CN116171509B - 连接构造 - Google Patents

连接构造

Info

Publication number
CN116171509B
CN116171509B CN202080103899.3A CN202080103899A CN116171509B CN 116171509 B CN116171509 B CN 116171509B CN 202080103899 A CN202080103899 A CN 202080103899A CN 116171509 B CN116171509 B CN 116171509B
Authority
CN
China
Prior art keywords
insulating
connection structure
wire
housing
fastening body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080103899.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN116171509A (zh
Inventor
椋木康滋
堀口刚司
茂田宏树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Toshiba Mitsubishi Electric Industrial Systems Corp
TMEIC Corp
Original Assignee
Mitsubishi Electric Corp
Toshiba Mitsubishi Electric Industrial Systems Corp
TMEIC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp, Toshiba Mitsubishi Electric Industrial Systems Corp, TMEIC Corp filed Critical Mitsubishi Electric Corp
Publication of CN116171509A publication Critical patent/CN116171509A/zh
Application granted granted Critical
Publication of CN116171509B publication Critical patent/CN116171509B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1407—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by turn-bolt or screw member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H01R12/718—Contact members provided on the PCB without an insulating housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/91—Coupling devices allowing relative movement between coupling parts, e.g. floating or self aligning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
CN202080103899.3A 2020-09-03 2020-09-03 连接构造 Active CN116171509B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/033436 WO2022049695A1 (ja) 2020-09-03 2020-09-03 接続構造

Publications (2)

Publication Number Publication Date
CN116171509A CN116171509A (zh) 2023-05-26
CN116171509B true CN116171509B (zh) 2025-07-29

Family

ID=80491907

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080103899.3A Active CN116171509B (zh) 2020-09-03 2020-09-03 连接构造

Country Status (6)

Country Link
US (1) US12225675B2 (https=)
JP (1) JP7462770B2 (https=)
KR (1) KR102797647B1 (https=)
CN (1) CN116171509B (https=)
DE (1) DE112020007569T5 (https=)
WO (1) WO2022049695A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118020394A (zh) * 2021-09-21 2024-05-10 苹果公司 安装点的选择性绝缘

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133779A (ja) * 2001-10-24 2003-05-09 Canon Inc 回路基板と筐体との接続構造
CN101005730A (zh) * 2006-01-20 2007-07-25 佛山市顺德区顺达电脑厂有限公司 减少电子产品电磁干扰之电路板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5061705U (https=) * 1973-10-05 1975-06-06
JPH01135657U (https=) * 1988-03-09 1989-09-18
DE102005047106B4 (de) * 2005-09-30 2009-07-23 Infineon Technologies Ag Leistungshalbleitermodul und Verfahren zur Herstellung
US8854829B1 (en) * 2009-09-01 2014-10-07 Raytheon Company Standoff mounting system
KR101472639B1 (ko) 2012-12-31 2014-12-15 삼성전기주식회사 전자부품 내장기판 및 그 제조방법
TWM465753U (zh) * 2013-01-31 2013-11-11 Polytron Technologies Inc 電氣裝置
CN109565927A (zh) * 2017-03-24 2019-04-02 三菱电机株式会社 电路基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133779A (ja) * 2001-10-24 2003-05-09 Canon Inc 回路基板と筐体との接続構造
CN101005730A (zh) * 2006-01-20 2007-07-25 佛山市顺德区顺达电脑厂有限公司 减少电子产品电磁干扰之电路板

Also Published As

Publication number Publication date
DE112020007569T5 (de) 2023-07-06
CN116171509A (zh) 2023-05-26
JP7462770B2 (ja) 2024-04-05
KR20230041096A (ko) 2023-03-23
US12225675B2 (en) 2025-02-11
WO2022049695A1 (ja) 2022-03-10
US20230320014A1 (en) 2023-10-05
KR102797647B1 (ko) 2025-04-17
JPWO2022049695A1 (https=) 2022-03-10

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Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Country or region after: Japan

Address after: Tokyo, Japan

Applicant after: MITSUBISHI ELECTRIC Corp.

Applicant after: TMEIC Co.,Ltd.

Address before: Tokyo, Japan

Applicant before: MITSUBISHI ELECTRIC Corp.

Country or region before: Japan

Applicant before: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS Corp.

CB02 Change of applicant information
GR01 Patent grant
GR01 Patent grant