CN115551184A - Printed circuit board interconnected by conical column and manufacturing method thereof - Google Patents
Printed circuit board interconnected by conical column and manufacturing method thereof Download PDFInfo
- Publication number
- CN115551184A CN115551184A CN202211203902.6A CN202211203902A CN115551184A CN 115551184 A CN115551184 A CN 115551184A CN 202211203902 A CN202211203902 A CN 202211203902A CN 115551184 A CN115551184 A CN 115551184A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- hard board
- copper
- board substrate
- conical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a printed circuit board interconnected by conical columns and a manufacturing method thereof, wherein the printed circuit board comprises a hard board substrate, a first copper foil, a second copper foil and a prepreg; a through cylindrical through hole is arranged between the second copper foils at the uppermost layer and the lowermost layer, and a copper plating layer is arranged on the inner wall of the through cylindrical through hole; a conical column with a big head end facing upwards is arranged in the first copper foil positioned on the upper surface of the hard board substrate and the upper half layer of the hard board substrate; a conical column with a big head end facing upwards is arranged above the corresponding hard board substrate, in the second copper foil and the prepreg below the second copper foil; conical columns with large head ends facing downwards are arranged in the first copper foil on the lower surface of the hard board substrate and the lower half layer of the hard board substrate; a conical column with a big head end facing downwards is arranged below the corresponding hard board substrate and in the second copper foil and the prepreg above the second copper foil; all the second copper foils and the first copper foils are interconnected through the tapered columns and the copper-plated layers which are laminated together. The invention has simple production process, can effectively reduce the production cost and improve the production efficiency.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a printed circuit board interconnected by adopting tapered columns and a manufacturing method thereof.
Background
The requirement of the existing carrier plate on the flatness of the plate surface is higher and higher, the surfaces of Via holes or blind holes are required to be flat, and the existing stage process has the following problems:
1. the production flow is complex: the Via holes are generally designed on the similar carrier plate, and in order to smooth the surface of the through hole, the procedures of resin hole plugging, grinding of a copper-plated cover and the like are required, so that the process is long, and the uniformity of the copper thickness is poor.
2. The production cost is high: after the through hole is electroplated, resin plug holes and electroplating processes are added, and a plurality of stations are needed.
3. The production period is long: the flow is lengthened, and the production period is naturally available.
4. Poor yield rate: one plate of the similar carrier plate is designed into a double-sided plate, the plate thickness is different from 4mil to 10mil, and after hole plugging is carried out in the plate thickness range, resin grinding is easy to clamp the plate and expand and contract to deform, so that the plate surface quality is abnormal.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a printed circuit board which can save the process flow and reduce the deformation of the plate and is interconnected by adopting a conical column and a manufacturing method thereof.
According to the technical scheme provided by the invention, the printed circuit board which is interconnected by adopting the tapered columns comprises a hard board, a prepreg and a second copper foil; the hard board comprises a hard board substrate and first copper foils positioned on the upper surface and the lower surface of the hard board substrate; at least one layer of second copper foil is arranged above the hard board substrate, and the adjacent two layers of second copper foils and the second copper foil and the first copper foil are connected through prepregs, or the second copper foil and the adjacent first copper foil are connected through prepregs; at least one layer of second copper foil is arranged below the hard board substrate, and the adjacent two layers of second copper foils and the second copper foil and the first copper foil are connected through prepregs, or the second copper foil and the adjacent first copper foil are connected through prepregs;
a penetrating cylindrical through hole is formed between the uppermost layer of second copper foil and the lowermost layer of second copper foil, and a copper plating layer is arranged on the inner wall of the cylindrical through hole;
a conical column with a large head end arranged upwards is arranged in the first copper foil positioned on the upper surface of the hard board substrate and the upper half layer of the hard board substrate; conical columns with upward large end are arranged above the corresponding hard board substrate in the second copper foil and the semi-solidified sheet below the second copper foil;
conical columns with large ends arranged downwards are arranged in the first copper foil positioned on the lower surface of the hard board substrate and the lower half layer of the hard board substrate; a conical column with a downward big end is arranged in the second copper foil and the prepreg above the second copper foil below the corresponding hard board substrate;
all the second copper foils are connected with the first copper foils in an interconnecting mode through the conical columns and the copper-plated layers which are laminated together.
