CN218993814U

CN218993814U - Semiconductor equipment temperature regulating device

Info

Publication number: CN218993814U
Application number: CN202223368548.0U
Authority: CN
Inventors: 殷东科
Original assignee: Shanghai Dashi Automation Equipment Co ltd
Current assignee: Shanghai Dashi Automation Equipment Co ltd
Priority date: 2022-12-14
Filing date: 2022-12-14
Publication date: 2023-05-09
Anticipated expiration: 2032-12-14

Abstract

The utility model discloses a semiconductor equipment temperature regulating device, which relates to the field of semiconductor auxiliary equipment and comprises a heat exchange plate, wherein semiconductor refrigerating sheets are attached to the middle parts of two sides of the heat exchange plate, a heat insulation sleeve is sleeved on the outer side of the heat exchange plate, a diversion trench is formed in the heat exchange plate, and a heat radiation fan is arranged on the outer side of the semiconductor refrigerating sheets. According to the utility model, the semiconductor refrigerating sheets are arranged on the two sides of the heat exchange plate, so that the refrigerating fluid in the diversion trench on the heat exchange plate can be cooled, the diversion trench is of an integrated structure, the working stability of the device is improved, the heat conducting plate in the diversion trench improves the heat exchange efficiency, the heat insulation sleeve on the outer side of the heat exchange plate plays a role in heat insulation protection, the heat radiation fan is arranged on the outer side of the semiconductor refrigerating sheet and is connected with the elastic clamping plate on the convex plate through the support, so that the heat radiation fan is convenient to disassemble and maintain quickly, and the compression assembly on the convex block enables the support to be installed stably.

Description

Semiconductor equipment temperature regulating device

Technical Field

The utility model relates to the field of semiconductor auxiliary equipment, in particular to a temperature regulating device of semiconductor equipment.

Background

Performing constant temperature control on a liquid is an important process for semiconductor device critical specifications and semiconductor manufacturing. In semiconductor processes such as Photolithography (Photolithography), etching (Etch), and the like, cleaning of wafers using liquid chemicals (e.g., SPM, BOE, DIW) is required. In the wet etching and cleaning process after wet etching of the wafer, the temperature of the liquid chemical exceeds the set temperature due to the exothermic oxidation reaction. Therefore, the temperature of the liquid chemical needs to be adjusted so that the wet etching and cleaning process is always within a set temperature range to ensure the wafer yield. The temperature regulating device for cooling and heating the liquid chemicals in the prior art has the defect of relatively poor heat exchange efficiency and has the defect of lower service life.

The utility model patent number CN 216744985U discloses a semiconductor device temperature regulating device, which comprises a flat heat exchange body, side covers symmetrically attached to two sides of the heat exchange body, and a semiconductor refrigeration assembly attached to the surface of the side covers; the heat exchange body is provided with a plurality of spiral flow passages which are communicated with each other in a concave way on two sides, the heat exchange body is provided with a liquid inlet and a liquid outlet which are used for liquid to flow through the spiral flow passages along the thickness direction, a circle of grooves are formed on the radial outer sides of the spiral flow passages, sealing components are embedded in the grooves, and a hard sealing layer which covers the sealing components is arranged on one side of the side cover plate surface of the spiral flow passages. In the utility model, the two sides of the heat exchange body are concavely provided with the plurality of spiral flow passages which are communicated with each other, so that the semiconductor equipment temperature adjusting device realizes more accurate constant temperature adjustment effect, has better heat exchange effect and has the advantages of high structural stability and long service life.

The semiconductor device temperature adjusting device realizes good heat exchange effect, but does not have a heat dissipation mechanism of the semiconductor refrigeration assembly, so that a heating end of the semiconductor refrigeration mechanism cannot rapidly dissipate heat, and the semiconductor device temperature adjusting device does not have a protective heat insulation mechanism on the outer side of the heat exchange body, and meanwhile, a plurality of plates are arranged, so that the structure is complicated, and the semiconductor device temperature adjusting device is inconvenient to detach, overhaul and replace. Therefore, it is necessary to invent a semiconductor device temperature adjusting apparatus to solve the above-mentioned problems.

Disclosure of Invention

The present utility model is directed to a semiconductor device temperature adjusting apparatus for solving the above-mentioned problems of the related art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: semiconductor equipment temperature regulating device, including the heat exchange plate, the equal laminating of both sides middle part of heat exchange plate has the semiconductor refrigeration piece, the insulating sheath has been cup jointed in the outside of heat exchange plate, the guiding gutter has been seted up to the inside of heat exchange plate, the outside of semiconductor refrigeration piece is provided with cooling fan, cooling fan's upper and lower both ends all are fixed with the support, logical groove has been seted up at the middle part of support, both ends all are fixed with the flange about the both sides of insulating sheath, the one end and the logical groove of flange run through and link to each other, the standing groove has been seted up at the upper surface middle part of flange, the tank bottom of standing groove sets up to the sloping structure, the one end internally connected of standing groove has the elastic clamping board, the elastic clamping board links to each other with the support joint.

