CN213302596U

CN213302596U - Optical module

Info

Publication number: CN213302596U
Application number: CN202022334064.9U
Authority: CN
Inventors: 董本正; 于帮雨; 姬景奇
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2020-10-19
Filing date: 2020-10-19
Publication date: 2021-05-28
Anticipated expiration: 2030-10-19

Abstract

The application provides an optical module, includes: the shell comprises an upper shell and a lower shell, and the upper shell and the lower shell are covered to form a wrapping inner cavity; the VC temperature equalizing plate is arranged on the inner wall of the shell and is arranged along the length direction of the optical module; the circuit board is arranged in the wrapping inner cavity; the optical sub-module is electrically connected with the circuit board; the first chip is arranged on the circuit board, is electrically connected with the circuit board and is contacted with the VC temperature-uniforming plate; and the heat dissipation part is arranged on the inner wall of the shell and is in contact with the optical submodule. In the optical module provided by the application, heat generated by the working of the first chip is transmitted to the VC temperature equalizing plate and then is more uniformly conducted through the VC temperature equalizing plate, so that the heat generated by the first chip is effectively prevented from being concentrated around the first chip; the heat generated by the optical sub-module is transmitted to the shell through the heat dissipation part, so that the heat generated by the operation of the optical sub-module is prevented from being accumulated around the optical sub-module; the temperature inside the optical module is further uniformized, and the photoelectric performance of the optical module at high temperature is improved.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

The optical communication technology can be applied to novel services and application modes such as cloud computing, mobile internet, video and the like. The optical module realizes the function of photoelectric conversion in the technical field of optical communication, is one of key devices in optical communication equipment, and the intensity of an optical signal input into an external optical fiber by the optical module directly influences the quality of optical fiber communication.

At present, with the continuous improvement of the requirement of the transmission rate of the optical module, the integration level of the optical module is higher and higher. As the integration level of the optical module is higher and higher, the power density of the optical module is also increasing. For example, when the power density of the chip is too high, the heat at the chip is concentrated, and if the concentrated heat at the chip cannot be diffused in time, a local high-temperature region is generated, which will seriously affect the photoelectric performance of the optical module at high temperature. With the increase of the speed of the optical module, the power consumption of chips such as a driving chip is larger and larger, the power consumption of the optical module even reaches 20-30W, and the internal heat dissipation of the optical module becomes a troublesome problem.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an optical module, which is convenient for realizing the homogenization of the internal temperature of the optical module.

The application provides an optical module, includes:

the shell comprises an upper shell and a lower shell, and the upper shell and the lower shell are covered to form a wrapping inner cavity;

the VC temperature equalizing plate is arranged on the inner wall of the shell and is arranged along the length direction of the optical module;

the circuit board is arranged in the wrapping inner cavity;

the optical sub-assembly is electrically connected with the circuit board;

the first chip is arranged on the circuit board, is electrically connected with the circuit board and is in contact with the VC temperature-uniforming plate;

and the heat dissipation part is arranged on the inner wall of the shell and is in contact with the optical submodule.

The application provides an optical module, set up VC temperature-uniforming plate and radiating part on the inner wall of casing, and the VC temperature-uniforming plate sets up along the length direction of optical module, and first chip contacts with VC temperature-uniforming plate, and optics submodule contacts with radiating part. The first chip is in contact with the VC temperature equalizing plate, heat generated by the working of the first chip is transmitted to the VC temperature equalizing plate, then the heat is transmitted to the periphery of the first chip through the VC temperature equalizing plate, and finally the VC temperature equalizing plate is uniformly transmitted to the shell and then is radiated through the shell. Meanwhile, heat generated by the work of the optical secondary module is transmitted to the shell through the heat dissipation component, so that the heat generated by the work of the optical secondary module is prevented from being gathered around the optical secondary module, the internal temperature of the optical module is more uniform, and the photoelectric performance of the optical module at high temperature is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;

