WO2012159241A1 - Method and device for transporting solder spheres - Google Patents

Method and device for transporting solder spheres Download PDF

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Publication number
WO2012159241A1
WO2012159241A1 PCT/CN2011/074378 CN2011074378W WO2012159241A1 WO 2012159241 A1 WO2012159241 A1 WO 2012159241A1 CN 2011074378 W CN2011074378 W CN 2011074378W WO 2012159241 A1 WO2012159241 A1 WO 2012159241A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder spheres
tooling plate
spheres
solder
sphere chamber
Prior art date
Application number
PCT/CN2011/074378
Other languages
French (fr)
Inventor
Edward Feng
Original Assignee
Linde Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linde Aktiengesellschaft filed Critical Linde Aktiengesellschaft
Priority to EP11866365.7A priority Critical patent/EP2710630A4/en
Priority to PCT/CN2011/074378 priority patent/WO2012159241A1/en
Priority to CN201180070964.8A priority patent/CN103548128A/en
Priority to TW101117874A priority patent/TW201302367A/en
Publication of WO2012159241A1 publication Critical patent/WO2012159241A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components

Definitions

  • the invention relates to a method and a device for transporting solder spheres.
  • Solder bumping is a technology widely used in IC packaging. Typically, solder bumps are formed from corresponding solder spheres in a desired pattern upon the surface of a wafer or other substrate, which is to be electrically contacted with other active or passive devices. Solder bumps are small spheres of solder that are bonded to contact pads of wafers or substrates (or any other chip or semiconductor devices), and are subsequently used for facedown bonding.
  • the length of electrical connections between for example a chip and a substrate can be minimized for example by placing solder spheres on a chip or tooling plate and aligning the solder spheres with the contact pads on the substrate and re-flowing the solder spheres, for example in a furnace, to generate solder bumps and establish a bonding between the chip and the substrate.
  • This method provides excellent electrical connections with small parasitic inductances and capacitances and also, the contact pads are distributed over the entire chip surface and are not confined to the edges, as is common in wire bonding technologies.
  • the silicon area can be more efficiently used, and the maximum number of interconnections can be increased. Also, signal interconnections are shortened.
  • Solder bump technology is usually used in flip chip technology, wafer level scale packaging and ball grip array technology to provide interconnections between for example two substrates or chips.
  • solder bump fabrication on semiconductor wafers i. e. either solder paste printing, electrical plating or bump sphere transfer. The latter is widely used due to its flexibility in bump size and high operational yield.
  • solder spheres provided in a sphere chamber are picked up by a tooling plate, which is lowered into the sphere chamber. A vacuum is applied to the tooling plate to selectively pick up the spheres.
  • the tooling plate comprises a number of vacuum holes arranged in a pattern corresponding to the pattern in which the spheres are to be positioned on a wafer or substrate. To make sure that each vacuum hole can successfully pick up one sphere, means are provided within the sphere chamber to provide the solder spheres with a continuous motion.
  • Such means can be, for example, ultrasonic vibration means on the tooling plate or in the sphere chamber, by means of which the solder spheres are kept moving until they are sucked onto a vacuum hole.
  • a further possibility of providing such movement of the spheres is to blow air into the sphere chamber, for example from the bottom of the chamber, to impart a movement to the spheres, so that they can be more easily picked up by the tooling plate.
  • the movement of the spheres and the collisions happening among spheres also help to remove the extra spheres in one vacuum hole. But on the other side, such a blowing of air can lead to or speed up oxidization of the surface of the solder spheres, especially due to the fact that individual spheres frictionally contact one another. Oxidization leads to a deterioration of soldering efficiency, due to e. g. cold joint effects, non- wetting effects, etc. in the subsequent reflow process.
  • the invention thus seeks to avoid or minimize oxidation effects in connection with transporting solders spheres from a sphere chamber to a tooling plate.
  • the invention provides a simple and effective way for transporting solder spheres on to the desired positions on a tooling plate.
  • a porous board (for example made of ceramic) is provided, through which the nitrogen gas is blown.
  • a porous board is effective as a nitrogen gas diffusor, so that the nitrogen blown through the board becomes evenly distributed, providing a smooth gas flow, which is helpful in connection with the pick up of the spheres by the tooling plate.
  • solder spheres are subjected to an ultrasonic vibration in the sphere chamber.
