CN115722425B - 加热处理装置 - Google Patents

加热处理装置 Download PDF

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Publication number
CN115722425B
CN115722425B CN202210878151.1A CN202210878151A CN115722425B CN 115722425 B CN115722425 B CN 115722425B CN 202210878151 A CN202210878151 A CN 202210878151A CN 115722425 B CN115722425 B CN 115722425B
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CN
China
Prior art keywords
temperature
workpiece
heating
temperature control
valve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202210878151.1A
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English (en)
Chinese (zh)
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CN115722425A (zh
Inventor
黒泽雅彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to CN202311543732.0A priority Critical patent/CN118268215A/zh
Publication of CN115722425A publication Critical patent/CN115722425A/zh
Application granted granted Critical
Publication of CN115722425B publication Critical patent/CN115722425B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • B05D3/0263—After-treatment with IR heaters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0466—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being a non-reacting gas
    • B05D3/048—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being a non-reacting gas for cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any of groups F27B1/00 - F27B15/00
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Chamber type furnaces specially adapted for treating semiconductor wafers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00—Forming, maintaining or circulating atmospheres in heating chambers
    • F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Furnace Details (AREA)
CN202210878151.1A 2021-08-26 2022-07-25 加热处理装置 Active CN115722425B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311543732.0A CN118268215A (zh) 2021-08-26 2022-07-25 加热处理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021138109A JP7565252B2 (ja) 2021-08-26 2021-08-26 加熱処理装置
JP2021-138109 2021-08-26

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202311543732.0A Division CN118268215A (zh) 2021-08-26 2022-07-25 加热处理装置

Publications (2)

Publication Number Publication Date
CN115722425A CN115722425A (zh) 2023-03-03
CN115722425B true CN115722425B (zh) 2024-01-23

Family

ID=85292598

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202210878151.1A Active CN115722425B (zh) 2021-08-26 2022-07-25 加热处理装置
CN202311543732.0A Pending CN118268215A (zh) 2021-08-26 2022-07-25 加热处理装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202311543732.0A Pending CN118268215A (zh) 2021-08-26 2022-07-25 加热处理装置

Country Status (4)

Country Link
JP (1) JP7565252B2 (https=)
KR (1) KR102752956B1 (https=)
CN (2) CN115722425B (https=)
TW (1) TWI844060B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7465855B2 (ja) * 2021-09-27 2024-04-11 芝浦メカトロニクス株式会社 加熱処理装置、搬入搬出治具、および有機膜の形成方法
JP7761983B2 (ja) * 2023-03-22 2025-10-29 芝浦メカトロニクス株式会社 加熱処理装置
JP7751615B2 (ja) * 2023-09-26 2025-10-08 芝浦メカトロニクス株式会社 加熱処理装置
CN117524930B (zh) * 2023-11-07 2025-05-06 拓荆创益(沈阳)半导体设备有限公司 一种半导体腔室双加热盘的温度控制系统和方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10311676A (ja) * 1997-05-14 1998-11-24 Shibaura Eng Works Co Ltd 真空乾燥処理装置
JP2000234872A (ja) * 1999-02-10 2000-08-29 Dainippon Screen Mfg Co Ltd 熱処理装置
CN101276735A (zh) * 2007-03-29 2008-10-01 大日本网目版制造株式会社 基板热处理装置和喷嘴部件
CN101556905A (zh) * 2007-10-12 2009-10-14 东京毅力科创株式会社 热处理装置、热处理方法和存储介质
CN101712026A (zh) * 2009-11-17 2010-05-26 常州市超顺电子技术有限公司 涂胶铜箔焙烘箱
CN102177407A (zh) * 2008-08-08 2011-09-07 芝浦机械电子株式会社 热处理装置及热处理方法
CN105953540A (zh) * 2016-05-25 2016-09-21 刘明月 一种片状中药茯苓烘烤设备专用烘烤装置
CN110323161A (zh) * 2018-03-30 2019-10-11 芝浦机械电子株式会社 有机膜形成装置以及有机膜制造方法
CN110391132A (zh) * 2018-04-16 2019-10-29 芝浦机械电子株式会社 有机膜形成装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61251128A (ja) * 1985-04-30 1986-11-08 Toshiba Corp 半導体基板の熱処理方法および装置
JP3380988B2 (ja) 1993-04-21 2003-02-24 東京エレクトロン株式会社 熱処理装置
US7037797B1 (en) 2000-03-17 2006-05-02 Mattson Technology, Inc. Localized heating and cooling of substrates
MY135074A (en) * 2001-08-27 2008-01-31 Mitsubishi Materials Corp Sensor mounting device and sensor
TWI268556B (en) * 2005-02-28 2006-12-11 Viatron Tech Inc System for heat treatment of semiconductor device
WO2014111622A1 (en) * 2013-01-18 2014-07-24 Feracitas Oy A method for improving an air circulation and a way for heating air in a glass tempering oven
JP7008727B2 (ja) 2017-12-15 2022-01-25 芝浦メカトロニクス株式会社 有機膜形成装置
JP6871959B2 (ja) 2018-03-30 2021-05-19 芝浦メカトロニクス株式会社 有機膜形成装置、および有機膜の製造方法
JP6940541B2 (ja) * 2018-04-16 2021-09-29 芝浦メカトロニクス株式会社 有機膜形成装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10311676A (ja) * 1997-05-14 1998-11-24 Shibaura Eng Works Co Ltd 真空乾燥処理装置
JP2000234872A (ja) * 1999-02-10 2000-08-29 Dainippon Screen Mfg Co Ltd 熱処理装置
CN101276735A (zh) * 2007-03-29 2008-10-01 大日本网目版制造株式会社 基板热处理装置和喷嘴部件
CN101556905A (zh) * 2007-10-12 2009-10-14 东京毅力科创株式会社 热处理装置、热处理方法和存储介质
CN102177407A (zh) * 2008-08-08 2011-09-07 芝浦机械电子株式会社 热处理装置及热处理方法
CN101712026A (zh) * 2009-11-17 2010-05-26 常州市超顺电子技术有限公司 涂胶铜箔焙烘箱
CN105953540A (zh) * 2016-05-25 2016-09-21 刘明月 一种片状中药茯苓烘烤设备专用烘烤装置
CN110323161A (zh) * 2018-03-30 2019-10-11 芝浦机械电子株式会社 有机膜形成装置以及有机膜制造方法
CN110391132A (zh) * 2018-04-16 2019-10-29 芝浦机械电子株式会社 有机膜形成装置

Also Published As

Publication number Publication date
CN118268215A (zh) 2024-07-02
JP2023032160A (ja) 2023-03-09
KR102752956B1 (ko) 2025-01-09
TWI844060B (zh) 2024-06-01
JP7565252B2 (ja) 2024-10-10
CN115722425A (zh) 2023-03-03
TW202310671A (zh) 2023-03-01
KR20230031137A (ko) 2023-03-07

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