Preferably, the diameter of the large head end of the conical column is 75 to 125 mu m, and the diameter of the small head end of the conical column is 50 to 75 mu m.
Preferably, the diameter of the cylindrical through hole is 100 to 248 mu m, and the thickness of a copper plating layer arranged on the inner wall of the cylindrical through hole is 12.7 to 20.3 mu m.
Preferably, the number of layers of the second copper foil positioned above the hard board is 1 to 8, and the number of layers of the second copper foil positioned below the hard board is 1 to 8.
The manufacturing method of the printed circuit board adopting the tapered column for interconnection comprises the following steps:
s1, providing a hard board, wherein the hard board comprises a hard board substrate and first copper foils located on the upper surface and the lower surface of the hard board substrate;
s2, processing an interconnected conical blind hole with a large opening end facing upwards in the first copper foil positioned on the upper surface of the hard board substrate and the upper half layer of the hard board substrate through laser;
s3, machining a downward-opening-end interconnected conical blind hole in the first copper foil positioned on the lower surface of the hard board substrate and the lower half layer of the hard board substrate through laser, and enabling a small-opening end of the downward-opening-end interconnected conical blind hole to be in conduction butt joint with a small-opening end of the upward-opening-end interconnected conical blind hole;
s4, filling and leveling the interconnected conical blind holes to form conical columns;
s5, etching the first copper foils on the upper surface and the lower surface of the hard board substrate to manufacture circuit patterns;
s6, preparing a prepreg;
s7, preparing a second copper foil;
s8, laminating the second copper foil, the prepreg, the hard board, the prepreg and the second copper foil in sequence from bottom to top to finish lamination of the multilayer board;
s9, forming an interconnected conical blind hole with an upward large opening end in the second copper foil above the corresponding hard board substrate and the semi-curing piece below the second copper foil through laser processing, and enabling the interconnected conical blind hole to be in butt joint with the corresponding conical column; an interconnection tapered blind hole with a large opening end facing downwards is processed in a second copper foil below the corresponding hard board substrate and a prepreg above the second copper foil through laser, so that the interconnection tapered blind hole is butted with the corresponding tapered column;
s10, manufacturing a cylindrical through hole between the second copper foil on the uppermost layer and the second copper foil on the lowermost layer;
s11, filling and leveling the interconnected conical blind holes to form conical columns, and plating copper in the cylindrical through holes to form copper plating layers;
s12, etching the second copper foil on the uppermost layer and the second copper foil on the lowermost layer to manufacture a circuit pattern;
and S13, determining the times of repeating the steps S8 to S12 according to needs, and forming the printed circuit board which is interconnected by adopting the tapered columns.
Preferably, the diameter of the big end of the interconnected conical blind hole is 75 to 125 μm, and the diameter of the small end of the interconnected conical blind hole is 50 to 75 μm.
Preferably, in step S13, the number of times of repeating steps S8 to S12 is 2 to 7.
The invention directly adopts the mode of laser drilling conical through holes on two sides and filling and leveling by hole filling and electroplating, has simple production process, can effectively reduce the production cost and improve the production efficiency.
Drawings
Fig. 1 is a structural diagram of a hard sheet used in step S1 of embodiment 1 and embodiment 2.
Fig. 2 is a structural diagram of the hard sheet subjected to the step S2 in examples 1 and 2.
Fig. 3 is a structural diagram of the hard sheet after the step S3 processing in embodiment 1 and embodiment 2.
Fig. 4 is a structural diagram of the hard sheet after the step S4 processing in embodiment 1 and embodiment 2.
Fig. 5 is a structural diagram of the hard sheet after the processing of step S5 in embodiment 1 and embodiment 2.
Fig. 6 is a structural diagram of a prepreg used in step S6 of example 1 and example 2.
Fig. 7 is a structural diagram of the second copper foil used in step S7 of examples 1 and 2.
Fig. 8 is a structural diagram of a multilayer board after lamination in step S8 in example 1 and example 2.
Fig. 9 is a structural diagram of the multilayer board of example 1 and example 2 after being subjected to the step S9.
Fig. 10 is a structural diagram of the multilayer board of example 1 and example 2 after being subjected to the step S10.
FIG. 11 is a structural diagram of the multilayer board of examples 1 and 2 after being subjected to the step S11.
FIG. 12 is a schematic diagram of a structure of a finished product of embodiment 1 and a schematic diagram of a structure of a semifinished product of embodiment 2.
FIG. 13 is a structural view of a product of example 2.
Detailed Description
The present invention is further illustrated by the following examples.
Example 1
A printed wiring board using tapered pillars for interconnection, as shown in fig. 12, includes a hard board 1, a prepreg 2, and a second copper foil 3; the hard board 1 comprises a hard board substrate 1.1 and first copper foils 1.2 positioned on the upper surface and the lower surface of the hard board substrate 1.1; a layer of second copper foil 3 is arranged above the hard board substrate 1.1, and the second copper foil 3 is connected with the adjacent first copper foil 1.2 through a prepreg 2; a layer of second copper foil 3 is arranged below the hard board substrate 1.1, and the second copper foil 3 is connected with the adjacent first copper foil 1.2 through a prepreg 2;
a penetrating cylindrical through hole is formed between the uppermost layer of second copper foil 3 and the lowermost layer of second copper foil 3, the diameter of the cylindrical through hole is 100-248 mu m, a copper plating layer 4 is arranged on the inner wall of the cylindrical through hole, and the thickness of the copper plating layer 4 is 12.7-20.3 mu m;
a tapered column 5 with a big head end upwards is arranged in the upper half layer of the first copper foil 1.2 positioned on the upper surface of the hard board substrate 1.1 and the hard board substrate 1.1, the diameter of the big head end of the tapered column 5 ranges from 75 to 125 micrometers, and the diameter of the small head end ranges from 50 to 75 micrometers; a conical column 5 with a big end upwards is arranged in the second copper foil 3 and the prepreg 2 positioned below the second copper foil above the corresponding hard board substrate 1.1, the diameter of the big end of the conical column 5 ranges from 75 to 125 micrometers, and the diameter of the small end ranges from 50 to 75 micrometers;
a tapered column 5 with a big end arranged downwards is arranged in the first copper foil 1.2 positioned on the lower surface of the hard board substrate 1.1 and the lower half layer of the hard board substrate 1.1, the diameter of the big end of the tapered column 5 is 75-125 mu m, and the diameter of the small end of the tapered column 5 is 50-75 mu m; a tapered column 5 with a downward big end is arranged below the corresponding hard board substrate 1.1 and in the second copper foil 3 and the prepreg 2 positioned above the tapered column, the diameter of the big end of the tapered column 5 is 75 to 125 micrometers, and the diameter of the small end of the tapered column 5 is 50 to 75 micrometers;
all the second copper foils 3 and the first copper foils 1.2 are interconnected through the tapered pillars 5 and the copper-plated layers 4 which are laminated together.