FIG. 4 is a schematic diagram of an exploded structure of an optical module according to an embodiment of the present application;

fig. 5 is a schematic diagram of an internal mechanism of an optical module according to an embodiment of the present disclosure;

fig. 6 is an exploded schematic structural diagram of another optical module according to an embodiment of the present disclosure;

fig. 7 is a schematic view illustrating an assembly of a VC temperature equalization plate and a first chip according to an embodiment of the present disclosure;

fig. 8 is an assembly diagram of a heat dissipation member and a sub-module housing according to an embodiment of the present disclosure;

fig. 9 is a first schematic internal structural diagram of another optical module according to an embodiment of the present application;

fig. 10 is a second schematic internal structural diagram of another optical module according to an embodiment of the present application;

fig. 11 is a first cross-sectional view of an optical module according to an embodiment of the present disclosure;

fig. 12 is a second cross-sectional view of an optical module according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

In the following, some embodiments of the present application will be described in detail with reference to the drawings, and features in the following examples and examples may be combined with each other without conflict.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the optical module realizes optical connection with external optical fibers through an optical interface, the external optical fibers are connected in various ways, and various optical fiber connector types are derived; the method is characterized in that the electric connection is realized by using a golden finger at an electric interface, which becomes the mainstream connection mode of the optical module industry, and on the basis, the definition of pins on the golden finger forms various industry protocols/specifications; the optical connection mode realized by adopting the optical interface and the optical fiber connector becomes the mainstream connection mode of the optical module industry, on the basis, the optical fiber connector also forms various industry standards, such as an LC interface, an SC interface, an MPO interface and the like, the optical interface of the optical module also makes adaptive structural design aiming at the optical fiber connector, and the optical fiber adapters arranged at the optical interface are various.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical interface of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; the electrical interface of the optical module 200 is externally connected to the optical network terminal 100, and establishes a bidirectional electrical signal connection with the optical network terminal 100; bidirectional interconversion of optical signals and electric signals is realized inside the optical module, so that information connection is established between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber 101.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal has a network cable interface 104, which is used for accessing the network cable 103 and establishing a bidirectional electrical signal connection (generally, an electrical signal of an ethernet protocol, which is different from an electrical signal used by an optical module in protocol/type) with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module. The optical network terminal is an upper computer of the optical module, provides data signals for the optical module and receives the data signals from the optical module, and a bidirectional signal transmission channel is established between the remote server and the local information processing equipment through the optical fiber, the optical module, the optical network terminal and a network cable.

Common local information processing apparatuses include routers, home switches, electronic computers, and the like; common optical network terminals include an optical network unit ONU, an optical line terminal OLT, a data center server, a data center switch, and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electrical connector is arranged in the cage 106 and used for accessing an electrical interface (such as a gold finger) of the optical module; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into an optical network terminal, the electrical interface of the optical module is inserted into the electrical connector inside the cage 106, and the optical interface of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure, and fig. 4 is an exploded structural diagram of an optical module according to an embodiment of the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in the embodiments of the present application includes an upper housing 201, a lower housing 202, a circuit board 300, and an optical sub-module 400.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings, which is used as a shell of the optical module; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned at two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned at two sides of the cover plate and are perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize that the upper shell covers the lower shell.

The two openings can be two ends (203, 204) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 203 for external optical fiber access; the photoelectric devices such as the circuit board 300 and the optical sub-assembly 400 are positioned in the packaging cavity formed by the upper and lower shells.

The assembly mode of combining the upper shell 201 and the lower shell 202 is adopted, so that the circuit board 300, the optical sub-module 400 and other devices can be conveniently installed in the shells, and the upper shell 201 and the lower shell 202 form an outermost packaging protection shell of the optical module; the upper shell 201 and the lower shell 202 are generally made of metal materials, such as zinc alloy, which is beneficial to realizing electromagnetic shielding and heat dissipation; generally, the housing of the optical module is not made into an integrated component, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and the production automation is not facilitated. In the present embodiment, heat dissipation fins are disposed on the upper housing 201 and/or the lower housing 202 to assist in increasing the heat dissipation capability of the optical module.

