CN116448156B - 一种芯片检测用芯片支撑结构 - Google Patents
一种芯片检测用芯片支撑结构 Download PDFInfo
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- CN116448156B CN116448156B CN202310706967.0A CN202310706967A CN116448156B CN 116448156 B CN116448156 B CN 116448156B CN 202310706967 A CN202310706967 A CN 202310706967A CN 116448156 B CN116448156 B CN 116448156B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/30—Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310706967.0A CN116448156B (zh) | 2023-06-15 | 2023-06-15 | 一种芯片检测用芯片支撑结构 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310706967.0A CN116448156B (zh) | 2023-06-15 | 2023-06-15 | 一种芯片检测用芯片支撑结构 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116448156A CN116448156A (zh) | 2023-07-18 |
| CN116448156B true CN116448156B (zh) | 2023-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310706967.0A Active CN116448156B (zh) | 2023-06-15 | 2023-06-15 | 一种芯片检测用芯片支撑结构 |
Country Status (1)
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| CN (1) | CN116448156B (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116659789B (zh) * | 2023-08-02 | 2023-09-22 | 江苏晖恒芯片科技有限责任公司 | 一种芯片震动测试机 |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09307289A (ja) * | 1996-05-17 | 1997-11-28 | Sony Corp | チップマウント装置 |
| KR200325972Y1 (ko) * | 2003-06-24 | 2003-09-13 | 한동희 | 평판디스플레이의 이방전도성필름 및 구동칩 본딩장치 |
| KR20130038629A (ko) * | 2011-10-10 | 2013-04-18 | 주식회사 프로텍 | 고속 led 칩 분류 장치 |
| CN109059976A (zh) * | 2018-08-10 | 2018-12-21 | 苏州红隼机电科技有限公司 | 一种用于芯片检测的芯片支撑装置 |
| CN111211083A (zh) * | 2020-01-13 | 2020-05-29 | 长江存储科技有限责任公司 | 晶圆承载装置 |
| CN211346844U (zh) * | 2019-11-28 | 2020-08-25 | 宁波超速达通讯科技有限公司 | 一种用于芯片检测的芯片支撑装置 |
| CN211453712U (zh) * | 2019-12-26 | 2020-09-08 | 深圳市中航工控半导体有限公司 | 一种用于芯片检测的芯片支撑装置 |
| CN113021209A (zh) * | 2019-12-24 | 2021-06-25 | 长春长光华大智造测序设备有限公司 | 一种用于芯片固定的真空吸附装置 |
| CN213749990U (zh) * | 2020-11-21 | 2021-07-20 | 盐城市昊芯科技有限公司 | 一种芯片检测机的支撑控制结构 |
| CN217424596U (zh) * | 2022-05-19 | 2022-09-13 | 江苏时恒电子科技有限公司 | 一种用于热敏电阻芯片恒温恒湿检测的多工位托盘结构 |
| CN218251571U (zh) * | 2022-09-27 | 2023-01-10 | 峰雨光电科技(上海)有限公司 | 一种芯片检测用芯片支撑装置 |
| CN218918792U (zh) * | 2022-12-05 | 2023-04-25 | 无锡市锡胡精密制造有限公司 | 一种芯片封装加工用模具 |
-
2023
- 2023-06-15 CN CN202310706967.0A patent/CN116448156B/zh active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09307289A (ja) * | 1996-05-17 | 1997-11-28 | Sony Corp | チップマウント装置 |
| KR200325972Y1 (ko) * | 2003-06-24 | 2003-09-13 | 한동희 | 평판디스플레이의 이방전도성필름 및 구동칩 본딩장치 |
| KR20130038629A (ko) * | 2011-10-10 | 2013-04-18 | 주식회사 프로텍 | 고속 led 칩 분류 장치 |
| CN109059976A (zh) * | 2018-08-10 | 2018-12-21 | 苏州红隼机电科技有限公司 | 一种用于芯片检测的芯片支撑装置 |
| CN211346844U (zh) * | 2019-11-28 | 2020-08-25 | 宁波超速达通讯科技有限公司 | 一种用于芯片检测的芯片支撑装置 |
| CN113021209A (zh) * | 2019-12-24 | 2021-06-25 | 长春长光华大智造测序设备有限公司 | 一种用于芯片固定的真空吸附装置 |
| CN211453712U (zh) * | 2019-12-26 | 2020-09-08 | 深圳市中航工控半导体有限公司 | 一种用于芯片检测的芯片支撑装置 |
| CN111211083A (zh) * | 2020-01-13 | 2020-05-29 | 长江存储科技有限责任公司 | 晶圆承载装置 |
| CN213749990U (zh) * | 2020-11-21 | 2021-07-20 | 盐城市昊芯科技有限公司 | 一种芯片检测机的支撑控制结构 |
| CN217424596U (zh) * | 2022-05-19 | 2022-09-13 | 江苏时恒电子科技有限公司 | 一种用于热敏电阻芯片恒温恒湿检测的多工位托盘结构 |
| CN218251571U (zh) * | 2022-09-27 | 2023-01-10 | 峰雨光电科技(上海)有限公司 | 一种芯片检测用芯片支撑装置 |
| CN218918792U (zh) * | 2022-12-05 | 2023-04-25 | 无锡市锡胡精密制造有限公司 | 一种芯片封装加工用模具 |
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| Publication number | Publication date |
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| CN116448156A (zh) | 2023-07-18 |
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| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20230718 Assignee: Jiangsu Zetian Heping Machinery Technology Co.,Ltd. Assignor: Jiangsu Huiheng Chip Technology Co.,Ltd. Contract record no.: X2023980053343 Denomination of invention: A chip support structure for chip detection Granted publication date: 20231003 License type: Common License Record date: 20231221 |
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| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Jiangsu Zetian Heping Machinery Technology Co.,Ltd. Assignor: Jiangsu Huiheng Chip Technology Co.,Ltd. Contract record no.: X2023980053343 Date of cancellation: 20240830 |
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| EC01 | Cancellation of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20230718 Assignee: Jiangsu Zetian Heping Machinery Technology Co.,Ltd. Assignor: Jiangsu Huiheng Chip Technology Co.,Ltd. Contract record no.: X2024980016387 Denomination of invention: A chip support structure for chip detection Granted publication date: 20231003 License type: Common License Record date: 20240924 |
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| EE01 | Entry into force of recordation of patent licensing contract | ||
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Jiangsu Zetian Heping Machinery Technology Co.,Ltd. Assignor: Jiangsu Huiheng Chip Technology Co.,Ltd. Contract record no.: X2024980016387 Date of cancellation: 20250702 |
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| EC01 | Cancellation of recordation of patent licensing contract |