JPWO2021220570A1 - - Google Patents

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Publication number
JPWO2021220570A1
JPWO2021220570A1 JP2022518607A JP2022518607A JPWO2021220570A1 JP WO2021220570 A1 JPWO2021220570 A1 JP WO2021220570A1 JP 2022518607 A JP2022518607 A JP 2022518607A JP 2022518607 A JP2022518607 A JP 2022518607A JP WO2021220570 A1 JPWO2021220570 A1 JP WO2021220570A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022518607A
Other languages
Japanese (ja)
Other versions
JP7440622B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021220570A1 publication Critical patent/JPWO2021220570A1/ja
Application granted granted Critical
Publication of JP7440622B2 publication Critical patent/JP7440622B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022518607A 2020-04-28 2021-02-02 電子制御装置 Active JP7440622B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020078870 2020-04-28
JP2020078870 2020-04-28
PCT/JP2021/003650 WO2021220570A1 (ja) 2020-04-28 2021-02-02 電子制御装置

Publications (2)

Publication Number Publication Date
JPWO2021220570A1 true JPWO2021220570A1 (https=) 2021-11-04
JP7440622B2 JP7440622B2 (ja) 2024-02-28

Family

ID=78331925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022518607A Active JP7440622B2 (ja) 2020-04-28 2021-02-02 電子制御装置

Country Status (4)

Country Link
US (1) US12127377B2 (https=)
JP (1) JP7440622B2 (https=)
CN (1) CN115462188B (https=)
WO (1) WO2021220570A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022004183A1 (ja) * 2020-07-01 2022-01-06 日立Astemo株式会社 電子制御装置
TWI765592B (zh) * 2021-03-03 2022-05-21 啟碁科技股份有限公司 室外電子設備及其陽光遮罩
US20230345669A1 (en) * 2022-04-20 2023-10-26 Quanta Computer Inc. Heat-Absorbing Chassis For Fan-Less Electronic Component
CN116963468A (zh) * 2023-07-28 2023-10-27 江苏富联通讯技术股份有限公司 一种快速散热的5g通信模块组件及其装配方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119844A (ja) * 2002-09-27 2004-04-15 Mitsubishi Electric Corp 電子機器
JP2015026670A (ja) * 2013-07-25 2015-02-05 パナソニック株式会社 放熱装置
JP2017188570A (ja) * 2016-04-06 2017-10-12 三菱電機株式会社 冷媒流路付き電気機器
JP2020008719A (ja) * 2018-07-09 2020-01-16 セイコーエプソン株式会社 光源装置およびプロジェクター

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223876A (ja) * 1999-01-29 2000-08-11 Toshiba Corp 電子機器
JP2001291982A (ja) * 2000-04-06 2001-10-19 Mitsubishi Electric Corp 自然空冷式密閉型電子機器筐体
EP1285877B1 (en) * 2000-04-24 2008-04-02 Mitsubishi Denki Kabushiki Kaisha Elevator control device
JP2002190685A (ja) * 2000-12-22 2002-07-05 Toshiba Corp 電子機器
JP5314481B2 (ja) * 2009-04-02 2013-10-16 株式会社ソニー・コンピュータエンタテインメント 電子機器
EP2292472A1 (en) * 2009-09-04 2011-03-09 Delphi Technologies, Inc. Closed and internal cooling system for car radio
US20110108250A1 (en) * 2009-11-09 2011-05-12 Alex Horng Heat Dissipating device
US8189331B2 (en) * 2010-05-25 2012-05-29 Hewlett-Packard Development Company, L.P. Thermal management systems and methods
CN102402261B (zh) * 2010-09-08 2014-11-12 神讯电脑(昆山)有限公司 具有防水功能的主机装置与其散热模块
US8711561B2 (en) * 2011-02-03 2014-04-29 Panasonic Corporation Cooling structure for electronic device
CN104284558B (zh) * 2013-07-11 2016-12-28 佛山市建准电子有限公司 手持式电子装置的护套
JP6307884B2 (ja) * 2014-01-08 2018-04-11 富士通株式会社 電子機器
US9836101B1 (en) * 2014-11-11 2017-12-05 Darren Saravis Cooling mount
JP6978828B2 (ja) 2016-05-30 2021-12-08 Ｆｘｃ株式会社 電子デバイス及び電子デバイスの放熱構造
JP2019113227A (ja) 2017-12-21 2019-07-11 株式会社フジクラ 冷却モジュール
JP2021039980A (ja) * 2019-08-30 2021-03-11 日立オートモティブシステムズ株式会社 電子制御装置
US11262819B2 (en) * 2020-01-09 2022-03-01 Htc Corporation Electronic device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119844A (ja) * 2002-09-27 2004-04-15 Mitsubishi Electric Corp 電子機器
JP2015026670A (ja) * 2013-07-25 2015-02-05 パナソニック株式会社 放熱装置
JP2017188570A (ja) * 2016-04-06 2017-10-12 三菱電機株式会社 冷媒流路付き電気機器
JP2020008719A (ja) * 2018-07-09 2020-01-16 セイコーエプソン株式会社 光源装置およびプロジェクター

Also Published As

Publication number Publication date
CN115462188B (zh) 2024-12-31
US12127377B2 (en) 2024-10-22
US20230292470A1 (en) 2023-09-14
CN115462188A (zh) 2022-12-09
WO2021220570A1 (ja) 2021-11-04
JP7440622B2 (ja) 2024-02-28

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