CN115397094A - Metal substrate thermoelectric separation structure and manufacturing process thereof - Google Patents
Metal substrate thermoelectric separation structure and manufacturing process thereof Download PDFInfo
- Publication number
- CN115397094A CN115397094A CN202211182394.8A CN202211182394A CN115397094A CN 115397094 A CN115397094 A CN 115397094A CN 202211182394 A CN202211182394 A CN 202211182394A CN 115397094 A CN115397094 A CN 115397094A
- Authority
- CN
- China
- Prior art keywords
- thermoelectric separation
- heat
- heat dissipation
- layer
- carrier plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a metal substrate thermoelectric separation structure and a manufacturing process thereof in the technical field of PCB heat dissipation, comprising a thermoelectric separation heat dissipation carrier plate, and an insulating layer and a welding layer which are sequentially arranged on the thermoelectric separation heat dissipation carrier plate, wherein the welding layer is provided with a heat dissipation port penetrating through a heat conduction layer, the insulating layer is provided with a heat conduction layer used for being connected with the heat dissipation port and the thermoelectric separation heat dissipation carrier plate, and the first step is as follows: coating an insulating layer on the thermoelectric separation radiating carrier plate; step two: attaching a welding layer on the insulating layer; step three: manufacturing the appearance of the welding layer by etching; step four: manufacturing a heat dissipation port and a heat conduction groove for accommodating the heat conduction layer by etching or machining; step five: and plating a heat-conducting film in the heat-conducting groove. When the electronic component is used, heat on the electronic component is mainly transferred to the thermoelectric separation heat dissipation carrier plate through the heat conduction layer, and the thermoelectric separation heat dissipation carrier plate transfers and disperses the heat, so that the heat dissipation capacity is further improved.
Description
Technical Field
The invention relates to the technical field of PCB heat dissipation, in particular to a metal substrate thermoelectric separation structure and a manufacturing process thereof.
Background
For the radiating effect who improves the PCB product, the high heat conduction insulating material of current market adoption usually or adopt the better metal substrate of heat dispersion as the heat dissipation medium, conventional PCBA is at the during operation heat and is passed away through the pad, and the pad of heat conduction is kept apart by the insulating layer again, the radiating efficiency of insulating layer is generally relatively poor, make on the pad heat can't transmit fast to metal substrate, lead to after carrying the electronic component of high-power consumption, need be equipped with corresponding heat abstractor, lead to the further promotion of energy consumption.
Disclosure of Invention
The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a metal substrate thermoelectric separation structure and a manufacturing process thereof, which solve the above-mentioned problems of the related art.
The purpose of the invention is realized by the following modes:
a metal substrate thermoelectric separation structure comprises a thermoelectric separation heat dissipation carrier plate, and an insulating layer and a welding layer which are sequentially arranged on the thermoelectric separation heat dissipation carrier plate, wherein a heat dissipation port penetrating through a heat conduction layer is formed in the welding layer, and the insulating layer is provided with the heat conduction layer which is used for being connected with the heat dissipation port and the thermoelectric separation heat dissipation carrier plate.
In the above description, the thermoelectric separation heat dissipation carrier plate is made of metal, and heat transferred from the heat conduction layer can be quickly dissipated through the heat conductivity of the metal.
In the above description, the thermoelectric separation and heat dissipation carrier plate is made of a ceramic or silicone grease or sapphire substrate.
Further in the above description, the solder layer is made of metallic copper.
Further in the above description, the heat conductive layer is made of metallic tin or metallic nickel.
Further in the above description, the process comprises the following processing steps:
the method comprises the following steps: coating an insulating layer on the thermoelectric separation heat dissipation carrier plate;
step two: attaching a welding layer on the insulating layer;
step three: manufacturing the appearance of the welding layer by etching;
step four: manufacturing a heat dissipation opening and a heat conduction groove for accommodating the heat conduction layer by etching or machining;
step five: and plating a heat-conducting film in the heat-conducting groove.
The invention has the beneficial effects that: when the electronic component is used, heat on the electronic component is mainly transferred to the thermoelectric separation heat dissipation carrier plate through the heat conduction layer, and the thermoelectric separation heat dissipation carrier plate transfers and disperses the heat, so that the heat dissipation capacity is further improved.
Drawings
FIG. 1 is a cross-sectional view of a metal substrate thermoelectric separation structure and a process for fabricating the same according to the present invention; in the figures, the reference numbers are: 1-thermoelectric separation heat dissipation carrier plate, 2-insulating layer, 3-welding layer, 4-heat conduction layer, 5-heat dissipation opening.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
In this embodiment, referring to fig. 1, a metal substrate thermoelectric separation structure specifically implemented by the metal substrate thermoelectric separation structure includes a thermoelectric separation heat dissipation carrier plate 1, and an insulating layer 2 and a soldering layer 3 sequentially disposed on the thermoelectric separation heat dissipation carrier plate 1, wherein a heat dissipation port 5 penetrating through a heat conduction layer 4 is disposed on the soldering layer 3, and the heat conduction layer 4 for connecting the heat dissipation port 5 and the thermoelectric separation heat dissipation carrier plate 1 is disposed on the insulating layer 2. When the thermoelectric separation radiating carrier plate is used, heat on an electronic element is mainly transferred to the thermoelectric separation radiating carrier plate 1 through the heat conducting layer 4, and the heat conducting silicone grease is arranged between the heat conducting layer 4 and the thermoelectric separation radiating carrier plate, so that the influence of processing errors is reduced, the heat is transferred and dispersed by the thermoelectric separation radiating carrier plate 1, and the radiating capacity is further improved.
