WO2022049695A1 - 接続構造 - Google Patents

接続構造 Download PDF

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Publication number
WO2022049695A1
WO2022049695A1 PCT/JP2020/033436 JP2020033436W WO2022049695A1 WO 2022049695 A1 WO2022049695 A1 WO 2022049695A1 JP 2020033436 W JP2020033436 W JP 2020033436W WO 2022049695 A1 WO2022049695 A1 WO 2022049695A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
circuit board
connection structure
insulating
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/033436
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
康滋 椋木
剛司 堀口
宏樹 茂田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Toshiba Mitsubishi Electric Industrial Systems Corp
Original Assignee
Mitsubishi Electric Corp
Toshiba Mitsubishi Electric Industrial Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp, Toshiba Mitsubishi Electric Industrial Systems Corp filed Critical Mitsubishi Electric Corp
Priority to US18/022,752 priority Critical patent/US12225675B2/en
Priority to JP2022546796A priority patent/JP7462770B2/ja
Priority to CN202080103899.3A priority patent/CN116171509B/zh
Priority to KR1020237005635A priority patent/KR102797647B1/ko
Priority to DE112020007569.9T priority patent/DE112020007569T5/de
Priority to PCT/JP2020/033436 priority patent/WO2022049695A1/ja
Publication of WO2022049695A1 publication Critical patent/WO2022049695A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1407—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by turn-bolt or screw member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H01R12/718—Contact members provided on the PCB without an insulating housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/91—Coupling devices allowing relative movement between coupling parts, e.g. floating or self aligning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters

Definitions

  • This disclosure relates to a connection structure.
  • the circuit board When a power converter such as a switching power supply is mounted on the circuit board, high-frequency noise current is generated due to the switching operation of the power converter.
  • the high frequency noise current is transmitted where it has a low high frequency impedance.
  • the parasitic capacitance of a circuit board has a low high frequency impedance.
  • the circuit board is connected to a housing that is grounded for safety by a conductive connecting member. Therefore, the high frequency noise current flows out from the circuit board to the ground through the connecting member and the housing.
  • the high-frequency noise current flowing out to the ground deteriorates the electromagnetic environment compatibility of electrical equipment as a common mode current.
  • the high-frequency noise current flowing through the housing induces radiated noise, which deteriorates the electromagnetic environment compatibility of electrical equipment.
  • the core material of the screw connecting the circuit board and the housing is an insulating material.
  • the tap (thread) of the screw has conductivity. Therefore, the connection structure between the circuit board and the housing has a high inductance component. Since the connection structure between the circuit board and the housing acts as an inductance for suppressing the high frequency noise current flowing from the circuit board to the housing, unnecessary radiation noise (radiation noise) is reduced.
  • connection point of the connection structure to the housing is limited to the position where the screw is fixed to the housing. Therefore, when the position where the screw is fixed to the housing is far from the ground, the distance through which the high-frequency noise current flows along the surface of the housing becomes long.
  • the connection structure of the present disclosure includes a circuit board, an insulating member, a housing, and a conducting wire.
  • the insulating member includes a first part and a second part. The first part is fixed to the circuit board. The second part faces the first part. The second part is fixed to the housing.
  • the housing includes the contacts. The contacts are grounded.
  • the conducting wire electrically connects the circuit board and the housing in a state of being wound around the insulating member. The shortest distance along the surface of the housing from the position where the conductor and the housing are connected to the contact point is shorter than the shortest distance along the surface of the housing from the second part of the insulating member to the contact point.
  • the shortest distance along the surface of the housing from the position where the conductor and the housing are connected to the contact is along the surface of the housing from the second part of the insulating member to the contact. It is shorter than the shortest distance. Therefore, the distance through which the high-frequency noise current flows along the surface of the housing can be shortened.
  • FIG. It is a perspective view schematically showing the structure of the connection structure which concerns on Embodiment 1.
  • FIG. It is a partial side view of the connection structure shown in FIG. It is a partial side view which shows the structure of the connection structure which concerns on Embodiment 2. It is a partial side view which shows roughly the structure of the connection structure which concerns on Embodiment 3.
