CN115494591B - Composite heat radiation system capable of plugging optical module and optical communication equipment - Google Patents
Composite heat radiation system capable of plugging optical module and optical communication equipment Download PDFInfo
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- CN115494591B CN115494591B CN202211139765.4A CN202211139765A CN115494591B CN 115494591 B CN115494591 B CN 115494591B CN 202211139765 A CN202211139765 A CN 202211139765A CN 115494591 B CN115494591 B CN 115494591B
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- power consumption
- radiator
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Optics & Photonics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a composite heat radiation system of pluggable optical module and optical communication equipment, comprising: a base, wherein a space for accommodating power consumption devices is formed in the base; the radiator is used for being arranged on one side of the power consumption device, a temperature equalizing plate is clamped between the radiator and the base, one side of the temperature equalizing plate is attached to the radiator, and the other side of the temperature equalizing plate is attached to the power consumption device. According to the composite heat dissipation system and the optical communication equipment with the pluggable optical module, the temperature equalization plate is arranged between the power consumption device and the radiator, the temperature equalization plate is in contact with the power consumption device, so that the effect of temperature equalization can be achieved, local hot spots of the power consumption device can be reduced, heat of the power consumption device can be dissipated to the outside through the temperature equalization plate and the radiator, therefore, the thermal resistance of the surface of the power consumption device can be reduced, and the heat dissipation efficiency is improved. The reduction of the packaging thermal resistance improves the heat radiation capacity of the optical module, reduces the operation temperature of the optical module and prolongs the whole service life of the optical module.
Description
Technical Field
The present invention relates to the field of optical communications technologies, and in particular, to a composite heat dissipation system with pluggable optical modules and an optical communication device.
Background
At present, coherent optical modules are developed towards the miniaturization of packaging and the integration trend of multiple devices, the power consumption density is continuously improved, and the heat dissipation requirement is also higher and higher.
In the related technology, high-power-consumption devices inside the optical module are easy to generate local hot spots, the diffusion thermal resistance of the surface of the module is larger, so that the heat dissipation efficiency of the module is reduced, meanwhile, the heat exchange between the module body and the outside is difficult, the contact temperature rise between the module body and the radiator is continuously increased, and the low-packaging thermal resistance design of the optical module is an urgent direction of the heat dissipation design of the system in the process of constructing the devices, the modules, the single-disk and the full-link heat dissipation optimized coupling design of the system.
Therefore, there is a need to design a composite heat dissipation system and an optical communication device with pluggable optical modules to overcome the above-mentioned problems.
Disclosure of Invention
The embodiment of the invention provides a composite heat dissipation system of a pluggable optical module and optical communication equipment, which are used for solving the problems that in the related art, the heat dissipation efficiency of the module is reduced and heat exchange between a module body and the outside is difficult due to larger diffusion thermal resistance of the surface of the module.
In a first aspect, a composite heat dissipation system for a pluggable optical module is provided, comprising: the base is internally provided with a space for accommodating power consumption devices; the radiator is used for being arranged on one side of the power consumption device, a temperature equalizing plate is clamped between the radiator and the base, one side of the temperature equalizing plate is attached to the radiator, and the other side of the temperature equalizing plate is attached to the power consumption device.
In some embodiments, the temperature equalizing plate protrudes toward the base to form a plurality of heat dissipation bosses, and the heat dissipation bosses are used for being attached to the power consumption device.
In some embodiments, the temperature equalization plate comprises a first cover plate and a second cover plate which are arranged at intervals, a plurality of stand columns are arranged between the first cover plate and the second cover plate, and the stand columns are arranged at intervals.
In some embodiments, the temperature equalization plate includes a first cover plate and a second cover plate that are arranged at intervals, a plurality of supporting spring plates are further arranged between the first cover plate and the second cover plate, one end of each supporting spring plate is connected with the first cover plate, and the other end of each supporting spring plate is connected with the second cover plate.
In some embodiments, the temperature equalization plate further includes a reinforcing frame, the reinforcing frame is located between the first cover plate and the second cover plate, and the reinforcing frame clamps and fixes the first cover plate and the second cover plate.