The manufacturing method of the printed circuit board interconnected by the tapered columns comprises the following steps:
s1, providing a hard board 1, wherein the hard board 1 comprises a hard board substrate 1.1 and first copper foils 1.2 positioned on the upper surface and the lower surface of the hard board substrate 1.1, as shown in FIG. 1;
s2, forming an interconnected conical blind hole 1.3 with a big opening end facing upwards in the first copper foil 1.2 positioned on the upper surface of the hard board substrate 1.1 and the upper half layer of the hard board substrate 1.1 through laser processing, wherein the diameter of the big head end of the interconnected conical blind hole 1.3 is 75-125 mu m, and the diameter of the small head end is 50-75 mu m, as shown in FIG. 2;
s3, forming a downward-big-end interconnected conical blind hole 1.3 in the lower half layer of the first copper foil 1.2 and the hard board substrate 1.1 on the lower surface of the hard board substrate 1.1 through laser machining, wherein the diameter of a big head end of the downward-big-end interconnected conical blind hole 1.3 is 75-125 micrometers, and the diameter of a small head end of the downward-big-end interconnected conical blind hole 1.3 is 50-75 micrometers, so that a small end of the downward-big-end interconnected conical blind hole 1.3 and a small end of the upward-big-end interconnected conical blind hole 1.3 are communicated and butted, as shown in FIG. 3;
s4, filling and leveling the interconnected conical blind holes 1.3 to form conical columns 5, as shown in FIG. 4;
s5, manufacturing circuit patterns on the first copper foils 1.2 on the upper surface and the lower surface of the hard board substrate 1.1 through etching, wherein the circuit patterns are shown in FIG. 5;
s6, preparing a prepreg 2 as shown in FIG. 6;
s7, preparing a second copper foil 3 as shown in FIG. 7;
s8, laminating the second copper foil 3, the prepreg 2, the hard board 1, the prepreg 2 and the second copper foil 3 in sequence from bottom to top to complete multi-layer board lamination, as shown in figure 8;
s9, forming an interconnected tapered blind hole 1.3 with a large opening end facing upwards in the second copper foil 3 above the corresponding hard board substrate 1.1 and the prepreg 2 below the second copper foil 3 through laser processing, wherein the diameter of the large head end of the interconnected tapered blind hole 1.3 is 75 to 125 micrometers, and the diameter of the small head end of the interconnected tapered blind hole 1.3 is 50 to 75 micrometers, so that the interconnected tapered blind hole 1.3 is butted with the corresponding tapered column 5; an interconnected conical blind hole 1.3 with a large opening end facing downwards is machined in a second copper foil 3 below a corresponding hard board substrate 1.1 and a prepreg 2 above the second copper foil 3 through laser, the diameter of the large head end of the interconnected conical blind hole 1.3 is 75-125 micrometers, and the diameter of the small head end of the interconnected conical blind hole is 50-75 micrometers, so that the interconnected conical blind hole 1.3 is butted with a corresponding conical column 5, as shown in fig. 9;
s10, manufacturing a cylindrical through hole 1.4 with the diameter of 100-248 mu m between the uppermost layer of second copper foil 3 and the lowermost layer of second copper foil 3, as shown in FIG. 10;
s11, filling the interconnected tapered blind holes 1.3 to form tapered columns 5, and carrying out copper plating in the cylindrical through holes 1.4 to form copper plating layers 4 with the thicknesses of 12.7 to 20.3 mu m, as shown in a figure 11;
and S12, etching to manufacture a circuit pattern on the second copper foil 3 at the uppermost layer and the second copper foil 3 at the lowermost layer to form a printed circuit board which is interconnected by tapered columns, wherein the total number of copper foil layers is 4, namely, the number of times of repeating S8-S12 is 0, as shown in FIG. 12.