  • FIG. It is a partial side view which shows the structure of the connection structure which concerns on Embodiment 4.
  • Embodiment 1 The configuration of the connection structure 100 according to the first embodiment will be described with reference to FIGS. 1 and 2.
  • the connection structure 100 includes a circuit board 1, a housing 2, an insulating member 3, and a conducting wire 4.
  • the circuit board 1 and the housing 2 are included in the internal structure of the electric device.
  • the electrical device is, for example, a power converter.
  • the power conversion device is, for example, an uninterruptible power supply device, a large-capacity air conditioner, or the like.
  • the circuit board 1 and the housing 2 face each other.
  • the circuit board 1 may be housed inside the housing 2.
  • the power converter 11 is mounted on the circuit board 1.
  • the power converter 11 is, for example, a switching power supply.
  • the power converter 11 includes a power conversion semiconductor element (not shown).
  • the semiconductor element for power conversion is, for example, a metal oxide semiconductor field effect transistor (MOSFET: Metal Oxide Semiconductor Field Effect Transistor) made of silicon (Si) or the like.
  • the power converter 11 is configured to convert the power supply voltage by utilizing the switching function of the power conversion semiconductor element.
  • the circuit board 1 may further mount a heat sink (not shown) configured to cool the power conversion semiconductor element.
  • the switching power supply is used, for example, as a power supply circuit for an uninterruptible power supply.
  • the uninterruptible power supply includes a semiconductor element for power conversion.
  • the circuit board 1 is used, for example, as a power supply circuit of a gate drive circuit configured to drive a power semiconductor element of an uninterruptible power supply.
  • the housing 2 includes the contact 21.
  • the contact 21 is grounded.
  • the contact 21 is electrically connected to the ground EG.
  • the ground EG is not always arranged in a flat position where the circuit board 1 can be arranged.
  • the earth EG may be arranged, for example, on a pillar (not shown) of the housing 2. Therefore, the ground EG is not always arranged at a position where the insulating member 3 can be fixed.
  • the material of the housing 2 is, for example, metal.
  • the housing 2 may constitute the outer shape of the electric device.
  • FIG. 1 In FIG. 1, four insulating members 3 and four conducting wires 4 are arranged between the circuit board 1 and the housing 2, but at least one insulating member 3 and at least one conducting wire 4 are arranged. You just have to. Other connecting members may be provided between the circuit board 1 and the housing 2. The number and position of the insulating member 3 and the conducting wire 4 may be determined according to, for example, the circuit structure of the power converter 11 such as the switching power supply mounted on the circuit board 1. In FIG. 2, one insulating member 3 and one conducting wire 4 are arranged between the circuit board 1 and the housing 2.
  • the insulating member 3 is sandwiched between the circuit board 1 and the housing 2.
  • the insulating member 3 extends from the circuit board 1 toward the housing 2.
  • the insulating member 3 extends along the axial direction.
  • the axial direction of the insulating member 3 is a direction along the direction from the circuit board 1 to the housing 2.
  • the insulating member 3 includes a first part 3a and a second part 3b.
  • the first part 3a is fixed to the circuit board 1.
  • the first screw hole 3c is provided in the first portion 3a.
  • the first screw hole 3c constitutes a female screw.
  • the second part 3b faces the first part 3a.
  • the second part 3b is fixed to the housing 2.
  • the second part 3b is provided with a second screw hole 3d.
  • the second screw hole 3d constitutes a female screw.
  • the second part 3b is fixed to the housing 2.
  • the insulating member 3 includes a groove G provided over the entire circumference of the outer circumference.
  • the groove G is provided along the circumferential direction of the insulating member 3.
  • a plurality of grooves G are arranged in the insulating member 3 along the axial direction of the insulating member 3.
  • the insulating member 3 is, for example, an insulating insulator.
  • the insulating insulator may be a general-purpose product.
  • the general-purpose product is a part easily available to general consumers.
  • the conductor 4 electrically connects the circuit board 1 and the housing 2 in a state of being wound around the insulating member 3.
  • the conducting wire 4 is wound around the circumferential direction of the insulating member 3.
  • the conductor 4 is wound around the insulating member 3 along the groove G.
