CN1153400A - 导电性球搭载装置 - Google Patents
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Abstract
在用搭载吸附装置吸附用于在产品的电极上形成突出电极的导电性球时,可确实地吸附贮存部分中导电性球的导电性球搭载装置。该装置的箱体下表面上形成真空吸附导电性球的吸附孔,在其下表面未形成吸附孔的部分上形成凹下部分。为吸附导电性球,使箱体降落于贮存于容器中的导电性球层的上表面,为使导电性球流动,已吹进容器的气体往上吹向凹入部分。因此,导电性球的表层部分其整体充分地流动化,所以,可以把导电性球通过真空吸附而吸附到所有的吸附孔上。
Description
本发明涉及向芯片或基板之类的产品的电极上搭载用于形成突出电极的导电性球的导电性球搭载装置。
作为在芯片或基板之类的产品上形成突出电极的方法,人们知道一种用搭载吸附装置一揽子向产品的电极上搭载多个导电性球,然后,在加热炉等等之中,加热熔融导电性球使之固化在电极上边的方法。
图5是现有的导电性球搭载装置的搭载吸附装置上下倒了过来的斜视图,图6是用同一搭载吸附装置正在吸附导电性球的局部放大断面图。在图5中,搭载吸附装置1被构成为在箱体2的下表面上形成有吸附孔3。在本例中,由于要一揽子往4个产品上搭载导电性球,故吸附孔3被排列成方形并形成于4个地方。4是形成于箱体2的上边缘部分上的凸缘。
图6示出的是使箱体2下降到容器5中大量存放的导电性球6的层上边,接着使箱体2上升,以把导电性球6真空吸附于吸附孔3上而进行吸附的样子。向容器5的下部,吹进空气之类的气体,如虚线箭头所示,借助于使该气体吹向上方来使导电性球6流动。借助于这样地处理以使导电性球6流动,使微小的导电性球6易于真空吸附到吸附孔3上去。此外,箱体2被连接到吸引装置上。
在图6中,气体向上吹到整个容器5的内部。但是,如图6所示,在为了吸附导电性球6,在使箱体2的下表面降落于导电性球6的层上边的状态下,气体就如虚线箭头所示全部吹向箱体2的侧旁的空间,在箱体2的中央附近则被箱体2的下表面挡住而难于往上吹。因此,在侧面部分A处导电性球6能满意地进行流动而易于被确实可靠地真空吸附于吸附孔3上去,但在中央部分B处,则存在导电性球6不能满意地进行流动而使吸附孔3易于吸附失败的问题。
因而,本发明的目的是提供一种可以消除上述现有方法的那些问题,可以确实地吸附存放于贮存部分中的导电性球的导电性球的搭载装置。
因此,本发明是一种具备有导电性球的贮存部分和把该导电性球通过真空吸附而吸附于下表面的吸附孔上并搭载到由定位部分定好了位置的产品上的搭载吸附装置,并采用向上述贮存部分送气的办法以使导电性球流动化的导电性球搭载装置,在上述搭载吸附装置的下表面的没有形成上述吸附孔的部分上形成了用于使气体逃逸的凹入部分。
倘采用本发明,则由于为了吸附贮存于贮存部分中的导电性球而使搭载吸附装置下降并降落于导电性球的层的上表面上的状态下,吹向上方的气体可以向上吹往形成于搭载吸附装置的下表面上凹入部分,故导电性球层在搭载吸附装置的整个下表面上可以满意地流动化,并通过真空吸附而被确实地吸附到所有的吸附孔上去。
下边简单地说明附图。
图1是本发明的一个实施形态的导电性球搭载装置的侧面图。
图2是本发明的一个实施形态的导电性球搭载装置的搭载吸附装置的上下倒了过来的斜视图。
图3是本发明的一个实施形态的导电性球搭载装置的导电性球的贮存部分的断面图。
图4是用本发明的一个实施形态的导电性球搭载装置的搭载吸附装置正在吸附导电性球的局部放大断面图。
图5是现有的导电性球搭载装置的搭载吸附装置的上下倒了过来的斜视图。
图6是用现有的导电性球搭载装置的搭载吸附装置正在吸附导电性球的局部放大断面图。
其次,参看附图对本发明的一个实施形态进行说明。图1是本发明的一个实施形态的导电性球搭载装置的侧面图。图2是该搭载吸附装置的上下倒了过来的斜视图。图3是该导电性球贮存部分的断面图。图4是用该搭载吸附装置吸附导电性球时的局部放大断面图。
在图1中,10是搭载吸附装置,被构成为把箱体12结合到主体11下部上。主体11通过管道连接到吸引装置上。滑块14被结合到主体11的上部,在滑块14的内部内藏有使搭载吸附装置10进行上下动作的上下动作机构。另外,滑块14被保持在可动台15上并沿着可动台15向横向作水平移动。
在图2中,在箱体12的下表面上形成有4个框形的突出部分16,在突出部分16上排列成方形地形成了吸附孔17。因此,这一部件也和现有例一样一次可把导电性球搭载到4个产品上去。在突出部分16的中央部分形成有用于使气体逃逸的凹入部分18,此外在四个突出部分16之间也变成了十字形的用于使气体逃逸的凹入部分19。在箱体12的上边缘部分上向外突出地设置有用于装配主体11的凸缘20。
在图1中,在搭载吸附装置10的移动路径的下方设置有导电性球的贮存部分30、助焊剂槽21和产品22的载置部分23。其次,参看图3来说明导电性球贮存部分30的构造。31是基座,在其上方设置有箱子部分32。基座31的上表面上设有导轨33,此外,在箱子部分32的下表面上设有与导轨33相互嵌入的滑动部分34。在基座31的下部设有使凸轮3 5旋转的电机36。在箱子部分32的下表面上突出设有杆37,杆37的下端部分轴装有与凸轮35相接触的滚轮38。杆37用弹簧39向右方赋以能量,并借助于其弹力使滚轮38与凸轮35的外周面弹性接触。因此,当驱动电机36使凸轮35旋转时,箱子部分32将沿着导轨在横方向上进行往复运动。
在箱子部分32的上部装卸自如地安装有容器41。容器41的底面是网之类的通气板42,通气板42的上边贮存有大量的导电性球6。容器41的下方设有喷出气体的喷嘴43。喷咀43通过管道44连接到气体供给部分上。从喷嘴43吹出来的气体把通气板42上的导电性球6层往上方吹使导电性球6流动。另外,采用驱动电机36使箱子部分32向横方向振动的办法,使导电性球6进一步流动。
