CN116218389A - Method for manufacturing die-cut and die-bonded integrated tape and method for manufacturing semiconductor device - Google Patents
Method for manufacturing die-cut and die-bonded integrated tape and method for manufacturing semiconductor device Download PDFInfo
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- CN116218389A CN116218389A CN202310234425.8A CN202310234425A CN116218389A CN 116218389 A CN116218389 A CN 116218389A CN 202310234425 A CN202310234425 A CN 202310234425A CN 116218389 A CN116218389 A CN 116218389A
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- Prior art keywords
- pressure
- sensitive adhesive
- adhesive layer
- die
- plasma treatment
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- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
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- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J7/00—Adhesives in the form of films or foils
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Landscapes
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
- Dicing (AREA)
- Medicinal Preparation (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a manufacturing method of a die-cut and die-bonded integrated tape and a manufacturing method of a semiconductor device. The method for manufacturing the pressure-sensitive adhesive sheet comprises the following steps: preparing a pressure-sensitive adhesive sheet precursor having a substrate and a pressure-sensitive adhesive layer provided on the substrate; and a step of performing plasma treatment on the surface of the pressure-sensitive adhesive layer on the side opposite to the base material in the pressure-sensitive adhesive sheet precursor.
Description
The present application is a divisional application of chinese application No. 201980038462.3, having a filing date of 2019, 06/06, entitled "method for producing pressure-sensitive adhesive sheet, method for producing die-cut and die-bonded integrated tape, method for producing semiconductor device, method for treating pressure-sensitive adhesive, method for fixing adherend, and method for separating adherend".
Technical Field
The present invention relates to a method for producing a pressure-sensitive adhesive sheet (pressure-sensitive adhesive sheet), a method for producing a die-cut and die-bonded integrated tape, a method for producing a semiconductor device, a method for treating a pressure-sensitive adhesive, a method for immobilizing an adherend, and a method for peeling an adherend.
Background
Pressure sensitive adhesives are used in a variety of applications in the industrial field. In industry, adhesive force (bulk property of pressure-sensitive adhesives themselves due to crosslinking density or the like) is generally controlled by adjusting the crosslinking density.
On the other hand, a method of improving tackiness of an adherend with a pressure-sensitive adhesive by subjecting the adherend to a surface treatment is known. For example, patent document 1 describes that the tackiness between a synthetic resin product (adherend) and a coating film is improved by subjecting the synthetic resin product (adherend) to a plasma treatment. Patent document 2 describes that, in the pressure-sensitive adhesive sheet, the surface of the plastic film substrate (adherend) is subjected to plasma treatment or the like, whereby the adhesiveness of the surface of the plastic film substrate to the pressure-sensitive adhesive layer can be improved. From the viewpoint of improving tackiness, it is disclosed in these patent documents that an adherend is subjected to a surface treatment.
Technical literature of the prior art
Patent literature
Patent document 1: japanese patent laid-open No. 59-100143
Patent document 2: japanese patent application laid-open No. 2011-068718
Disclosure of Invention
Technical problem to be solved by the invention
However, the conventional pressure-sensitive adhesives have room for improvement in terms of adhesion. Accordingly, a main object of the present invention is to provide a method for producing a pressure-sensitive adhesive sheet, which is capable of producing a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer excellent in adhesive force.
Means for solving the technical problems
As an influencing factor of the tackiness of the adherend to the pressure-sensitive adhesive, there is affinity (wettability) of the pressure-sensitive adhesive with respect to the adherend in addition to the bonding force of the pressure-sensitive adhesive (bulk property of the pressure-sensitive adhesive itself). However, according to the studies of the inventors of the present invention, it was judged that in the method of adjusting the crosslinking density of the pressure-sensitive adhesive to control the adhesive bonding force of the pressure-sensitive adhesive, there is a so-called relationship between the adhesive bonding force and wettability. For example, when the crosslinking density is adjusted so as to increase the adhesive strength, the wettability of the pressure-sensitive adhesive to the adherend tends to decrease. Further, as a result of further studies based on the findings, it was found that by performing plasma treatment on the pressure-sensitive adhesive layer instead of performing plasma treatment on the adherend, the contact angle of the treated surface can be reduced and the adhesive strength can be improved, and the present invention has been completed.
One aspect of the present invention provides a method for producing a pressure-sensitive adhesive sheet, comprising: preparing a pressure-sensitive adhesive sheet precursor having a base material and a pressure-sensitive adhesive layer provided on the base material; and a step of performing plasma treatment on the surface of the pressure-sensitive adhesive layer on the side opposite to the base material in the pressure-sensitive adhesive sheet precursor.
The plasma treatment may be a plasma treatment using atmospheric pressure plasma. The treatment temperature of the plasma treatment may be lower than the temperature of the lower one of the melting point of the substrate or the melting point of the pressure-sensitive adhesive layer.
The method for producing a pressure-sensitive adhesive sheet may further include a step of adhering a protective material to the surface of the pressure-sensitive adhesive layer on which the plasma treatment has been performed, the surface being opposite to the base material. The protective material may be a material which has been treated by plasma treatment and which is stuck to the surface of the pressure-sensitive adhesive layer side on which plasma treatment has been performed.
In another aspect, the present invention provides a pressure-sensitive adhesive sheet obtained by the above-described production method.
In another aspect, the present invention provides a method for producing a die-cut and die-bonded integrated tape, comprising a step of forming an adhesive (adhesive) layer on a surface of a pressure-sensitive adhesive layer subjected to plasma treatment on a side opposite to a substrate, with respect to the pressure-sensitive adhesive sheet obtained by the above production method.
In another aspect, the present invention provides a die-cut and die-bonded integrated tape obtained by the above-described manufacturing method.
In another aspect, the present invention provides a method for manufacturing a semiconductor device, comprising: a step of adhering the adhesive layer of the die-cut and die-bonded integrated tape obtained by the above-described production method to a semiconductor wafer; singulating the semiconductor wafer, the adhesive layer, and the pressure-sensitive adhesive layer subjected to the plasma treatment; picking up a semiconductor element to which an adhesive layer is attached from the pressure-sensitive adhesive layer to which plasma treatment has been applied; and a step of adhering the semiconductor element to the semiconductor element mounting support substrate via the adhesive layer.
