CN115768591A - 软钎料合金、软钎料粉末、焊膏、焊料球、预成型软钎料和钎焊接头 - Google Patents

软钎料合金、软钎料粉末、焊膏、焊料球、预成型软钎料和钎焊接头 Download PDF

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Publication number
CN115768591A
CN115768591A CN202180041107.9A CN202180041107A CN115768591A CN 115768591 A CN115768591 A CN 115768591A CN 202180041107 A CN202180041107 A CN 202180041107A CN 115768591 A CN115768591 A CN 115768591A
Authority
CN
China
Prior art keywords
mass
less
solder
alloy
solder alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180041107.9A
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English (en)
Chinese (zh)
Inventor
川崎浩由
白鸟正人
川又勇司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Publication of CN115768591A publication Critical patent/CN115768591A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN202180041107.9A 2020-04-10 2021-02-19 软钎料合金、软钎料粉末、焊膏、焊料球、预成型软钎料和钎焊接头 Pending CN115768591A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020071024 2020-04-10
JP2020-071024 2020-04-10
PCT/JP2021/006450 WO2021205760A1 (ja) 2020-04-10 2021-02-19 はんだ合金、はんだ粉末、ソルダペースト、はんだボール、ソルダプリフォーム及びはんだ継手

Publications (1)

Publication Number Publication Date
CN115768591A true CN115768591A (zh) 2023-03-07

Family

ID=78023297

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180041107.9A Pending CN115768591A (zh) 2020-04-10 2021-02-19 软钎料合金、软钎料粉末、焊膏、焊料球、预成型软钎料和钎焊接头

Country Status (5)

Country Link
JP (1) JP7212300B2 (https=)
KR (1) KR102587716B1 (https=)
CN (1) CN115768591A (https=)
TW (1) TWI782423B (https=)
WO (1) WO2021205760A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7323854B1 (ja) * 2023-01-12 2023-08-09 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置
JP7323853B1 (ja) * 2023-01-12 2023-08-09 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005040847A (ja) * 2003-07-25 2005-02-17 Hitachi Metals Ltd はんだボールの製造方法
JP2007237250A (ja) * 2006-03-09 2007-09-20 Nippon Steel Materials Co Ltd 鉛フリーハンダ合金、ハンダボール及び電子部材
CN101213326A (zh) * 2005-07-01 2008-07-02 日矿金属株式会社 高纯度锡或锡合金及高纯度锡的制造方法
CN103561903A (zh) * 2011-03-23 2014-02-05 千住金属工业株式会社 无铅焊料合金
CN105307812A (zh) * 2013-04-09 2016-02-03 千住金属工业株式会社 焊膏
CN106862794A (zh) * 2014-02-04 2017-06-20 千住金属工业株式会社 芯球、焊膏、成形焊料、助焊剂涂布芯球以及焊料接头
JP2017113756A (ja) * 2015-12-21 2017-06-29 住友金属鉱山株式会社 表面性に優れたＳｎを主成分とするはんだ合金及びその選別方法
CN107427969A (zh) * 2016-03-22 2017-12-01 株式会社田村制作所 无铅软钎料合金、助焊剂组合物、焊膏组合物、电子电路基板和电子控制装置
CN107848078A (zh) * 2015-07-24 2018-03-27 哈利玛化成株式会社 钎焊合金、焊膏和电子线路基板
JP6540869B1 (ja) * 2018-03-30 2019-07-10 千住金属工業株式会社 はんだペースト
CN110430968A (zh) * 2017-03-31 2019-11-08 千住金属工业株式会社 软钎料合金、焊膏和钎焊接头
JP2020011293A (ja) * 2019-04-11 2020-01-23 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手
JP2020055037A (ja) * 2018-09-28 2020-04-09 荒川化学工業株式会社 鉛フリーはんだフラックス、鉛フリーソルダペースト

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5019764B1 (https=) * 1971-04-30 1975-07-09
JP2005103645A (ja) 2004-10-29 2005-04-21 Hitachi Metals Ltd はんだボールおよびその製造方法
JP6717559B2 (ja) 2013-10-16 2020-07-01 三井金属鉱業株式会社 半田合金及び半田粉
JP6521161B1 (ja) * 2018-07-20 2019-05-29 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005040847A (ja) * 2003-07-25 2005-02-17 Hitachi Metals Ltd はんだボールの製造方法
CN101213326A (zh) * 2005-07-01 2008-07-02 日矿金属株式会社 高纯度锡或锡合金及高纯度锡的制造方法
JP2007237250A (ja) * 2006-03-09 2007-09-20 Nippon Steel Materials Co Ltd 鉛フリーハンダ合金、ハンダボール及び電子部材
CN103561903A (zh) * 2011-03-23 2014-02-05 千住金属工业株式会社 无铅焊料合金
CN105307812A (zh) * 2013-04-09 2016-02-03 千住金属工业株式会社 焊膏
CN106862794A (zh) * 2014-02-04 2017-06-20 千住金属工业株式会社 芯球、焊膏、成形焊料、助焊剂涂布芯球以及焊料接头
CN107848078A (zh) * 2015-07-24 2018-03-27 哈利玛化成株式会社 钎焊合金、焊膏和电子线路基板
JP2017113756A (ja) * 2015-12-21 2017-06-29 住友金属鉱山株式会社 表面性に優れたＳｎを主成分とするはんだ合金及びその選別方法
CN107427969A (zh) * 2016-03-22 2017-12-01 株式会社田村制作所 无铅软钎料合金、助焊剂组合物、焊膏组合物、电子电路基板和电子控制装置
CN110430968A (zh) * 2017-03-31 2019-11-08 千住金属工业株式会社 软钎料合金、焊膏和钎焊接头
JP6540869B1 (ja) * 2018-03-30 2019-07-10 千住金属工業株式会社 はんだペースト
JP2020055037A (ja) * 2018-09-28 2020-04-09 荒川化学工業株式会社 鉛フリーはんだフラックス、鉛フリーソルダペースト
JP2020011293A (ja) * 2019-04-11 2020-01-23 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手

Also Published As

Publication number Publication date
JP7212300B2 (ja) 2023-01-25
TWI782423B (zh) 2022-11-01
KR20220149610A (ko) 2022-11-08
TW202142347A (zh) 2021-11-16
WO2021205760A1 (ja) 2021-10-14
KR102587716B1 (ko) 2023-10-12
JPWO2021205760A1 (https=) 2021-10-14

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