KR102752956B1 - 가열 처리 장치 - Google Patents

가열 처리 장치 Download PDF

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Publication number
KR102752956B1
KR102752956B1 KR1020220097343A KR20220097343A KR102752956B1 KR 102752956 B1 KR102752956 B1 KR 102752956B1 KR 1020220097343 A KR1020220097343 A KR 1020220097343A KR 20220097343 A KR20220097343 A KR 20220097343A KR 102752956 B1 KR102752956 B1 KR 102752956B1
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KR
South Korea
Prior art keywords
temperature
unit
heating
work
valve
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KR1020220097343A
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English (en)
Korean (ko)
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KR20230031137A (ko
Inventor
마사히코 구로사와
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
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Publication of KR20230031137A publication Critical patent/KR20230031137A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H01L21/67098—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • B05D3/0263—After-treatment with IR heaters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0466—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being a non-reacting gas
    • B05D3/048—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being a non-reacting gas for cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any of groups F27B1/00 - F27B15/00
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Chamber type furnaces specially adapted for treating semiconductor wafers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00—Forming, maintaining or circulating atmospheres in heating chambers
    • F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers
    • H01L21/67017—
    • H01L21/67248—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Furnace Details (AREA)
KR1020220097343A 2021-08-26 2022-08-04 가열 처리 장치 Active KR102752956B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021138109A JP7565252B2 (ja) 2021-08-26 2021-08-26 加熱処理装置
JPJP-P-2021-138109 2021-08-26

Publications (2)

Publication Number Publication Date
KR20230031137A KR20230031137A (ko) 2023-03-07
KR102752956B1 true KR102752956B1 (ko) 2025-01-09

Family

ID=85292598

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220097343A Active KR102752956B1 (ko) 2021-08-26 2022-08-04 가열 처리 장치

Country Status (4)

Country Link
JP (1) JP7565252B2 (https=)
KR (1) KR102752956B1 (https=)
CN (2) CN115722425B (https=)
TW (1) TWI844060B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7465855B2 (ja) * 2021-09-27 2024-04-11 芝浦メカトロニクス株式会社 加熱処理装置、搬入搬出治具、および有機膜の形成方法
JP7761983B2 (ja) * 2023-03-22 2025-10-29 芝浦メカトロニクス株式会社 加熱処理装置
JP7751615B2 (ja) * 2023-09-26 2025-10-08 芝浦メカトロニクス株式会社 加熱処理装置
CN117524930B (zh) * 2023-11-07 2025-05-06 拓荆创益(沈阳)半导体设备有限公司 一种半导体腔室双加热盘的温度控制系统和方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61251128A (ja) * 1985-04-30 1986-11-08 Toshiba Corp 半導体基板の熱処理方法および装置
JP3380988B2 (ja) 1993-04-21 2003-02-24 東京エレクトロン株式会社 熱処理装置
JP3831478B2 (ja) * 1997-05-14 2006-10-11 芝浦メカトロニクス株式会社 真空乾燥処理装置
JP4017276B2 (ja) * 1999-02-10 2007-12-05 大日本スクリーン製造株式会社 熱処理装置
US7037797B1 (en) 2000-03-17 2006-05-02 Mattson Technology, Inc. Localized heating and cooling of substrates
MY135074A (en) * 2001-08-27 2008-01-31 Mitsubishi Materials Corp Sensor mounting device and sensor
TWI268556B (en) * 2005-02-28 2006-12-11 Viatron Tech Inc System for heat treatment of semiconductor device
JP4988401B2 (ja) * 2007-03-29 2012-08-01 大日本スクリーン製造株式会社 基板熱処理装置
JP5029535B2 (ja) * 2007-10-12 2012-09-19 東京エレクトロン株式会社 熱処理装置、熱処理方法及び記憶媒体
CN102177407A (zh) * 2008-08-08 2011-09-07 芝浦机械电子株式会社 热处理装置及热处理方法
CN101712026B (zh) * 2009-11-17 2012-07-11 常州市超顺电子技术有限公司 涂胶铜箔焙烘箱
WO2014111622A1 (en) * 2013-01-18 2014-07-24 Feracitas Oy A method for improving an air circulation and a way for heating air in a glass tempering oven
CN105953540A (zh) * 2016-05-25 2016-09-21 刘明月 一种片状中药茯苓烘烤设备专用烘烤装置
JP7008727B2 (ja) 2017-12-15 2022-01-25 芝浦メカトロニクス株式会社 有機膜形成装置
KR102226624B1 (ko) * 2018-03-30 2021-03-12 시바우라 메카트로닉스 가부시끼가이샤 유기막 형성 장치, 및 유기막의 제조 방법
JP6871959B2 (ja) 2018-03-30 2021-05-19 芝浦メカトロニクス株式会社 有機膜形成装置、および有機膜の製造方法
CN110391132B (zh) * 2018-04-16 2023-05-16 芝浦机械电子株式会社 有机膜形成装置
JP6940541B2 (ja) * 2018-04-16 2021-09-29 芝浦メカトロニクス株式会社 有機膜形成装置

Also Published As

Publication number Publication date
CN118268215A (zh) 2024-07-02
CN115722425B (zh) 2024-01-23
JP2023032160A (ja) 2023-03-09
TWI844060B (zh) 2024-06-01
JP7565252B2 (ja) 2024-10-10
CN115722425A (zh) 2023-03-03
TW202310671A (zh) 2023-03-01
KR20230031137A (ko) 2023-03-07

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