Example 2
A printed wiring board using tapered pillars for interconnection, as shown in fig. 13, includes a hard board 1, a prepreg 2, and a second copper foil 3; the hard board 1 comprises a hard board substrate 1.1 and first copper foils 1.2 positioned on the upper surface and the lower surface of the hard board substrate 1.1; two layers of second copper foils 3 are arranged above the hard board substrate 1.1, and the adjacent second copper foils 3 and the adjacent first copper foils 1.2 are connected through prepregs 2; two layers of second copper foils 3 are arranged below the hard board substrate 1.1, and the adjacent second copper foils 3 and the adjacent first copper foils 1.2 are connected through prepregs 2;
a penetrating cylindrical through hole is formed between the uppermost layer of second copper foil 3 and the lowermost layer of second copper foil 3, the diameter of the cylindrical through hole is 100 to 248 mu m, a copper plating layer 4 is arranged on the inner wall of the cylindrical through hole, and the thickness of the copper plating layer 4 is 12.7 to 20.3 mu m;
a tapered column 5 with a big head end upwards is arranged in the first copper foil 1.2 positioned on the upper surface of the hard board substrate 1.1 and the upper half layer of the hard board substrate 1.1, the diameter of the big head end of the tapered column 5 is 75-125 μm, and the diameter of the small head end of the tapered column 5 is 50-75 μm; a conical column 5 with a large end upwards is arranged above the corresponding hard board substrate 1.1 and in the second copper foil 3 and the prepreg 2 below the second copper foil, the diameter of the large end of the conical column 5 is 75-125 μm, and the diameter of the small end of the conical column 5 is 50-75 μm;
a tapered column 5 with a big end arranged downwards is arranged in the first copper foil 1.2 positioned on the lower surface of the hard board substrate 1.1 and the lower half layer of the hard board substrate 1.1, the diameter of the big end of the tapered column 5 is 75-125 mu m, and the diameter of the small end of the tapered column 5 is 50-75 mu m; a tapered column 5 with a downward big end is arranged in the second copper foil 3 and the prepreg 2 positioned above the second copper foil below the corresponding hard board substrate 1.1, the diameter of the big end of the tapered column 5 ranges from 75 to 125 micrometers, and the diameter of the small end ranges from 50 to 75 micrometers;
all the second copper foils 3 and the first copper foils 1.2 are interconnected through the tapered pillars 5 and the copper-plated layers 4 which are laminated together.
The manufacturing method of the printed circuit board adopting the tapered column for interconnection comprises the following steps:
s1, providing a hard board 1, wherein the hard board 1 comprises a hard board substrate 1.1 and first copper foils 1.2 positioned on the upper surface and the lower surface of the hard board substrate 1.1, as shown in FIG. 1;
s2, forming an interconnected tapered blind hole 1.3 with a big end facing upwards in the first copper foil 1.2 positioned on the upper surface of the hard board substrate 1.1 and the upper half layer of the hard board substrate 1.1 through laser processing, wherein the diameter of the big end of the interconnected tapered blind hole 1.3 is 75 to 125 micrometers, and the diameter of the small end is 50 to 75 micrometers, as shown in figure 2;
s3, forming an interconnected conical blind hole 1.3 with a downward big end through laser processing in the lower half layer of the first copper foil 1.2 and the hard board substrate 1.1, wherein the first copper foil is positioned on the lower surface of the hard board substrate 1.1, the diameter of the big end of the interconnected conical blind hole 1.3 ranges from 75 to 125 micrometers, and the diameter of the small end ranges from 50 to 75 micrometers, so that the small end of the interconnected conical blind hole 1.3 with the downward big end and the small end of the interconnected conical blind hole 1.3 with the upward big end are butted, as shown in FIG. 3;
s4, filling and leveling the interconnected conical blind holes to form conical columns 5, as shown in FIG. 4;
s5, manufacturing circuit patterns on the first copper foils 1.2 on the upper surface and the lower surface of the hard board substrate 1.1 through etching, wherein the circuit patterns are shown in FIG. 5;
s6, preparing a prepreg 2 as shown in FIG. 6;
s7, preparing a second copper foil 3 as shown in FIG. 7;
s8, overlapping the second copper foil 3, the prepreg 2 and the hard board 1 to complete multi-layer board lamination, so that the upper part and the lower part of the hard board 1 are connected with a layer of second copper foil 3 through a layer of prepreg 2, as shown in FIG. 8;
s9, laser processing is carried out on the second copper foil 3 above the corresponding hard board substrate 1.1 and the prepreg 2 to form an interconnected conical blind hole 1.3 with a large opening end facing upwards, the diameter of the large head end of the interconnected conical blind hole 1.3 is 75-125 micrometers, and the diameter of the small head end of the interconnected conical blind hole is 50-75 micrometers, so that the interconnected conical blind hole 1.3 is butted with the corresponding conical column 5; an interconnection tapered blind hole 1.3 with a large opening end facing downwards is machined in a second copper foil 3 and a prepreg 2 below a corresponding hard board substrate 1.1 through laser, the diameter of a large head end of the interconnection tapered blind hole 1.3 is 75-125 micrometers, and the diameter of a small head end of the interconnection tapered blind hole is 50-75 micrometers, so that the interconnection tapered blind hole 1.3 is in butt joint with a corresponding tapered column 5, as shown in fig. 9;
s10, manufacturing a cylindrical through hole with the diameter of 100 to 248 mu m between the uppermost layer of second copper foil 3 and the lowermost layer of second copper foil 3, as shown in FIG. 10;
s11, filling the interconnected conical blind holes 1.3 to form conical columns 5, and carrying out copper plating in the cylindrical through holes to form copper plating layers 4 with the thickness of 12.7-20.3 mu m, as shown in FIG. 11;
s12, etching the uppermost second copper foil 3 and the lowermost second copper foil 3 to form a circuit pattern, as shown in fig. 12;
s13, repeating the steps S8-S12 once to form the printed circuit board which is interconnected by the tapered columns, wherein the total number of copper foil layers is 6, as shown in FIG. 13.