In another aspect, the present invention provides a method for treating a pressure-sensitive adhesive, comprising the step of subjecting the pressure-sensitive adhesive to a plasma treatment. The plasma treatment may be a plasma treatment using atmospheric pressure plasma. The treatment temperature of the plasma treatment may be lower than the melting point of the pressure-sensitive adhesive.
In another aspect, the present invention provides a method for immobilizing an adherend, comprising the step of adhering a second adherend to a first adherend by a pressure-sensitive adhesive treated by the above method. In still another aspect, the present invention provides a method for peeling an adherend, comprising the step of peeling a first adherend from a second adherend by treating with water at least one of an interface between the first adherend and a pressure-sensitive adhesive or an interface between the second adherend and a pressure-sensitive adhesive, the adherend being immobilized by the above method.
Effects of the invention
According to the present invention, it is possible to provide a method for producing a pressure-sensitive adhesive sheet capable of producing a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer excellent in adhesive force. Further, according to the present invention, a method for producing a die-cut and die-bonded integrated tape using the pressure-sensitive adhesive sheet obtained by such a production method can be provided. Further, according to the present invention, a method for manufacturing a semiconductor device using the die-cut and die-bonded integrated tape obtained by such a manufacturing method can be provided. Further, according to the present invention, a method of treating a pressure-sensitive adhesive, a method of immobilizing an adherend, and a method of peeling an adherend can be provided.
Drawings
Fig. 1 is a sectional view schematically showing an embodiment of a method for producing a pressure-sensitive adhesive sheet. In fig. 1, fig. 1 (a), 1 (b), 1 (c) and 1 (d) are cross-sectional views schematically showing respective steps.
Fig. 2 is a cross-sectional view schematically showing an embodiment of a method for manufacturing a die-cut and die-bonded integrated tape. Fig. 2 (a), 2 (b) and 2 (c) are cross-sectional views schematically showing the respective steps.
Fig. 3 is a cross-sectional view schematically showing an embodiment of a method for manufacturing a semiconductor device. Fig. 3 (a), 3 (b), 3 (c), 3 (d), 3 (e) and 3 (f) are cross-sectional views schematically showing the respective steps.
Fig. 4 is a cross-sectional view schematically showing an embodiment of a semiconductor device.
Detailed Description
Hereinafter, embodiments of the present invention will be described with appropriate reference to the drawings. However, the present invention is not limited to the following embodiments. In the following embodiments, the constituent elements (including steps) are not necessarily essential unless otherwise specifically indicated. The sizes of the constituent elements in the drawings are conceptual sizes, and the relative relationships between the sizes of the constituent elements are not limited to the relationships shown in the drawings.
The numerical values and ranges thereof in this specification are also not limiting on the invention. In the present specification, a numerical range indicated by "to" means a range in which numerical values described before and after "to" are included as a minimum value and a maximum value, respectively. In the numerical ranges described in stages in the present specification, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of the numerical range described in another stage. In addition, in the numerical ranges described in the present specification, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the embodiment.
In the present specification, (meth) acrylate means acrylate or methacrylate corresponding thereto.
[ method for producing pressure-sensitive adhesive sheet ]
Fig. 1 is a sectional view schematically showing an embodiment of a method for producing a pressure-sensitive adhesive sheet. The method for producing a pressure-sensitive adhesive sheet according to the present embodiment includes: a step of preparing a pressure-sensitive adhesive sheet precursor having a base material and a pressure-sensitive adhesive layer provided on the base material (a preparation step of the pressure-sensitive adhesive sheet precursor); and a step of performing plasma treatment (a plasma treatment performing step) on a surface of the pressure-sensitive adhesive layer on the side opposite to the base material in the pressure-sensitive adhesive sheet precursor. The method for producing a pressure-sensitive adhesive sheet according to the present embodiment may further include a step of adhering a protective material to a surface of the pressure-sensitive adhesive layer subjected to the plasma treatment on the side opposite to the base material (protective material placement step).
Preparation procedure of pressure-sensitive adhesive sheet precursor
In this step, a pressure-sensitive adhesive sheet precursor 100 to be a target of plasma treatment is prepared (refer to fig. 1 (a)). The pressure-sensitive adhesive sheet precursor 100 has a substrate 10 and a pressure-sensitive adhesive layer 20 provided on the substrate 10.
The substrate 10 is not particularly limited as long as it has a higher melting point (or decomposition point or softening point) than the heat generated by the plasma treatment, and a substrate film used in the field of pressure-sensitive adhesives can be used. The base film is preferably expandable in the die bonding step. Examples of the substrate film include polyester films such as polyethylene terephthalate films; polyolefin-based films such as polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, and polyvinyl acetate film; plastic films such as polyvinyl chloride films and polyimide films. The surface of the substrate 10 on which the pressure-sensitive adhesive layer 20 is to be formed may be subjected to a surface treatment such as corona treatment.
The pressure-sensitive adhesive layer 20 is a layer composed of a pressure-sensitive adhesive component. The pressure-sensitive adhesive component constituting the pressure-sensitive adhesive layer 20 is not particularly limited as long as it has a higher melting point (or decomposition point or softening point) than heat generated by plasma treatment, and is preferably a pressure-sensitive adhesive component having adhesive strength at room temperature (25 ℃) and adhesive force to a layer (for example, an adhesive layer described later) laminated on the pressure-sensitive adhesive layer 20. The pressure-sensitive adhesive component constituting the pressure-sensitive adhesive layer 20 may also contain a base resin. Examples of the base resin include acrylic resins, synthetic rubbers, natural rubbers, and polyimide resins. From the viewpoint of reducing the residual paste of the pressure-sensitive adhesive component, the base resin preferably has a functional group such as a hydroxyl group or a carboxyl group that can react with a crosslinking agent or the like described later. The base resin may be a resin cured by high energy rays such as ultraviolet rays, radiation rays, or the like or a resin cured by heat. The base resin is preferably a resin cured by high energy rays, and more preferably a resin cured by ultraviolet rays (ultraviolet-curable base resin).
In the case of using a resin cured by high-energy rays as a base resin, a photopolymerization initiator may be used in combination as needed. The photopolymerization initiator may be, for example, an aromatic ketone compound, a benzoin ether compound, a benzil compound, an ester compound, an acridine compound, a 2,4, 5-triarylimidazole dimer, or the like.