In some embodiments, the surface of the temperature uniformity plate is coated with a diamond coating, the diamond coating being located between the heat sink and the temperature uniformity plate.
In some embodiments, a groove is formed in the base at a position corresponding to the power consumption device, a heat conducting fin is embedded in the groove, and a heat conducting material is filled between the heat conducting fin and the power consumption device.
In some embodiments, the composite heat dissipation system further comprises a clamp mechanism for mounting to a single-disk panel, and the heat sink is pressed to the temperature equalization plate by the clamp mechanism.
In some embodiments, the clamp mechanism comprises: a compression boss is arranged on one side of the compression rod, which is close to the radiator; and the pulling handle is connected with the pressure bar through a driving mechanism, and when the pulling handle rotates, the pulling handle drives the pressure bar to move towards a direction close to or far away from the radiator through the driving mechanism.
In some embodiments, the pulling handle is provided with an operation part, one end of the pulling handle, which is far away from the operation part, is used for being hinged to the single-disc panel through a first pin shaft, and a second pin shaft is further installed on the pulling handle and is positioned between the operation part and the first pin shaft; the driving mechanism comprises a connecting rod, one end of the connecting rod is hinged to the second pin shaft, and the other end of the connecting rod is hinged to the pressing rod through a third pin shaft, so that the pressing rod is driven to move in a direction approaching to or away from the radiator through the connecting rod.
In a second aspect, an optical communication device is provided, which is characterized in that the optical communication device includes the composite heat dissipation system of the pluggable optical module.
The technical scheme provided by the invention has the beneficial effects that:
the embodiment of the invention provides a composite heat dissipation system of a pluggable optical module and optical communication equipment, wherein a temperature equalization plate is arranged between a power consumption device and a radiator, and is in contact with the power consumption device, so that the temperature equalization plate can play a role in equalizing temperature, local hot spots of the power consumption device can be reduced, and heat of the power consumption device can be dissipated to the outside through the temperature equalization plate and the radiator, therefore, the thermal resistance of the surface of the power consumption device can be reduced, and the heat dissipation efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is an exploded schematic view of a composite heat dissipation system of a pluggable optical module according to an embodiment of the present invention;
FIG. 2 is an exploded view of a temperature uniformity plate according to an embodiment of the present invention;
FIG. 3 is a schematic top view of a temperature uniformity plate according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of a temperature equalization plate according to an embodiment of the present invention;
fig. 5 is a schematic perspective view of a base according to an embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view of a base provided by an embodiment of the present invention;
fig. 7 is a schematic structural diagram of an optical module mounted on a single-disk panel according to an embodiment of the present invention;
FIG. 8 is a schematic perspective view of a clamp mechanism according to an embodiment of the present invention;
fig. 9 is a schematic structural view of a clamp mechanism according to another embodiment of the present invention.
In the figure:
1. a base; 11. a groove; 2. a power consumption device; 3. a heat sink;
4. a temperature equalizing plate; 41. a first cover plate; 42. a second cover plate; 43. a column; 44. a supporting spring plate; 45. reinforcing the frame; 5. a diamond coating;
6. a heat conductive sheet; 7. a single-plate panel;
8. a clamp mechanism; 81. a compression bar; 82. compressing the boss; 83. pulling the handle; 831. an operation unit; 84. a first pin; 85. a second pin; 86. a third pin; 87. a connecting rod; 88. a fourth pin;
9. an optical module.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The prior art of improving the heat radiation capability of the optical module mainly adopts high heat conduction structural member materials, selected high heat conduction interface materials, external radiator optimization and the like; the heat dissipation capacity of the above measure is limited to be improved, the scheme is single, and the problem that how to reduce the overall packaging heat resistance of the optical module is a problem to be solved urgently in the heat dissipation design of the optical module is faced with the current situation that the power consumption density of the current optical module is continuously improved.
The embodiment of the invention provides a composite heat dissipation system of a pluggable optical module and optical communication equipment, which can solve the problems of reduced heat dissipation efficiency of the module and difficult heat exchange between a module body and the outside caused by larger heat diffusion resistance of the surface of the module in the related technology.