The thermoelectric separation radiating carrier plate 1 is composed of metal aluminum, heat transferred from the heat conducting layer 4 can be rapidly dispersed through the heat conductivity of the metal aluminum, the welding layer 3 is composed of metal copper, the heat conducting layer 4 is composed of metal tin or metal nickel, and the insulating layer 2 is composed of plastic.
The process comprises the following processing steps:
the method comprises the following steps: coating a plastic layer on the thermoelectric separation radiating carrier plate 1;
step two: a metal copper sheet is adhered on the insulating layer 2;
step three: the shape of the metal copper sheet is manufactured by etching, so that the metal copper sheet can be matched with a corresponding electronic element for use;
step four: manufacturing a heat dissipation port 5 and a heat conduction groove for accommodating the heat conduction layer 4 by etching;
step five: and plating a heat-conducting film in the heat-conducting groove, wherein the heat-conducting film is made of metal tin.
Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. The utility model provides a metal substrate thermoelectric separation structure, includes thermoelectric separation heat dissipation support plate and sets gradually insulating layer and the welded layer on thermoelectric separation heat dissipation support plate, its characterized in that: the welding layer is provided with a heat dissipation port penetrating through the heat conduction layer, and the insulating layer is provided with a heat conduction layer used for being connected with the heat dissipation port and the thermoelectric separation heat dissipation support plate.
2. The metal substrate thermoelectric separation structure of claim 1, wherein: the thermoelectric separation radiating carrier plate is made of metal.
3. The metal substrate thermoelectric separation structure of claim 1, wherein: the thermoelectric separation radiating carrier plate is composed of a ceramic or silicone grease or sapphire substrate.
4. The metal substrate thermoelectric separation structure of claim 1, wherein: the solder layer is made of metallic copper.
5. The metal substrate thermoelectric separation structure of claim 1, wherein: the heat conduction layer is made of metal tin or metal nickel.
6. A process for manufacturing a metal substrate thermoelectric separation structure, wherein the process produces a metal substrate thermoelectric separation structure as claimed in any one of claims 1 to 5, the process comprising the following processing steps:
the method comprises the following steps: coating an insulating layer on the thermoelectric separation heat dissipation carrier plate;
step two: attaching a welding layer on the insulating layer;
step three: manufacturing the appearance of the welding layer by etching;
step four: manufacturing a heat dissipation opening and a heat conduction groove for accommodating the heat conduction layer by etching or machining;
step five: and plating a heat-conducting film in the heat-conducting groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211182394.8A CN115397094A (en) | 2022-09-27 | 2022-09-27 | Metal substrate thermoelectric separation structure and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211182394.8A CN115397094A (en) | 2022-09-27 | 2022-09-27 | Metal substrate thermoelectric separation structure and manufacturing process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115397094A true CN115397094A (en) | 2022-11-25 |
Family
ID=84129177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211182394.8A Pending CN115397094A (en) | 2022-09-27 | 2022-09-27 | Metal substrate thermoelectric separation structure and manufacturing process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115397094A (en) |
-
2022
- 2022-09-27 CN CN202211182394.8A patent/CN115397094A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107342510B (en) | Electrical connector assembly | |
| WO2015196634A1 (en) | Manufacturing method for high-power precious alloy chip resistor | |
| CN201918430U (en) | Integral heat dissipation structure for LED substrate | |
| CN107896421B (en) | PCB capable of fast radiating | |
| CN102256441A (en) | Metal substrate of heat conducting aluminium-based core and preparation method thereof | |
| CN107342465A (en) | Electric coupler component | |
| CN102655714A (en) | Manufacturing process of metal substrate high-conductivity metal base circuit board | |
| CN109346449B (en) | High-power high-voltage LTCC module heat dissipation package | |
| CN115397094A (en) | Metal substrate thermoelectric separation structure and manufacturing process thereof | |
| CN217363612U (en) | Heat pipe mounting structure of radiator | |
| CN110620094A (en) | Packaging structure and packaging process of power semiconductor device | |
| CN215834516U (en) | Heat conducting device for electronic element | |
| CN114850811A (en) | Method for processing radiator | |
| CN211152320U (en) | Special-shaped heat-conducting metal-based copper-clad plate | |
| CN210575922U (en) | Packaging structure of power semiconductor device | |
| CN210182365U (en) | Power element capable of double-side heat radiation | |
| TWI362774B (en) | Lighting device and method for forming the same | |
| CN205016516U (en) | Semiconductor device and electronic device | |
| CN219017636U (en) | Radiating fin of semiconductor radiator | |
| CN220652012U (en) | TO-247-5L packaging structure based on DBC insulation heat dissipation | |
| CN217389106U (en) | Ceramic substrate with high thermal conductivity | |
| CN210491303U (en) | Heat radiator | |
| CN211879373U (en) | Heat-dissipating semiconductor | |
| CN117320264B (en) | Thermoelectric separation structure of metal substrate and manufacturing process thereof | |
| CN216531910U (en) | Super-thick PCB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication |