KR102587716B1 - 땜납 합금, 땜납 분말, 솔더 페이스트, 땜납 볼, 솔더 프리폼 및 땜납 이음 - Google Patents

땜납 합금, 땜납 분말, 솔더 페이스트, 땜납 볼, 솔더 프리폼 및 땜납 이음 Download PDF

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Publication number
KR102587716B1
KR102587716B1 KR1020227034653A KR20227034653A KR102587716B1 KR 102587716 B1 KR102587716 B1 KR 102587716B1 KR 1020227034653 A KR1020227034653 A KR 1020227034653A KR 20227034653 A KR20227034653 A KR 20227034653A KR 102587716 B1 KR102587716 B1 KR 102587716B1
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South Korea
Prior art keywords
solder
mass
less
solder alloy
alloy
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KR1020227034653A
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Korean (ko)
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KR20220149610A (ko
Inventor
히로요시 가와사키
마사토 시라토리
유지 가와마타
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센주긴조쿠고교 가부시키가이샤
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020227034653A 2020-04-10 2021-02-19 땜납 합금, 땜납 분말, 솔더 페이스트, 땜납 볼, 솔더 프리폼 및 땜납 이음 Active KR102587716B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020071024 2020-04-10
JPJP-P-2020-071024 2020-04-10
PCT/JP2021/006450 WO2021205760A1 (ja) 2020-04-10 2021-02-19 はんだ合金、はんだ粉末、ソルダペースト、はんだボール、ソルダプリフォーム及びはんだ継手

Publications (2)

Publication Number Publication Date
KR20220149610A KR20220149610A (ko) 2022-11-08
KR102587716B1 true KR102587716B1 (ko) 2023-10-12

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Application Number Title Priority Date Filing Date
KR1020227034653A Active KR102587716B1 (ko) 2020-04-10 2021-02-19 땜납 합금, 땜납 분말, 솔더 페이스트, 땜납 볼, 솔더 프리폼 및 땜납 이음

Country Status (5)

Country Link
JP (1) JP7212300B2 (https=)
KR (1) KR102587716B1 (https=)
CN (1) CN115768591A (https=)
TW (1) TWI782423B (https=)
WO (1) WO2021205760A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7323854B1 (ja) * 2023-01-12 2023-08-09 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置
JP7323853B1 (ja) * 2023-01-12 2023-08-09 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5019764B2 (ja) 2006-03-09 2012-09-05 新日鉄マテリアルズ株式会社 鉛フリーハンダ合金、ハンダボール及び電子部材
JP5296269B1 (ja) * 2005-07-01 2013-09-25 Ｊｘ日鉱日石金属株式会社 高純度錫合金
JP2017113756A (ja) 2015-12-21 2017-06-29 住友金属鉱山株式会社 表面性に優れたＳｎを主成分とするはんだ合金及びその選別方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5019764B1 (https=) * 1971-04-30 1975-07-09
JP2005040847A (ja) * 2003-07-25 2005-02-17 Hitachi Metals Ltd はんだボールの製造方法
JP2005103645A (ja) 2004-10-29 2005-04-21 Hitachi Metals Ltd はんだボールおよびその製造方法
WO2012127642A1 (ja) * 2011-03-23 2012-09-27 千住金属工業株式会社 鉛フリーはんだ合金
CN105307812B (zh) * 2013-04-09 2018-03-27 千住金属工业株式会社 焊膏
JP6717559B2 (ja) 2013-10-16 2020-07-01 三井金属鉱業株式会社 半田合金及び半田粉
JP5534122B1 (ja) * 2014-02-04 2014-06-25 千住金属工業株式会社 核ボール、はんだペースト、フォームはんだ、フラックスコート核ボールおよびはんだ継手
US10518362B2 (en) * 2015-07-24 2019-12-31 Harima Chemicals, Incorporated Solder alloy, solder paste, and electronic circuit board
BR112018068596A2 (pt) * 2016-03-22 2019-02-12 Tamura Corporation liga de soldas sem chumbo, composição de fluxo, composição de pasta de solda, placa de circuito eletrônico, e controlador eletrônico
WO2018181873A1 (ja) * 2017-03-31 2018-10-04 千住金属工業株式会社 はんだ合金、ソルダペースト及びはんだ継手
JP6540869B1 (ja) * 2018-03-30 2019-07-10 千住金属工業株式会社 はんだペースト
JP6521161B1 (ja) * 2018-07-20 2019-05-29 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手
JP7331579B2 (ja) * 2018-09-28 2023-08-23 荒川化学工業株式会社 鉛フリーはんだフラックス、鉛フリーソルダペースト
JP2020011293A (ja) * 2019-04-11 2020-01-23 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5296269B1 (ja) * 2005-07-01 2013-09-25 Ｊｘ日鉱日石金属株式会社 高純度錫合金
JP5019764B2 (ja) 2006-03-09 2012-09-05 新日鉄マテリアルズ株式会社 鉛フリーハンダ合金、ハンダボール及び電子部材
JP2017113756A (ja) 2015-12-21 2017-06-29 住友金属鉱山株式会社 表面性に優れたＳｎを主成分とするはんだ合金及びその選別方法

Also Published As

Publication number Publication date
JP7212300B2 (ja) 2023-01-25
TWI782423B (zh) 2022-11-01
KR20220149610A (ko) 2022-11-08
TW202142347A (zh) 2021-11-16
WO2021205760A1 (ja) 2021-10-14
JPWO2021205760A1 (https=) 2021-10-14
CN115768591A (zh) 2023-03-07

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