Referring to fig. 1, a composite heat dissipation system of a pluggable optical module according to an embodiment of the present invention may include: a base 1, wherein a space for accommodating a power consumption device 2 is arranged in the base 1, and the power consumption device 2 generates heat when in operation; radiator 3, radiator 3 be used for set up in one side of consumption device 2, in this embodiment, radiator 3 can be located the top of consumption device 2, just radiator 3 with it is equipped with samming board 4 to press from both sides between the base 1, samming board 4 can tiling at the surface of consumption device 2, samming board 4 one side with radiator 3 laminating, the opposite side be used for with the laminating of consumption device 2. Wherein, it should be understood that the bonding herein may be direct bonding or indirect bonding.
In this embodiment, because the temperature equalizing plate 4 is disposed between the power consumption device 2 and the radiator 3, one side of the temperature equalizing plate 4 is in contact with the power consumption device 2, the temperature equalizing plate 4 can perform a temperature equalizing function on the power consumption device 2, so that local hot spots of the power consumption device 2 can be reduced, and heat of the power consumption device 2 can be dissipated to the outside through the temperature equalizing plate 4 and the radiator 3, therefore, thermal resistance of the surface of the power consumption device 2 can be reduced, and heat dissipation efficiency is improved.
Wherein, can be equipped with a small amount of water in the samming board 4, can form the steam chamber in samming board 4 after being heated and evaporated, build the heat emission passageway of low thermal resistance, and then the effect of realization samming that can be better.
Referring to fig. 2 and fig. 4, in some embodiments, the temperature equalizing plate 4 may protrude toward the base 1 to form a plurality of heat dissipation bosses, where the heat dissipation bosses may be formed by stamping from the temperature equalizing plate 4 to one side, or may be formed integrally or separately in other manners, and the heat dissipation bosses are used to attach to the power consumption device 2. The plurality of heat dissipation bosses can be arranged at intervals, and the combination of the plurality of heat dissipation bosses not only has the effect of laminating heat dissipation, but also has certain rigidity characteristic due to the concave-convex structural design.
Referring to fig. 2 to 4, in some alternative embodiments, the temperature equalizing plate 4 may include a first cover 41 and a second cover 42 that are disposed at intervals, and a plurality of columns 43 are disposed between the first cover 41 and the second cover 42 and the plurality of columns 43 are disposed at intervals. The plurality of columns 43 may be uniformly disposed on the surface of the first cover plate 41 or the second cover plate 42, and the plurality of columns 43 may support the first cover plate 41 and the second cover plate 42, so that the temperature equalizing plate 4 has sufficient rigidity and strength.
Further, referring to fig. 2 and 4, the temperature equalizing plate 4 includes a first cover plate 41 and a second cover plate 42 that are disposed at intervals, a plurality of supporting elastic pieces 44 are further disposed between the first cover plate 41 and the second cover plate 42, one end of each supporting elastic piece 44 is connected with the first cover plate 41, and the other end is connected with the second cover plate 42. The supporting elastic sheet 44 is supported between the first cover plate 41 and the second cover plate 42, and the supporting elastic sheet 44 has a certain elasticity, so that the first cover plate 41 and the second cover plate 42 are integrally connected through the supporting elastic sheet 44 and have a certain elasticity, and can be elastically deformed, so that the radiator 3 and the temperature equalization plate 4 can be fully contacted. The supporting spring plate 44 may be spaced from the upright 43, or may be disposed adjacent to the upright 43. In this embodiment, the upright posts 43 and the supporting spring pieces 44 are preferably alternately distributed, and the supporting spring pieces 44 are preferably Z-shaped.
Referring to fig. 2, in some embodiments, the temperature equalizing plate 4 may further include a reinforcing frame 45, where the reinforcing frame 45 is preferably four boxes, the reinforcing frame 45 is located between the first cover plate 41 and the second cover plate 42, and the reinforcing frame 45 clamps and fixes the first cover plate 41 and the second cover plate 42, so as to ensure that the temperature equalizing plate 4 has sufficient rigidity and strength during the plugging and unplugging process of the base 1.