  • the conductor 4 is configured to be deformable.
  • the conductor 4 includes a first end 4a and a second end 4b.
  • the first end 4a is electrically connected to the circuit board 1.
  • the first end 4a may be arranged away from the first part 3a.
  • the first end 4a is arranged away from the first part 3a.
  • the second end 4b is electrically connected to the housing 2.
  • the second end 4b is arranged away from the second part 3b.
  • the first end 4a and the second end 4b are not fixed to the insulating member 3.
  • the shortest distance along the surface of the housing 2 from the position where the conductor 4 and the housing 2 are connected to the contact 21 is along the surface of the housing 2 from the second part 3b of the insulating member 3 to the contact 21. Shorter than the shortest distance.
  • the shortest distance along the surface of the housing 2 is the creepage distance of the housing 2.
  • the shortest distance along the surface of the housing 2 from the second end 4b to the contact 21 is shorter than the shortest distance along the surface of the housing 2 from the second portion 3b of the insulating member 3 to the contact 21.
  • the conductor 4 Since the conductor 4 is wound around the outer circumference of the insulating member 3, it has a winding structure. Therefore, the conductor 4 has a higher self-inductance than when it extends linearly between the circuit board 1 and the housing 2. Impedance is proportional to self-inductance. Therefore, the conductor 4 has a higher high frequency impedance than the case where it has a linear shape. In the present embodiment, the high frequency impedance is the impedance in the high frequency region. As a result, it is possible to suppress the high frequency noise current from propagating from the circuit board 1 to the housing 2 via the conducting wire 4.
  • the connection structure 100 further includes a first fastening body 51, a second fastening body 52, a third fastening body 53, and a fourth fastening body 54.
  • the circuit board 1 is provided with a female screw configured to screw the first fastener 51 and a female screw configured to screw the third fastener 53.
  • the housing 2 is provided with a female screw configured to screw the second fastener 52 and a female screw configured to screw the fourth fastener 54.
  • the first fastening body 51 fixes the first part 3a and the circuit board 1.
  • the first fastening body 51 is a first screw configured to be screwed into the first screw hole 3c.
  • the first screw is a male screw.
  • the first screw may be a general-purpose product.
  • the material of the first fastener 51 is a magnetic material.
  • the first fastening body 51 is, for example, an iron male screw.
  • the first head portion 51H of the first fastening body 51 may be exposed on the side opposite to the insulating member 3 with respect to the circuit board 1.
  • the first head 51H may be exposed to air.
  • the conducting wire 4 When the conducting wire 4 is wound around the first fastening body 51, heat may be generated in the first fastening body 51 due to iron loss.
  • the heat generated by the iron loss of the first fastener 51 may be cooled from the first head 51H.
  • the heat generated by the iron loss of the first fastener 51 may be cooled by either natural air cooling or forced air cooling. This can improve the quality of the connection structure 100 and the electrical equipment having the connection structure 100.
  • the second fastening body 52 fixes the second part 3b and the housing 2.
  • the second fastening body 52 is a second screw configured to be screwed into the second screw hole 3d.
  • the second screw is a male screw.
  • the second screw may be a general-purpose product.
  • the material of the second fastener 52 is a magnetic material.
  • the second fastener 52 is, for example, a male screw.
  • the heat generated by the iron loss of the second fastener 52 may be dissipated to the housing 2.
  • the heat radiated to the housing 2 is radiated to the outside of the housing 2.
  • the second fastener 52 is effectively cooled. Therefore, the quality of the electric device having the connection structure 100 and the connection structure 100 can be improved.
  • the third fastening body 53 fixes the first end 4a and the circuit board 1.
  • the third fastener 53 is a third screw configured to be screwed into a female screw provided on the circuit board 1.
  • the third screw is a male screw.
  • the third screw may be a general-purpose product.
  • the material of the third fastener 53 may be a magnetic material.
  • the third fastener 53 is, for example, an iron male screw.
  • the fourth fastening body 54 fixes the second end 4b and the housing 2.
  • the fourth fastening body 54 is a fourth screw configured to be screwed into a female screw provided in the housing 2.
  • the fourth screw is a male screw.
