JPWO2022107806A1 - - Google Patents
Info
- Publication number
- JPWO2022107806A1 JPWO2022107806A1 JP2022517181A JP2022517181A JPWO2022107806A1 JP WO2022107806 A1 JPWO2022107806 A1 JP WO2022107806A1 JP 2022517181 A JP2022517181 A JP 2022517181A JP 2022517181 A JP2022517181 A JP 2022517181A JP WO2022107806 A1 JPWO2022107806 A1 JP WO2022107806A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/346—Solder materials or compositions specially adapted therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Connection Of Batteries Or Terminals (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022097574A JP7144708B2 (ja) | 2020-11-19 | 2022-06-16 | はんだ合金、はんだボール、及びはんだ継手 |
| JP2022097573A JP2022130498A (ja) | 2020-11-19 | 2022-06-16 | はんだ合金、はんだボール、及びはんだ継手 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063115611P | 2020-11-19 | 2020-11-19 | |
| US63/115,611 | 2020-11-19 | ||
| PCT/JP2021/042233 WO2022107806A1 (ja) | 2020-11-19 | 2021-11-17 | はんだ合金、はんだボール、及びはんだ継手 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022097573A Division JP2022130498A (ja) | 2020-11-19 | 2022-06-16 | はんだ合金、はんだボール、及びはんだ継手 |
| JP2022097574A Division JP7144708B2 (ja) | 2020-11-19 | 2022-06-16 | はんだ合金、はんだボール、及びはんだ継手 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022107806A1 true JPWO2022107806A1 (https=) | 2022-05-27 |
| JP7100283B1 JP7100283B1 (ja) | 2022-07-13 |
| JPWO2022107806A5 JPWO2022107806A5 (https=) | 2022-11-24 |
Family
ID=81708026
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022517181A Active JP7100283B1 (ja) | 2020-11-19 | 2021-11-17 | はんだ合金、はんだボール、及びはんだ継手 |
| JP2022097574A Active JP7144708B2 (ja) | 2020-11-19 | 2022-06-16 | はんだ合金、はんだボール、及びはんだ継手 |
| JP2022097573A Pending JP2022130498A (ja) | 2020-11-19 | 2022-06-16 | はんだ合金、はんだボール、及びはんだ継手 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022097574A Active JP7144708B2 (ja) | 2020-11-19 | 2022-06-16 | はんだ合金、はんだボール、及びはんだ継手 |
| JP2022097573A Pending JP2022130498A (ja) | 2020-11-19 | 2022-06-16 | はんだ合金、はんだボール、及びはんだ継手 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US12583060B2 (https=) |
| EP (2) | EP4578592A1 (https=) |
| JP (3) | JP7100283B1 (https=) |
| KR (2) | KR102901735B1 (https=) |
| CN (1) | CN116472140A (https=) |
| CA (3) | CA3198256C (https=) |
| MX (4) | MX2023005700A (https=) |
| MY (1) | MY199315A (https=) |
| TW (2) | TW202421803A (https=) |
| WO (1) | WO2022107806A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6912742B1 (ja) * | 2020-02-14 | 2021-08-04 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
| JP7100283B1 (ja) * | 2020-11-19 | 2022-07-13 | 千住金属工業株式会社 | はんだ合金、はんだボール、及びはんだ継手 |
| TWI838983B (zh) * | 2022-11-28 | 2024-04-11 | 昇貿科技股份有限公司 | 無鉛銲料合金及焊料接點 |
| JP7633557B1 (ja) | 2023-12-28 | 2025-02-20 | 千住金属工業株式会社 | はんだ合金、はんだボール、はんだペースト、およびはんだ継手 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0670568A (ja) * | 1992-07-10 | 1994-03-11 | Matsushita Electric Ind Co Ltd | 直流モータの速度制御装置 |
| JP2000015476A (ja) * | 1998-06-29 | 2000-01-18 | Ishikawa Kinzoku Kk | 無鉛はんだ |
| US6517602B2 (en) * | 2000-03-14 | 2003-02-11 | Hitachi Metals, Ltd | Solder ball and method for producing same |
| JP4144415B2 (ja) | 2003-01-07 | 2008-09-03 | 千住金属工業株式会社 | 鉛フリーはんだ |
| US8562906B2 (en) * | 2006-03-09 | 2013-10-22 | Nippon Steel & Sumikin Materials Co., Ltd. | Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member |
| KR101243410B1 (ko) | 2007-07-13 | 2013-03-13 | 센주긴조쿠고교 가부시키가이샤 | 차재 실장용 무납 땜납과 차재 전자 회로 |
| EP2275224B1 (en) | 2008-04-23 | 2014-01-22 | Senju Metal Industry Co., Ltd | Lead-free solder alloy suppressed in occurrence of shrinkage cavity |
| CN101716703B (zh) | 2009-11-30 | 2012-11-21 | 南京达迈科技实业有限公司 | 低银SnAgCuBi系无铅焊锡合金及其制备方法 |
| US20150266137A1 (en) | 2012-10-09 | 2015-09-24 | Alpha Metals, Inc. | Lead-free and antimony-free tin solder reliable at high temperatures |