Referring to fig. 4, in some alternative embodiments, the surface of the temperature uniformity plate 4 is coated with a diamond coating 5, and the diamond coating 5 may be attached to the upper surface of the temperature uniformity plate 4 by a vapor deposition method, and the diamond coating 5 is located between the heat sink 3 and the temperature uniformity plate 4. The diamond coating 5 has good heat conduction performance, the heat conduction coefficient reaches 2000W/m.K, the diamond coating 5 is attached to the upper surface, so that a tiny gap between the temperature equalizing plate 4 and the radiator 3 can be well filled, and the contact thermal resistance between the optical module 9 (wherein when the power consumption device 2 is assembled in the base 1, the temperature equalizing plate 4, the power consumption device 2, the base 1 and the like can form the optical module 9) and the radiator 3 is reduced; at the same time, the diamond coating 5 has the function of uniform temperature so as to eliminate local hot spots caused by the high-power consumption device 2.
Referring to fig. 5 and 6, in some embodiments, a groove 11 is provided at a position of the base 1 corresponding to the power consumption device 2, the groove 11 may or may not penetrate through the base 1, and a heat conducting sheet 6 may be embedded in the groove 11, where the heat conducting sheet 6 may be made of a high heat conducting material, preferably a copper sheet, and the heat conducting sheet 6 may be bonded to the base 1 by soldering, and since the material of the bottom case is generally aluminum (heat conductivity coefficient 200W/m.k), if the heat dissipation performance is to be improved, copper (heat conductivity coefficient 380W/m.k) may be made, but copper is relatively heavy and high in cost, the local copper embedding treatment is adopted in this embodiment, so that the cost can be reduced while the heat dissipation performance is improved. Further, a heat conducting material may be filled between the heat conducting fin 6 and the power consumption device 2 to perform auxiliary heat dissipation, so as to further eliminate local hot spots caused by the high power consumption device 2, and the heat conducting material may fill a micro gap between the heat conducting fin 6 and the power consumption device 2, so as to achieve sufficient contact between the power consumption device 2 and the heat conducting material.
Referring to fig. 7, in some alternative embodiments, the composite heat dissipation system may further comprise a fixture mechanism 8, the fixture mechanism 8 being configured to mount to the single-tray panel 7; and radiator 3 can compress tightly in through fixture mechanism 8 samming board 4, also can fasten radiator 3 and samming board 4 together through fixture mechanism 8, base 1 power consumption device 2 and samming board 4 can constitute optical module 9 install in single-disc panel 7, wherein, optical module 9 installs behind single-disc panel 7, can support fixture mechanism 8 in the outside of radiator 3, realizes the inseparable laminating of the inside radiator 3 of single-disc panel 7 and optical module 9, changes from traditional radiator 3 passive fixation into active fixation, reaches the problem that the dimensional solution contact thermal resistance is great from radiator 3 installation mode dimension.
Referring to fig. 7, further, the clamp mechanism 8 may include: a compression boss 82 is arranged on one side of the compression rod 81 close to the radiator 3, and the compression boss 82 protrudes out of the compression rod 81; and a pulling handle 83, wherein the pulling handle 83 is connected with the pressing rod 81 through a driving mechanism, and when the pulling handle 83 rotates, the pulling handle 83 drives the pressing rod 81 to move towards or away from the radiator 3 through the driving mechanism. Wherein, pull handle 83 can be rotary motion to can drive depression bar 81 and do the up-and-down motion, actuating mechanism can be with rotary motion conversion into up-and-down motion, and then realize depression bar 81 to the compaction of radiator 3 and loosen, in this embodiment, through setting up depression bar 81, pull handle 83 and actuating mechanism etc. the realization that can be convenient is pressed tightly and is loosen the action of clamp mechanism 8, and depression bar 81 can select long arm depression bar 81 for depression bar 81 can stretch into the middle part of radiator 3 and compress tightly. Meanwhile, the pressing boss 82 can be used for supporting the radiator 3, and when the pressing rod 81 does not contact the radiator 3, the pressing boss 82 contacts the radiator 3 first and supports the radiator 3.