  • the fourth screw may be a general-purpose product.
  • the material of the fourth fastener 54 may be a magnetic material.
  • the fourth fastener 54 is, for example, an iron male screw.
  • the circuit board 1 has a stray capacitance (parasitic capacitance) connected to the power conversion semiconductor element of the power converter 11.
  • a semiconductor element for power conversion such as a metal oxide semiconductor field effect transistor of the power converter 11 performs a switching operation, a steep voltage fluctuation occurs.
  • High frequency noise currents occur when voltage fluctuations are applied to stray capacitance.
  • the high frequency noise current is proportional to the time variation of the voltage and the stray capacitance value.
  • High frequency noise current selectively propagates in places with low high frequency impedance.
  • the high frequency noise current flows out from the power converter 11 such as the switching power supply.
  • the capacitance between the windings of a transformer in a switching power supply has a low high frequency impedance.
  • the stray capacitance between the circuit patterns of the circuit board 1 has a low high frequency impedance.
  • the stray capacitance between the power conversion semiconductor element and the heat sink (not shown) has a low high frequency impedance.
  • the high-frequency noise current flowing out of the power converter 11 reaches the conducting wire 4 through a portion having a low high-frequency impedance.
  • the high frequency noise current can propagate to the housing 2 via the conductor 4.
  • the conductor 4 needs to have a high high frequency impedance.
  • the conductor 4 since the conductor 4 is wound around the insulating member 3, the conductor 4 has a high high frequency impedance.
  • connection structure 100 As shown in FIG. 2, the shortest distance along the surface of the housing 2 from the position where the conductor 4 and the housing 2 are connected to the contact point 21 is set. It is shorter than the shortest distance along the surface of the housing 2 from the second part 3b of the insulating member 3 to the contact 21. Therefore, the distance through which the high-frequency noise current flows on the surface of the housing 2 can be shortened as compared with the case where the conducting wire 4 is fixed to the housing 2 at the position of the insulating member 3.
  • connection structure 100 since the high frequency noise current can be suppressed from circulating inside the housing 2, the generation of radiation noise can be suppressed. Therefore, the electromagnetic compatibility (EMC) of the electric device having the connection structure 100 is improved.
  • EMC electromagnetic compatibility
  • connection structure 100 further includes a first fastener 51, a second fastener 52, a third fastener 53, and a fourth fastener 54. Therefore, the circuit board 1, the housing 2, the insulating member 3, and the conducting wire 4 can be fixed by the fastening body.
  • the first fastening body 51 is a first screw configured to be screwed into the first screw hole 3c.
  • the second fastening body 52 is a second screw configured to be screwed into the second screw hole 3d.
  • the first screw and the second screw are male screws. Therefore, a general-purpose male screw can be used for the first fastening body 51 and the second fastening body 52. Further, a general-purpose insulating insulator can be used for the insulating member 3. Therefore, the manufacturing cost of the connection structure 100 can be reduced as compared with the case where the connection structure 100 includes a conductive screw thread, an insulating core material, and a conductive tap wound spirally around the core material. ..
  • the insulating member 3 includes a groove G provided over the entire circumference of the outer circumference. Therefore, the creepage distance of the insulating member 3 is longer than that in the case where the insulating member 3 is not provided with the groove G. Therefore, it is possible to suppress the high frequency noise current from propagating from the circuit board 1 to the housing 2 along the surface of the insulating member 3. Therefore, it is possible to suppress the generation of radiation noise.
  • the conductor 4 is configured to be deformable. Therefore, the position where the circuit board 1 and the housing 2 are electrically connected is not limited to the position of the insulating member 3. Therefore, the degree of freedom in design is improved.
  • connection structure 100 according to the second embodiment has the same configuration and operation and effect as the first embodiment, unless otherwise specified. Therefore, the same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will not be repeated.
  • the conductor 4 As shown in FIG. 3, the conductor 4 according to the present embodiment is wound in multiple times in the groove G.
  • the conducting wire 4 is wound around the groove G multiple times along the circumferential direction of the insulating member 3.
  • the conducting wire 4 is wound, for example, in a triple direction along the circumferential direction of the insulating member of the groove G.