And repeating the steps S8-S12 for different times to obtain the printed circuit board with the second copper foil 3 with different layers and interconnected by the tapered columns.
Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to examples, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.
Claims (7)
1. A printed circuit board adopting tapered columns for interconnection comprises a hard board (1), a prepreg (2) and a second copper foil (3); the hard board (1) comprises a hard board substrate (1.1) and first copper foils (1.2) positioned on the upper surface and the lower surface of the hard board substrate (1.1); at least one layer of second copper foil (3) is arranged above the hard board substrate (1.1), two adjacent layers of second copper foils (3) are connected through prepregs (2), and the second copper foils (3) are connected with the adjacent first copper foils (1.2), or the second copper foils (3) are connected with the adjacent first copper foils (1.2) through prepregs (2); at least one layer of second copper foil (3) is arranged below the hard board substrate (1.1), and the adjacent two layers of second copper foils (3) and the second copper foil (3) and the first copper foil (1.2) are connected through prepregs (2), or the second copper foil (3) and the adjacent first copper foil (1.2) are connected through prepregs (2);
a penetrating cylindrical through hole is formed between the uppermost layer of second copper foil (3) and the lowermost layer of second copper foil (3), and a copper plating layer (4) is arranged on the inner wall of the cylindrical through hole;
the method is characterized in that: a conical column (5) with a large head end arranged upwards is arranged in the first copper foil (1.2) positioned on the upper surface of the hard board substrate (1.1) and the upper half layer of the hard board substrate (1.1); a conical column (5) with a large head end arranged upwards is arranged above the corresponding hard board substrate (1.1) and in the second copper foil (3) and the prepreg (2) positioned below the second copper foil;
a conical column (5) with a big head end arranged downwards is arranged in the lower half layer of the first copper foil (1.2) positioned on the lower surface of the hard board substrate (1.1) and the hard board substrate (1.1); a conical column (5) with a large head end arranged downwards is arranged below the corresponding hard board substrate (1.1) and in the second copper foil (3) and the prepreg (2) positioned above the second copper foil;
all the second copper foils (3) are connected with the first copper foils (1.2) through the conical columns (5) and the copper-plated layers (4) which are laminated together.
2. The printed wiring board using tapered posts for interconnection of claim 1, wherein: the diameter of the large end of the conical column (5) is 75-125 μm, and the diameter of the small end is 50-75 μm.
3. The printed wiring board using tapered posts for interconnection of claim 1, wherein: the diameter of the cylindrical through hole is 100 to 248 mu m, and the thickness of a copper plating layer (4) arranged on the inner wall of the cylindrical through hole is 12.7 to 20.3 mu m.
4. The printed wiring board using tapered posts for interconnection of claim 1, wherein: the number of the layers of the second copper foil (3) above the hard board (1) is 1 to 8, and the number of the layers of the second copper foil (3) below the hard board (1) is 1 to 8.