In order to adjust the adhesive force, the pressure-sensitive adhesive component may also contain a crosslinking agent capable of forming a crosslinked structure with the functional group of the base resin. The crosslinking agent preferably has at least one functional group selected from the group consisting of epoxy group, isocyanate group, aziridine group and triazine group. The crosslinking agent may be used alone or in combination of two or more.
In order to maintain the effect of the plasma treatment, it is effective to adjust the content of the crosslinking agent. The content of the crosslinking agent is preferably 5 parts by mass or more, more preferably 7 parts by mass or more, and still more preferably 10 parts by mass or more, relative to 100 parts by mass of the base resin. When the content of the crosslinking agent is 5 parts by mass or more relative to 100 parts by mass of the base resin, the effect of the plasma treatment tends to be suppressed from being degraded. The content of the crosslinking agent may be 30 parts by mass or less with respect to 100 parts by mass of the base resin. When the content of the crosslinking agent is 30 parts by mass or less relative to 100 parts by mass of the base resin, the effect of the plasma treatment tends to be easily maintained, and the adhesion between the pressure-sensitive adhesive layer and the protective material tends to be suppressed from decreasing.
The pressure sensitive adhesive component may also contain other components. Examples of the other component include catalysts such as amine and tin added for the purpose of promoting the crosslinking reaction between the base resin and the photopolymerization initiator; tackifiers such as rosin-based and terpene-based resins added for the purpose of appropriately adjusting the adhesive properties; various surfactants, and the like.
In one embodiment, the pressure-sensitive adhesive layer 20 may be a layer composed of a pressure-sensitive adhesive composition containing an acrylic resin having a hydroxyl group and a crosslinking agent having an isocyanate group.
The acrylic resin having a hydroxyl group as the base resin can be obtained by polymerizing a monomer component containing a (meth) acrylate having a hydroxyl group. The polymerization method may be appropriately selected from known polymerization methods such as various radical polymerization methods, and may be, for example, suspension polymerization method, solution polymerization method, bulk polymerization method, or the like.
In the case of polymerizing the monomer component in the above-mentioned polymerization method, a polymerization initiator may be used as needed. Examples of such a polymerization initiator include ketone peroxide, ketal peroxide, hydrogen peroxide, dialkyl peroxide, diacyl peroxide, peroxycarbonate, peroxyester, 2 '-azobisisobutyronitrile, 2' -azobis (2, 4-dimethylvaleronitrile), and 2,2 '-azobis (4-methoxy-2' -dimethylvaleronitrile).
The pressure-sensitive adhesive sheet precursor 100 having the pressure-sensitive adhesive layer 20 can be manufactured using a known method. The pressure-sensitive adhesive sheet precursor 100 can be obtained, for example, by a manufacturing method including: a step of diluting the material for the pressure-sensitive adhesive layer with a dispersion medium to prepare a varnish; a step of applying the obtained varnish to the substrate 10; and a step of removing the dispersion medium from the applied varnish.
The thickness of the pressure-sensitive adhesive layer 20 in the pressure-sensitive adhesive sheet precursor 100 may be 0.1 to 30 μm. If the thickness of the pressure-sensitive adhesive layer 20 is 0.1 μm or more, sufficient adhesive strength tends to be ensured. If the thickness of the pressure-sensitive adhesive layer 20 is 30 μm or less, it tends to be economically advantageous.
The thickness of the pressure-sensitive adhesive sheet precursor 100 as a whole (the total thickness of the base material 10 and the pressure-sensitive adhesive layer 20) may be 5 to 150 μm, 50 to 150 μm, or 100 to 150 μm.
The pressure-sensitive adhesive sheet precursor 100 may be bonded with a protective material on the surface of the pressure-sensitive adhesive layer 20 on the opposite side from the substrate 10 before the plasma treatment is performed. The protective material may be the same as the material exemplified in the protective material 30 described later.
Process for plasma treatment
In this step, plasma treatment (a of fig. 1 (b)) is performed on the surface of the pressure-sensitive adhesive layer 20 on the opposite side to the base material 10 in the pressure-sensitive adhesive sheet precursor 100 (refer to fig. 1 (b)). Thereby, the pressure-sensitive adhesive sheet 110 having the pressure-sensitive adhesive layer (pressure-sensitive adhesive layer 20A after plasma treatment) on which the plasma treatment a has been performed can be manufactured (refer to fig. 1 (c)).
The plasma is a state in which molecules constituting the gas are partially or completely ionized and separated into cations and electrons to move freely. By treating the surface of the pressure-sensitive adhesive layer on the side opposite to the substrate with a gas in a plasma state, chemical reaction is performed on the surface of the pressure-sensitive adhesive layer, and an oxygen-containing hydrophilic group is imparted thereto, so that the contact angle of the treated surface is reduced, and wettability can be improved. With this reaction, the adhesive force of the pressure-sensitive adhesive layer 20 of the pressure-sensitive adhesive sheet precursor can be improved.
The plasma treatment is not particularly limited, and may be plasma treatment using atmospheric pressure plasma from the viewpoints of cost, throughput and damage reduction. The plasma treatment using the atmospheric pressure plasma can be performed using, for example, an ultra-high density atmospheric pressure plasma unit (manufactured by Fuji mechanical manufacturing Co., ltd., product name: FPB-20 model II).
The treatment temperature of the plasma treatment is preferably lower than the temperature of the lower one of the melting point of the substrate 10 and the melting point of the pressure-sensitive adhesive layer 20, from the viewpoint of avoiding damage to the substrate 10 and the pressure-sensitive adhesive layer 20 caused by the plasma treatment. The plasma treatment is preferably performed while adjusting the conditions such as the treatment temperature and the treatment speed so that wrinkles, deflection, and the like do not occur in the pressure-sensitive adhesive sheet precursor 100 (the base material 10 and the pressure-sensitive adhesive layer 20) during the time in which the treatment is performed, that is, so that thermal deformation of the pressure-sensitive adhesive sheet does not occur significantly. If wrinkles, deflection, and the like occur, the operation of the apparatus during plasma processing may be hindered. The temperature conditions for the plasma treatment may be, for example, 300 ℃ or less, 250 ℃ or less, or 200 ℃ or less.
