CN219017636U - Radiating fin of semiconductor radiator - Google Patents

Abstract

The utility model provides a radiating fin of a semiconductor radiator, and relates to the technical field of radiating fins. The heat dissipation device comprises a heat dissipation fin body, wherein the heat dissipation fin body comprises a base and a plurality of heat dissipation aluminum sheets arranged on the base, and the plurality of heat dissipation aluminum sheets are annularly arranged on the base to form a heat dissipation cavity; the heat dissipation aluminum sheet is L-shaped, wherein the transverse axis of the heat dissipation aluminum sheet is contacted with the base, and the base and the heat dissipation aluminum sheet are made of pure aluminum. The number of the radiating aluminum sheets can be increased by manufacturing the pure aluminum sheets into the radiating fins with thinner thickness, so that the radiating area is increased; through setting up radiating aluminum sheet to L shape, inwards extend on fixing its cross axle in the base, increase the area of contact of bottom surface and heat source to improve the radiating effect, the radiating cavity of inside formation can be used to place radiator fan, improves radiating efficiency. Compared with the radiating fins in the prior art, the radiating area can be increased, so that the radiating efficiency is improved, and the best radiating effect is achieved.

Description

Radiating fin of semiconductor radiator

Technical Field

The utility model relates to the technical field of radiating fins, in particular to a radiating fin of a semiconductor radiator.

Background

As the technological age advances, the operation efficiency of electronic devices is higher and higher, so that the functional requirements on the radiator are also increased, the existing radiator has been largely adopting stacked heat dissipation fin groups in order to increase the heat dissipation efficiency, and at present, the heat dissipation fins are increasingly widely used, so that many precise electronic or electric appliances need to use the heat dissipation fins for heat dissipation, and especially, the heat dissipation of the semiconductor refrigerator is often carried out by adopting the heat dissipation fins.

The common radiating fins in the prior art comprise an upper fin and a base, wherein the traditional upper fin is manufactured by adopting a cold forging aluminum process, and the thickness is at least 1mm and cannot be too thin, so that the radiating fins cannot be arranged too much during arrangement, the radiating area of the finally manufactured radiating fins is smaller, and the optimal radiating effect cannot be achieved; the heat dissipation fins used in the prior art are made of cold-forging aluminum, the thickness is thicker, the number is smaller, and most of heat can be dissipated from the side edges of the fin arrangement, so that the heat dissipation effect is poor.

In view of the shortcomings of the prior art, it is desirable to provide a heat sink fin for a semiconductor heat sink that solves the problems set forth in the background art.

Disclosure of Invention

The utility model aims to provide a radiating fin of a semiconductor radiator, which can solve the defects in the prior art, adopts a radiating fin made of pure aluminum and forms an annular radiating cavity, so that the thickness of the radiating fin can be reduced, the number of the radiating fins can be increased, the radiating area is increased, and an L-shaped radiating aluminum sheet is contacted with a base part, so that the radiating area can be further increased, the heat can be radiated in all directions, and the radiating effect is improved.

The embodiment of the utility model provides a radiating fin of a semiconductor radiator, which comprises a radiating fin body, wherein the radiating fin body comprises a base and a plurality of radiating aluminum sheets arranged on the base, and the radiating aluminum sheets are annularly arranged on the base to form a radiating cavity; the heat dissipation aluminum sheet is L-shaped, wherein the transverse axis of the heat dissipation aluminum sheet is in contact with the base, and the base and the heat dissipation aluminum sheet are made of pure aluminum.

In some embodiments of the utility model, the heat dissipating aluminum sheet has a thickness of 0.3mm±0.05mm.

In some embodiments of the utility model, the heat dissipating aluminum sheet is coated with a nickel coating.

In some embodiments of the utility model, the base and the heat sink aluminum sheet are both made of 1070a pure aluminum.

In some embodiments of the utility model, the heat dissipating aluminum sheet is soldered to the base using solder reflow.

In some embodiments of the present utility model, the two opposite sides of the heat dissipation fin body are provided with connecting grooves.

In some embodiments of the utility model, the number of heat dissipating aluminum sheets is 100±10 sheets.

Compared with the prior art, the embodiment of the utility model has at least the following advantages or beneficial effects:

the utility model comprises a radiating fin body, wherein the radiating fin body comprises a base and a plurality of radiating aluminum sheets arranged on the base, and the radiating aluminum sheets are annularly arranged on the base to form a radiating cavity; the heat dissipation aluminum sheet is L-shaped, wherein the transverse axis of the heat dissipation aluminum sheet is in contact with the base, and the base and the heat dissipation aluminum sheet are made of pure aluminum. The number of the radiating aluminum sheets can be increased by manufacturing the pure aluminum sheets into the radiating fins with thinner thickness, so that the radiating area is increased; through setting up radiating aluminum sheet to L shape, inwards extend on fixing its cross axle in the base, increase the area of contact of bottom surface and heat source to improve the radiating effect, the radiating cavity of inside formation can be used to place radiator fan, improves radiating efficiency. Compared with the radiating fins in the prior art, the radiating area can be increased, so that the radiating efficiency is improved, and the best radiating effect is achieved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram of an overall structure of a heat sink fin of a semiconductor heat sink according to an embodiment of the utility model;

fig. 2 is a schematic structural diagram of a semiconductor radiator according to an embodiment of the present utility model when a radiator fin is provided with a radiator fan.

