-29 | 2007-07-04 | 力晶半导体股份有限公司 | 一种半导体晶片载具内部的污染采样方法 |
US7344030B2 (en) * | 2003-11-07 | 2008-03-18 | Entegris, Inc. | Wafer carrier with apertured door for cleaning |
US7073522B2 (en) * | 2004-04-05 | 2006-07-11 | Quantum Global Technologies, Llc | Apparatus for applying disparate etching solutions to interior and exterior surfaces |
KR100615603B1 (ko) * | 2004-10-18 | 2006-08-25 | 삼성전자주식회사 | 반도체 제조용 확산 설비의 확산로 세정 방법 및 세정용보조구 |
DE102005030275A1 (de) * | 2005-06-21 | 2006-12-28 | Dynamic Microsystems Semiconductor Equipment Gmbh | Verfahren und Vorrichtung zum Reinigen oder Trocknen von topfartigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer |
US8225804B2 (en) * | 2007-03-02 | 2012-07-24 | Safety-Kleen Systems, Inc. | Multipurpose aqueous parts washer |
CN105870041A (zh) * | 2008-05-28 | 2016-08-17 | 空气制品及化学品有限公司 | 夹具干燥设备和方法 |
JP6046608B2 (ja) * | 2010-06-11 | 2016-12-21 | テル エフエスアイ インコーポレイテッド | 超小型電子ワークピースの加工に使用されるツールにおけるツール表面を洗浄する方法 |
CN103170469B (zh) * | 2011-12-22 | 2016-02-03 | 中芯国际集成电路制造(上海)有限公司 | 用于清洗和干燥晶圆盒的装置及方法 |
US20160303622A1 (en) | 2013-10-23 | 2016-10-20 | Brooks Ccs Gmbh | Cleaning Systems and Methods for Semiconductor Substrate Storage Articles |
CN107433274A (zh) * | 2016-05-25 | 2017-12-05 | 上海新昇半导体科技有限公司 | 石英腔体的清洗方法 |
FR3054474B1 (fr) * | 2017-02-16 | 2018-08-17 | Sidel Participations | Dispositif et procede de depoussierage de l'interieur d'au moins une preforme |
US11699609B2 (en) * | 2018-09-28 | 2023-07-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Automated nozzle cleaning system |
HRP20230674T1 (hr) * | 2019-12-16 | 2023-09-29 | LVP Engineering & Constructions BVBA | Uređaj i postupak za čišćenje kontejnera |
WO2021207311A1 (en) * | 2020-04-08 | 2021-10-14 | Pintek Solutions Corporation | Sample carrier cleaner |
DE102023100730B4 (de) * | 2023-01-13 | 2024-09-19 | Gsec German Semiconductor Equipment Company Gmbh | Verfahren zum Reinigen von topfförmigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer oder für Lithografie-Masken mit einer entsprechenden Vorrichtung |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1661602A (en) | 1926-03-05 | 1928-03-06 | Dary Samuel | Milk-can-washing machine |
US3092120A (en) * | 1960-04-01 | 1963-06-04 | Harry B Hilger | Washer for cups and the like |
GB1498795A (en) | 1974-03-21 | 1978-01-25 | Jackson J | Method and apparatus for cleaning containers |
US4133340A (en) * | 1977-04-18 | 1979-01-09 | Ballard Thomas B | Cleaning machine for simultaneously cleaning the interior and exterior of hollow articles |
US4381016A (en) | 1981-07-07 | 1983-04-26 | Douglas Robin S | Cleaning fluid distribution head |
US4785836A (en) * | 1987-07-17 | 1988-11-22 | Soichiro Yamamoto | Spray washer |
US5137043A (en) | 1991-05-02 | 1992-08-11 | Wickham Iii Ward E | Vehicle for cleaning intermediate bulk containers |
US5363867A (en) | 1992-01-21 | 1994-11-15 | Shinko Electric Co., Ltd. | Article storage house in a clean room |
US5224503A (en) * | 1992-06-15 | 1993-07-06 | Semitool, Inc. | Centrifugal wafer carrier cleaning apparatus |
US5409545A (en) | 1993-03-04 | 1995-04-25 | Environmental Sampling Supply, Inc. | Apparatus and method for cleaning containers |