The plasma treatment can adjust the treatment area. Accordingly, the plasma treatment can be performed on a part or the whole part of the face of the pressure-sensitive adhesive layer 20 on the side opposite to the substrate 10 in the pressure-sensitive adhesive sheet precursor 100. If plasma treatment is applied to a part of the surface of the pressure-sensitive adhesive layer 20, the contact angle of the surface to be treated can be adjusted, and therefore, a portion having a low contact angle (i.e., a portion having a high adhesive strength of the pressure-sensitive adhesive layer) and a portion having a high contact angle (i.e., a portion having a low adhesive strength of the pressure-sensitive adhesive layer) can be easily formed separately on the same surface.
< procedure for disposing protective Material >
In this step, a protective material 30 is attached to the surface of the pressure-sensitive adhesive layer (pressure-sensitive adhesive layer 20A after plasma treatment) on the opposite side of the substrate 10 (see fig. 1 (d)). Thereby, the pressure-sensitive adhesive sheet 120 with a protective material can be obtained. The method of attaching the protective material 30 can be performed using a known method.
The protective material 30 is not particularly limited, and a protective film used in the field of pressure-sensitive adhesives can be used. Examples of the protective film include polyester films such as polyethylene terephthalate films; polyolefin-based films such as polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, and polyvinyl acetate film; plastic films such as polyvinyl chloride films and polyimide films. The protective film may be made of paper, nonwoven fabric, metal foil, or the like. The surface of the protective material 30 on the pressure-sensitive adhesive layer 20A side after plasma treatment may be treated with a release agent such as a silicone release agent, a fluorine release agent, or a long-chain alkyl acrylate release agent.
The protective material 30 may be the following: in the protective material 30, the surface of the pressure-sensitive adhesive layer 20A side, which is stuck after the plasma treatment, has been treated by the plasma treatment. By using a material treated by plasma treatment as the protective material 30, the state of the pressure-sensitive adhesive layer 20A after plasma treatment in which wettability is improved tends to be maintained for a long period of time.
The thickness of the protective material 30 is not particularly limited and may be 5 to 500 μm, 10 to 200 μm or 15 to 100 μm.
[ method for producing die-cut and die-bonded Integrated tape ]
Fig. 2 is a cross-sectional view schematically showing an embodiment of a method for manufacturing a die-cut and die-bonded integrated tape. The method for producing the die-cut and die-bonded integrated tape 130 according to the present embodiment includes a step of forming the adhesive layer 40 on the surface (the surface subjected to the plasma treatment) of the pressure-sensitive adhesive layer 20A on the opposite side to the substrate 10 (see fig. 2 (a) and 2 (b)) of the pressure-sensitive adhesive sheet 110 obtained by the above production method.
The adhesive layer 40 is a layer composed of an adhesive component. Examples of the adhesive component constituting the adhesive layer 40 include a thermosetting adhesive component, a photocurable adhesive component, a thermoplastic adhesive component, and an oxygen-reactive adhesive component. From the standpoint of adhesion, the adhesive layer preferably contains a thermosetting adhesive component.
From the standpoint of adhesion, the thermosetting adhesive component preferably contains an epoxy resin and a phenolic resin which can be a curing agent for the epoxy resin.
The epoxy resin is not particularly limited as long as it is a resin having an epoxy group in a molecule. Examples of the epoxy resin include bisphenol a type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol a novolac type epoxy resin, bisphenol F novolac type epoxy resin, dicyclopentadiene skeleton-containing epoxy resin, stilbene type epoxy resin, triazine skeleton-containing epoxy resin, fluorene skeleton-containing epoxy resin, triphenol methane type epoxy resin, biphenyl type epoxy resin, xylylene type epoxy resin, biphenyl aralkyl type epoxy resin, naphthalene type epoxy resin, polyfunctional phenols, and polycyclic aromatic diglycidyl ether compounds such as anthracene. These may be used singly or in combination of two or more. The content of the epoxy resin may be 2 to 50 mass% based on the total amount of the adhesive layer.
The phenolic resin is not particularly limited as long as it is a resin having a phenolic hydroxyl group in the molecule. Examples of the phenolic resin include novolac type phenolic resins obtained by condensing or co-condensing phenols such as phenol, cresol, resorcinol, catechol, bisphenol a, bisphenol F, phenylphenol, and aminophenol, and/or naphthols such as α -naphthol, β -naphthol, and dihydroxynaphthalene with compounds having an aldehyde group such as formaldehyde in the presence of an acidic catalyst; phenol aralkyl resins synthesized from phenols such as allylated bisphenol A, allylated bisphenol F, allylated naphthalene diphenol, phenol novolak, phenol and/or naphthols and dimethoxyp-xylene or bis (methoxymethyl) biphenyl, naphthol aralkyl resins and the like. These may be used singly or in combination of two or more. The content of the phenolic resin may be 2 to 50 mass% based on the total amount of the adhesive layer.
As other components, the adhesive layer 40 may contain a curing accelerator such as tertiary amine, imidazole, quaternary ammonium salt, etc.; inorganic fillers such as aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum nitride, aluminum borate whisker, boron nitride, crystalline silica, and amorphous silica. The content of the other components may be 0 to 20 mass% based on the total amount of the adhesive layer.
In the pressure-sensitive adhesive sheet 110, plasma treatment is performed to a part or the whole part of the face of the pressure-sensitive adhesive layer 20 on the side opposite to the base material 10. In the case where the plasma treatment is applied to a part of the face of the pressure-sensitive adhesive layer 20 on the opposite side from the substrate 10, the adhesive layer 40 may be formed so as to cover a part or the whole of the face of the pressure-sensitive adhesive layer 20 on which the plasma treatment has been applied, or may be formed so as to cover a part or the whole of the face of the pressure-sensitive adhesive layer 20 on which the plasma treatment has not been applied. The adhesive layer 40 may be formed so as to cover a part or the whole of the plasma-treated surface of the pressure-sensitive adhesive layer 20 and the 2 surfaces of the pressure-sensitive adhesive layer 20 that are not plasma-treated. In the case where the plasma treatment is applied to the entire portion of the pressure-sensitive adhesive layer 20, the adhesive layer 40 may be formed in such a manner as to cover a part or the entire portion of the surface of the pressure-sensitive adhesive layer 20 to which the plasma treatment has been applied.
As a method of forming the adhesive layer 40 on the surface of the pressure-sensitive adhesive layer 20A after plasma treatment on the side opposite to the substrate 10, for example, a method of forming an adhesive component into a film shape by a known method and bonding the obtained film-like adhesive to the surface of the pressure-sensitive adhesive layer 20A after plasma treatment on the side opposite to the substrate 10 can be cited. Thus, the die-cut and die-bonded integrated tape 130 can be obtained (refer to fig. 2 (b)).
