CN115462188B - 电子控制装置 - Google Patents

电子控制装置 Download PDF

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Publication number
CN115462188B
CN115462188B CN202180029225.8A CN202180029225A CN115462188B CN 115462188 B CN115462188 B CN 115462188B CN 202180029225 A CN202180029225 A CN 202180029225A CN 115462188 B CN115462188 B CN 115462188B
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CN
China
Prior art keywords
electronic control
cover
control device
hole
fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180029225.8A
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English (en)
Chinese (zh)
Other versions
CN115462188A (zh
Inventor
上之惠子
河合义夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Astemo Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Astemo Ltd filed Critical Hitachi Astemo Ltd
Publication of CN115462188A publication Critical patent/CN115462188A/zh
Application granted granted Critical
Publication of CN115462188B publication Critical patent/CN115462188B/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202180029225.8A 2020-04-28 2021-02-02 电子控制装置 Active CN115462188B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-078870 2020-04-28
JP2020078870 2020-04-28
PCT/JP2021/003650 WO2021220570A1 (ja) 2020-04-28 2021-02-02 電子制御装置

Publications (2)

Publication Number Publication Date
CN115462188A CN115462188A (zh) 2022-12-09
CN115462188B true CN115462188B (zh) 2024-12-31

Family

ID=78331925

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180029225.8A Active CN115462188B (zh) 2020-04-28 2021-02-02 电子控制装置

Country Status (4)

Country Link
US (1) US12127377B2 (https=)
JP (1) JP7440622B2 (https=)
CN (1) CN115462188B (https=)
WO (1) WO2021220570A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022004183A1 (ja) * 2020-07-01 2022-01-06 日立Astemo株式会社 電子制御装置
TWI765592B (zh) * 2021-03-03 2022-05-21 啟碁科技股份有限公司 室外電子設備及其陽光遮罩
US20230345669A1 (en) * 2022-04-20 2023-10-26 Quanta Computer Inc. Heat-Absorbing Chassis For Fan-Less Electronic Component
CN116963468A (zh) * 2023-07-28 2023-10-27 江苏富联通讯技术股份有限公司 一种快速散热的5g通信模块组件及其装配方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109196967A (zh) * 2016-05-30 2019-01-11 Fxc 株式会社 电子器件以及电子器件的散热构造

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JP2000223876A (ja) * 1999-01-29 2000-08-11 Toshiba Corp 電子機器
JP2001291982A (ja) * 2000-04-06 2001-10-19 Mitsubishi Electric Corp 自然空冷式密閉型電子機器筐体
EP1285877B1 (en) * 2000-04-24 2008-04-02 Mitsubishi Denki Kabushiki Kaisha Elevator control device
JP2002190685A (ja) * 2000-12-22 2002-07-05 Toshiba Corp 電子機器
JP2004119844A (ja) 2002-09-27 2004-04-15 Mitsubishi Electric Corp 電子機器
JP5314481B2 (ja) * 2009-04-02 2013-10-16 株式会社ソニー・コンピュータエンタテインメント 電子機器
EP2292472A1 (en) * 2009-09-04 2011-03-09 Delphi Technologies, Inc. Closed and internal cooling system for car radio
US20110108250A1 (en) * 2009-11-09 2011-05-12 Alex Horng Heat Dissipating device
US8189331B2 (en) * 2010-05-25 2012-05-29 Hewlett-Packard Development Company, L.P. Thermal management systems and methods
CN102402261B (zh) * 2010-09-08 2014-11-12 神讯电脑(昆山)有限公司 具有防水功能的主机装置与其散热模块
US8711561B2 (en) * 2011-02-03 2014-04-29 Panasonic Corporation Cooling structure for electronic device
CN104284558B (zh) * 2013-07-11 2016-12-28 佛山市建准电子有限公司 手持式电子装置的护套
JP2015026670A (ja) 2013-07-25 2015-02-05 パナソニック株式会社 放熱装置
JP6307884B2 (ja) * 2014-01-08 2018-04-11 富士通株式会社 電子機器
US9836101B1 (en) * 2014-11-11 2017-12-05 Darren Saravis Cooling mount
JP6190914B1 (ja) 2016-04-06 2017-08-30 三菱電機株式会社 冷媒流路付き電気機器
JP2019113227A (ja) 2017-12-21 2019-07-11 株式会社フジクラ 冷却モジュール
JP2020008719A (ja) 2018-07-09 2020-01-16 セイコーエプソン株式会社 光源装置およびプロジェクター
JP2021039980A (ja) * 2019-08-30 2021-03-11 日立オートモティブシステムズ株式会社 電子制御装置
US11262819B2 (en) * 2020-01-09 2022-03-01 Htc Corporation Electronic device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109196967A (zh) * 2016-05-30 2019-01-11 Fxc 株式会社 电子器件以及电子器件的散热构造

Also Published As

Publication number Publication date
US12127377B2 (en) 2024-10-22
US20230292470A1 (en) 2023-09-14
JPWO2021220570A1 (https=) 2021-11-04
CN115462188A (zh) 2022-12-09
WO2021220570A1 (ja) 2021-11-04
JP7440622B2 (ja) 2024-02-28

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