  • the conductor 4 constitutes a winding structure stacked in multiple layers.
  • connection structure 100 As shown in FIG. 3, the conductor 4 is wound around the groove G multiple times. Therefore, the conductor 4 has a higher self-inductance than when it is wound in the groove G in a single layer. Therefore, the conducting wire 4 has a higher high frequency impedance than when it is wound in the groove G in a single layer. Therefore, it is possible to suppress the high frequency noise current from flowing from the circuit board 1 to the housing 2 via the conducting wire 4. This improves the electromagnetic environment compatibility of the electric device having the connection structure 100.
  • the conductor 4 is wound around the groove G multiple times. Therefore, the conducting wire 4 having a stable potential close to that of the earth EG can be wound around the insulating member 3 in a plurality of ways. Therefore, it is possible to suppress the generation of high-frequency noise current due to the stray capacitance of the lead wire 4 connected to the housing 2 and the second fastener 52.
  • the potential of the circuit board 1 may be displaced by, for example, the potential fluctuation during the switching operation of the power converter 11 such as a switching power supply.
  • the stray capacitance of the conductor 4 connected to the circuit board 1 and the first fastener 51 is smaller than the stray capacitance of the conductor 4 connected to the housing 2 and the second fastener 52.
  • the impedance of the portion of the conductor 4 connected to the circuit board 1 and the first fastener 51 is higher than the impedance of the portion of the conductor 4 connected to the housing 2 and the second fastener 52. Therefore, it is possible to suppress the generation of high frequency noise current in the circuit board 1. Therefore, the electromagnetic environment compatibility of the electric device having the connection structure 100 is improved.
  • connection structure 100 according to the third embodiment will be described with reference to FIG.
  • the third embodiment has the same configuration and operation and effect as the first embodiment. Therefore, the same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will not be repeated.
  • connection structure 100 further includes at least one conjugate 6.
  • the insulating member 3 includes a plurality of insulating portions 30.
  • the plurality of insulating portions 30 are laminated from the circuit board 1 toward the housing 2.
  • the plurality of insulating portions 30 are laminated along the axial direction of the insulating member 3.
  • the plurality of insulating portions 30 are arranged in series.
  • the adjacent insulating portions 30 among the plurality of insulating portions 30 are connected by at least one coupling body 6.
  • Each of the plurality of insulating portions 30 is, for example, an insulating insulator which is a general-purpose product.
  • Each of the plurality of insulating portions 30 includes a plurality of grooves G provided over the entire circumference of the outer circumference.
  • the plurality of insulating portions 30 may have the same structure as each other.
  • the plurality of insulating portions 30 include a first insulating portion 31, a central insulating portion 32, and a second insulating portion 33.
  • the first insulating portion 31, the central insulating portion 32, and the second insulating portion 33 are sequentially laminated from the circuit board 1 toward the housing 2.
  • the first insulating portion 31 is fixed to the circuit board 1.
  • the first insulating portion 31 is connected to the central insulating portion 32 by the coupling body 6.
  • the central insulating portion 32 is sandwiched between the first insulating portion 31 and the second insulating portion 33.
  • the second insulating portion 33 is fixed to the housing 2.
  • the second insulating portion 33 is connected to the central insulating portion 32 by the coupling body 6.
  • the first part 3a is arranged in the first insulating part 31.
  • the second part 3b is arranged in the second insulating part 33.
  • At least one coupling 6 is arranged inside a plurality of insulating portions 30.
  • the coupling body 6 connects adjacent insulating portions 30 to each other.
  • the coupling body 6 is embedded so as to straddle the adjacent insulating portions 30.
  • the coupling body 6 extends along the axial direction of the insulating member 3 inside the adjacent insulating portions 30 to each other. In this embodiment, since the three insulating portions 30 are arranged, the two coupled bodies 6 are arranged.
  • At least one conjugate 6 is a magnetic material.
  • the combined body 6 may be a general-purpose product.
  • the bond 6 may be, for example, an iron male screw.
  • the material of the bond 6 may be ferrite or the like, which is a ferromagnet.
  • the conductor 4 is wound around a plurality of insulating portions 30 around at least one coupling 6.
  • the conductor 4 is wound around the plurality of insulating portions 30 across the plurality of insulating portions 30.
  • the conducting wire 4 is wound around each of the plurality of grooves G provided in each of the plurality of insulating portions 30.
  • the winding is wound in a single layer around the insulating portion 30 in FIG. 4, the winding method of the conductor 4 is not limited to a single layer. As will be described later in the fourth and fifth embodiments, the conductor 4 may be wound in multiple directions.
  • the insulating member 3 includes a plurality of insulating portions 30.
  • the plurality of insulating portions 30 are laminated from the circuit board 1 toward the housing 2. Therefore, the axial dimension of the insulating member 3 can be easily changed as compared with the case where the insulating member 3 is composed of only one member. Therefore, since the distance between the circuit board 1 and the housing 2 can be easily changed, the degree of freedom in designing the connection structure 100 is improved.
  • the insulating member 3 includes a plurality of insulating portions 30.
  • Each of the plurality of insulating portions 30 may be an insulating insulator which is a general-purpose product. Therefore, the manufacturing cost of the connection structure 100 can be reduced.
  • connection structure 100 includes at least one conjugate 6.
  • the bond 6 is a magnetic material.
  • the conductor 4 is wound around a plurality of insulating portions 30 around at least one coupling 6. Therefore, the coupling body 6 is surrounded by a winding structure composed of the conducting wire 4. As a result, the coupling 6 adds a magnetic path inside the winding structure. Therefore, the self-impedance of the conductor 4 increases. Therefore, it is possible to suppress the high frequency noise current from flowing from the circuit board 1 to the housing 2 via the conducting wire 4. This improves the electromagnetic environment compatibility of the electric device having the connection structure 100.
  • connection structure 100 according to the fourth embodiment will be described with reference to FIG. Unless otherwise specified, the fourth embodiment has the same configuration and operation and effect as the third embodiment. Therefore, the same components as those in the third embodiment are designated by the same reference numerals, and the description thereof will not be repeated.
  • the conductor 4 is multiplely wound around at least one of the plurality of insulating portions 30.
  • the conducting wire 4 is multiplely wound around the groove G of at least one of the plurality of insulating portions 30.
  • the density at which the conductor 4 is wound around the insulating portion 30 may be appropriately adjusted.
  • the density at which the conductor 4 is wound around the central insulating portion 32 may be higher than the density at which the conductor 4 is wound around the first insulating portion 31 and the density at which the conductor 4 is wound around the second insulating portion 33. ..
  • the conductor 4 may be wound around the central insulating portion 32 by centralized winding. In the present embodiment, the fact that the conductor 4 is wound around the central insulating portion 32 by concentrated winding means that the conductor 4 is wound around the central insulating portion 32 more than the first insulating portion 31 and the second insulating portion 33. That is.
  • the conductor 4 may be wound around the insulating portion 30 arranged at the center of the insulating member 3 in the axial direction among the plurality of insulating portions 30 by concentrated winding.
  • connection structure 100 according to the fourth embodiment, as shown in FIG. 5, the conductor 4 is wound in multiple directions around at least one of the plurality of insulating portions 30. Therefore, the density at which the conducting wire 4 is wound around the insulating portion 30 can be appropriately adjusted. Therefore, the lead wire 4 can be wound around the insulating portion 30 centrally arranged in the axial direction of the insulating member 3 among the plurality of insulating portions 30 by centralized winding.
  • the insulating portion 30 arranged at the center in the axial direction of the insulating member 3 has higher workability than the insulating portion 30 arranged at the ends in the axial direction of the insulating member 3. As a result, the workability of winding the conducting wire 4 around the insulating portion 30 is improved, so that the assembling property of the connection structure 100 is improved. Therefore, the manufacturing cost of the connection structure 100 can be reduced.
  • Embodiment 5 the configuration of the connection structure 100 according to the fifth embodiment will be described with reference to FIG.
  • the fifth embodiment has the same configuration and operation and effect as the third embodiment, unless otherwise specified. Therefore, the same components as those in the third embodiment are designated by the same reference numerals, and the description thereof will not be repeated.
  • the conductor 4 is multiplely wound around a plurality of insulating portions 30 around at least one coupling 6.
  • the conducting wire 4 is multiplely wound around the plurality of insulating portions 30 along the circumferential direction of the plurality of insulating portions 30 around at least one coupling body 6.
  • connection structure 100 the conductor 4 is wound around a plurality of insulating portions 30 in a plurality of manners around at least one coupling 6. Therefore, the leakage flux generated from the conducting wire 4 is concentrated around the coupling body 6. Therefore, the leakage flux generated from the conductor 4 forms a magnetic flux loop around the coupling 6. If the magnetic flux loop reaches the circuit board 1, a malfunction of an electronic component (not shown) mounted on the circuit board 1 may be induced, which may cause a malfunction in the electric device in which the circuit board 1 is built.
  • the magnetic flux loop of the leakage flux is formed around the coupling body 6, it is possible to suppress the magnetic flux loop from reaching the circuit board 1. Therefore, the malfunction of the circuit board 1 can be suppressed. Therefore, the reliability of the electric device having the circuit board 1 of the connection structure 100 is improved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
PCT/JP2020/033436 2020-09-03 2020-09-03 接続構造 Ceased WO2022049695A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US18/022,752 US12225675B2 (en) 2020-09-03 2020-09-03 Connection structure
JP2022546796A JP7462770B2 (ja) 2020-09-03 2020-09-03 接続構造
CN202080103899.3A CN116171509B (zh) 2020-09-03 2020-09-03 连接构造
KR1020237005635A KR102797647B1 (ko) 2020-09-03 2020-09-03 접속 구조
DE112020007569.9T DE112020007569T5 (de) 2020-09-03 2020-09-03 Verbindungsstruktur
PCT/JP2020/033436 WO2022049695A1 (ja) 2020-09-03 2020-09-03 接続構造

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JP (1) JP7462770B2 (https=)
KR (1) KR102797647B1 (https=)
CN (1) CN116171509B (https=)
DE (1) DE112020007569T5 (https=)
WO (1) WO2022049695A1 (https=)

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CN118020394A (zh) * 2021-09-21 2024-05-10 苹果公司 安装点的选择性绝缘

Citations (4)

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JPS5061705U (https=) * 1973-10-05 1975-06-06
JPH01135657U (https=) * 1988-03-09 1989-09-18
JP2003133779A (ja) * 2001-10-24 2003-05-09 Canon Inc 回路基板と筐体との接続構造
US8854829B1 (en) * 2009-09-01 2014-10-07 Raytheon Company Standoff mounting system

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Publication number Priority date Publication date Assignee Title
DE102005047106B4 (de) * 2005-09-30 2009-07-23 Infineon Technologies Ag Leistungshalbleitermodul und Verfahren zur Herstellung
CN101005730A (zh) * 2006-01-20 2007-07-25 佛山市顺德区顺达电脑厂有限公司 减少电子产品电磁干扰之电路板
KR101472639B1 (ko) 2012-12-31 2014-12-15 삼성전기주식회사 전자부품 내장기판 및 그 제조방법
TWM465753U (zh) * 2013-01-31 2013-11-11 Polytron Technologies Inc 電氣裝置
CN109565927A (zh) * 2017-03-24 2019-04-02 三菱电机株式会社 电路基板

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Publication number Priority date Publication date Assignee Title
JPS5061705U (https=) * 1973-10-05 1975-06-06
JPH01135657U (https=) * 1988-03-09 1989-09-18
JP2003133779A (ja) * 2001-10-24 2003-05-09 Canon Inc 回路基板と筐体との接続構造
US8854829B1 (en) * 2009-09-01 2014-10-07 Raytheon Company Standoff mounting system

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DE112020007569T5 (de) 2023-07-06
CN116171509A (zh) 2023-05-26
JP7462770B2 (ja) 2024-04-05
KR20230041096A (ko) 2023-03-23
US12225675B2 (en) 2025-02-11
CN116171509B (zh) 2025-07-29
US20230320014A1 (en) 2023-10-05
KR102797647B1 (ko) 2025-04-17
JPWO2022049695A1 (https=) 2022-03-10

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