The die-cut and die-bonded integrated tape 130 may be provided with the protective material 50 on the side of the adhesive layer 40 opposite to the pressure-sensitive adhesive layer 20A. The protective material 50 is not particularly limited, and a protective film used for the die-cut and die-bonded integrated tape can be used. Examples of the protective film include polyester films such as polyethylene terephthalate films; polyolefin-based films such as polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, and polyvinyl acetate film; plastic films such as polyvinyl chloride films and polyimide films. Thus, the die-cut and die-bonded integrated tape 140 with the protective material can be obtained (see fig. 2 (c)).
[ method of manufacturing semiconductor device (semiconductor Package) ]
Fig. 3 is a cross-sectional view schematically showing an embodiment of a method for manufacturing a semiconductor device. The method for manufacturing a semiconductor device according to the present embodiment includes: a step of adhering the adhesive layer 40 of the die-cut and die-bonded integrated tape 130 obtained by the above-described manufacturing method to the semiconductor wafer W (wafer lamination step, see fig. 3 (a) and 3 (b)); a step of singulating the semiconductor wafer W, the adhesive layer 40, and the pressure-sensitive adhesive layer that has been subjected to the plasma treatment (pressure-sensitive adhesive layer 20A after the plasma treatment) (dicing step, refer to fig. 3 (c)); a step of irradiating ultraviolet rays (ultraviolet irradiation step, refer to fig. 3 (d)) to the pressure-sensitive adhesive layer (pressure-sensitive adhesive layer 20A after plasma treatment) that has been subjected to plasma treatment (via the base material 10) as needed; a step of picking up the semiconductor element Wa (the adhesive layer-attached semiconductor element 60) attached with the adhesive layer 40a from the pressure-sensitive adhesive layer (the pressure-sensitive adhesive layer 20 Aa) subjected to the plasma treatment (a pick-up step, refer to fig. 3 (e)); and a step of bonding the semiconductor element 60 with the adhesive layer to the semiconductor element mounting support substrate 80 via the adhesive layer 40a (semiconductor element bonding step, refer to fig. 3 (f)).
< wafer lamination Process >)
First, the die-cut and die-bonded integrated tape 130 is placed in a predetermined apparatus. Next, the die-attach integrated tape 130 is attached to the main surface Ws of the semiconductor wafer W via the adhesive layer 40 (see fig. 3 (a) and 3 (b)). The circuit surface of the semiconductor wafer W is preferably provided on the surface opposite to the main surface Ws.
< cutting procedure >)
Next, the semiconductor wafer W, the adhesive layer 40, and the pressure-sensitive adhesive layer 20A after the plasma treatment are diced (refer to fig. 3 (c)). At this time, a part of the base material 10 may be cut. Thus, the dicing die-bonding integrated tape 130 also functions as a dicing sheet.
< ultraviolet irradiation Process >)
For the pressure-sensitive adhesive layer 20A after the plasma treatment, ultraviolet rays may be irradiated as needed (via the substrate 10) (refer to fig. 3 (d)). In pressure sensitive adhesivesIn the case where the base resin in the composition is a resin that is cured by ultraviolet rays (ultraviolet ray-curable base resin), the pressure-sensitive adhesive layer 20A is cured, so that the adhesion (bond force) between the pressure-sensitive adhesive layer 20A and the adhesive layer 40 can be reduced. In the ultraviolet irradiation, ultraviolet rays having a wavelength of 200 to 400nm are preferably used. The irradiation conditions of ultraviolet rays are preferably adjusted to an illuminance of 30 to 240mW/cm, respectively 2 Is in the range of 200 to 500mJ/cm 2 Is not limited in terms of the range of (a).
< picking Process >)
Next, the diced adhesive layer-attached semiconductor elements 60 are separated from each other by expanding the base material 10, and the adhesive layer-attached semiconductor elements 60 lifted up from the base material 10 side by the needle rollers 72 are sucked by the suction collet 74, thereby picking up from the pressure-sensitive adhesive layer 20Aa (refer to fig. 3 (e)). In the case where a part of the surface of the pressure-sensitive adhesive layer 20 on the side opposite to the substrate 10 is subjected to plasma treatment, the surface of the pressure-sensitive adhesive layer 20Aa on the side of the adhesive layer 40a may be the surface subjected to plasma treatment, the surface not subjected to plasma treatment, or the surface including both the surface subjected to plasma treatment and the surface not subjected to plasma treatment. In addition, the adhesive layer-attached semiconductor element 60 has a semiconductor element Wa and an adhesive layer 40a. The semiconductor element Wa is an element obtained by dividing the semiconductor wafer W by dicing, and the adhesive layer 40a is a layer obtained by dividing the adhesive layer 40 by dicing. The pressure-sensitive adhesive layer 20Aa is a layer obtained by dividing the pressure-sensitive adhesive layer 20A after plasma treatment by dicing. When the semiconductor element 60 with the adhesive layer is picked up, the pressure-sensitive adhesive layer 20Aa may remain on the substrate 10. In the pick-up step, the substrate 10 does not necessarily need to be expanded, but the pick-up property can be further improved by expanding the substrate 10.
The amount of jack up by the needle 72 can be appropriately set. In addition, from the viewpoint of securing sufficient pick-up performance even for an extremely thin wafer, for example, two-stage or three-stage lifting may be performed. Also, the semiconductor element 60 with the adhesive layer may be picked up by a method other than the method using the suction collet 74.
< procedure of semiconductor element adhesion >)
After the semiconductor element 60 with the adhesive layer is picked up, the semiconductor element 60 with the adhesive layer is bonded to the semiconductor element mounting support substrate 80 by thermocompression bonding through the adhesive layer 40a (refer to fig. 3 (f)). A plurality of semiconductor elements 60 with adhesive layers may be bonded to the semiconductor element mounting support substrate 80.
The method for manufacturing a semiconductor device according to the present embodiment may further include, as necessary: a step of electrically connecting the semiconductor element Wa and the semiconductor element mounting support substrate 80 by wire bonding 70; and a step of resin-sealing the semiconductor element Wa with the resin sealing material 92 on the surface 80a of the semiconductor element mounting support substrate 80.
Fig. 4 is a cross-sectional view schematically showing an embodiment of a semiconductor device. The semiconductor device 200 shown in fig. 4 can be manufactured by performing the above-described steps. The semiconductor device 200 may be configured such that solder balls 94 are formed on the surface of the semiconductor element mounting support substrate 80 opposite to the surface 80a, and are electrically connected to an external substrate (motherboard).
[ method of treating pressure-sensitive adhesive ]
The method for treating a pressure-sensitive adhesive according to one embodiment includes a step of performing plasma treatment on the pressure-sensitive adhesive. The pressure-sensitive adhesive may be the same as the pressure-sensitive adhesive exemplified in the above-described method for producing the pressure-sensitive adhesive sheet. The plasma treatment may be the same as that exemplified in the above-described method for producing the pressure-sensitive adhesive sheet. The plasma treatment may be a plasma treatment using atmospheric pressure plasma. The treatment temperature of the plasma treatment may be lower than the melting point of the pressure-sensitive adhesive.
[ method of immobilizing adherend ]
The method for immobilizing an adherend according to an embodiment includes a step of adhering a second adherend to a first adherend with a pressure-sensitive adhesive treated by the above method. The first adherend and the second adherend are not particularly limited, and examples thereof include metal adherends (stainless steel (SUS), aluminum, etc.), nonmetallic adherends (polycarbonate, glass, etc.), and the like. The immobilization conditions of the adherend can be appropriately set according to the kind of the pressure-sensitive adhesive, and the kinds of the first adherend and the second adherend.
[ method of peeling adherend ]
The method for peeling an adherend according to an embodiment includes a step of peeling the first adherend from the second adherend by treating with water at least one of the interface between the first adherend and the pressure-sensitive adhesive and the interface between the second adherend and the pressure-sensitive adhesive (bringing the first adherend into contact with water) of the adherend immobilized by the above method. The pressure-sensitive adhesive subjected to the plasma treatment tends to be more hydrophilic than the pressure-sensitive adhesive not subjected to the plasma treatment, and tends to be easily peeled off by being treated with water (brought into contact with water). In addition, when the first adherend and the second adherend are peeled off, the pressure-sensitive adhesive may be attached to either the first adherend or the second adherend, or may be detached from the first adherend and the second adherend.
Examples
Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited to these examples.
Example 1
[ production of pressure-sensitive adhesive sheet ]
Preparation of pressure-sensitive adhesive sheet precursor
According to the solution polymerization method, 2-ethylhexyl acrylate and methyl methacrylate as monomers, and hydroxyethyl acrylate and acrylic acid as functional group-containing monomers are polymerized, thereby obtaining an acrylic resin having a hydroxyl group. The weight average molecular weight of the acrylic resin having hydroxyl groups was 40 ten thousand, and the glass transition point was-38 ℃.
The weight average molecular weight (Mw) was measured in terms of polystyrene using SD-8022/DP-8020/RI-8020 manufactured by Tosoh Corporation as a GPC apparatus, hitachi Chemical Co., ltd. Gel pack (Gel pack) GL-A150-S/GL-A160-S as a column, and tetrahydrofuran as an eluent.
The glass transition point was calculated by the following relational expression (FOX expression).
1/Tg＝Σ(X i /Tg i )
In the above formula, tg represents the glass transition point (K) of the copolymer. X is X i Represents the mass fraction of each monomer, X 1 +X 2 +…+X i +…+X n ＝1。Tg i Glass transition point (K) representing homopolymer of each monomer]
A varnish for forming a pressure-sensitive adhesive layer was obtained by preparing 12 parts by mass of a polyfunctional isocyanate crosslinking agent (Mitsubishi Chemical co., ltd., product name "MITEC NY 730A-T") with respect to 100 parts by mass of an acrylic resin having a hydroxyl group using a three-in-one motor and a stirring blade, and stirring.
The obtained varnish for forming the pressure-sensitive adhesive layer was applied to a base film a (a polyethylene terephthalate film having a thickness of 38 μm) while adjusting the gap so that the thickness of the pressure-sensitive adhesive layer became 10 μm using an applicator. After the applied varnish for forming a pressure-sensitive adhesive layer was dried at 80 ℃ for 5 minutes, a base film B (polyolefin-based film having a thickness of 80 μm) whose surface had been subjected to corona treatment was laminated on the pressure-sensitive adhesive layer, and left at room temperature (25 ℃) for 2 weeks, and sufficiently subjected to aging treatment, thereby obtaining a pressure-sensitive adhesive sheet precursor having a structure of base film a/pressure-sensitive adhesive layer/base film B.
< implementation of plasma treatment >
The pressure-sensitive adhesive sheet was produced by peeling off the base film a of the pressure-sensitive adhesive sheet precursor, and subjecting the surface of the pressure-sensitive adhesive layer on the side opposite to the base film B in the pressure-sensitive adhesive sheet precursor to plasma treatment using an ultra-high density atmospheric pressure plasma unit (product name: FPB-20TYPE II, manufactured by fuji mechanical manufacturing). Then, a protective material (polyethylene terephthalate (PET) film) was disposed on the face of the pressure-sensitive adhesive layer that had been subjected to the plasma treatment, and a pressure-sensitive adhesive sheet with a protective material of example 1 was obtained.
(conditions of plasma treatment)
Use of a heater: not using
Irradiation speed: 500 mm/s
Irradiation distance: 5mm of
Slit nozzle: 20mm wide
The gas is used: nitrogen and air
Gas flow rate: nitrogen 60L/min and air 21L/min
Number of repetitions: 1 time (irradiation method: 20mm wide X8 line)
Sample size: 150mm by 150mm
The irradiation distance, irradiation speed, heater setting, and the like are adjusted, and are set so that the processing temperature is 100 ℃ or lower in order to avoid wrinkles, deflection, and the like in the pressure-sensitive adhesive sheet precursor 100 (the substrate 10 and the pressure-sensitive adhesive layer 20) during the time in which the processing is performed.
Example 2
A pressure-sensitive adhesive sheet with a protective material of example 2 was obtained in the same manner as in example 1, except that the same plasma treatment (repetition number: 1) as that performed on the pressure-sensitive adhesive layer side of the protective material was performed.
Example 3
A pressure-sensitive adhesive sheet with a protective material of example 3 was obtained in the same manner as in example 2 except that the number of repetitions of plasma treatment of the protective material was changed from 1 to 4.
