CN116472140A - 焊料合金、焊球及焊料接头 - Google Patents

焊料合金、焊球及焊料接头 Download PDF

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Publication number
CN116472140A
CN116472140A CN202180077121.4A CN202180077121A CN116472140A CN 116472140 A CN116472140 A CN 116472140A CN 202180077121 A CN202180077121 A CN 202180077121A CN 116472140 A CN116472140 A CN 116472140A
Authority
CN
China
Prior art keywords
mass
solder alloy
solder
alloy
free
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180077121.4A
Other languages
English (en)
Chinese (zh)
Inventor
饭岛裕贵
吉川俊策
出井宽大
松藤贵大
杉泽昂太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Publication of CN116472140A publication Critical patent/CN116472140A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connection Of Batteries Or Terminals (AREA)
CN202180077121.4A 2020-11-19 2021-11-17 焊料合金、焊球及焊料接头 Pending CN116472140A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063115611P 2020-11-19 2020-11-19
US63/115,611 2020-11-19
PCT/JP2021/042233 WO2022107806A1 (ja) 2020-11-19 2021-11-17 はんだ合金、はんだボール、及びはんだ継手

Publications (1)

Publication Number Publication Date
CN116472140A true CN116472140A (zh) 2023-07-21

Family

ID=81708026

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180077121.4A Pending CN116472140A (zh) 2020-11-19 2021-11-17 焊料合金、焊球及焊料接头

Country Status (10)

Country Link
US (1) US12583060B2 (https=)
EP (2) EP4578592A1 (https=)
JP (3) JP7100283B1 (https=)
KR (2) KR102901735B1 (https=)
CN (1) CN116472140A (https=)
CA (3) CA3198256C (https=)
MX (4) MX2023005700A (https=)
MY (1) MY199315A (https=)
TW (2) TW202421803A (https=)
WO (1) WO2022107806A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6912742B1 (ja) * 2020-02-14 2021-08-04 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
JP7100283B1 (ja) * 2020-11-19 2022-07-13 千住金属工業株式会社 はんだ合金、はんだボール、及びはんだ継手
TWI838983B (zh) * 2022-11-28 2024-04-11 昇貿科技股份有限公司 無鉛銲料合金及焊料接點
JP7633557B1 (ja) 2023-12-28 2025-02-20 千住金属工業株式会社 はんだ合金、はんだボール、はんだペースト、およびはんだ継手

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101716703A (zh) * 2009-11-30 2010-06-02 南京达迈科技实业有限公司 低银SnAgCuBi系无铅焊锡合金及其制备方法
CN101801588A (zh) * 2007-07-13 2010-08-11 千住金属工业株式会社 车载安装用无铅焊料以及车载电路
CN102066043A (zh) * 2008-04-23 2011-05-18 千住金属工业株式会社 抑制缩孔的无铅焊料合金
US20140328719A1 (en) * 2013-05-03 2014-11-06 Accurus Scientific Co., Ltd. Lead-free solder composition
US20150146394A1 (en) * 2013-05-29 2015-05-28 Nippon Steel & Sumkin Materials Co., Ltd. Solder ball and electronic member
CN105189027A (zh) * 2013-09-11 2015-12-23 千住金属工业株式会社 无铅软钎料、无铅焊料球、使用了该无铅软钎料的焊料接头和具有该焊料接头的半导体电路
JP6700568B1 (ja) * 2019-08-09 2020-05-27 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0670568A (ja) * 1992-07-10 1994-03-11 Matsushita Electric Ind Co Ltd 直流モータの速度制御装置
JP2000015476A (ja) * 1998-06-29 2000-01-18 Ishikawa Kinzoku Kk 無鉛はんだ
US6517602B2 (en) * 2000-03-14 2003-02-11 Hitachi Metals, Ltd Solder ball and method for producing same
JP4144415B2 (ja) 2003-01-07 2008-09-03 千住金属工業株式会社 鉛フリーはんだ
US8562906B2 (en) * 2006-03-09 2013-10-22 Nippon Steel & Sumikin Materials Co., Ltd. Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member
US20150266137A1 (en) 2012-10-09 2015-09-24 Alpha Metals, Inc. Lead-free and antimony-free tin solder reliable at high temperatures
AU2015254179B2 (en) 2014-04-30 2017-07-20 Nihon Superior Co., Ltd. Lead-free solder alloy
KR101985646B1 (ko) 2014-07-21 2019-06-04 알파 어셈블리 솔루션스 인크. 솔더링용 저온 고신뢰성 주석 합금
JP6755546B2 (ja) 2016-08-09 2020-09-16 株式会社日本スペリア社 接合方法
US20180102464A1 (en) 2016-10-06 2018-04-12 Alpha Assembly Solutions Inc. Advanced Solder Alloys For Electronic Interconnects
JP6828880B2 (ja) 2016-10-06 2021-02-10 株式会社弘輝 はんだペースト、はんだ合金粉
WO2018174162A1 (ja) 2017-03-23 2018-09-27 株式会社日本スペリア社 はんだ継手
JP6578393B2 (ja) * 2018-02-27 2019-09-18 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路実装基板及び電子制御装置
TWI725664B (zh) 2018-12-14 2021-04-21 日商千住金屬工業股份有限公司 焊料合金、焊料膏、焊料預形體及焊料接頭
JP6912742B1 (ja) * 2020-02-14 2021-08-04 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
JP2021178350A (ja) * 2020-05-14 2021-11-18 株式会社日本スペリア社 鉛フリーはんだ合金
JP7100283B1 (ja) * 2020-11-19 2022-07-13 千住金属工業株式会社 はんだ合金、はんだボール、及びはんだ継手

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101801588A (zh) * 2007-07-13 2010-08-11 千住金属工业株式会社 车载安装用无铅焊料以及车载电路
CN102066043A (zh) * 2008-04-23 2011-05-18 千住金属工业株式会社 抑制缩孔的无铅焊料合金
CN101716703A (zh) * 2009-11-30 2010-06-02 南京达迈科技实业有限公司 低银SnAgCuBi系无铅焊锡合金及其制备方法
US20140328719A1 (en) * 2013-05-03 2014-11-06 Accurus Scientific Co., Ltd. Lead-free solder composition
TW201442818A (zh) * 2013-05-03 2014-11-16 Accurus Scient Co Ltd 抗高溫時效高強度無鉛焊錫
US20150146394A1 (en) * 2013-05-29 2015-05-28 Nippon Steel & Sumkin Materials Co., Ltd. Solder ball and electronic member
CN105189027A (zh) * 2013-09-11 2015-12-23 千住金属工业株式会社 无铅软钎料、无铅焊料球、使用了该无铅软钎料的焊料接头和具有该焊料接头的半导体电路
JP6700568B1 (ja) * 2019-08-09 2020-05-27 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手

Also Published As

Publication number Publication date
WO2022107806A1 (ja) 2022-05-27
KR20230087565A (ko) 2023-06-16
MX2023011402A (es) 2023-10-12
JP2022126750A (ja) 2022-08-30
KR102901735B1 (ko) 2025-12-19
JP7100283B1 (ja) 2022-07-13
JP2022130498A (ja) 2022-09-06
US12583060B2 (en) 2026-03-24
EP4249165A4 (en) 2024-05-15
EP4249165A1 (en) 2023-09-27
TW202421803A (zh) 2024-06-01
MX2023011401A (es) 2023-10-12
TWI833132B (zh) 2024-02-21
EP4578592A1 (en) 2025-07-02
MY199315A (en) 2023-10-24
US20230398643A1 (en) 2023-12-14
MX2023005700A (es) 2023-11-30
KR20260004560A (ko) 2026-01-08
JPWO2022107806A1 (https=) 2022-05-27
CA3236527A1 (en) 2022-05-27
CA3198256A1 (en) 2022-05-27
CA3198256C (en) 2025-05-06
CA3236521A1 (en) 2022-05-27
MX2023014150A (es) 2023-12-13
TW202229570A (zh) 2022-08-01
JP7144708B2 (ja) 2022-09-30

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