CN116529333A - 导电性粘接膜 - Google Patents

导电性粘接膜 Download PDF

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Publication number
CN116529333A
CN116529333A CN202180081558.5A CN202180081558A CN116529333A CN 116529333 A CN116529333 A CN 116529333A CN 202180081558 A CN202180081558 A CN 202180081558A CN 116529333 A CN116529333 A CN 116529333A
Authority
CN
China
Prior art keywords
adhesive film
resin
conductive adhesive
epoxy resin
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180081558.5A
Other languages
English (en)
Chinese (zh)
Inventor
渡边恭祐
奥野真奈美
久保有希
阪内启之
山田惠
佐藤直哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Publication of CN116529333A publication Critical patent/CN116529333A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN202180081558.5A 2020-12-10 2021-11-11 导电性粘接膜 Pending CN116529333A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-204982 2020-12-10
JP2020204982 2020-12-10
PCT/JP2021/041515 WO2022123999A1 (ja) 2020-12-10 2021-11-11 導電性接着フィルム

Publications (1)

Publication Number Publication Date
CN116529333A true CN116529333A (zh) 2023-08-01

Family

ID=81972915

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180081558.5A Pending CN116529333A (zh) 2020-12-10 2021-11-11 导电性粘接膜

Country Status (5)

Country Link
JP (1) JPWO2022123999A1 (https=)
KR (1) KR20230113757A (https=)
CN (1) CN116529333A (https=)
TW (1) TW202237788A (https=)
WO (1) WO2022123999A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005044524A (ja) * 2003-07-22 2005-02-17 Sumitomo Bakelite Co Ltd 導電性接着フィルムおよびこれを用いた半導体装置
JP2012142368A (ja) * 2010-12-28 2012-07-26 Nitto Denko Corp ダイシング・ダイボンドフィルム及び半導体素子
JP2013229277A (ja) * 2012-03-31 2013-11-07 Aica Kogyo Co Ltd 導電性接着フィルム
CN104302724A (zh) * 2012-05-17 2015-01-21 汉高知识产权控股有限责任公司 用以提高导电管芯附接膜的粘合性的扩链环氧树脂
TW201518471A (zh) * 2013-11-07 2015-05-16 Toyo Ink Sc Holdings Co Ltd 導電性接著劑、導電性接著片、配線裝置及配線裝置的製造方法
CN106085274A (zh) * 2015-04-27 2016-11-09 东洋油墨Sc控股株式会社 导电性粘合剂、导电性粘合片及配线元件
TW201829634A (zh) * 2016-10-03 2018-08-16 日商味之素股份有限公司 樹脂組成物
CN108913047A (zh) * 2018-07-26 2018-11-30 深圳广恒威科技有限公司 导电固晶粘结胶液、高导热性能导电胶膜及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012164925A (ja) 2011-02-09 2012-08-30 Nec Lighting Ltd Ｌｅｄ装置
WO2014003159A1 (ja) * 2012-06-29 2014-01-03 タツタ電線株式会社 導電性接着剤組成物、導電性接着フィルム、接着方法及び回路基板
JP6033734B2 (ja) * 2013-04-30 2016-11-30 日東電工株式会社 フィルム状接着剤、ダイシングテープ一体型フィルム状接着剤、及び、半導体装置の製造方法
TWI653312B (zh) * 2014-03-11 2019-03-11 日商味之素股份有限公司 接著薄膜
JP2016060761A (ja) * 2014-09-16 2016-04-25 デクセリアルズ株式会社 異方性導電接着剤、及び接続構造体の製造方法
CN108026420B (zh) * 2016-05-12 2020-11-06 日本Mektron株式会社 导电性粘合剂和屏蔽膜
TWI689573B (zh) * 2016-05-23 2020-04-01 日商拓自達電線股份有限公司 導電性接著劑組成物

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005044524A (ja) * 2003-07-22 2005-02-17 Sumitomo Bakelite Co Ltd 導電性接着フィルムおよびこれを用いた半導体装置
JP2012142368A (ja) * 2010-12-28 2012-07-26 Nitto Denko Corp ダイシング・ダイボンドフィルム及び半導体素子
JP2013229277A (ja) * 2012-03-31 2013-11-07 Aica Kogyo Co Ltd 導電性接着フィルム
CN104302724A (zh) * 2012-05-17 2015-01-21 汉高知识产权控股有限责任公司 用以提高导电管芯附接膜的粘合性的扩链环氧树脂
TW201518471A (zh) * 2013-11-07 2015-05-16 Toyo Ink Sc Holdings Co Ltd 導電性接著劑、導電性接著片、配線裝置及配線裝置的製造方法
CN106085274A (zh) * 2015-04-27 2016-11-09 东洋油墨Sc控股株式会社 导电性粘合剂、导电性粘合片及配线元件
TW201829634A (zh) * 2016-10-03 2018-08-16 日商味之素股份有限公司 樹脂組成物
CN108913047A (zh) * 2018-07-26 2018-11-30 深圳广恒威科技有限公司 导电固晶粘结胶液、高导热性能导电胶膜及其制备方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
吕洪久;: "电子设备用导电性胶粘剂", 化工新型材料, no. 03, 31 March 1986 (1986-03-31), pages 24 - 26 *

Also Published As

Publication number Publication date
TW202237788A (zh) 2022-10-01
WO2022123999A1 (ja) 2022-06-16
JPWO2022123999A1 (https=) 2022-06-16
KR20230113757A (ko) 2023-08-01

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