Example 4
A pressure-sensitive adhesive sheet with a protective material of example 2 was obtained in the same manner as in example 1 except that the number of repetitions of plasma treatment of the pressure-sensitive adhesive layer was changed from 1 to 4.
Example 5
A pressure-sensitive adhesive sheet with a protective material of example 5 was obtained in the same manner as in example 4, except that the same plasma treatment (repetition number: 1) as that performed on the pressure-sensitive adhesive layer side of the protective material was performed.
Example 6
A pressure-sensitive adhesive sheet with a protective material of example 6 was obtained in the same manner as in example 5, except that the number of repetitions of plasma treatment of the protective material was changed from 1 to 4.
Comparative example 1
A pressure-sensitive adhesive sheet with a protective material of comparative example 1 was obtained in the same manner as in example 1 except that the pressure-sensitive adhesive layer was not subjected to plasma treatment.
[ evaluation ]
Measurement of contact Angle of Water with respect to plasma-treated surface of pressure-sensitive adhesive layer
The contact angle of water with respect to the surface subjected to the plasma treatment was measured for the pressure-sensitive adhesive sheets with protective material of examples 1 to 6 and comparative example 1. In the measurement, a contact angle measuring instrument (product name: drop Master300 manufactured by the company, interfacial chemistry Co., ltd.) was used. The determination was made by: the protective material of the pressure-sensitive adhesive sheet with the protective material is peeled off, and water is dropped as a probe liquid on the surface of the pressure-sensitive adhesive layer on which the plasma treatment has been performed. The measurement conditions were set to 23 to 28 ℃, the amount of droplets of the probe liquid was 1.5. Mu.L, and the measurement timing was set to 5 seconds after the dripping of the probe liquid. The number of trials was 10, and the median of the obtained values was obtained as the contact angle θ. The results are shown in table 1.
TABLE 1
< measurement of peel Strength of pressure-sensitive adhesive layer on SUS substrate >
The pressure-sensitive adhesive sheets with protective materials of example 1, example 2 and comparative example 1 were cut to a width of 10mm and a length of 70mm or more, and the protective materials were peeled off from the pressure-sensitive adhesive sheets with protective materials and then stuck to SUS plates (SUS 430 BA), which were taken as initial measurement samples. When attached to the SUS plate, the sample was reciprocated 3 times with a 3kg hammer roller. The peeling guide tape (OJI TAC co., ltd., manufactured, EC tape) was cut to a width of 10mm, and attached to the tip of the load cell by sticking it to the tip of the sample by about 10 mm. The position of the load cell is fine-tuned in such a way that the progress of the peeling is parallel to the band width. The initial measurement sample was stored in cold storage (5 ℃) for 3 months, and the sample was used as a measurement sample for 3 months. For these measurement samples, peeling of the SUS substrate and the pressure-sensitive adhesive layer was performed at a peeling angle of 30 degrees and a peeling speed of 50 mm/min, and the peeling strength was determined. In addition, the SUS substrate was cleaned with acetone before use. The results are shown in table 2. The values in table 2 are relative values based on the peel strength values of comparative example 1.
TABLE 2
It is presumed that the same effect can be obtained also in the case of using, for example, a pressure-sensitive adhesive layer having another acrylic resin, synthetic rubber, natural rubber, polyimide resin, or the like as a base resin, instead of the pressure-sensitive adhesive layer in the pressure-sensitive adhesive sheets with protective materials of examples 1 to 6.
In the pressure-sensitive adhesive sheets with protective material of examples 1 to 6, the contact angle of the plasma-treated face of the pressure-sensitive adhesive layer was reduced and the wettability of the pressure-sensitive adhesive layer was improved, as compared with the pressure-sensitive adhesive sheets with protective material of comparative example 1. The pressure-sensitive adhesive sheets with protective material of examples 1 and 2 have improved peel strength and adhesion strength as compared with the pressure-sensitive adhesive sheet with protective material of comparative example 1. Further, it was found from a comparison between example 1 and example 2 that the effect of the plasma treatment can be maintained for a long period of time by also performing the plasma treatment on the protective material. From these results, it was confirmed that the production method of the present invention can produce a pressure-sensitive adhesive sheet excellent in adhesive bonding strength.
Symbol description
10-substrate, 20-pressure-sensitive adhesive layer after plasma treatment, 30-protective material, 40-adhesive layer, 50-protective material, 60-semiconductor element with adhesive layer, 70-wire bonding, 72-needle roller, 74-suction collet, 80-support substrate for semiconductor element mounting, 92-resin encapsulating material, 94-solder ball, W-semiconductor wafer, 100-pressure-sensitive adhesive sheet precursor, 110-pressure-sensitive adhesive sheet, 120-pressure-sensitive adhesive sheet with protective material, 130-die-cut die-bonding integral type tape, 140-die-cut die-bonding integral type tape with protective material.
Claims (7)
1. A method for manufacturing a die-cut and die-bonded integrated tape, comprising:
a first step of preparing a pressure-sensitive adhesive sheet precursor having a base material and a pressure-sensitive adhesive layer provided on the base material;
a second step of performing plasma treatment on a surface of the pressure-sensitive adhesive layer on a side opposite to the base material in the pressure-sensitive adhesive sheet precursor; and
and a third step of forming an adhesive layer on a surface of the pressure-sensitive adhesive layer on which the plasma treatment has been performed, the surface being on the opposite side of the substrate.
2. The method for producing a die-cut and die-bonded integrated tape according to claim 1, wherein,
the plasma treatment is a plasma treatment using atmospheric pressure plasma.
3. The method for producing a die-cut and die-bonded integrated tape according to claim 1 or 2, wherein,
the plasma treatment is performed at a treatment temperature lower than the lower one of the melting point of the base material and the melting point of the pressure-sensitive adhesive layer.
4. The method for producing a die-cut and die-bonded integrated tape according to claim 1 or 2, wherein,
the second step and the third step further include:
a step of adhering a protective material to a surface of the pressure-sensitive adhesive layer on which the plasma treatment has been performed, the surface being on the opposite side of the substrate; and
and a step of peeling the protective material from the pressure-sensitive adhesive layer which has been subjected to the plasma treatment.
5. The method for producing a die-cut and die-bonded integrated tape according to claim 4, wherein,
in the protective material, the surface of the protective material that is adhered to the pressure-sensitive adhesive layer side on which the plasma treatment has been performed has been treated by the plasma treatment.
