CN115835956A - 层叠板、印刷电路板、半导体封装及层叠板的制造方法 - Google Patents

层叠板、印刷电路板、半导体封装及层叠板的制造方法 Download PDF

Info

Publication number
CN115835956A
CN115835956A CN202180042350.2A CN202180042350A CN115835956A CN 115835956 A CN115835956 A CN 115835956A CN 202180042350 A CN202180042350 A CN 202180042350A CN 115835956 A CN115835956 A CN 115835956A
Authority
CN
China
Prior art keywords
layers
composite
laminate
glass fiber
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180042350.2A
Other languages
English (en)
Chinese (zh)
Inventor
村上德昭
岛冈伸治
藤田广明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of CN115835956A publication Critical patent/CN115835956A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/28—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
CN202180042350.2A 2020-06-17 2021-06-16 层叠板、印刷电路板、半导体封装及层叠板的制造方法 Pending CN115835956A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020104375 2020-06-17
JP2020-104375 2020-06-17
PCT/JP2021/022910 WO2021256516A1 (ja) 2020-06-17 2021-06-16 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法

Publications (1)

Publication Number Publication Date
CN115835956A true CN115835956A (zh) 2023-03-21

Family

ID=79268020

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180042350.2A Pending CN115835956A (zh) 2020-06-17 2021-06-16 层叠板、印刷电路板、半导体封装及层叠板的制造方法

Country Status (5)

Country Link
JP (3) JP7136389B2 (enExample)
KR (1) KR20230025395A (enExample)
CN (1) CN115835956A (enExample)
TW (2) TW202533942A (enExample)
WO (1) WO2021256516A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118974145A (zh) * 2022-04-15 2024-11-15 日东纺绩株式会社 玻璃纤维强化树脂成型品

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05261861A (ja) * 1992-03-19 1993-10-12 Shin Kobe Electric Mach Co Ltd 積層板
WO2013042752A1 (ja) * 2011-09-22 2013-03-28 日立化成株式会社 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
JP5223973B1 (ja) * 2012-01-06 2013-06-26 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
JP2015076589A (ja) * 2013-10-11 2015-04-20 パナソニックＩｐマネジメント株式会社 積層板
WO2015079820A1 (ja) * 2013-11-29 2015-06-04 日東紡績株式会社 ガラス繊維織物－樹脂組成物積層体
JP2018130938A (ja) * 2017-02-17 2018-08-23 日立化成株式会社 プリプレグ、積層板、プリント配線板、コアレス基板、半導体パッケージ及びコアレス基板の製造方法
CN113195219A (zh) * 2018-12-18 2021-07-30 昭和电工材料株式会社 层叠板、印刷线路板、半导体封装体及层叠板的制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2740990B2 (ja) 1991-11-26 1998-04-15 株式会社日立製作所 低熱膨張性加圧成形用樹脂組成物
JP7056201B2 (ja) * 2018-02-14 2022-04-19 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05261861A (ja) * 1992-03-19 1993-10-12 Shin Kobe Electric Mach Co Ltd 積層板
WO2013042752A1 (ja) * 2011-09-22 2013-03-28 日立化成株式会社 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
JP5223973B1 (ja) * 2012-01-06 2013-06-26 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
JP2015076589A (ja) * 2013-10-11 2015-04-20 パナソニックＩｐマネジメント株式会社 積層板
WO2015079820A1 (ja) * 2013-11-29 2015-06-04 日東紡績株式会社 ガラス繊維織物－樹脂組成物積層体
CN105764684A (zh) * 2013-11-29 2016-07-13 日东纺绩株式会社 玻璃纤维织物-树脂组合物叠层体
JP2018130938A (ja) * 2017-02-17 2018-08-23 日立化成株式会社 プリプレグ、積層板、プリント配線板、コアレス基板、半導体パッケージ及びコアレス基板の製造方法
CN113195219A (zh) * 2018-12-18 2021-07-30 昭和电工材料株式会社 层叠板、印刷线路板、半导体封装体及层叠板的制造方法

Also Published As

Publication number Publication date
TWI891816B (zh) 2025-08-01
JP7136389B2 (ja) 2022-09-13
JP2026050454A (ja) 2026-03-19
JP7806636B2 (ja) 2026-01-27
WO2021256516A1 (ja) 2021-12-23
TW202533942A (zh) 2025-09-01
TW202212119A (zh) 2022-04-01
KR20230025395A (ko) 2023-02-21
JP2022171670A (ja) 2022-11-11
JPWO2021256516A1 (enExample) 2021-12-23

Similar Documents

Publication Publication Date Title
KR101355777B1 (ko) 프리프레그, 적층판, 프린트 배선판 및 반도체 장치
KR101733646B1 (ko) 열경화성 수지 조성물, 및 이를 이용한 프리프레그, 지지체 부착 절연 필름, 적층판 및 인쇄 배선판
CN113195219B (zh) 层叠板、印刷线路板、半导体封装体及层叠板的制造方法
CN103009720A (zh) 层叠体、层叠板、多层层叠板、印刷配线板及层叠板的制造方法
KR102463619B1 (ko) 코어리스 기판용 프리프레그, 코어리스 기판, 코어리스 기판의 제조 방법 및 반도체 패키지
JP5633382B2 (ja) 熱硬化性樹脂組成物並びにこれを用いたプリプレグ、積層板及び多層プリント配線板
JP2026050454A (ja) 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法
JP2018029204A (ja) 積層体、積層板、多層積層板、プリント配線板、多層プリント配線板及び積層板の製造方法
JP7088031B2 (ja) プリプレグ、積層板、プリント配線板、コアレス基板、半導体パッケージ及びコアレス基板の製造方法
JP2018130938A (ja) プリプレグ、積層板、プリント配線板、コアレス基板、半導体パッケージ及びコアレス基板の製造方法
JP7484422B2 (ja) プリプレグ、積層板、金属張積層板及び半導体パッケージ、並びに積層板及び金属張積層板の製造方法
JP6164318B2 (ja) プリント配線板用プリプレグ、積層板及びプリント配線板
JP7243077B2 (ja) プリプレグ、プリプレグの硬化物、積層板、プリント配線板及び半導体パッケージ
HK40016036A (en) Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing method and semiconductor package

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information
CB02 Change of applicant information

Address after: Tokyo, Japan

Applicant after: Lishennoco Co.,Ltd.

Address before: Tokyo, Japan

Applicant before: Showa electrical materials Co.,Ltd.