CN115485412A - 用于化学品输送系统的加热器设计方案 - Google Patents

用于化学品输送系统的加热器设计方案 Download PDF

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Publication number
CN115485412A
CN115485412A CN202180032165.5A CN202180032165A CN115485412A CN 115485412 A CN115485412 A CN 115485412A CN 202180032165 A CN202180032165 A CN 202180032165A CN 115485412 A CN115485412 A CN 115485412A
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CN
China
Prior art keywords
temperature
heating element
gas line
furnace
heating
Prior art date
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Pending
Application number
CN202180032165.5A
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English (en)
Chinese (zh)
Inventor
达温德·沙玛
克里斯多夫·J·劳
班亚·翁森纳库姆
查理·达马索
马文·克莱顿·布里斯
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Lam Research Corp
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Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of CN115485412A publication Critical patent/CN115485412A/zh
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4485Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation without using carrier gas in contact with the source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45561Gas plumbing upstream of the reaction chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563Gas nozzles
    • C23C16/45565Shower nozzles
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
    • C23C16/5096Flat-bed apparatus
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0402Apparatus for fluid treatment

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
CN202180032165.5A 2020-04-30 2021-04-27 用于化学品输送系统的加热器设计方案 Pending CN115485412A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063018288P 2020-04-30 2020-04-30
US63/018,288 2020-04-30
PCT/US2021/029452 WO2021222292A1 (en) 2020-04-30 2021-04-27 Heater design solutions for chemical delivery systems

Publications (1)

Publication Number Publication Date
CN115485412A true CN115485412A (zh) 2022-12-16

Family

ID=78332189

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180032165.5A Pending CN115485412A (zh) 2020-04-30 2021-04-27 用于化学品输送系统的加热器设计方案

Country Status (6)

Country Link
US (1) US12460294B2 (https=)
JP (1) JP7691439B2 (https=)
KR (1) KR20230005931A (https=)
CN (1) CN115485412A (https=)
TW (1) TWI902792B (https=)
WO (1) WO2021222292A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12460294B2 (en) 2020-04-30 2025-11-04 Lam Research Corporation Heater design solutions for chemical delivery systems

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI129734B (en) * 2019-04-25 2022-08-15 Beneq Oy Precursor supply chamber
CN114318300B (zh) * 2021-12-30 2024-05-10 拓荆科技股份有限公司 一种半导体加工设备及其反应腔室、工艺管路穿腔模块
KR102728765B1 (ko) 2024-01-10 2024-11-13 포이스주식회사 기체상태 화학약품 공급라인의 온도제어시스템
KR102770119B1 (ko) 2024-01-10 2025-02-20 포이스주식회사 기체상태 화학약품 공급라인의 퍼지시스템

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US3651240A (en) * 1969-01-31 1972-03-21 Trw Inc Heat transfer device
US3677329A (en) * 1970-11-16 1972-07-18 Trw Inc Annular heat pipe
JPH02210822A (ja) 1989-02-10 1990-08-22 Toshiba Corp 気相成長装置
US5451258A (en) 1994-05-11 1995-09-19 Materials Research Corporation Apparatus and method for improved delivery of vaporized reactant gases to a reaction chamber
JPH0897160A (ja) 1994-09-29 1996-04-12 Fujitsu Ltd ガス吹き出し装置及びガス混合装置及び半導体装置製造方法
US5714738A (en) * 1995-07-10 1998-02-03 Watlow Electric Manufacturing Co. Apparatus and methods of making and using heater apparatus for heating an object having two-dimensional or three-dimensional curvature
WO2000036640A1 (en) 1998-12-16 2000-06-22 Tokyo Electron Limited Method of forming thin film
US6915592B2 (en) 2002-07-29 2005-07-12 Applied Materials, Inc. Method and apparatus for generating gas to a processing chamber
KR20080070893A (ko) 2007-01-29 2008-08-01 (주)티티에스 블록히터가 장착된 가스라인을 갖는 반도체 제조장치
JP2009084625A (ja) 2007-09-28 2009-04-23 Tokyo Electron Ltd 原料ガスの供給システム及び成膜装置
KR101084275B1 (ko) 2009-09-22 2011-11-16 삼성모바일디스플레이주식회사 소스 가스 공급 유닛, 이를 구비하는 증착 장치 및 방법
TWI518198B (zh) 2014-04-09 2016-01-21 中央研究院 製備薄膜之系統
JP6627464B2 (ja) 2015-03-30 2020-01-08 東京エレクトロン株式会社 原料ガス供給装置及び成膜装置
US11421320B2 (en) * 2017-12-07 2022-08-23 Entegris, Inc. Chemical delivery system and method of operating the chemical delivery system
US10975470B2 (en) * 2018-02-23 2021-04-13 Asm Ip Holding B.V. Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
US11183400B2 (en) * 2018-08-08 2021-11-23 Lam Research Corporation Progressive heating of components of substrate processing systems using TCR element-based heaters
KR20200101141A (ko) * 2019-02-19 2020-08-27 고려대학교 산학협력단 전구체 소스 공급을 위한 금속블록 결합형 히터 어셈블리를 포함하는 증착 장치
JP7691439B2 (ja) 2020-04-30 2025-06-11 ラム リサーチ コーポレーション 化学物質送達システム用のヒーター設計ソリューション

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12460294B2 (en) 2020-04-30 2025-11-04 Lam Research Corporation Heater design solutions for chemical delivery systems

Also Published As

Publication number Publication date
JP2023523945A (ja) 2023-06-08
JP7691439B2 (ja) 2025-06-11
US12460294B2 (en) 2025-11-04
TWI902792B (zh) 2025-11-01
WO2021222292A1 (en) 2021-11-04
KR20230005931A (ko) 2023-01-10
TW202208670A (zh) 2022-03-01
US20230175128A1 (en) 2023-06-08

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