CN116235305B - 图像显示装置的制造方法以及图像显示装置 - Google Patents

图像显示装置的制造方法以及图像显示装置

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Publication number
CN116235305B
CN116235305B CN202180065689.4A CN202180065689A CN116235305B CN 116235305 B CN116235305 B CN 116235305B CN 202180065689 A CN202180065689 A CN 202180065689A CN 116235305 B CN116235305 B CN 116235305B
Authority
CN
China
Prior art keywords
light
layer
image display
insulating film
display device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180065689.4A
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English (en)
Chinese (zh)
Other versions
CN116235305A (zh
Inventor
秋元肇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Publication of CN116235305A publication Critical patent/CN116235305A/zh
Application granted granted Critical
Publication of CN116235305B publication Critical patent/CN116235305B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
CN202180065689.4A 2020-11-25 2021-11-22 图像显示装置的制造方法以及图像显示装置 Active CN116235305B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020195353 2020-11-25
JP2020-195353 2020-11-25
PCT/JP2021/042841 WO2022113949A1 (ja) 2020-11-25 2021-11-22 画像表示装置の製造方法および画像表示装置

Publications (2)

Publication Number Publication Date
CN116235305A CN116235305A (zh) 2023-06-06
CN116235305B true CN116235305B (zh) 2026-03-06

Family

ID=81754585

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180065689.4A Active CN116235305B (zh) 2020-11-25 2021-11-22 图像显示装置的制造方法以及图像显示装置

Country Status (5)

Country Link
US (1) US12477886B2 (https=)
JP (1) JP7728516B2 (https=)
CN (1) CN116235305B (https=)
TW (1) TWI898085B (https=)
WO (1) WO2022113949A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12074146B2 (en) * 2021-12-03 2024-08-27 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display panel and manufacturing method thereof
WO2024048394A1 (ja) * 2022-09-01 2024-03-07 株式会社ジャパンディスプレイ 積層構造体、積層構造体の製造方法、及び半導体デバイス

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015015321A (ja) * 2013-07-03 2015-01-22 高槻電器工業株式会社 半導体発光素子及びその製造方法

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2884083B1 (ja) * 1998-03-25 1999-04-19 静岡大学長 金属層上にエピタキシャル成長した半導体層を形成する方法及びこの方法を用いて製造した光放出半導体デバイス
JP4613373B2 (ja) 1999-07-19 2011-01-19 ソニー株式会社 Ｉｉｉ族ナイトライド化合物半導体薄膜の形成方法および半導体素子の製造方法
JP2002141492A (ja) 2000-10-31 2002-05-17 Canon Inc 発光ダイオードディスプレイパネル及びその製造方法
JP4319078B2 (ja) * 2004-03-26 2009-08-26 シャープ株式会社 半導体装置の製造方法
JP2008021745A (ja) 2006-07-11 2008-01-31 Showa Denko Kk Ｉｉｉ族窒化物化合物半導体積層構造体およびその成長方法
US8941141B2 (en) * 2006-10-17 2015-01-27 Epistar Corporation Light-emitting device
JP5935643B2 (ja) * 2012-10-10 2016-06-15 サンケン電気株式会社 半導体発光装置
JP6612119B2 (ja) * 2015-02-16 2019-11-27 株式会社東芝 半導体発光装置
WO2017150502A1 (ja) * 2016-03-04 2017-09-08 シャープ株式会社 薄膜トランジスタ基板及び表示パネル
EP3913680B1 (fr) 2016-05-13 2025-07-23 Commissariat à l'Energie Atomique et aux Energies Alternatives Procédé de fabrication d'un dispositif optoélectronique comportant une pluralité de diodes au nitrure de gallium
TWI704671B (zh) * 2016-06-24 2020-09-11 日商半導體能源研究所股份有限公司 顯示裝置以及其驅動方法
KR102633079B1 (ko) * 2016-10-28 2024-02-01 엘지디스플레이 주식회사 발광 다이오드 디스플레이 장치
KR102651097B1 (ko) * 2016-10-28 2024-03-22 엘지디스플레이 주식회사 발광 다이오드 디스플레이 장치
KR102490188B1 (ko) * 2016-11-09 2023-01-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치, 표시 모듈, 전자 기기, 및 표시 장치의 제작 방법
US10877181B2 (en) 2016-11-11 2020-12-29 AGC Inc. Substrate with low-reflection property and manufacturing method thereof
JP6773528B2 (ja) * 2016-11-15 2020-10-21 株式会社ジャパンディスプレイ 感圧センサ及び感圧センサ付表示装置
KR102734610B1 (ko) * 2016-12-30 2024-11-25 엘지디스플레이 주식회사 액정 표시 장치
TWI626738B (zh) * 2017-04-06 2018-06-11 宏碁股份有限公司 顯示裝置及其製造方法
JP6904769B2 (ja) * 2017-04-20 2021-07-21 株式会社半導体エネルギー研究所 表示装置
CN108987423B (zh) 2017-06-05 2023-09-12 三星电子株式会社 显示装置
KR102395993B1 (ko) * 2017-06-05 2022-05-11 삼성전자주식회사 디스플레이 장치
KR102503168B1 (ko) * 2018-02-08 2023-02-27 삼성디스플레이 주식회사 표시 장치 및 그의 제조 방법
JP7249787B2 (ja) 2018-02-28 2023-03-31 シャープ株式会社 表示素子及び表示装置
US10748879B2 (en) 2018-02-28 2020-08-18 Sharp Kabushiki Kaisha Image display device and display
JP7248441B2 (ja) 2018-03-02 2023-03-29 シャープ株式会社 画像表示素子
CN110277421B (zh) * 2018-03-16 2021-10-29 京东方科技集团股份有限公司 阵列基板及其制造方法、显示装置
JP7289294B2 (ja) * 2018-05-18 2023-06-09 株式会社半導体エネルギー研究所 表示装置、表示モジュール、電子機器、及び、表示装置の作製方法
WO2020188851A1 (ja) * 2019-03-15 2020-09-24 三菱電機株式会社 Ｌｅｄディスプレイ
JP7457255B2 (ja) * 2019-05-08 2024-03-28 日亜化学工業株式会社 画像表示装置の製造方法および画像表示装置
CN113994485B (zh) * 2019-05-10 2026-03-24 日亚化学工业株式会社 图像显示装置的制造方法以及图像显示装置
CN110459557B (zh) 2019-08-16 2022-06-24 京东方科技集团股份有限公司 芯片晶圆及其制备方法、Micro-LED显示器
WO2021065918A1 (ja) * 2019-10-01 2021-04-08 日亜化学工業株式会社 画像表示装置の製造方法および画像表示装置
EP4216290A4 (en) * 2020-09-17 2024-10-23 Nichia Corporation Production method for image display device and image display device
JP7820654B2 (ja) * 2021-03-30 2026-02-26 日亜化学工業株式会社 画像表示装置の製造方法および画像表示装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015015321A (ja) * 2013-07-03 2015-01-22 高槻電器工業株式会社 半導体発光素子及びその製造方法

Also Published As

Publication number Publication date
TW202228280A (zh) 2022-07-16
US20230290808A1 (en) 2023-09-14
JPWO2022113949A1 (https=) 2022-06-02
JP7728516B2 (ja) 2025-08-25
WO2022113949A1 (ja) 2022-06-02
US12477886B2 (en) 2025-11-18
TWI898085B (zh) 2025-09-21
CN116235305A (zh) 2023-06-06

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