MY199315A - Solder alloy, solder ball and solder joint - Google Patents
Solder alloy, solder ball and solder jointInfo
- Publication number
- MY199315A MY199315A MYPI2023001946A MYPI2023001946A MY199315A MY 199315 A MY199315 A MY 199315A MY PI2023001946 A MYPI2023001946 A MY PI2023001946A MY PI2023001946 A MYPI2023001946 A MY PI2023001946A MY 199315 A MY199315 A MY 199315A
- Authority
- MY
- Malaysia
- Prior art keywords
- solder
- mass
- alloy
- joint
- ball
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/346—Solder materials or compositions specially adapted therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Connection Of Batteries Or Terminals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063115611P | 2020-11-19 | 2020-11-19 | |
| PCT/JP2021/042233 WO2022107806A1 (ja) | 2020-11-19 | 2021-11-17 | はんだ合金、はんだボール、及びはんだ継手 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY199315A true MY199315A (en) | 2023-10-24 |
Family
ID=81708026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2023001946A MY199315A (en) | 2020-11-19 | 2021-11-17 | Solder alloy, solder ball and solder joint |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US12583060B2 (https=) |
| EP (2) | EP4578592A1 (https=) |
| JP (3) | JP7100283B1 (https=) |
| KR (2) | KR102901735B1 (https=) |
| CN (1) | CN116472140A (https=) |
| CA (3) | CA3198256C (https=) |
| MX (4) | MX2023005700A (https=) |
| MY (1) | MY199315A (https=) |
| TW (2) | TW202421803A (https=) |
| WO (1) | WO2022107806A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6912742B1 (ja) * | 2020-02-14 | 2021-08-04 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
| JP7100283B1 (ja) * | 2020-11-19 | 2022-07-13 | 千住金属工業株式会社 | はんだ合金、はんだボール、及びはんだ継手 |
| TWI838983B (zh) * | 2022-11-28 | 2024-04-11 | 昇貿科技股份有限公司 | 無鉛銲料合金及焊料接點 |
| JP7633557B1 (ja) | 2023-12-28 | 2025-02-20 | 千住金属工業株式会社 | はんだ合金、はんだボール、はんだペースト、およびはんだ継手 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0670568A (ja) * | 1992-07-10 | 1994-03-11 | Matsushita Electric Ind Co Ltd | 直流モータの速度制御装置 |
| JP2000015476A (ja) * | 1998-06-29 | 2000-01-18 | Ishikawa Kinzoku Kk | 無鉛はんだ |
| US6517602B2 (en) * | 2000-03-14 | 2003-02-11 | Hitachi Metals, Ltd | Solder ball and method for producing same |
| JP4144415B2 (ja) | 2003-01-07 | 2008-09-03 | 千住金属工業株式会社 | 鉛フリーはんだ |
| US8562906B2 (en) * | 2006-03-09 | 2013-10-22 | Nippon Steel & Sumikin Materials Co., Ltd. | Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member |
| KR101243410B1 (ko) | 2007-07-13 | 2013-03-13 | 센주긴조쿠고교 가부시키가이샤 | 차재 실장용 무납 땜납과 차재 전자 회로 |
| EP2275224B1 (en) | 2008-04-23 | 2014-01-22 | Senju Metal Industry Co., Ltd | Lead-free solder alloy suppressed in occurrence of shrinkage cavity |
| CN101716703B (zh) | 2009-11-30 | 2012-11-21 | 南京达迈科技实业有限公司 | 低银SnAgCuBi系无铅焊锡合金及其制备方法 |
| US20150266137A1 (en) | 2012-10-09 | 2015-09-24 | Alpha Metals, Inc. | Lead-free and antimony-free tin solder reliable at high temperatures |
| TWI576195B (zh) * | 2013-05-03 | 2017-04-01 | Accurus Scientific Co Ltd | High temperature resistant high strength lead free solder |