US5616208A (en) | 1993-09-17 | 1997-04-01 | Tokyo Electron Limited | Vacuum processing apparatus, vacuum processing method, and method for cleaning the vacuum processing apparatus |
US5522410A (en) | 1994-12-22 | 1996-06-04 | Meilleur; Michel | Portable single-cup washer |
SE509676C2 (sv) * | 1995-05-26 | 1999-02-22 | Bengt Arne Ohlson | Tvättanordning för in- och utvändig tvättning av sprundförsedda fat |
US5603342A (en) | 1995-06-29 | 1997-02-18 | Coulter Corporation | Apparatus for cleaning a fluid sample probe |
-
1999
- 1999-01-08 WO PCT/US1999/000446 patent/WO1999034939A1/en active IP Right Grant
- 1999-01-08 EP EP99901383.2A patent/EP1075337B1/en not_active Expired - Lifetime
- 1999-01-08 CN CNB998037109A patent/CN1165385C/zh not_active Expired - Lifetime
- 1999-01-08 JP JP2000527372A patent/JP4447165B2/ja not_active Expired - Lifetime
- 1999-01-08 KR KR1020007007611A patent/KR100560077B1/ko not_active IP Right Cessation
- 1999-01-08 US US09/227,702 patent/US6248177B1/en not_active Expired - Lifetime
-
2002
- 2002-11-08 HK HK02108130.2A patent/HK1046660B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP4447165B2 (ja) | 2010-04-07 |
KR100560077B1 (ko) | 2006-03-13 |
KR20010040331A (ko) | 2001-05-15 |
HK1046660B (zh) | 2005-07-08 |
EP1075337B1 (en) | 2015-11-18 |
WO1999034939A9 (en) | 1999-09-30 |
CN1356930A (zh) | 2002-07-03 |
WO1999034939A8 (en) | 2001-05-31 |
EP1075337A1 (en) | 2001-02-14 |
US6248177B1 (en) | 2001-06-19 |
EP1075337A4 (en) | 2004-05-19 |
HK1046660A1 (en) | 2003-01-24 |
JP2002500101A (ja) | 2002-01-08 |
WO1999034939A1 (en) | 1999-07-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: HONEST CO.,LTD. Free format text: FORMER NAME OR ADDRESS: FLUOROWARE INC. |
|
CP03 | Change of name, title or address |
Address after: American Minnesota Patentee after: ENTEGRIS, Inc. Address before: American Minnesota Patentee before: Fluoroware, Inc. |
|
ASS | Succession or assignment of patent right |
Owner name: DUOLIU ENGINEERING CO., LTD. Free format text: FORMER OWNER: ENTEGRIS INC. Effective date: 20120706 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20120706 Address after: The American state of New Mexico Patentee after: Multi flow Engineering Co.,Ltd. Address before: American Minnesota Patentee before: ENTEGRIS, Inc. |
|
ASS | Succession or assignment of patent right |
Owner name: AIR PRODUCTS AND CHEMICALS, INE. Free format text: FORMER OWNER: DUOLIU ENGINEERING CO., LTD. Effective date: 20140808 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20140808 Address after: American Pennsylvania Patentee after: Air Products and Chemicals, Inc. Address before: The American state of New Mexico Patentee before: Multi flow Engineering Co.,Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20170622 Address after: Arizona, USA Patentee after: Versum Materials US, LLC Address before: American Pennsylvania Patentee before: Air Products and Chemicals, Inc. |
|
TR01 | Transfer of patent right | ||
CX01 | Expiry of patent term |
Granted publication date: 20040908 |
|
CX01 | Expiry of patent term |