The optical module further comprises an unlocking component (not shown in the figure), wherein the unlocking component is located on the outer wall of the wrapping cavity/lower shell 202 and used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.

The optical sub-assembly 400 may include an optical sub-assembly and an optical sub-assembly, and the optical sub-assembly is electrically connected to the circuit board 300, such as directly connected to the circuit board or connected to the circuit board 300 through a flexible circuit board. The optical sub-assembly 400 includes a laser and various optical and electrical components to assist in the proper operation of the laser. As shown in fig. 4, in the optical module provided in the embodiment of the present application, a mounting hole 301 is formed in a circuit board 300, and an optical sub-module 400 is embedded in the mounting hole 301; fixing the optical sub-assembly 400 through the mounting hole 301 facilitates the connection and fixation of the optical sub-assembly 400 and the circuit board 300. On the other hand, the circuit board 300 is usually a printed circuit board, which has a relatively small thermal conductivity, so that the optical sub-assembly 400 is fixed through the mounting hole 301 to facilitate heat dissipation of the optical sub-assembly 400 compared to the case where the optical sub-assembly 400 is disposed on the circuit board 300. Of course, in the embodiment of the present application, the optical subassembly 400 may be physically separated from the circuit board 300 and then connected to the circuit board 300 through the flexible circuit board.

Fig. 5 is a schematic view of an internal structure of an optical module according to an embodiment of the present application. As shown in fig. 5, in the optical module provided in the embodiment of the present application, the optical sub-module 400 includes a sub-module housing 401, and the sub-module housing 401 is configured to accommodate devices such as a laser, a photo detector, and a TEC (semiconductor Cooler), so as to facilitate integration of the optical sub-module 400. The sub-module housing 401 is embedded in the mounting hole 301, so that the sub-module housing 401 facilitates the mounting and fixing of the optical sub-module 400. Meanwhile, the sub-module case 401 includes a top surface and a bottom surface that are oppositely disposed, and the top surface and the bottom surface of the sub-module case 401 are primary heat dissipation surfaces of the sub-module case 401, respectively, and thus the sub-module case 401 facilitates the heat dissipation of the optical sub-module 400. Therefore, the sub-module housing 401 in the embodiment of the present application can facilitate the installation of the optical sub-module and the heat dissipation of the optical sub-module. In the embodiment of the present application, the top and bottom surfaces of the sub-module case 401 are the surfaces of the sub-module case 401 parallel to the upper surface of the circuit board 300, respectively. Optionally, the optical sub-assembly 400 is arranged at the front of the optical module, i.e. at an end close to the optical port 203 of the optical module.

As shown in fig. 5, in the optical module provided in the embodiment of the present application, a first chip 302 is further disposed on the circuit board 300. In this embodiment of the application, the first chip 302 is mainly a chip that generates more heat when operating in the optical module, that is, the first chip 302 is mainly a high-heat-density chip in the optical module, such as a Data processing chip DSP, a Clock Data Recovery (CDR), a laser driving chip, a transimpedance amplifier chip, and the like. When the first chip 302 works, a large amount of heat is generated, and if the heat cannot be transferred out in time, the heat generated by the first chip 302 will be concentrated on and around the first chip 302, which causes heat concentration at a corresponding position of the first chip 302 of the optical module.