5. The method of manufacturing a printed wiring board using tapered pillars for interconnection as set forth in claim 1, wherein the method comprises the steps of:
s1, providing a hard board (1), wherein the hard board (1) comprises a hard board substrate (1.1) and first copper foils (1.2) positioned on the upper surface and the lower surface of the hard board substrate (1.1);
s2, forming an interconnected conical blind hole (1.3) with a large opening end facing upwards in the first copper foil (1.2) on the upper surface of the hard board substrate (1.1) and the upper half layer of the hard board substrate (1.1) through laser processing;
s3, processing a downward-big-opening-end interconnected conical blind hole (1.3) in the lower half layer of the first copper foil (1.2) positioned on the lower surface of the hard board substrate (1.1) and the hard board substrate (1.1) through laser, and enabling a small opening end of the downward-big-opening-end interconnected conical blind hole (1.3) to be communicated and butted with a small opening end of the upward-big-opening-end interconnected conical blind hole (1.3);
s4, filling and leveling the interconnected conical blind holes to form a conical column (5);
s5, manufacturing circuit patterns on the first copper foils (1.2) on the upper surface and the lower surface of the hard board substrate (1.1) through etching;
s6, preparing a prepreg (2);
s7, preparing a second copper foil (3);
s8, overlapping the second copper foil (3), the prepreg (2), the hard board (1), the prepreg (2) and the second copper foil (3) in sequence from bottom to top to complete lamination of the multilayer board;
s9, forming an interconnected conical blind hole (1.3) with a large opening end facing upwards in a second copper foil (3) above a corresponding hard board substrate (1.1) and a prepreg (2) below the second copper foil (3) through laser processing, so that the interconnected conical blind hole (1.3) is butted with a corresponding conical column (5); a second copper foil (3) below the corresponding hard board substrate (1.1) and an interconnection tapered blind hole (1.3) with a large opening end facing downwards, which is positioned above the second copper foil (3) and in the prepreg (2), are processed by laser, so that the interconnection tapered blind hole (1.3) is butted with the corresponding tapered column (5);
s10, manufacturing a cylindrical through hole (1.4) between the second copper foil (3) on the uppermost layer and the second copper foil (3) on the lowermost layer;
s11, filling and leveling the interconnected conical blind holes (1.3) to form conical columns (5), and carrying out copper plating in the cylindrical through holes (1.4) to form copper plating layers (4);
s12, etching the second copper foil (3) on the uppermost layer and the second copper foil (3) on the lowermost layer to manufacture a circuit pattern;
and S13, determining the times of repeating the steps S8 to S12 according to needs, and forming the printed circuit board which is interconnected by adopting the tapered columns.
6. The method of manufacturing a printed wiring board using tapered pillars for interconnection of claim 5, wherein: the diameter of a large head end of the interconnected conical blind hole (1.3) is 75 to 125 mu m, and the diameter of a small head end of the interconnected conical blind hole is 50 to 75 mu m.
7. The method of manufacturing a printed wiring board using tapered pillars for interconnection of claim 5, wherein: in step S13, the number of times of repeating steps S8 to S12 is 2 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211203902.6A CN115551184A (en) | 2022-09-29 | 2022-09-29 | Printed circuit board interconnected by conical column and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211203902.6A CN115551184A (en) | 2022-09-29 | 2022-09-29 | Printed circuit board interconnected by conical column and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115551184A true CN115551184A (en) | 2022-12-30 |
Family
ID=84731921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211203902.6A Pending CN115551184A (en) | 2022-09-29 | 2022-09-29 | Printed circuit board interconnected by conical column and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115551184A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1311900A (en) * | 1998-11-25 | 2001-09-05 | 微型元件有限公司 | Device for electronic packaging, pin jig fixture |