Further, referring to fig. 8 and 9, the pulling handle 83 may have an operation portion 831, the operation portion 831 may be located at the top of the pulling handle 83, may be located at the bottom of the pulling handle 83, or may also horizontally place the pulling handle 83, one end of the pulling handle 83 away from the operation portion 831 is hinged to the single-disc panel 7 through a first pin 84, so that the pulling operation portion 831 may drive the pulling handle 83 to perform a rotational motion about an axis of the first pin 84, and a second pin 85 may be further installed on the pulling handle 83, where the second pin 85 is located between the operation portion 831 and the first pin 84, and when the pulling handle 83 rotates, the second pin 85 is also simultaneously driven to rotate together; the driving mechanism may include a connecting rod 87, one end of the connecting rod 87 is hinged to the second pin shaft 85, and the other end of the connecting rod 87 is hinged to the pressing rod 81 through a third pin shaft 86, so that when the second pin shaft 85 rotates, the second pin shaft 85 can drive one end of the connecting rod 87 to move, and then the connecting rod 87 rotates around the third pin shaft 86, when the second pin shaft 85 rotates downwards, the third pin shaft 86 at the other end of the connecting rod 87 can tilt upwards, and then the pressing rod 81 is driven to move upwards, and when the second pin shaft 85 rotates upwards, the third pin shaft 86 at the other end of the connecting rod 87 can move downwards, and then the pressing rod 81 is driven to move downwards, and then the pressing rod 81 can be driven to move towards a direction close to or far away from the radiator 3 through the connecting rod 87.
Further, one end of the pressing rod 81 may be hinged to the single-disc panel 7 through a fourth pin 88, so that the third pin 86 and the connecting rod 87 may rotate around the axis of the fourth pin 88 when the pressing rod 81 is driven to move. Of course, in other embodiments, the compression bar 81 may be limited to moving in a straight line.
The embodiment of the invention also provides optical communication equipment, which can comprise the composite heat dissipation system of the pluggable optical module provided in any embodiment.
The composite heat radiation system and the optical communication equipment of the pluggable optical module provided by the embodiment of the invention can reduce the packaging heat resistance of the pluggable optical module from multiple dimensions, and comprise a structure of a temperature equalizing plate 4, a heat radiation structure of a diamond coating 5, a copper embedding structure of a base 1, a structure of a fixture fixed radiator 3 and the like. The reduction of the packaging thermal resistance improves the heat radiation capability of the optical module 9, reduces the operation temperature of the optical module 9, prolongs the whole service life of the optical module 9, and improves the product temperature specification and the product competitiveness; and the reduction of the packaging thermal resistance transfers the heat radiation pressure of the system layer, so that the bottleneck problems of heat radiation of the radiator 3, the fan and other systems can be relieved, and the noise level of the system equipment is reduced, so that the equipment is more green, low-carbon and environment-friendly.
In the description of the present invention, it should be noted that the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present invention and simplifying the description, and are not indicative or implying that the apparatus or element in question must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present invention. Unless specifically stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
It should be noted that in the present invention, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing is only a specific embodiment of the invention to enable those skilled in the art to understand or practice the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. A composite heat dissipation system for pluggable optical modules, comprising:
the power consumption device comprises a base (1), wherein a space for accommodating the power consumption device (2) is arranged in the base (1);
the radiator (3) is used for being arranged on one side of the power consumption device (2), a temperature equalizing plate (4) is arranged between the radiator (3) and the base (1) in a clamping mode, one side of the temperature equalizing plate (4) is attached to the radiator (3), and the other side of the temperature equalizing plate is attached to the power consumption device (2);
the composite heat dissipation system further comprises a clamp mechanism (8), wherein the clamp mechanism (8) is used for being installed on a single-disc panel (7), and the radiator (3) is tightly pressed on the temperature equalizing plate (4) through the clamp mechanism (8); the clamp mechanism (8) comprises:
a compression boss (82) is arranged on one side of the compression rod (81) close to the radiator (3);
the pulling handle (83) is connected with the pressing rod (81) through a driving mechanism, and when the pulling handle (83) rotates, the pulling handle (83) drives the pressing rod (81) to move towards or away from the radiator (3) through the driving mechanism;
the pulling handle (83) is provided with an operation part (831), one end of the pulling handle (83) far away from the operation part (831) is hinged to the single-disc panel (7) through a first pin shaft (84), a second pin shaft (85) is further arranged on the pulling handle (83), and the second pin shaft (85) is positioned between the operation part (831) and the first pin shaft (84);
the driving mechanism comprises a connecting rod (87), one end of the connecting rod (87) is hinged to the second pin shaft (85), and the other end of the connecting rod (87) is hinged to the pressing rod (81) through a third pin shaft (86), so that the pressing rod (81) is driven to move towards a direction approaching or far away from the radiator (3) through the connecting rod (87).