In a conventional optical module, heat generated by the first chip 302 is transferred to a housing of the optical module by self-diffusion; because the zinc alloy has the advantages of easy processing, good castability, low cost and the like, the shell of the optical module is usually made of the zinc alloy, but the zinc alloy has limitations in heat dissipation performance and weak heat diffusion capability, and then a large amount of heat generated by the first chip 302 is concentrated on the shell around the first chip 302. If the first chip 302 is located at the rear of the optical module, heat will be mainly concentrated at the rear of the housing, such as the rear of the upper housing 201, which causes uneven temperature at the front and rear ends of the optical module, and further will affect the performance of the optical module at high temperature. In order to avoid the first chip 302 from causing uneven temperature at the front end and the rear end of the optical module, the optical module provided in the embodiment of the present application further includes a VC temperature equalization plate, the VC temperature equalization plate is in contact connection with the first chip 302 and the housing, and the VC temperature equalization plate is used for facilitating the transfer and diffusion of heat generated by the first chip 302. In the embodiment of the present application, the VC temperature equalization plate contacts and connects the first chip 302 and the upper case 201, so as to transfer and diffuse heat generated by the first chip 302 on the upper case 201 more conveniently, but the embodiment of the present application is not limited to the VC temperature equalization plate contacts and connects the first chip 302 and the upper case 201; optionally, the VC temperature equalization plate contacts the inner wall of the upper housing 201, for example, the VC temperature equalization plate is embedded inside the cover plate of the upper housing 201.

Fig. 6 is an exploded schematic view of another optical module according to an embodiment of the present application. As shown in fig. 6, in the optical module provided in the embodiment of the present application, a VC temperature equalization plate 205 is further included, and the VC temperature equalization plate 205 is used to contact and connect the first chip 302 and the upper case 201. As shown in fig. 6, in the embodiment, the upper surface of the upper housing 201 is provided with heat dissipation fins, which are main heat dissipation components of the optical module, and the upper surface of the upper housing 201 is a main heat dissipation surface. Optionally, the heat dissipation fins are arranged on the upper casing 201 in a protruding manner in a strip-edge shape, the contact area between the arranged heat dissipation fins and the external air flow can be increased, the air flow can accelerate the circulation speed of the air flow through the heat dissipation fins, and then the heat dissipation efficiency between the upper casing 201 and the external environment is improved from the heat dissipation contact area and the circulation speed, namely the heat dissipation efficiency of the surface of the optical module shell is improved. However, in the embodiment of the present invention, the heat dissipation fins are not limited to be disposed on the upper surface of the upper housing 201, and the heat dissipation fins may also be disposed on the surface of the lower housing 202 to serve as the main heat dissipation surface of the optical module. The VC temperature equalization plate 205 is a good thermal conductor, and has good thermal conductivity (thermal conductivity higher than zinc alloy). The VC temperature-equalizing plate is a material with good heat-conducting property, the heat-conducting property of the VC temperature-equalizing plate is far better than that of zinc alloy, and the VC temperature-equalizing plate is more convenient for heat dissipation.

The heat in the VC temperature-uniforming plate can be uniformly distributed on the whole surface with high efficiency, and a vacuum cavity and cooling liquid are arranged inside the VC temperature-uniforming plate. After the uniform temperature plate base is heated, the heat source can heat the copper mesh micro-evaporator, the cooling liquid is heated and quickly evaporated into hot air under the vacuum ultralow-pressure environment, the hot air circulates (conducts heat) in the copper mesh micro-environment, the hot air is heated and rises, the cooling liquid is radiated after meeting a cold source on the upper portion of the heat dissipation plate and is condensed into liquid again, the condensed cooling liquid flows back to an evaporation source at the bottom of the uniform temperature plate through a copper micro-structure capillary pipeline, the returned cooling liquid is gasified again after being heated through the evaporator and flows to a cold end, and the purpose of quickly transferring heat and equalizing temperature is achieved through repeated circulation.

As shown in fig. 6, the first chip 302 is disposed at the rear of the optical module (close to the electrical port 204 of the optical module), the VC temperature equalization plate 205 has a relatively long length, and can penetrate through the rear of the optical module to the front, so that heat generated by the first chip 302 can be diffused from the rear of the optical module to the rear of the optical module, that is, the heat generated by the first chip 302 is diffused to the whole upper housing 201, so that the heat on the upper housing 201 is uniformly distributed, and then the heat is dissipated by the heat dissipation fins on the upper housing 201, and the heat dissipation fins dissipate the heat by convection heat transfer with air, thereby achieving a good heat dissipation purpose.

Fig. 7 is an assembly diagram of a VC temperature equalization plate and a first chip according to an embodiment of the present disclosure. As shown in fig. 7, one end of the VC temperature equalization plate 205 is connected to the first chip 302 in a contact manner, the other end of the VC temperature equalization plate 205 extends to the periphery of the first chip 302, for example, the other end of the VC temperature equalization plate 205 extends to the front of the optical module. In this embodiment, one end of the VC temperature equalization plate 205 may be directly connected to the first chip 302 in a contact manner, one end of the VC temperature equalization plate 205 may also be indirectly connected to the first chip 302 in a contact manner through a heat conduction material, such as a heat conduction pad, a heat conduction glue, etc., so as to ensure that the VC temperature equalization plate 205 and the first chip 302 are fully contacted.

In the embodiment of the present application, the laser is enclosed in the secondary module housing 401, and the temperature of the laser is controlled by the TEC, and further the TEC is enclosed in the secondary module housing 401. When the VC temperature equalization plate 205 is used to transfer the heat generated by the first chip 302 from the rear of the optical module to the front of the optical module, the heat generated by the first chip 302 will be diffused to the periphery of the sub-module housing 401, which will affect the temperature control of the TEC. For avoiding diffusing to submodule shell 401 around the heat cause the influence to TEC's accuse temperature, in the optical module that this application embodiment provided, still include the heat dissipation part, heat dissipation part contact connection submodule shell 401 and casing, the heat dissipation part is used for transmitting the heat that the TEC hot side produced to submodule shell 401, then transmits to the heat dissipation part through submodule shell 401, transmits the heat to the casing through the heat dissipation part at last. In this embodiment, the heat dissipation component is a good conductor, and when the VC temperature-uniforming plate 205 is in contact connection with the first chip 302 and the upper housing 201, the heat dissipation component is in contact connection with the sub-module housing 401 and the lower housing 202, and is used to transfer heat generated by the thermal surface of the TEC to the lower housing 202, so as to optimize the heat dissipation path of the TEC.

As shown in fig. 6, in the optical module provided in the embodiment of the present application, the heat dissipation member 206 is further included, the heat dissipation member 206 is used for assisting and optimizing heat dissipation of the sub-module housing 401, and the heat dissipation member 206 is used for contacting and connecting the sub-module housing 401 and the lower housing 202. The heat dissipation member 206 may be a copper sheet/block, VC vapor chamber, or the like. Optionally, the heat dissipation member 206 is a copper block heat dissipation member. And then the heat that the TEC hot side produced transfers to submodule casing 401, then transfers to the heat dissipation part through submodule casing 401, and finally with heat transfer to lower casing 202 through the heat dissipation part, because heat dissipation part 206 is the copper billet, the coefficient of heat conductivity and the thermal diffusivity of copper billet are higher, more are favorable to thermal conduction, and then reach the purpose of optimizing TEC heat dissipation route. In the embodiment of the present application, in order to avoid the VC temperature-uniforming plate 205 from causing excessive influence on the optical sub-module 400, the first heat dissipation surface of the sub-module case 401 is not in contact with the VC temperature-uniforming plate 205.

Fig. 8 is an assembly diagram of a heat dissipation component and a sub-module housing according to an embodiment of the present disclosure. As shown in fig. 8, one end of the heat dissipation member 206 contacts the second heat dissipation surface of the sub-module housing 401, and the other end of the heat dissipation member 206 extends to the periphery of the sub-module housing 401. Optionally, the other end of the heat dissipation member 206 extends towards the rear of the optical module. In this embodiment, one end of the heat dissipating member 206 may directly contact the second heat dissipating surface of the secondary module housing 401, and one end of the heat dissipating member 206 may also indirectly contact the second heat dissipating surface of the secondary module housing 401 through a heat conducting material, such as a heat conducting pad, a heat conducting adhesive, etc., so as to ensure that the heat dissipating member 206 and the second heat dissipating surface of the secondary module housing 401 are in full contact.

