CN217523122U - Circuit board convenient to heat dissipation - Google Patents
Circuit board convenient to heat dissipation Download PDFInfo
- Publication number
- CN217523122U CN217523122U CN202220967077.6U CN202220967077U CN217523122U CN 217523122 U CN217523122 U CN 217523122U CN 202220967077 U CN202220967077 U CN 202220967077U CN 217523122 U CN217523122 U CN 217523122U
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- circuit board
- heat dissipation
- connecting plate
- cavity
- dissipation mechanism
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Abstract
The utility model relates to a circuit board convenient for heat dissipation, which comprises a first circuit board, a second circuit board and a heat dissipation mechanism arranged between the first circuit board and the second circuit board; the first circuit board is connected with the second circuit board through side plates to form an integral structure; the heat dissipation mechanism comprises a connecting plate, a fan, a liquid pump, a circulating cooling pipeline and a condensing motor; the side walls of the two sides of the connecting plate are provided with connecting grooves which are arranged in a sliding fit manner with connecting lugs arranged on the side plates; the upper and lower surfaces of the connecting plate are provided with fans for circulating gas. The side plates are provided with connecting lugs for mounting the heat dissipation mechanism, and the connecting lugs are matched with the connecting plates for sliding mounting, so that the heat dissipation mechanism can be used for circuit boards of various sizes, and is convenient to mount and dismount and simple in structure; the heat dissipation mechanism is arranged in the middle between the first circuit board and the second circuit board, water-cooling circulation is conducted on the upper cavity and the lower cavity, heat around the environment is absorbed, the fan is arranged, and the heat dissipation effect of the whole LED circuit board is improved.
Description
Technical Field
The utility model belongs to the technical field of the circuit board, concretely relates to circuit board convenient to heat dissipation.
Background
The existing electronic equipment generally comprises a circuit board and an electronic element carried on the circuit board to form a circuit module, and the circuit board can be used as a chip packaging substrate; however, in the working process, a large number of components and parts work mutually, and motors around the circuit board work mutually, so that the heat of the environment around the circuit board is high, and when the circuit board is in the environment for a long time, the circuit board is easy to break down, the service life of the circuit board is influenced, meanwhile, the circuit board with a small size cannot be provided with large-scale heat dissipation equipment for heat dissipation, and the circuit board is easy to be damaged in the process of dismounting and mounting the heat dissipation equipment.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a install and remove convenient, the radiating circuit board of being convenient for.
A circuit board for facilitating heat dissipation, comprising: the heat dissipation structure comprises a first circuit board, a second circuit board and a heat dissipation mechanism arranged between the first circuit board and the second circuit board; the first circuit board and the second circuit board are connected through arranging side plates on two sides to form an integral structure; the heat dissipation mechanism comprises a connecting plate, a fan, a liquid pump, a circulating cooling pipeline and a condensing motor; the circulating cooling pipeline is arranged on one surface of the connecting plate and is connected with the condensing motor; the condensing motor is connected with the liquid pump; the side walls of the two sides of the connecting plate are provided with connecting grooves, and the connecting grooves and connecting lugs arranged on the side plates are installed in a sliding fit manner; and fans for circulating gas are arranged on the upper surface and the lower surface of the connecting plate.
The upper surface of the connecting plate and the first circuit board form a first cavity; the lower surface of the connecting plate and the second circuit board form a second cavity; the connecting plate is provided with a plurality of through holes for connecting the first cavity and the second cavity.
Wherein, the circulative cooling pipeline sets up the upper surface at the connecting plate, is located in the first cavity.
And the upper surface and the lower surface of the connecting plate are both provided with circulating cooling pipelines.
The heat dissipation mechanism also comprises a case; the case is fixed on the side wall of one end of the connecting plate; the liquid pump and the condensing motor are fixed inside the case.
The heat dissipation mechanism further comprises a condensation pipe; the condensation pipe is connected with the circulating cooling pipeline.
Wherein, the connecting groove is a dovetail groove; the cross section of the connecting lug is in an inverted trapezoid shape and is in adaptive connection with the dovetail groove.
And the parts of the first circuit board, the second circuit board and the side plate, which are right opposite to the fan, are all provided with a plurality of radiating holes in a penetrating way.
The utility model discloses following beneficial effect has:
the utility model discloses a first circuit board, second circuit board and both sides set up the curb plate and constitute a hollow overall structure, set up the connection lug of installation heat dissipation mechanism on the curb plate, cooperate the slidable mounting with the connecting plate of heat dissipation mechanism, can be convenient use in the circuit board of various sizes, reach and conveniently install and dismantle, the structure is simple and easy; the heat dissipation mechanism is arranged in the middle between the first circuit board and the second circuit board, water cooling circulation is conducted on the upper cavity and the lower cavity, heat around the environment is absorbed, a plurality of through holes for connecting the upper cavity and the lower cavity are distributed in the connecting plate, the fans are arranged in the upper cavity and the lower cavity, cold air flowing circulation in the cavities and between the first cavity and the second cavity is enhanced, and the heat dissipation effect of the whole LED circuit board is improved.
Drawings
Fig. 1 is a cross-sectional view of a circuit board facilitating heat dissipation according to the present invention;
fig. 2 is a schematic structural view of the heat dissipation mechanism of the present invention;
fig. 3 is a top view of the circuit board convenient for heat dissipation of the present invention.
Detailed Description
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "coaxial," "bottom," "one end," "top," "middle," "other end," "upper," "side," "top," "inner," "front," "center," "two end," and the like are used in an orientation or positional relationship that is indicated based on the orientation or positional relationship shown in the drawings for ease of description and simplicity of description, rather than to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and is not to be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounting," "setting," "connecting," "fixing," "screwing" and the like are to be construed broadly, and may be, for example, a fixed connection, a detachable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.
As shown in fig. 1 to 3, a circuit board facilitating heat dissipation includes: the heat dissipation structure comprises a first circuit board 1, a second circuit board 2 and a heat dissipation mechanism arranged between the first circuit board 1 and the second circuit board 2; the two sides of the first circuit board 1 and the second circuit board 2 are connected through arranging a side plate 3 to form an integral structure; the heat dissipation mechanism comprises a connecting plate 4, a fan 5, a liquid pump 6, a circulating cooling pipeline 7 and a motor 8; the circulating cooling pipeline 7 is arranged on one surface of the connecting plate 4 and is connected with the motor 8; the motor 8 is connected with the liquid pump 6; the two side walls of the connecting plate 4 are provided with connecting grooves 9 which are arranged in a sliding fit manner with connecting lugs 10 arranged on the side plates 3; the upper and lower surfaces of the connecting plate 4 are provided with fans 5 for circulating air. The utility model discloses a curb plate 3 that first circuit board 1, second circuit board 2 and both sides set up constitutes a cavity overall structure, has set up the connecting lug 10 of installation heat dissipation mechanism on the curb plate 3, with the connecting plate 4 cooperation slidable mounting of heat dissipation mechanism, can be convenient use in the circuit board of various sizes, reach easy to assemble and dismantle, the structure is simple and easy.
The upper surface of the connecting plate 4 and the first circuit board 1 form a first cavity 11; the lower surface of the connecting plate 4 and the second circuit board 2 form a second cavity 12; the connecting plate 4 is provided with a plurality of through holes 13 for connecting the first cavity 11 and the second cavity 12. The heat dissipation mechanism is arranged in the middle between the first circuit board 1 and the second circuit board 2, water cooling circulation is conducted on the upper cavity and the lower cavity, heat around the environment is absorbed, a plurality of through holes 13 for connecting the upper cavity and the lower cavity are distributed on the connecting plate 4, the fans 5 are arranged in the upper cavity and the lower cavity, cold air flowing circulation in the cavities and between the first cavity 11 and the second cavity 12 is enhanced, and the heat dissipation effect of the whole LED circuit board is improved.
The distribution of the circulating cooling pipes 7 can be in various manners, for example, the circulating cooling pipes 7 are arranged on the upper surface of the connecting plate 4 and located in the first cavity 11, and as the cold air sinks, the hot gas rises, that is, the circulating cooling pipes 7 absorb the heat of the first cavity 11 first, the gas temperature of the first cavity 11 drops and sinks into the second cavity 12 along with the through holes 13 on the connecting plate 4, and the gas in the second cavity 12 rises through the through holes 13 on the connecting plate 4 to perform circulating transmission, and accelerate the flowing circulation under the action of the fan 5; the upper surface and the lower surface of the connecting plate 4 can be provided with circulating cooling pipelines 7, that is, the first cavity 11 and the second cavity 12 are separately provided with circulating cooling pipelines 7 for heat transfer.