| TWI235019B (en) * | 2004-07-27 | 2005-06-21 | Unimicron Technology Corp | Process of conductive column and circuit board with conductive column |
| CN102378478A (en) * | 2010-08-21 | 2012-03-14 | 揖斐电株式会社 | Printed wiring board and a method of manufacturing a printed wiring board |
| JP2017084914A (en) * | 2015-10-26 | 2017-05-18 | 京セラ株式会社 | Printed wiring board and method of manufacturing the same |
| US20190124765A1 (en) * | 2017-10-24 | 2019-04-25 | Ibiden Co., Ltd. | Printed wiring board |
| CN210781530U (en) * | 2019-06-28 | 2020-06-16 | 赛创电气（铜陵）有限公司 | Base plate hole pattern structure and PCB |
-
2022
- 2022-09-29 CN CN202211203902.6A patent/CN115551184A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1311900A (en) * | 1998-11-25 | 2001-09-05 | 微型元件有限公司 | Device for electronic packaging, pin jig fixture |
| TWI235019B (en) * | 2004-07-27 | 2005-06-21 | Unimicron Technology Corp | Process of conductive column and circuit board with conductive column |
| CN102378478A (en) * | 2010-08-21 | 2012-03-14 | 揖斐电株式会社 | Printed wiring board and a method of manufacturing a printed wiring board |
| JP2012069926A (en) * | 2010-08-21 | 2012-04-05 | Ibiden Co Ltd | Printed wiring board and manufacturing method therefor |
| JP2017084914A (en) * | 2015-10-26 | 2017-05-18 | 京セラ株式会社 | Printed wiring board and method of manufacturing the same |
| US20190124765A1 (en) * | 2017-10-24 | 2019-04-25 | Ibiden Co., Ltd. | Printed wiring board |
| CN210781530U (en) * | 2019-06-28 | 2020-06-16 | 赛创电气（铜陵）有限公司 | Base plate hole pattern structure and PCB |
Non-Patent Citations (1)
| Title |
|---|
| 何为: "《印制电路基础：原理、工艺技术及应用》", 北京：机械工业出版社, pages: 294 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101827496B (en) | Method for machining PCB with step groove | |
| CN106961808B (en) | The production method of sunk type high density interconnecting board | |
| CN105934110A (en) | Sandwich structure for ultrathin laminated board processing and laminated board manufacturing method | |
| CN101541145A (en) | Processing method of ultra-thin core board in manufacturing of printed circuit board or integrated circuit package substrate | |
| WO2012065376A1 (en) | Substrate of printed circuit board and manufacturing method thereof | |
| CN101720175A (en) | Manufacturing method of multi-layer circuit board with high aspect ratio blind hole and multi-layer circuit board | |
| JP6036837B2 (en) | Multilayer wiring board and method for manufacturing multilayer wiring board | |
| CN105704948A (en) | Manufacturing method of ultra-thin printed circuit board and ultra-thin printed circuit board | |
| CN112218430A (en) | Manufacturing method of copper block-embedded circuit board of new energy automobile | |
| CN104053300A (en) | Locating hole structure of soft and hard multilayer circuit board and setting method of locating hole | |
| CN104519681B (en) | The preparation method of the high Aligning degree line card type printed circuit board of high-layer oversize | |
| TWI578873B (en) | Manufacturing method of high-density multilayer board | |
| CN108684160A (en) | A kind of multistage blind hole HDI board manufacturing methods | |
| CN115551184A (en) | Printed circuit board interconnected by conical column and manufacturing method thereof | |
| CN103517580A (en) | Manufacturing method of multilayer PCB board and multilayer PCB board | |
| CN103889167A (en) | Method for forming via holes and embedded holes in multilayer circuit board | |
| CN203912323U (en) | Location hole structure of flexible/hard multilayer circuit board | |
| CN111954381A (en) | Process method for manufacturing sandwich aluminum-based double-sided board | |
| CN104812163A (en) | HDI (high density interconnect) PCB (printed circuit board) laminated structure | |
| CN115103513A (en) | PCB (printed circuit board) with high-depth-aperture-ratio metal blind hole plug-in hole and manufacturing process thereof | |
| CN113099604B (en) | Interconnection printed circuit board for ultrahigh heat dissipation requirement product and manufacturing method thereof | |
| CN112638064A (en) | Printed circuit board with second-order blind hole and processing method | |
| CN110461085B (en) | Circuit board capable of realizing crimping of components in stepped groove and manufacturing method thereof | |
| CN201571253U (en) | High-layer circuit board | |
| CN112105163A (en) | Manufacturing method for realizing rapid compression joint of blind hole circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |