TWI782423B - 焊料合金、焊料粉末、焊膏、焊料球、焊料預成形物及焊料接頭 - Google Patents

焊料合金、焊料粉末、焊膏、焊料球、焊料預成形物及焊料接頭 Download PDF

Info

Publication number
TWI782423B
TWI782423B TW110105773A TW110105773A TWI782423B TW I782423 B TWI782423 B TW I782423B TW 110105773 A TW110105773 A TW 110105773A TW 110105773 A TW110105773 A TW 110105773A TW I782423 B TWI782423 B TW I782423B
Authority
TW
Taiwan
Prior art keywords
mass
solder
less
alloy
solder alloy
Prior art date
Application number
TW110105773A
Other languages
English (en)
Chinese (zh)
Other versions
TW202142347A (zh
Inventor
川浩由
白鳥正人
川又勇司
Original Assignee
日商千住金屬工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商千住金屬工業股份有限公司 filed Critical 日商千住金屬工業股份有限公司
Publication of TW202142347A publication Critical patent/TW202142347A/zh
Application granted granted Critical
Publication of TWI782423B publication Critical patent/TWI782423B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW110105773A 2020-04-10 2021-02-19 焊料合金、焊料粉末、焊膏、焊料球、焊料預成形物及焊料接頭 TWI782423B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020071024 2020-04-10
JP2020-071024 2020-04-10

Publications (2)

Publication Number Publication Date
TW202142347A TW202142347A (zh) 2021-11-16
TWI782423B true TWI782423B (zh) 2022-11-01

Family

ID=78023297

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110105773A TWI782423B (zh) 2020-04-10 2021-02-19 焊料合金、焊料粉末、焊膏、焊料球、焊料預成形物及焊料接頭

Country Status (5)

Country Link
JP (1) JP7212300B2 (https=)
KR (1) KR102587716B1 (https=)
CN (1) CN115768591A (https=)
TW (1) TWI782423B (https=)
WO (1) WO2021205760A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7323854B1 (ja) * 2023-01-12 2023-08-09 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置
JP7323853B1 (ja) * 2023-01-12 2023-08-09 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5019764B2 (ja) * 2006-03-09 2012-09-05 新日鉄マテリアルズ株式会社 鉛フリーハンダ合金、ハンダボール及び電子部材
JP5296269B1 (ja) * 2005-07-01 2013-09-25 Ｊｘ日鉱日石金属株式会社 高純度錫合金
TW201546303A (zh) * 2014-02-04 2015-12-16 千住金屬工業股份有限公司 核球、焊料膏、泡沫焊料、助焊劑塗覆核球及焊料接頭
JP2017113756A (ja) * 2015-12-21 2017-06-29 住友金属鉱山株式会社 表面性に優れたＳｎを主成分とするはんだ合金及びその選別方法
TW202007779A (zh) * 2018-07-20 2020-02-16 日商千住金屬工業股份有限公司 焊料合金、焊料粉末、焊料糊、及使用其等之焊料接頭

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5019764B1 (https=) * 1971-04-30 1975-07-09
JP2005040847A (ja) * 2003-07-25 2005-02-17 Hitachi Metals Ltd はんだボールの製造方法
JP2005103645A (ja) 2004-10-29 2005-04-21 Hitachi Metals Ltd はんだボールおよびその製造方法
WO2012127642A1 (ja) * 2011-03-23 2012-09-27 千住金属工業株式会社 鉛フリーはんだ合金
CN105307812B (zh) * 2013-04-09 2018-03-27 千住金属工业株式会社 焊膏
JP6717559B2 (ja) 2013-10-16 2020-07-01 三井金属鉱業株式会社 半田合金及び半田粉
US10518362B2 (en) * 2015-07-24 2019-12-31 Harima Chemicals, Incorporated Solder alloy, solder paste, and electronic circuit board
BR112018068596A2 (pt) * 2016-03-22 2019-02-12 Tamura Corporation liga de soldas sem chumbo, composição de fluxo, composição de pasta de solda, placa de circuito eletrônico, e controlador eletrônico
WO2018181873A1 (ja) * 2017-03-31 2018-10-04 千住金属工業株式会社 はんだ合金、ソルダペースト及びはんだ継手
JP6540869B1 (ja) * 2018-03-30 2019-07-10 千住金属工業株式会社 はんだペースト
JP7331579B2 (ja) * 2018-09-28 2023-08-23 荒川化学工業株式会社 鉛フリーはんだフラックス、鉛フリーソルダペースト
JP2020011293A (ja) * 2019-04-11 2020-01-23 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5296269B1 (ja) * 2005-07-01 2013-09-25 Ｊｘ日鉱日石金属株式会社 高純度錫合金
JP5019764B2 (ja) * 2006-03-09 2012-09-05 新日鉄マテリアルズ株式会社 鉛フリーハンダ合金、ハンダボール及び電子部材
TW201546303A (zh) * 2014-02-04 2015-12-16 千住金屬工業股份有限公司 核球、焊料膏、泡沫焊料、助焊劑塗覆核球及焊料接頭
JP2017113756A (ja) * 2015-12-21 2017-06-29 住友金属鉱山株式会社 表面性に優れたＳｎを主成分とするはんだ合金及びその選別方法
TW202007779A (zh) * 2018-07-20 2020-02-16 日商千住金屬工業股份有限公司 焊料合金、焊料粉末、焊料糊、及使用其等之焊料接頭

Also Published As

Publication number Publication date
JP7212300B2 (ja) 2023-01-25
KR20220149610A (ko) 2022-11-08
TW202142347A (zh) 2021-11-16
WO2021205760A1 (ja) 2021-10-14
KR102587716B1 (ko) 2023-10-12
JPWO2021205760A1 (https=) 2021-10-14
CN115768591A (zh) 2023-03-07

Similar Documents

Publication Publication Date Title
KR102241026B1 (ko) 땜납 합금, 땜납 분말, 땜납 페이스트 및 이것들을 사용한 솔더 조인트
KR20210008915A (ko) 땜납 합금, 땜납 분말, 땜납 페이스트 및 이들을 사용한 솔더 조인트
JP6928296B1 (ja) ソルダペースト
TWI782723B (zh) 焊膏
TWI782423B (zh) 焊料合金、焊料粉末、焊膏、焊料球、焊料預成形物及焊料接頭
KR102376716B1 (ko) 납땜 합금, 납땜 분말, 및 납땜 조인트
CN115916453B (zh) 软钎料合金、软钎料粉末、焊膏、焊料球、预成型软钎料和钎焊接头
CN113924186B (zh) 焊料合金、焊料粉末以及焊接接头
HK40081502A (en) Solder alloy, solder powder, solder paste, solder ball, solder preform, and solder joint
HK40085091A (en) Solder alloy, solder powder, solder paste, solder ball, solder preform, and solder joint
HK40085091B (en) Solder alloy, solder powder, solder paste, solder ball, solder preform, and solder joint
JP2020192599A (ja) はんだ合金、はんだ粉末、およびはんだ継手
TWI783703B (zh) 助焊劑及焊膏
HK40067606A (en) Solder paste
HK40067606B (en) Solder paste
HK40065661A (zh) 助焊剂和焊膏
JP2020192601A (ja) はんだ合金、はんだ粉末、およびはんだ継手
WO2020240928A1 (ja) はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手