2. The composite heat dissipation system of a pluggable optical module of claim 1, wherein:
the temperature equalizing plate (4) protrudes towards the base (1) to form a plurality of heat dissipation bosses, and the heat dissipation bosses are used for being attached to the power consumption device (2).
3. The composite heat dissipation system of a pluggable optical module of claim 1, wherein:
the temperature equalization plate (4) comprises a first cover plate (41) and a second cover plate (42) which are arranged at intervals, a plurality of stand columns (43) are arranged between the first cover plate (41) and the second cover plate (42), and the stand columns (43) are arranged at intervals.
4. A composite heat dissipation system for pluggable optical modules as defined in claim 1 or 3, wherein:
the temperature equalization plate (4) comprises a first cover plate (41) and a second cover plate (42) which are arranged at intervals, a plurality of supporting elastic pieces (44) are further arranged between the first cover plate (41) and the second cover plate (42), one end of each supporting elastic piece (44) is connected with the first cover plate (41), and the other end of each supporting elastic piece is connected with the second cover plate (42).
5. The composite heat dissipation system of a pluggable optical module of claim 1, wherein:
the surface of the temperature equalizing plate (4) is coated with a diamond coating (5), and the diamond coating (5) is positioned between the radiator (3) and the temperature equalizing plate (4).
6. The composite heat dissipation system of a pluggable optical module of claim 1, wherein:
the base (1) is provided with a groove (11) at the position corresponding to the power consumption device (2), a heat conducting sheet (6) is embedded in the groove (11), and a heat conducting material is filled between the heat conducting sheet (6) and the power consumption device (2).
7. An optical communication device, characterized in that it comprises a composite heat dissipation system of pluggable optical modules according to any of claims 1-6.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211139765.4A CN115494591B (en) | 2022-09-19 | 2022-09-19 | Composite heat radiation system capable of plugging optical module and optical communication equipment |
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| CN202211139765.4A CN115494591B (en) | 2022-09-19 | 2022-09-19 | Composite heat radiation system capable of plugging optical module and optical communication equipment |
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| CN116795191B (en) * | 2023-08-28 | 2023-12-01 | 安徽百信信息技术有限公司 | Heat radiation assembly with pluggable heat source and server applying heat radiation assembly |
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| CN212211742U (en) * | 2020-03-25 | 2020-12-22 | 广州视源电子科技股份有限公司 | Air-cooled radiator and electronic device |
| CN211653220U (en) * | 2020-03-30 | 2020-10-09 | 烽火通信科技股份有限公司 | Radiator joint structure and optical module shielding cage subassembly |
| CN114859478A (en) * | 2021-01-20 | 2022-08-05 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN213302596U (en) * | 2020-10-19 | 2021-05-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112684549A (en) * | 2020-12-23 | 2021-04-20 | 上海熙德热传科技有限公司 | Optical module elastic construction radiator |
| CN112689446A (en) * | 2020-12-31 | 2021-04-20 | 连云港军泽机电科技有限公司 | Combined type high-heat-conductivity cold plate and application method thereof |
| CN113467011A (en) * | 2021-06-16 | 2021-10-01 | 世强先进(深圳)科技股份有限公司 | QSFP-DD packaged pluggable optical communication module with high-efficiency heat dissipation |
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2022
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