Wherein, the heat dissipation mechanism further comprises a chassis 14; the case 14 is fixed on the side wall of one end of the connecting plate 4; the liquid pump 6 and the condenser motor 8 are fixed inside the cabinet 14. The heat dissipation mechanism further comprises a condensation pipe 15; the condensation pipe 15 is connected with the circulating cooling pipeline 7, after cold water in the circulating cooling pipeline 7 absorbs heat transferred in the cavity, the water temperature rises, at the moment, circulating reflux passes through the condensation pipe 15, and the water is condensed again by the condensation pipe 15.
Wherein, the connecting groove 9 is a dovetail groove; the cross section of the connecting lug 10 is in an inverted trapezoid shape and is in adaptive connection with the dovetail groove. The connecting groove 9 and the connecting lug 10 of the connecting plate 4 are well matched, the heat dissipation mechanism is installed by pushing inwards, in order to be firmly combined and smoothly slide, the connecting groove 9 is a dovetail groove, and the section of the connecting lug 10 is in an inverted trapezoid shape.
The parts of the first circuit board 1, the second circuit board 2 and the side board 3, which are right opposite to the fan 5, are all provided with a plurality of radiating holes 16 in a penetrating way, so that the radiating and gas circulation are enhanced.
The details of the present invention are well known to those skilled in the art.
The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (8)
1. A circuit board convenient to heat dissipation, its characterized in that includes:
the heat dissipation structure comprises a first circuit board, a second circuit board and a heat dissipation mechanism arranged between the first circuit board and the second circuit board;
the first circuit board and the second circuit board are connected through arranging side plates on two sides to form an integral structure;
the heat dissipation mechanism comprises a connecting plate, a fan, a liquid pump, a circulating cooling pipeline and a condensing motor;
the circulating cooling pipeline is arranged on one surface of the connecting plate and is connected with the condensing motor;
the condensing motor is connected with the liquid pump;
the side walls of the two sides of the connecting plate are provided with connecting grooves, and the connecting grooves and connecting lugs arranged on the side plates are installed in a sliding fit manner;
the upper surface and the lower surface of the connecting plate are provided with fans for circulating gas.
2. A circuit board facilitating heat dissipation according to claim 1,
the upper surface of the connecting plate and the first circuit board form a first cavity;
the lower surface of the connecting plate and the second circuit board form a second cavity;
the connecting plate is provided with a plurality of through holes for connecting the first cavity and the second cavity.
3. A circuit board facilitating heat dissipation according to claim 2,
the circulating cooling pipeline is arranged on the upper surface of the connecting plate and is positioned in the first cavity.
4. A circuit board facilitating heat dissipation according to claim 2,
and the upper surface and the lower surface of the connecting plate are both provided with circulating cooling pipelines.
5. A circuit board facilitating heat dissipation according to claim 1,
the heat dissipation mechanism further comprises a case;
the case is fixed on the side wall of one end of the connecting plate;
the liquid pump and the condensing motor are fixed inside the case.
6. A circuit board facilitating heat dissipation according to claim 1,
the heat dissipation mechanism also comprises a condensation pipe; the condensation pipe is connected with the circulating cooling pipeline.
7. A circuit board facilitating heat dissipation according to claim 1,
the connecting groove is a dovetail groove;
the cross section of the connecting lug is inverted trapezoid and is in adaptive connection with the dovetail groove.
8. A circuit board facilitating heat dissipation according to claim 1,
the first circuit board, the second circuit board and the part of the side plate, which is right opposite to the fan, are all provided with a plurality of heat dissipation holes in a penetrating way.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220967077.6U CN217523122U (en) | 2022-04-25 | 2022-04-25 | Circuit board convenient to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220967077.6U CN217523122U (en) | 2022-04-25 | 2022-04-25 | Circuit board convenient to heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217523122U true CN217523122U (en) | 2022-09-30 |
Family
ID=83371596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220967077.6U Active CN217523122U (en) | 2022-04-25 | 2022-04-25 | Circuit board convenient to heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217523122U (en) |
-
2022
- 2022-04-25 CN CN202220967077.6U patent/CN217523122U/en active Active
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