Preferably, the diversion trench is arranged into an arch-shaped structure, and a plurality of heat-conducting plates distributed at equal intervals are arranged on the upper inner wall and the lower inner wall of the diversion trench in a staggered manner.

Preferably, the heat conducting plate is arranged to be of an inclined structure, and a plurality of through holes distributed in a rectangular array are formed in the surface of the heat conducting plate.

Preferably, a convex block is fixed in the middle of the lower surface of the convex plate, and a pressing component is arranged on one side of the convex block.

Preferably, the pressing assembly comprises a notch formed in one side of the protruding block, a pressing plate is arranged in the notch, and one side of the pressing plate is attached to the support.

Preferably, the slot bottom of the slot opening is provided with a plurality of grooves distributed in a linear array, a plurality of compression springs and a plurality of sections of telescopic rods which are distributed in a staggered mode are respectively arranged in the grooves, and one ends of the compression springs and the plurality of sections of telescopic rods are fixedly connected with the other side of the pressing plate.

The utility model has the technical effects and advantages that:

according to the utility model, the semiconductor refrigerating sheets are arranged on the two sides of the heat exchange plate, so that the refrigerating fluid in the diversion trench on the heat exchange plate can be cooled, the diversion trench is of an integrated structure, the working stability of the device is improved, the heat conducting plate in the diversion trench improves the heat exchange efficiency, the heat insulation sleeve on the outer side of the heat exchange plate plays a role in heat insulation protection, the heat radiation fan is arranged on the outer side of the semiconductor refrigerating sheet and is connected with the elastic clamping plate on the convex plate through the support, so that the heat radiation fan is convenient to disassemble and maintain quickly, and the compression assembly on the convex block enables the support to be installed stably.

Drawings

Fig. 1 is a schematic diagram of the overall structure of the present utility model.

Fig. 2 is a schematic side view of the overall structure of the present utility model.

Fig. 3 is a schematic cross-sectional view of a convex plate structure according to the present utility model.

Fig. 4 is a schematic cross-sectional view of a heat exchanger plate structure according to the present utility model.

Fig. 5 is a schematic view of a heat conducting plate structure according to the present utility model.

Fig. 6 is a schematic plan view of the structure of the compression assembly of the present utility model.

In the figure: 1. a heat exchange plate; 2. a semiconductor refrigeration sheet; 3. a heat insulating sleeve; 4. a diversion trench; 5. a heat radiation fan; 6. a bracket; 7. a through groove; 8. a convex plate; 9. a placement groove; 10. an elastic clamping plate; 11. a heat conductive plate; 12. a through hole; 13. a bump; 14. a compression assembly; 15. a notch; 16. a pressing plate; 17. a groove; 18. a compression spring; 19. a multi-section telescopic rod.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The utility model provides a semiconductor equipment temperature regulating device shown in figures 1-6, which comprises a heat exchange plate 1, wherein semiconductor refrigerating sheets 2 are attached to the middle parts of two sides of the heat exchange plate 1, a heat insulation sleeve 3 is sleeved on the outer side of the heat exchange plate 1, the heat insulation sleeve 3 plays a role in keeping warm and protecting the heat exchange plate 1, a diversion trench 4 is arranged in the heat exchange plate 1, the diversion trench 4 is of an arch-shaped structure, the stroke of refrigerating fluid in the diversion trench 4 is improved, the heat exchange efficiency is improved, a plurality of heat conducting plates 11 distributed at equal intervals are arranged on the upper inner wall and the lower inner wall of the diversion trench 4 in a staggered mode, the heat conducting plates 11 are of an inclined structure, the heat exchange efficiency is improved, a plurality of through holes 12 distributed in a rectangular array are formed in the surface of the heat conducting plates 11, and the through holes 12 play a role in diversion.

Specifically, the outside of semiconductor refrigeration piece 2 is provided with radiator fan 5, radiator fan 5's upper and lower both ends all are fixed with support 6, logical groove 7 has been seted up at the middle part of support 6, both ends all are fixed with flange 8 about the both sides of insulating sheath 3, the one end of flange 8 runs through with logical groove 7 and links to each other, standing groove 9 has been seted up at the upper surface middle part of flange 8, the one end internally connected of standing groove 9 has resilient clamping plate 10, the tank bottom of standing groove 9 sets up to the slope structure, be convenient for resilient clamping plate 10 remove when contacting with logical groove 7, resilient clamping plate 10 links to each other with support 6 joint, resilient clamping plate 10 is spacing with support 6 for radiator fan 5 stable installation, the lower surface middle part of flange 8 is fixed with lug 13, one side of lug 13 is provided with compresses tightly subassembly 14.

More specifically, the compressing assembly 14 comprises a notch 15 formed in one side of the protruding block 13, a pressing plate 16 is arranged in the notch 15, one side of the pressing plate 16 is attached to the support 6, a plurality of grooves 17 distributed in a linear array are formed in the bottom of the notch 15, a plurality of compressing springs 18 and a plurality of telescopic rods 19 distributed in a staggered mode are respectively arranged in the grooves 17, one ends of the compressing springs 18 and the telescopic rods 19 are fixedly connected with the other side of the pressing plate 16, the pressing springs 18 enable the pressing plate 16 to provide pressure for the support 6, the support 6 is tightly attached to the elastic clamping plate 10, the mounting stability of the support 6 is improved, and the compressing plate 16 is kept to linearly move by the aid of the telescopic rods 19.

The working principle of the utility model is as follows:

when the device works, firstly, the inlet pipe and the outlet pipe of the refrigerating fluid are respectively communicated with the two ends of the diversion trench 4, then the refrigerating fluid is introduced into the diversion trench 4, then the semiconductor refrigerating sheet 2 is started, the semiconductor refrigerating sheet 2 cools the heat exchange plate 1, the heat exchange plate 1 and the heat conducting plate 11 are matched with each other to exchange heat with the cooling fluid, and meanwhile, the heat dissipation fan 5 is started, and the heat dissipation fan 5 cools the heating end of the semiconductor refrigerating sheet 2;

when the cooling fan 5 is installed, firstly the through groove 7 on the bracket 6 is aligned with the convex plate 8, then the convex plate 8 is inserted into the through groove 7, at the moment, the elastic clamping plate 10 in the placing groove 9 is stressed to move into the placing groove 9 until the elastic clamping plate 10 is connected with the bracket 6 in a clamping way, at the moment, the pressing plate 16 is stressed and extruded into the notch 15, the compression spring 18 is stressed and compressed, and the generated reaction force drives the pressing plate 16 to extrude the bracket 6, so that the bracket 6 is tightly attached to the elastic clamping plate 10, and the installation stability of the bracket 6 is improved.

Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.

Claims

1. Semiconductor equipment temperature regulating device, including heat exchange plate (1), its characterized in that: the utility model discloses a semiconductor refrigeration piece, including heat exchange plate (1), heat exchange plate (1) and support (6), heat exchange plate (1) are all laminated in both sides middle part has semiconductor refrigeration piece (2), insulating sheath (3) have been cup jointed in the outside of heat exchange plate (1), guiding gutter (4) have been seted up to the inside of heat exchange plate (1), the outside of semiconductor refrigeration piece (2) is provided with radiator fan (5), upper and lower both ends of radiator fan (5) all are fixed with support (6), logical groove (7) have been seted up at the middle part of support (6), both ends all are fixed with flange (8) about the both sides of insulating sheath (3), the one end and logical groove (7) of flange (8) run through and link to each other, standing groove (9) have been seted up at the upper surface middle part of flange (8), the tank bottom of standing groove (9) sets up to the slope structure, the one end internally connected with elasticity cardboard (10) of standing groove (9) links to each other with support (6) joint.

2. The semiconductor device temperature adjustment apparatus according to claim 1, wherein: the guide grooves (4) are arranged in an arc-shaped structure, and a plurality of heat conducting plates (11) distributed at equal intervals are arranged on the upper inner wall and the lower inner wall of the guide grooves (4) in a staggered mode.

3. The semiconductor device temperature adjustment apparatus according to claim 2, wherein: the heat conducting plate (11) is of an inclined structure, and a plurality of through holes (12) distributed in a rectangular array are formed in the surface of the heat conducting plate (11).

4. A semiconductor device temperature adjusting apparatus according to claim 3, wherein: the middle part of the lower surface of the convex plate (8) is fixed with a convex block (13), and one side of the convex block (13) is provided with a pressing component (14).

5. The semiconductor device temperature adjustment apparatus according to claim 4, wherein: the pressing assembly (14) comprises a notch (15) formed in one side of the protruding block (13), a pressing plate (16) is arranged in the notch (15), and one side of the pressing plate (16) is attached to the support (6).

6. The semiconductor device temperature adjustment apparatus according to claim 5, wherein: the groove bottom of notch (15) has seted up a plurality of recesses (17) that are linear array and distribute, a plurality of inside of recess (17) is provided with a plurality of compression springs (18) and multisection telescopic link (19) of crisscross distribution respectively, the opposite side fixed connection of compression spring (18) and multisection telescopic link (19) and clamp plate (16) is all connected.