| TWI576195B (zh) * | 2013-05-03 | 2017-04-01 | Accurus Scientific Co Ltd | High temperature resistant high strength lead free solder |
| US9320152B2 (en) | 2013-05-29 | 2016-04-19 | Nippon Steel & Sumikin Materials Co., Ltd. | Solder ball and electronic member |
| JP6145164B2 (ja) | 2013-09-11 | 2017-06-07 | 千住金属工業株式会社 | 鉛フリーはんだ、鉛フリーはんだボール、この鉛フリーはんだを使用したはんだ継手およびこのはんだ継手を有する半導体回路 |
| AU2015254179B2 (en) | 2014-04-30 | 2017-07-20 | Nihon Superior Co., Ltd. | Lead-free solder alloy |
| KR101985646B1 (ko) | 2014-07-21 | 2019-06-04 | 알파 어셈블리 솔루션스 인크. | 솔더링용 저온 고신뢰성 주석 합금 |
| JP6755546B2 (ja) | 2016-08-09 | 2020-09-16 | 株式会社日本スペリア社 | 接合方法 |
| US20180102464A1 (en) | 2016-10-06 | 2018-04-12 | Alpha Assembly Solutions Inc. | Advanced Solder Alloys For Electronic Interconnects |
| JP6828880B2 (ja) | 2016-10-06 | 2021-02-10 | 株式会社弘輝 | はんだペースト、はんだ合金粉 |
| WO2018174162A1 (ja) | 2017-03-23 | 2018-09-27 | 株式会社日本スペリア社 | はんだ継手 |
| JP6578393B2 (ja) * | 2018-02-27 | 2019-09-18 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、電子回路実装基板及び電子制御装置 |
| TWI725664B (zh) | 2018-12-14 | 2021-04-21 | 日商千住金屬工業股份有限公司 | 焊料合金、焊料膏、焊料預形體及焊料接頭 |
| JP6700568B1 (ja) | 2019-08-09 | 2020-05-27 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手 |
| JP6912742B1 (ja) * | 2020-02-14 | 2021-08-04 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
| JP2021178350A (ja) * | 2020-05-14 | 2021-11-18 | 株式会社日本スペリア社 | 鉛フリーはんだ合金 |
| JP7100283B1 (ja) * | 2020-11-19 | 2022-07-13 | 千住金属工業株式会社 | はんだ合金、はんだボール、及びはんだ継手 |
-
2021
- 2021-11-17 JP JP2022517181A patent/JP7100283B1/ja active Active
- 2021-11-17 EP EP24196170.5A patent/EP4578592A1/en active Pending
- 2021-11-17 CA CA3198256A patent/CA3198256C/en active Active
- 2021-11-17 CA CA3236527A patent/CA3236527A1/en active Pending
- 2021-11-17 MX MX2023005700A patent/MX2023005700A/es unknown
- 2021-11-17 WO PCT/JP2021/042233 patent/WO2022107806A1/ja not_active Ceased
- 2021-11-17 CA CA3236521A patent/CA3236521A1/en active Pending
- 2021-11-17 CN CN202180077121.4A patent/CN116472140A/zh active Pending
- 2021-11-17 TW TW113101418A patent/TW202421803A/zh unknown
- 2021-11-17 KR KR1020237016199A patent/KR102901735B1/ko active Active
- 2021-11-17 KR KR1020257041766A patent/KR20260004560A/ko active Pending
- 2021-11-17 MY MYPI2023001946A patent/MY199315A/en unknown
- 2021-11-17 EP EP21894680.4A patent/EP4249165A4/en active Pending
- 2021-11-17 US US18/033,750 patent/US12583060B2/en active Active
- 2021-11-17 TW TW110142774A patent/TWI833132B/zh active
-
2022
- 2022-06-16 JP JP2022097574A patent/JP7144708B2/ja active Active
- 2022-06-16 JP JP2022097573A patent/JP2022130498A/ja active Pending
-
2023
- 2023-05-15 MX MX2023014150A patent/MX2023014150A/es unknown
- 2023-05-15 MX MX2023011401A patent/MX2023011401A/es unknown
- 2023-05-15 MX MX2023011402A patent/MX2023011402A/es unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022107806A1 (ja) | 2022-05-27 |
| KR20230087565A (ko) | 2023-06-16 |
| MX2023011402A (es) | 2023-10-12 |
| CN116472140A (zh) | 2023-07-21 |
| JP2022126750A (ja) | 2022-08-30 |
| KR102901735B1 (ko) | 2025-12-19 |
| JP7100283B1 (ja) | 2022-07-13 |
| JP2022130498A (ja) | 2022-09-06 |
| US12583060B2 (en) | 2026-03-24 |
| EP4249165A4 (en) | 2024-05-15 |
| EP4249165A1 (en) | 2023-09-27 |
| TW202421803A (zh) | 2024-06-01 |
| MX2023011401A (es) | 2023-10-12 |
| TWI833132B (zh) | 2024-02-21 |
| EP4578592A1 (en) | 2025-07-02 |
| MY199315A (en) | 2023-10-24 |
| US20230398643A1 (en) | 2023-12-14 |
| MX2023005700A (es) | 2023-11-30 |
| KR20260004560A (ko) | 2026-01-08 |
| CA3236527A1 (en) | 2022-05-27 |
| CA3198256A1 (en) | 2022-05-27 |
| CA3198256C (en) | 2025-05-06 |
| CA3236521A1 (en) | 2022-05-27 |
| MX2023014150A (es) | 2023-12-13 |
| TW202229570A (zh) | 2022-08-01 |
| JP7144708B2 (ja) | 2022-09-30 |
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