  • Such an ultrasonic vibration supports the movement of the solder spheres provided by the nitrogen gas flow.
  • the disadvantages observed in the connection with such an ultrasonic vibration in the prior art can be avoided due to the presence of nitrogen in the sphere chamber.
  • the nitrogen gas is blown into the sphere chamber from the lower side or from the bottom of the sphere chamber, and the tooling plate is positioned at the upper side or at the top side of the sphere chamber.
  • an even nitrogen gas flow can be provided over an area essentially corresponding to the whole area of the tooling plate.
  • the positioning of the solder spheres on the tooling plate is effected by vacuum means provided with the tooling plate.
  • the tooling plate is provided with vacuum holes with diameters slightly smaller than the diameters of the solder spheres.
  • the vacuum means create a negative pressure at these vacuum holes, so that solder spheres can be trapped at the positions of the vacuum holes.
  • the method according to the invention further comprises, when the solder spheres are positioned at the desired positions on the tooling plate to arrange the tooling plate over a wafer or substrate such that the solder spheres are aligned with contact pads on the wafer or substrate, whereafter the solder spheres are released by the tooling plates, and the solder spheres are subsequently re-flowed.
  • Figure 1 shows a schematic side view of a preferred embodiment of a device for
  • a device according to the invention is shown in figure 1 and generally designated 100.
  • Device 100 comprises a sphere chamber 102, in which a plurality of spheres 110 is provided.
  • the sphere chamber can serve as a storage chamber for spheres 110.
  • a tooling plate 104 is provided above or in the upper part of the sphere chamber 102, i. e. at its upper side, which can be lowered into the sphere chamber 102.
  • the tooling plate 104 is provided with vacuum means 106, by means of which vacuum holes 104a provided in the tooling plate 104 can be provided with a negative pressure or vacuum, which acts as a trapping force for solder spheres 110 within the sphere chamber 102, so that each vacuum hole 104a can be filled with one solder sphere 110.
  • the diameters of the vacuum holes 104a are chosen slightly smaller than the diameters of the solder spheres 110.
  • the solder spheres can be released from the tooling plate.
  • gas blowing means 112 (schematically shown by means of arrows) are provided.
  • the blowing means blow nitrogen into the sphere chamber through holes or nozzles 102a provided in the lower side of the sphere chamber 102.
  • ultrasonic vibration means which can also impart or support a movement of the solder spheres towards the vacuum holes 104a.
  • Such ultrasonic vibration means are schematically shown as double arrows 114 (for the tooling plates 104) and 116 (for the sphere chamber 102).
  • the solder spheres are urged towards the tooling plate and, in case the vacuum means 106 are switched on, can be trapped in the vacuum holes 104a.
  • a porous board 120 is provided in the sphere chamber between the lower side of the sphere chamber 102 and the tooling plate 104.
  • the pores in the board 120 are dimensioned so that they can act as a nitrogen gas diffusor, which leads to the desired even and uniform nitrogen gas flow. Such an even and uniform flow assists in an effective pick up of the solder spheres by the tooling plate.
  • any oxygen content of the chamber can be diluted or removed so that any negative effects induced by the presence of oxygen in the sphere chamber are effectively avoided.
  • solder bump bonding is well known, and will not be described in detail. Suffice it to say that when all vacuum holes are occupied by solder spheres, the tooling plate is moved into alignment with a wafer or substrate provided with contact pads in positions corresponding to the positions of the solder spheres on the tooling plate, i. e. the positions of the vacuum holes. By switching off or deactivating the vacuum means, the solder spheres are released from the tooling plate and placed on the contact pads.
  • the contact pads have been prepared with flux. Subsequently, the solder spheres can be re- flowed, thus providing solder bumps at the desired positions.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

A method for transporting solder spheres (110) comprises the following steps: providing a plurality of solder spheres (110) in a sphere chamber (102), blowing nitrogen gas into the sphere chamber (102) such that the solder spheres (110) are transported towards a tooling plate (104), and positioning the solder spheres (110) at desired positions on the tooling plate (104). A device for transporting solder spheres (110) comprises a sphere chamber (102), in which a plurality of solder spheres (110) can be provided, means (112) for blowing nitrogen gas into the sphere chamber (102), and a tooling plate (104). The invention provides a simple and effective way for transporting solder spheres to the desired positions on the tooling plate, which can avoid or minimize oxidation effects.