Reference numerals: 100. a heat radiation fin body; 101. a base; 102. a heat radiation aluminum sheet; 103. a heat dissipation cavity; 104. a connecting groove; 200. a fan.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Examples

Referring to fig. 1-2, a schematic structural diagram of a heat sink fin of a semiconductor heat sink according to an embodiment of the present utility model is shown;

a heat radiation fin of a semiconductor radiator specifically comprises: the heat dissipation fin body 100, the heat dissipation fin body 100 comprises a base 101 and a plurality of heat dissipation aluminum sheets 102 arranged on the base 101, and the plurality of heat dissipation aluminum sheets 102 are annularly arranged on the base 101 to form a heat dissipation cavity 103; the heat dissipation aluminum sheet 102 is L-shaped, wherein a lateral axis of the heat dissipation aluminum sheet 102 contacts with the base 101, and the base 101 and the heat dissipation aluminum sheet 102 are made of pure aluminum.

Next, a heat radiation fin of a semiconductor heat sink in the present exemplary embodiment will be further described.

In one implementation manner of this embodiment, the heat dissipation fin body 100 includes a base 101 and a plurality of heat dissipation aluminum sheets 102 disposed on the base 101, the base 101 is in a ring shape, the plurality of heat dissipation aluminum sheets 102 are annularly arranged on the base 101 to form a heat dissipation cavity 103, the heat dissipation cavity 103 can be used for placing the heat dissipation fan 200, so as to improve heat dissipation efficiency and effect, and the heat dissipation aluminum sheets 102 and the base 101 are fixed by reflow soldering, so that the reflow soldering temperature is easy to control, oxidation can be avoided in the soldering process, and the manufacturing cost is easier to control; the heat dissipation aluminum sheet 102 is L-shaped, wherein, the transverse axis of the heat dissipation aluminum sheet 102 is welded and fixed with the base 101, the transverse axes of the heat dissipation aluminum sheets 102 are fixed on the base 101, a double-layer annular heat dissipation area is formed with the base 101, and the transverse axes of the heat dissipation aluminum sheets 102 can be in direct contact with a heat source after being fixed with the base 101, so that the heat dissipation area is further increased, and the heat dissipation effect can be greatly improved.

In one implementation manner of this embodiment, the base 101 and the heat dissipation aluminum sheet 102 are made of pure aluminum, specifically, 1070a pure aluminum, which has good heat conduction performance and can be made into aluminum sheets with a thickness of a fraction of a millimeter, in this embodiment, the thickness of the heat dissipation aluminum sheet 102 is made to be 0.3mm±0.05m, preferably 0.3mm, compared with the heat dissipation fins with 1mm-3mm in the prior art, the thickness is thinner, the arrangement of the heat dissipation aluminum sheets 102 is denser, and the number of the heat dissipation aluminum sheets 102 in this application is 100 sheets±10 sheets, preferably 100 sheets, so that the heat dissipation area is increased and the heat dissipation effect is better;

in a specific embodiment, when the semiconductor cooling fin is used, the heating surface of the semiconductor cooling fin is attached to the base 101 of the heat dissipation fin body 100, and the heat of the semiconductor cooling fin is transferred to the plurality of heat dissipation aluminum sheets 102 through the base 101 to dissipate heat, and the heat dissipation is accelerated under the assistance of the heat dissipation fan 200 in the heat dissipation cavity 103, so that the heat dissipation effect is improved.

It should be noted that, because the aluminum 1070a radiator 102 is softer, cannot be formed and cannot be supported, a nickel coating layer is plated on the outer layer of the radiator 102, so that the radiator 102 is hard and has strong plasticity, and is convenient to be made into an L shape or other shapes.

In one implementation manner of this embodiment, the connecting grooves 104 are formed on two opposite sides of the fin body 100. By providing the connection groove 104 thereon, the fin body 100 can be mounted on a device requiring heat dissipation through the connection member by mounting the connection member to the connection groove 104. In particular, the connector may be any connection structure known in the art suitable for connection of small devices.

The above is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (7)

1. The radiating fins of the semiconductor radiator comprise radiating fin bodies, and are characterized in that the radiating fin bodies comprise a base and a plurality of radiating aluminum sheets arranged on the base, and the radiating aluminum sheets are annularly arranged on the base to form a radiating cavity; the heat dissipation aluminum sheet is L-shaped, wherein the transverse axis of the heat dissipation aluminum sheet is in contact with the base, and the base and the heat dissipation aluminum sheet are made of pure aluminum.

2. The heat sink fin of claim 1, wherein the heat sink aluminum sheet has a thickness of 0.3mm ± 0.05mm.

3. The heat sink fin of claim 1, wherein the heat dissipating aluminum sheet is coated with a nickel coating.

4. The heat sink fin of claim 1, wherein the base and the heat sink aluminum sheet are each made of 1070a pure aluminum.

5. The heat sink fin of claim 1, wherein the heat sink aluminum sheet is soldered to the base using solder reflow.

6. The heat sink fin of claim 1, wherein the heat sink fin body has connection grooves formed on opposite sides thereof.

7. The heat sink fin of a semiconductor heat sink of claim 1, wherein the number of heat dissipating aluminum sheets is 100 ± 10.

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