6. The method for producing a die-cut and die-bonded integrated tape according to claim 1 or 2, wherein the pressure-sensitive adhesive layer is a layer composed of a pressure-sensitive adhesive component containing an acrylic resin having a hydroxyl group and a crosslinking agent having an isocyanate group.
7. A method for manufacturing a semiconductor device includes:
a step of adhering the adhesive layer of the die-cut and die-bonded integrated tape obtained by the production method according to any one of claims 1 to 6 to a semiconductor wafer;
a step of singulating the semiconductor wafer, the adhesive layer, and the pressure-sensitive adhesive layer subjected to the plasma treatment;
picking up a semiconductor element to which the adhesive layer is attached from the pressure-sensitive adhesive layer to which the plasma treatment has been applied; and
and adhering the semiconductor element to a semiconductor element mounting support substrate via the adhesive layer.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018110389 | 2018-06-08 | ||
| JP2018-110389 | 2018-06-08 | ||
| PCT/JP2019/022518 WO2019235562A1 (en) | 2018-06-08 | 2019-06-06 | Method for manufacturing adhesive sheet, method for manufacturing dicing/die-bonding tape, method for manufacturing semiconductor device, method for treating adhesive, method for immobilizing adherend, and method for peeling adherend |
| CN201980038462.3A CN112272691B (en) | 2018-06-08 | 2019-06-06 | Method for producing pressure-sensitive adhesive sheet |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980038462.3A Division CN112272691B (en) | 2018-06-08 | 2019-06-06 | Method for producing pressure-sensitive adhesive sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116218389A true CN116218389A (en) | 2023-06-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310234425.8A Pending CN116218389A (en) | 2018-06-08 | 2019-06-06 | Method for manufacturing die-cut and die-bonded integrated tape and method for manufacturing semiconductor device |
| CN201980038462.3A Active CN112272691B (en) | 2018-06-08 | 2019-06-06 | Method for producing pressure-sensitive adhesive sheet |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980038462.3A Active CN112272691B (en) | 2018-06-08 | 2019-06-06 | Method for producing pressure-sensitive adhesive sheet |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP7283472B2 (en) |
| KR (1) | KR102602484B1 (en) |
| CN (2) | CN116218389A (en) |
| SG (1) | SG11202011944WA (en) |
| TW (2) | TWI815903B (en) |
| WO (1) | WO2019235562A1 (en) |
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| JP2012084784A (en) * | 2010-10-14 | 2012-04-26 | Hitachi Chem Co Ltd | Semiconductor device manufacturing method, die-bonding film used therefor and semiconductor device using die-bonding film |
| CN103956363A (en) * | 2014-03-03 | 2014-07-30 | 上海天马有机发光显示技术有限公司 | Composite substrate and manufacturing method thereof, and flexible display device and manufacturing method thereof |
| CN103980820A (en) * | 2013-02-13 | 2014-08-13 | 琳得科株式会社 | Pressure-sensitive adhesion composition, pressure-sensitive adhesive, and pressure-sensitive adhesion sheet |
| CN206242599U (en) * | 2016-08-31 | 2017-06-13 | 绍兴旭源新材料科技有限公司 | A kind of Anti-static release liner |
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| JP2000073029A (en) * | 1998-08-26 | 2000-03-07 | Nitto Denko Corp | Adhesive member and its production |
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| JP2009086452A (en) | 2007-10-01 | 2009-04-23 | Nitto Denko Corp | Method for manufacturing adhesive optical film, adhesive optical film and image display device |
| JP5028248B2 (en) * | 2007-12-21 | 2012-09-19 | 日本ポリエチレン株式会社 | Surface protection film |
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| JP2013117004A (en) * | 2011-12-05 | 2013-06-13 | Nitto Denko Corp | Method of peeling adhesive sheet, and double-sided adhesive sheet |
| JP2017034117A (en) * | 2015-08-03 | 2017-02-09 | 日立化成株式会社 | Dicing/die-bonding integrated tape |
| JP6721341B2 (en) * | 2016-01-13 | 2020-07-15 | 住友化学株式会社 | Adhesive composition |
| WO2017188216A1 (en) * | 2016-04-28 | 2017-11-02 | リンテック株式会社 | Film for forming protective coat and composite sheet for forming protective coat |
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2019
- 2019-06-06 KR KR1020207037539A patent/KR102602484B1/en active IP Right Grant
- 2019-06-06 CN CN202310234425.8A patent/CN116218389A/en active Pending
- 2019-06-06 CN CN201980038462.3A patent/CN112272691B/en active Active
- 2019-06-06 TW TW108119835A patent/TWI815903B/en active
- 2019-06-06 JP JP2020523168A patent/JP7283472B2/en active Active
- 2019-06-06 TW TW112130989A patent/TW202405118A/en unknown
- 2019-06-06 SG SG11202011944WA patent/SG11202011944WA/en unknown
- 2019-06-06 WO PCT/JP2019/022518 patent/WO2019235562A1/en active Application Filing
Patent Citations (4)
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| JP2012084784A (en) * | 2010-10-14 | 2012-04-26 | Hitachi Chem Co Ltd | Semiconductor device manufacturing method, die-bonding film used therefor and semiconductor device using die-bonding film |
| CN103980820A (en) * | 2013-02-13 | 2014-08-13 | 琳得科株式会社 | Pressure-sensitive adhesion composition, pressure-sensitive adhesive, and pressure-sensitive adhesion sheet |
| CN103956363A (en) * | 2014-03-03 | 2014-07-30 | 上海天马有机发光显示技术有限公司 | Composite substrate and manufacturing method thereof, and flexible display device and manufacturing method thereof |
| CN206242599U (en) * | 2016-08-31 | 2017-06-13 | 绍兴旭源新材料科技有限公司 | A kind of Anti-static release liner |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019235562A1 (en) | 2019-12-12 |
| TWI815903B (en) | 2023-09-21 |
| SG11202011944WA (en) | 2021-01-28 |
| KR102602484B1 (en) | 2023-11-16 |
| JP7283472B2 (en) | 2023-05-30 |
| CN112272691A (en) | 2021-01-26 |
| TW202405118A (en) | 2024-02-01 |
| TW202000827A (en) | 2020-01-01 |
| CN112272691B (en) | 2023-03-28 |
| JPWO2019235562A1 (en) | 2021-06-24 |
| KR20210020042A (en) | 2021-02-23 |
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