该导电性球搭载装置由上述那样的结构组成,其次,说明把导电性球6搭载到产品22上的动作。在图1中,使搭载吸附装置10运动到贮存部分30的上方,在这里使之进行下降和上升动作以吸附容器41内的导电性球6。图4示出的是为了进行吸附,使搭载吸附装置10下降,使箱体12的下表面接触于导电性球6的层的上表面的状态。这时,从喷嘴43往上吹气(参看虚线箭头),此外,驱动电机36使容器42向横向振动(箭头N)以使导电性球6流动。这样一来,由于在箱体12已下降于导电性球6的层的上表面的状态下,气体不仅可以从箱体12的侧旁向上吹,而且还可以向上吹往凹入部分18和19,故导电性球6的整个表层都将充分地流动化。因此,所有的吸附孔17都可以确实地真空吸附导电性球6。
其次,在图1中,使搭载吸附装置10上升吸附导电性球6,并向助焊剂槽21移动。接着在助焊剂槽21的上方暂时停下来,在此处进行下降和上升动作,以把助焊剂附着于已真空吸附到箱体12的下表面上的导电性球6的下表面上。
接着使搭载吸附装置10移向产品22的上方,在此进行下降和上升动作的同时,解除导电性球6的真空吸附状态,以把导电性球6搭载到产品22的上表面的电极(没有画出来)上。把搭载上导电性球6的产品22送往加热炉(没有画出来),借助于在加热炉中进行加热,使产品22的电极上边的导电性球6熔融固化以形成突出电极。
本发明并不受限于上述实施例,例如要形成搭载吸附装置上的吸附孔的排列规格可以根据对象产品来设计。
倘采用本发明,为了吸附已贮存于贮存部分中的导电性球,在使搭载吸附装置下降并降落于导电性球的层的上表面上的状态下,由于吹往上方的气体可以向上吹进已形成于搭载吸附装置的下表面上的凹入部分,故导电性球在整个表层中可充分地流动,使导电性球通过真空吸附而确实地吸附到所有的吸附孔上。
Claims (4)
1.一种导电性球搭载装置,具备有导电性球贮存部分和用负压把该导电性球吸附于下表面的吸附孔上并把该导电性球搭载于已由定位部分定好了位置的产品上的搭载吸附装置,其特征在于:采用向上述贮存部分送气体的办法使该导电性球流动,在上述搭载吸附装置的下表面的未形成上述吸附孔的部分上形成了用于使气体逃逸的凹入部分。
2.如权利要求1所述的导电性球搭载装置,其特征在于:上述贮存部分进行水平往复运动。
3.一种导电性球搭载装置,具备有导电性球贮存部分和用负压把该导电性球吸附于下表面的吸附孔上,并把该导电性球搭载到已由定位部分定好了位置的产品上的搭载吸附装置,其特征在于:采用向上述贮存部分送气体的办法使该导电性球流动,使上述吸附孔部分突出出去,并使气体从未从上述下表面突出出来且未形成吸附孔的部分逃逸出去。
4.如权利要求3所述的导电性球搭载装置,其特征在于:上述贮存部分进行水平往复运动。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP282765/1995 | 1995-10-31 | ||
JP282765/95 | 1995-10-31 | ||
JP07282765A JP3120714B2 (ja) | 1995-10-31 | 1995-10-31 | 導電性ボールの搭載装置 |
Publications (2)
Publication Number | Publication Date |
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CN1153400A true CN1153400A (zh) | 1997-07-02 |
CN1059515C CN1059515C (zh) | 2000-12-13 |
Family
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN96122761A Expired - Fee Related CN1059515C (zh) | 1995-10-31 | 1996-10-30 | 导电性球搭载装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5758409A (zh) |
JP (1) | JP3120714B2 (zh) |
KR (1) | KR100219385B1 (zh) |
CN (1) | CN1059515C (zh) |
TW (1) | TW356966U (zh) |
Cited By (1)
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WO2012159241A1 (en) * | 2011-05-20 | 2012-11-29 | Linde Aktiengesellschaft | Method and device for transporting solder spheres |
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US6003753A (en) * | 1997-07-14 | 1999-12-21 | Motorola, Inc. | Air-blow solder ball loading system for micro ball grid arrays |
US6126063A (en) * | 1997-08-14 | 2000-10-03 | Lsi Logic Corporation | Integrated circuit packaging apparatus and method |
JP4171847B2 (ja) * | 1998-01-30 | 2008-10-29 | 澁谷工業株式会社 | 半田ボールマウント装置 |
KR20000015595A (ko) * | 1998-08-31 | 2000-03-15 | 김규현 | 반도체 패키지 제조를 위한 솔더볼 범핑방법 |
US6595408B1 (en) | 1998-10-07 | 2003-07-22 | Micron Technology, Inc. | Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement |
KR100376764B1 (ko) * | 1998-11-05 | 2003-06-19 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지제조장비 |
FR2789541B1 (fr) * | 1999-02-05 | 2001-03-16 | Novatec Sa Soc | Procede de realisation de modules electroniques a connecteur a billes ou a preformes integre brasables sur circuit imprime et dispositif de mise en oeuvre |
KR100685559B1 (ko) * | 1999-03-16 | 2007-02-22 | 마츠시타 덴끼 산교 가부시키가이샤 | 도전성 볼의 탑재 장치 및 방법 |
JP4598240B2 (ja) | 1999-06-24 | 2010-12-15 | アスリートFa株式会社 | ボール搭載装置及びボール搭載方法 |
US6830175B2 (en) * | 2003-02-05 | 2004-12-14 | Carl T. Ito | Solder ball dispenser |
FR2860177B1 (fr) * | 2003-09-26 | 2007-03-02 | Novatec | Procede et dispositif de prehension de billes a partir d'un conditionnement en vrac |
KR101641860B1 (ko) * | 2010-05-12 | 2016-07-29 | 엘지이노텍 주식회사 | 발광소자 어레이, 조명장치 및 백라이트 장치 |
JP5839170B2 (ja) | 2011-09-03 | 2016-01-06 | Tdk株式会社 | ワーク搬送装置、並びにワーク処理装置及びワーク処理方法 |
JP5939232B2 (ja) * | 2013-11-13 | 2016-06-22 | ウシオ電機株式会社 | Ledイルミネーションシステム |
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EP0082902B1 (fr) * | 1981-12-29 | 1985-11-27 | International Business Machines Corporation | Procédé pour souder les broches aux oeillets des conducteurs formés sur un substrat céramique |
JPH0795554B2 (ja) * | 1987-09-14 | 1995-10-11 | 株式会社日立製作所 | はんだ球整列装置 |
US5205896A (en) * | 1992-02-03 | 1993-04-27 | Hughes Aircraft Company | Component and solder preform placement device and method of placement |
GB2284933B (en) * | 1993-05-31 | 1996-12-04 | Citizen Watch Co Ltd | Solder ball feeder |
US5615823A (en) * | 1994-07-26 | 1997-04-01 | Matsushita Electric Industrial Co., Ltd. | Soldering ball mounting apparatus and method |
JP3528264B2 (ja) * | 1994-08-19 | 2004-05-17 | ソニー株式会社 | ソルダーボールのマウント装置 |
JP3079921B2 (ja) * | 1994-11-28 | 2000-08-21 | 松下電器産業株式会社 | 半田ボールの搭載装置および搭載方法 |
-
1995
- 1995-10-31 JP JP07282765A patent/JP3120714B2/ja not_active Expired - Fee Related
-
1996
- 1996-10-25 US US08/736,766 patent/US5758409A/en not_active Expired - Lifetime
- 1996-10-26 KR KR1019960048729A patent/KR100219385B1/ko not_active IP Right Cessation
- 1996-10-29 TW TW086215591U patent/TW356966U/zh unknown
- 1996-10-30 CN CN96122761A patent/CN1059515C/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012159241A1 (en) * | 2011-05-20 | 2012-11-29 | Linde Aktiengesellschaft | Method and device for transporting solder spheres |
Also Published As
Publication number | Publication date |
---|---|
JPH09129668A (ja) | 1997-05-16 |
KR100219385B1 (ko) | 1999-09-01 |
KR970023933A (ko) | 1997-05-30 |
CN1059515C (zh) | 2000-12-13 |
JP3120714B2 (ja) | 2000-12-25 |
US5758409A (en) | 1998-06-02 |
TW356966U (en) | 1999-04-21 |
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