CN115428097A - 导电粒子、导电材料以及连接结构体 - Google Patents
导电粒子、导电材料以及连接结构体 Download PDFInfo
- Publication number
- CN115428097A CN115428097A CN202180028854.9A CN202180028854A CN115428097A CN 115428097 A CN115428097 A CN 115428097A CN 202180028854 A CN202180028854 A CN 202180028854A CN 115428097 A CN115428097 A CN 115428097A
- Authority
- CN
- China
- Prior art keywords
- palladium
- region
- conductive
- core
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20200128831 | 2020-10-06 | ||
KR10-2020-0128831 | 2020-10-06 | ||
KR1020210027896A KR102598343B1 (ko) | 2020-10-06 | 2021-03-03 | 도전입자, 도전재료 및 접속 구조체 |
KR10-2021-0027896 | 2021-03-03 | ||
PCT/KR2021/013470 WO2022075663A1 (ko) | 2020-10-06 | 2021-09-30 | 도전입자, 도전재료 및 접속 구조체 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115428097A true CN115428097A (zh) | 2022-12-02 |
Family
ID=81125878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202180028854.9A Pending CN115428097A (zh) | 2020-10-06 | 2021-09-30 | 导电粒子、导电材料以及连接结构体 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2023544928A (ja) |
CN (1) | CN115428097A (ja) |
WO (1) | WO2022075663A1 (ja) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5151920B2 (ja) * | 2008-02-05 | 2013-02-27 | 日立化成工業株式会社 | 導電粒子及び導電粒子の製造方法 |
JP5900535B2 (ja) * | 2013-05-16 | 2016-04-06 | 日立化成株式会社 | 導電粒子、絶縁被覆導電粒子、異方導電性接着剤及び導電粒子の製造方法 |
WO2016080407A1 (ja) * | 2014-11-17 | 2016-05-26 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
WO2017138483A1 (ja) * | 2016-02-10 | 2017-08-17 | 日立化成株式会社 | 絶縁被覆導電粒子、異方導電性接着剤、及び接続構造体 |
KR102527715B1 (ko) * | 2016-11-21 | 2023-05-02 | 삼성전기주식회사 | 내부전극용 도전성 분말 및 커패시터 |
-
2021
- 2021-09-30 WO PCT/KR2021/013470 patent/WO2022075663A1/ko active Application Filing
- 2021-09-30 JP JP2022562541A patent/JP2023544928A/ja active Pending
- 2021-09-30 CN CN202180028854.9A patent/CN115428097A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2023544928A (ja) | 2023-10-26 |
WO2022075663A1 (ko) | 2022-04-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4243279B2 (ja) | 導電性微粒子及び異方性導電材料 | |
JP5358328B2 (ja) | 導電性粒子、並びに異方性導電フィルム、接合体、及び接続方法 | |
JP4563110B2 (ja) | 導電性微粒子の製造方法 | |
TWI444235B (zh) | Conductive microparticles and anisotropic conductive materials | |
CN102089832B (zh) | 导电性粒子、各向异性导电膜、接合体以及连接方法 | |
US8089151B2 (en) | Conductive particles for anisotropic conductive interconnection | |
JP4674096B2 (ja) | 導電性微粒子及び異方性導電材料 | |
JP4235227B2 (ja) | 導電性微粒子及び異方性導電材料 | |
JP4638341B2 (ja) | 導電性微粒子及び異方性導電材料 | |
TWI602198B (zh) | 導電粒子、絕緣被覆導電粒子以及異向導電性接著劑 | |
CN112309604B (zh) | 导电粒子及其制造方法、导电材料、接触结构体、电气及电子部件 | |
CN103827981A (zh) | 导电性微粒及含有导电性微粒的各向异性导电材料 | |
JPWO2015037711A1 (ja) | 導電性粒子、導電材料及び接続構造体 | |
JP2007324138A (ja) | 導電性微粒子及び異方性導電材料 | |
CN115428097A (zh) | 导电粒子、导电材料以及连接结构体 | |
KR102598343B1 (ko) | 도전입자, 도전재료 및 접속 구조체 | |
JP3914206B2 (ja) | 導電性微粒子及び異方性導電材料 | |
JP4589810B2 (ja) | 導電性微粒子及び異方性導電材料 | |
JP2006086104A (ja) | 導電性微粒子及び異方性導電材料 | |
KR101410992B1 (ko) | 도전입자, 그 제조방법 및 이를 포함하는 도전성 재료 | |
CN114644768A (zh) | 高强度珠粒、利用所述高强度珠粒的导电粒子 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20230616 Address after: Chungnam, South Korea Applicant after: DUK SAN NEOLUX CO.,LTD. Address before: Ulsan, Korea Applicant before: DUKSAN HI-METAL CO.,LTD. |