The circuit board 300 provided in the embodiment of the present application further includes chips with relatively more heat generation, such as a second chip and a third chip, other than the first chip 302, for example, a transimpedance amplifier, a limiting amplifier, a laser driver, and an MCU. To avoid heat concentration, the first chip 302, the transimpedance amplifier, the limiting amplifier, the laser driver, the MCU, and the like should be dispersedly disposed on the circuit board 300. For example, the first chip 302 is disposed on the upper surface of the circuit board 300, and the second chip, the third chip, etc. may be disposed on the lower surface of the circuit board 300, and the area of the circuit board 300 where the first chip 302 is disposed may be determined as much as possible, for example, the area where the first chip 302 projects on the circuit board 300 may not be determined as much as possible.

Fig. 9 is a first schematic view of an internal structure of another optical module according to an embodiment of the present application. As shown in fig. 9, the optical module provided in the embodiment of the present application further includes a second chip 303, where the second chip 303 is disposed on the lower surface of the circuit board 300. The upper surface and the lower surface of the circuit board 300 are relative concepts, and only in order to distinguish that the second chip 303 and the first chip 302 are disposed on different surfaces of the circuit board 300, the circuit board 300 is a printed circuit board, and the heat conduction performance is relatively poor, so that the circuit board 300 can prevent the heat generated by the first chip 302 from flowing to the second chip 303. Further, the projection of the second chip 303 on the circuit board 300, that is, the projection of the first chip 302 on the circuit board 300 is not overlapped, that is, the second chip 303 is not disposed on the back of the circuit board 300 where the first chip 302 is disposed, and accordingly, the heat conduction distance between the second chip 303 and the first chip 302 is increased.

Further, a first heat conduction boss 207 is arranged on the back surface of the second chip 303 arranged on the circuit board 300, and the first heat conduction boss 207 is used for assisting in promoting heat conduction and diffusion on the second chip 303. The first thermally conductive boss 207 is made of a material having a relatively high thermal conductivity; alternatively, the first heat-conducting boss 207 may be made of a metal material, such as copper, aluminum, and alloys thereof. In some embodiments of the present application, one end of the first heat conducting boss 207 is fixedly disposed on the circuit board 300 through a heat conducting adhesive, and the other end is used for contacting the upper housing 201; furthermore, heat generated by the second chip 303 is conducted to the upper shell 201 through the first heat conduction boss 207, and then the heat is dissipated through the upper shell 201, so that the heat dissipation of the second chip 303 is accelerated, the concentration of heat inside the optical module is further avoided, and the homogenization of the temperature inside the optical module is promoted.

As shown in fig. 9, the optical module provided in the embodiment of the present application further includes a third chip 304, where the third chip 304 is disposed on a lower surface of the circuit board 300. Projection of the third chip 304 on the circuit board 300 and projection of the first chip 302 on the circuit board 300 are not overlapped, that is, the third chip 304 is not disposed on the back of the circuit board 300 where the first chip 302 is disposed, and accordingly, the thermal conduction distance between the third chip 304 and the first chip 302 is increased.

Fig. 10 is a second schematic view of an internal structure of another optical module according to an embodiment of the present application. As shown in fig. 10, in the embodiment of the present application, a second heat conducting bump 208 is disposed on the back surface of the third chip 304 disposed on the circuit board 300, and the second heat conducting bump 208 is used to assist in promoting conduction and diffusion of heat on the third chip 304. Further, as shown in fig. 10, one end of the second heat conducting boss 208 is fixedly disposed on the circuit board 300 through a heat conducting glue 2081, and the other end is used for contacting the upper housing 201; and then the heat generated by the third chip 304 is conducted to the upper shell 201 through the second heat conduction boss 208, and then the heat is dissipated through the upper shell 201, so that the heat dissipation of the third chip 304 is accelerated, the concentration of the heat inside the optical module is further avoided, and the internal temperature of the optical module is homogenized. Therefore, in order to prevent the heat dissipated from the VC temperature equalization plate 205 from affecting the heat dissipation of the third chip 304, the second heat conduction protrusion 208 should avoid contacting the VC temperature equalization plate 205 when contacting the upper case 201; accordingly, the first heat conducting boss 207 should be prevented from contacting the VC temperature equalization plate 205 when contacting the upper housing 201.