| US9320152B2 (en) | 2013-05-29 | 2016-04-19 | Nippon Steel & Sumikin Materials Co., Ltd. | Solder ball and electronic member |
| JP6145164B2 (ja) | 2013-09-11 | 2017-06-07 | 千住金属工業株式会社 | 鉛フリーはんだ、鉛フリーはんだボール、この鉛フリーはんだを使用したはんだ継手およびこのはんだ継手を有する半導体回路 |
| AU2015254179B2 (en) | 2014-04-30 | 2017-07-20 | Nihon Superior Co., Ltd. | Lead-free solder alloy |
| KR101985646B1 (ko) | 2014-07-21 | 2019-06-04 | 알파 어셈블리 솔루션스 인크. | 솔더링용 저온 고신뢰성 주석 합금 |
| JP6755546B2 (ja) | 2016-08-09 | 2020-09-16 | 株式会社日本スペリア社 | 接合方法 |
| US20180102464A1 (en) | 2016-10-06 | 2018-04-12 | Alpha Assembly Solutions Inc. | Advanced Solder Alloys For Electronic Interconnects |
| JP6828880B2 (ja) | 2016-10-06 | 2021-02-10 | 株式会社弘輝 | はんだペースト、はんだ合金粉 |
| WO2018174162A1 (ja) | 2017-03-23 | 2018-09-27 | 株式会社日本スペリア社 | はんだ継手 |
| JP6578393B2 (ja) * | 2018-02-27 | 2019-09-18 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、電子回路実装基板及び電子制御装置 |
| TWI725664B (zh) | 2018-12-14 | 2021-04-21 | 日商千住金屬工業股份有限公司 | 焊料合金、焊料膏、焊料預形體及焊料接頭 |
| JP6700568B1 (ja) | 2019-08-09 | 2020-05-27 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手 |
| JP6912742B1 (ja) * | 2020-02-14 | 2021-08-04 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
| JP2021178350A (ja) * | 2020-05-14 | 2021-11-18 | 株式会社日本スペリア社 | 鉛フリーはんだ合金 |
| JP7100283B1 (ja) * | 2020-11-19 | 2022-07-13 | 千住金属工業株式会社 | はんだ合金、はんだボール、及びはんだ継手 |
-
2021
- 2021-11-17 JP JP2022517181A patent/JP7100283B1/ja active Active
- 2021-11-17 EP EP24196170.5A patent/EP4578592A1/en active Pending
- 2021-11-17 CA CA3198256A patent/CA3198256C/en active Active
- 2021-11-17 CA CA3236527A patent/CA3236527A1/en active Pending
- 2021-11-17 MX MX2023005700A patent/MX2023005700A/es unknown
- 2021-11-17 WO PCT/JP2021/042233 patent/WO2022107806A1/ja not_active Ceased
- 2021-11-17 CA CA3236521A patent/CA3236521A1/en active Pending
- 2021-11-17 CN CN202180077121.4A patent/CN116472140A/zh active Pending
- 2021-11-17 TW TW113101418A patent/TW202421803A/zh unknown
- 2021-11-17 KR KR1020237016199A patent/KR102901735B1/ko active Active
- 2021-11-17 KR KR1020257041766A patent/KR20260004560A/ko active Pending
- 2021-11-17 MY MYPI2023001946A patent/MY199315A/en unknown
- 2021-11-17 EP EP21894680.4A patent/EP4249165A4/en active Pending
- 2021-11-17 US US18/033,750 patent/US12583060B2/en active Active
- 2021-11-17 TW TW110142774A patent/TWI833132B/zh active
-
2022
- 2022-06-16 JP JP2022097574A patent/JP7144708B2/ja active Active
- 2022-06-16 JP JP2022097573A patent/JP2022130498A/ja active Pending
-
2023
- 2023-05-15 MX MX2023014150A patent/MX2023014150A/es unknown
- 2023-05-15 MX MX2023011401A patent/MX2023011401A/es unknown
- 2023-05-15 MX MX2023011402A patent/MX2023011402A/es unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022107806A1 (ja) | 2022-05-27 |
| KR20230087565A (ko) | 2023-06-16 |
| MX2023011402A (es) | 2023-10-12 |
| CN116472140A (zh) | 2023-07-21 |
| JP2022126750A (ja) | 2022-08-30 |
| KR102901735B1 (ko) | 2025-12-19 |
| JP7100283B1 (ja) | 2022-07-13 |
| JP2022130498A (ja) | 2022-09-06 |
| US12583060B2 (en) | 2026-03-24 |
| EP4249165A4 (en) | 2024-05-15 |
| EP4249165A1 (en) | 2023-09-27 |
| TW202421803A (zh) | 2024-06-01 |
| MX2023011401A (es) | 2023-10-12 |
| TWI833132B (zh) | 2024-02-21 |
| EP4578592A1 (en) | 2025-07-02 |
| US20230398643A1 (en) | 2023-12-14 |
| MX2023005700A (es) | 2023-11-30 |
| KR20260004560A (ko) | 2026-01-08 |
| JPWO2022107806A1 (https=) | 2022-05-27 |
| CA3236527A1 (en) | 2022-05-27 |
| CA3198256A1 (en) | 2022-05-27 |
| CA3198256C (en) | 2025-05-06 |
| CA3236521A1 (en) | 2022-05-27 |
| MX2023014150A (es) | 2023-12-13 |
| TW202229570A (zh) | 2022-08-01 |
| JP7144708B2 (ja) | 2022-09-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MY188098A (en) | Solder alloy, solder ball, solder preform, solder paste and solder joint | |
| MX2023011401A (es) | Aleacion de soldadura, bola de soldadura y junta de soldadura. | |
| MY187838A (en) | Solder alloy, solder powder, and solder paste, and solder joint using same | |
| PH12019501934A1 (en) | Solder material, solder paste, formed solder and solder joint | |
| EP4629759A3 (en) | High temperature ultra-high reliability alloys | |
| PH12021050351A1 (en) | Solder alloy | |
| MY198847A (en) | Lead-free and antimony-free solder alloy, solder ball, baii grid array, and solder joint | |
| PH12018500431B1 (en) | Lead-free solder alloy, flux composition, solder paste composition, electronic circuit board and electronic control device | |
| MY191908A (en) | Lead-free solder alloy and solder joint part | |
| MY186516A (en) | High impact toughness solder alloy | |
| MY194455A (en) | Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint | |
| MX2022004241A (es) | Aleacion de soldadura, pasta de soldadura, bola de soldadura, preforma de soldadura, junta de soldadura, circuito electronico en vehiculo, circuito electronico de ecu, dispositivo de circuito electronico en vehiculo y dispositivo de circuito electronico de ecu. | |
| MX2024003977A (es) | Aleacion de soldadura, bola de soldadura, preforma de soldadura, pasta de soldadura y junta de soldadura. | |
| EP4299238A3 (en) | Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications | |
| MY203364A (en) | Solder alloy, solder ball, solder paste, and solder joint | |
| PH12021551413A1 (en) | Soldering alloy, soldering paste, preform solder, soldering ball, wire solder, resin flux cored solder, solder joint, electronic circuit board, and multi-layer electronic circuit board | |
| PH12016000448B1 (en) | Solder alloy | |
| PH12020550954A1 (en) | Solder alloy and solder joint | |
| MY189490A (en) | Solder alloy, solder paste, solder ball, solder preform, and solder joint | |
| WO2019094241A3 (en) | Cost-effective lead-free solder alloy for electronic applications | |
| PH12022050406A1 (en) | Solder alloy and solder joint | |
| PH12022552462A1 (en) | Solder alloy, solder ball and solder joint | |
| PH12022050092B1 (en) | Solder alloy, solder powder, solder paste and solder joint | |
| MY195909A (en) | Solder Alloy, Solder Powder, Solder Paste, and Solder Joint Obtained Using These | |
| PH12018501147B1 (en) | Solder alloy for preventing fe leaching, flux-cored solder, wire solder, flux-cored wire solder, flux-coated solder and solder joint |