Fig. 11 is a first cross-sectional view of an optical module according to an embodiment of the present application. As shown in fig. 11, in the optical module provided in the embodiment of the present application, the VC temperature equalization plate 205 is in a long strip structure, and then the VC temperature equalization plate 205 extends from the rear portion of the optical module to the front portion of the optical module, so as to achieve uniform heat distribution between the rear portion and the front portion of the optical module; set up first mounting groove 2011 on the inner wall top surface of going up casing 201, VC temperature-uniforming plate 205 inlays and establishes in first mounting groove 2011, and the lateral wall of the first mounting groove 2011 of the side laminating of VC temperature-uniforming plate 205 realizes going up casing 201 with VC temperature-uniforming plate 205 embedding. The first mounting groove 2011 is formed in the upper shell 201 to fix the VC temperature-equalizing plate 205, so that the VC temperature-equalizing plate 205 is conveniently arranged in an optical module, the VC temperature-equalizing plate 205 is fully contacted with the upper shell 201, and the effect that the VC temperature-equalizing plate 205 transfers heat to the upper shell 201 is guaranteed. Further, in the embodiment of the present application, the VC temperature equalization plate 205 is fully contacted and connected to the first chip 302 through the first thermal pad 2051, so as to ensure the heat transfer effect between the VC temperature equalization plate 205 and the first chip 302. The first thermal pad 2051 is made of a thermal conductive material with a good thermal conductive effect and a certain elasticity, so as to ensure the thermal conductive effect between the first chip 302 and the VC temperature-uniforming plate 205. The first thermal pad 2051 may be made of a paste-like thermal interface material such as thermal silicone grease or thermal gel.

The heat generated by the first chip 302 is transferred to the rear portion of the VC temperature-uniforming plate 205 through the first heat-conducting pad 2051, the heat is transferred from the rear portion of the VC temperature-uniforming plate 205 to the front portion of the VC temperature-uniforming plate 205, and is simultaneously transferred to the upper housing 201 through the VC temperature-uniforming plate 205, and the heat is dissipated by utilizing the heat dissipation fins of the upper housing 201 to transfer heat by convection with air, so that a good heat dissipation purpose is achieved, and further, heat concentration in the optical module is avoided.

As shown in fig. 11, in the optical module provided in the embodiment of the present application, the second mounting groove 2021 is disposed on the bottom surface of the inner wall of the lower housing 202, the heat dissipation member 206 is embedded in the second mounting groove 2021, and the side surface of the heat dissipation member 206 is attached to the side wall of the second mounting groove 2021, so that the VC temperature equalization plate 205 is embedded in the lower housing 202. The second mounting groove 2021 is formed in the lower housing 202 to fix the heat dissipation member 206, so that the heat dissipation member 206 can be conveniently arranged in the optical module, the heat dissipation member 206 is fully contacted with the lower housing 202, and the effect that the heat dissipation member 206 transfers heat to the lower housing 202 is guaranteed. Further, in the embodiment of the present application, the heat dissipation member 206 is fully contacted and connected to the second heat dissipation surface of the sub-module housing 401 through the second thermal pad 2061, so as to ensure the heat transfer effect between the heat dissipation member 206 and the sub-module housing 401. The second thermal pad 2061 is made of a thermal conductive material having a good thermal conductive effect and a certain elasticity, so that the thermal conductive effect between the sub-module housing 401 and the heat dissipation member 206 is ensured. In the embodiment of the present application, the first heat dissipation surface of the sub-module housing 401 does not contact the VC temperature equalization plate 205, and in order to prevent the first heat dissipation surface of the sub-module housing 401 from contacting the VC temperature equalization plate 205, the depth of the first mounting groove 2011 and the thickness of the VC temperature equalization plate 205 should be controlled, so as to ensure that a certain gap exists between the first heat dissipation surface of the module housing 401 and the VC temperature equalization plate 205 as much as possible.

The heat generated by the optical subassembly 400 is transmitted to the subassembly housing 401, transmitted to the heat dissipation member 206 through the heat dissipation member 206, and finally transmitted to the lower housing 202 through the heat dissipation member 206, and dissipated by the lower housing 202, so that a good heat dissipation purpose is achieved, and further, the heat concentration in the optical module is avoided.

Fig. 12 is a second cross-sectional view of an optical module according to an embodiment of the present application. As shown in fig. 12, in the optical module according to the embodiment of the present application, the third chip 304 is disposed on the lower surface of the circuit board 300, one end of the second heat conduction boss 208 is fixed on the upper surface of the circuit board 300 opposite to the third chip 304 by the heat conduction glue 2081, and the other end of the second heat conduction boss 208 contacts with the inner wall of the upper case 201. The heat generated by the third chip 304 is transferred to the second heat conduction boss 208 through the heat conduction glue 2081, and then is transferred to the upper shell 201 through the second heat conduction boss 208, and the heat is dissipated by utilizing the heat dissipation fins of the upper shell 201 to conduct heat with the air in a convection manner, so that a good heat dissipation purpose is achieved, and further, the heat concentration in the optical module is avoided.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A light module, comprising:

the circuit board is arranged in the wrapping inner cavity;

the optical sub-assembly is electrically connected with the circuit board;

2. The optical module according to claim 1, wherein a heat dissipation fin is disposed on an upper surface of the upper housing, a first mounting groove is disposed on a top surface of an inner wall of the upper housing, the VC temperature equalization plate is embedded in the first mounting groove, and a side surface of the VC temperature equalization plate is attached to the upper housing.

3. The optical module of claim 1, wherein the circuit board has a mounting hole, and the optical sub-module is embedded in the mounting hole.

4. The optical module of claim 3, wherein the optical subassembly comprises a subassembly housing embedded in the mounting hole, the subassembly housing comprising a top surface and a bottom surface opposite to each other, the top surface being closer to the VC temperature uniforming plate than the bottom surface;

the heat dissipation part is arranged on the inner wall of the lower shell and is in contact with the bottom surface of the secondary module shell.

5. The optical module of claim 2, wherein the optical subassembly is located at a front portion of the circuit board, the first chip is located at a rear portion of the circuit board, and the VC temperature equalization plate extends from the rear portion of the upper housing to the front portion of the upper housing;

the optical secondary module is not in contact with the VC temperature-equalizing plate.

6. The optical module according to claim 4, wherein a second mounting groove is formed on a bottom surface of an inner wall of the lower housing, the heat dissipation member is embedded in the second mounting groove, and a side surface of the heat dissipation member is attached to the lower housing.

7. The optical module of claim 1, further comprising a second chip disposed on a lower surface of the circuit board, wherein a projection of the second chip on the circuit board is not coincident with a projection of the first chip on the circuit board.

8. The optical module according to claim 7, further comprising a first heat conducting boss, wherein one end of the first heat conducting boss is connected to the upper surface of the circuit board, and the projection of the first heat conducting boss on the circuit board covers the projection of the second chip on the circuit board, and the other end of the first heat conducting boss is in contact connection with the top surface of the inner wall of the upper housing.

9. The optical module of claim 4, wherein the heat dissipation member is a copper block heat sink.

10. The optical module of claim 4, wherein the VC temperature equalization plate is in contact connection with the first chip through a first thermal pad; the heat dissipation component is in contact connection with the bottom surface through a second heat conduction pad.