Description

Method and device for transporting solder spheres
Field of the invention
The invention relates to a method and a device for transporting solder spheres.
Background of the invention
Solder bumping is a technology widely used in IC packaging. Typically, solder bumps are formed from corresponding solder spheres in a desired pattern upon the surface of a wafer or other substrate, which is to be electrically contacted with other active or passive devices. Solder bumps are small spheres of solder that are bonded to contact pads of wafers or substrates (or any other chip or semiconductor devices), and are subsequently used for facedown bonding. The length of electrical connections between for example a chip and a substrate can be minimized for example by placing solder spheres on a chip or tooling plate and aligning the solder spheres with the contact pads on the substrate and re-flowing the solder spheres, for example in a furnace, to generate solder bumps and establish a bonding between the chip and the substrate. This method provides excellent electrical connections with small parasitic inductances and capacitances and also, the contact pads are distributed over the entire chip surface and are not confined to the edges, as is common in wire bonding technologies. Thus, the silicon area can be more efficiently used, and the maximum number of interconnections can be increased. Also, signal interconnections are shortened.
Solder bump technology is usually used in flip chip technology, wafer level scale packaging and ball grip array technology to provide interconnections between for example two substrates or chips. Usually, one of three methods for solder bump fabrication on semiconductor wafers is used, i. e. either solder paste printing, electrical plating or bump sphere transfer. The latter is widely used due to its flexibility in bump size and high operational yield. Usually, solder spheres provided in a sphere chamber are picked up by a tooling plate, which is lowered into the sphere chamber. A vacuum is applied to the tooling plate to selectively pick up the spheres. The tooling plate comprises a number of vacuum holes arranged in a pattern corresponding to the pattern in which the spheres are to be positioned on a wafer or substrate. To make sure that each vacuum hole can successfully pick up one sphere, means are provided within the sphere chamber to provide the solder spheres with a continuous motion.
Such means can be, for example, ultrasonic vibration means on the tooling plate or in the sphere chamber, by means of which the solder spheres are kept moving until they are sucked onto a vacuum hole. A further possibility of providing such movement of the spheres is to blow air into the sphere chamber, for example from the bottom of the chamber, to impart a movement to the spheres, so that they can be more easily picked up by the tooling plate. Additionally, the movement of the spheres and the collisions happening among spheres also help to remove the extra spheres in one vacuum hole. But on the other side, such a blowing of air can lead to or speed up oxidization of the surface of the solder spheres, especially due to the fact that individual spheres frictionally contact one another. Oxidization leads to a deterioration of soldering efficiency, due to e. g. cold joint effects, non- wetting effects, etc. in the subsequent reflow process.
Summary of the invention
The invention thus seeks to avoid or minimize oxidation effects in connection with transporting solders spheres from a sphere chamber to a tooling plate.
This object is achieved by a method for transporting solder spheres comprising the features of claim 1 and a corresponding device comprising the features of claim 7.
By blowing nitrogen into the sphere chamber such that the solder spheres are urged or transported towards the tooling plate, negative effects associated with previously known methods for achieving this transportation can be avoided. Due to the presence of nitrogen within the sphere chamber (i. e. creating a nitrogen atmosphere) the negative effects of oxidization in connection with frictional movement of the solder spheres can be avoided. The invention provides a simple and effective way for transporting solder spheres on to the desired positions on a tooling plate.
Advantageous embodiments of the invention are the subject matter of the dependent claims. According to a specially preferred embodiment, a porous board (for example made of ceramic) is provided, through which the nitrogen gas is blown. Such a porous board is effective as a nitrogen gas diffusor, so that the nitrogen blown through the board becomes evenly distributed, providing a smooth gas flow, which is helpful in connection with the pick up of the spheres by the tooling plate.
It is also advantageous if the solder spheres are subjected to an ultrasonic vibration in the sphere chamber. Such an ultrasonic vibration supports the movement of the solder spheres provided by the nitrogen gas flow. The disadvantages observed in the connection with such an ultrasonic vibration in the prior art can be avoided due to the presence of nitrogen in the sphere chamber.
Advantageously, the nitrogen gas is blown into the sphere chamber from the lower side or from the bottom of the sphere chamber, and the tooling plate is positioned at the upper side or at the top side of the sphere chamber. Hereby, an even nitrogen gas flow can be provided over an area essentially corresponding to the whole area of the tooling plate.
According to a preferred embodiment of the invention, the positioning of the solder spheres on the tooling plate is effected by vacuum means provided with the tooling plate. Advantageously, the tooling plate is provided with vacuum holes with diameters slightly smaller than the diameters of the solder spheres. The vacuum means create a negative pressure at these vacuum holes, so that solder spheres can be trapped at the positions of the vacuum holes. Expediently, the method according to the invention further comprises, when the solder spheres are positioned at the desired positions on the tooling plate to arrange the tooling plate over a wafer or substrate such that the solder spheres are aligned with contact pads on the wafer or substrate, whereafter the solder spheres are released by the tooling plates, and the solder spheres are subsequently re-flowed.
Further advantages of the invention will become apparent from the description of the appended figure.
It should be noted that the previously mentioned features and the features to be further described in the following are usable not only in the respectively indicated combination, but also in further combinations or taken alone, without departing from the scope of the present invention.
Brief description of the drawings
Figure 1 shows a schematic side view of a preferred embodiment of a device for
transporting solder spheres according to the invention.
Detailed description of preferred embodiments
A device according to the invention is shown in figure 1 and generally designated 100. Device 100 comprises a sphere chamber 102, in which a plurality of spheres 110 is provided. The sphere chamber can serve as a storage chamber for spheres 110.
Above or in the upper part of the sphere chamber 102, i. e. at its upper side, a tooling plate 104 is provided, which can be lowered into the sphere chamber 102. The tooling plate 104 is provided with vacuum means 106, by means of which vacuum holes 104a provided in the tooling plate 104 can be provided with a negative pressure or vacuum, which acts as a trapping force for solder spheres 110 within the sphere chamber 102, so that each vacuum hole 104a can be filled with one solder sphere 110. The diameters of the vacuum holes 104a are chosen slightly smaller than the diameters of the solder spheres 110.
By switching off the vacuum means at a later stage, when the tooling plate is positioned over a substrate with the solder spheres aligned with corresponding pads (not shown), the solder spheres can be released from the tooling plate.
In order to support a movement of the solder spheres 110 towards the vacuum holes 104a in the tooling plate 104, gas blowing means 112 (schematically shown by means of arrows) are provided. The blowing means blow nitrogen into the sphere chamber through holes or nozzles 102a provided in the lower side of the sphere chamber 102.
Additionally hereto, it is possible to provide the tooling plate 104 and/or the sphere chamber 102 with ultrasonic vibration means, which can also impart or support a movement of the solder spheres towards the vacuum holes 104a. Such ultrasonic vibration means are schematically shown as double arrows 114 (for the tooling plates 104) and 116 (for the sphere chamber 102).
By blowing nitrogen into the sphere chamber 102, a nitrogen atmosphere is created within the sphere chamber (i. e. oxygen is urged out of the chamber), so that oxidation effects due to frictional movement of the solder spheres can be avoided.
All in all, by means of a flow of nitrogen gas towards the tooling plate, the solder spheres are urged towards the tooling plate and, in case the vacuum means 106 are switched on, can be trapped in the vacuum holes 104a.
In order to provide an especially even and uniform flow of nitrogen gas, a porous board 120 is provided in the sphere chamber between the lower side of the sphere chamber 102 and the tooling plate 104. The pores in the board 120 are dimensioned so that they can act as a nitrogen gas diffusor, which leads to the desired even and uniform nitrogen gas flow. Such an even and uniform flow assists in an effective pick up of the solder spheres by the tooling plate.
By means of blowing nitrogen gas into the sphere chamber any oxygen content of the chamber can be diluted or removed so that any negative effects induced by the presence of oxygen in the sphere chamber are effectively avoided.
The further steps involved in solder bump bonding are well known, and will not be described in detail. Suffice it to say that when all vacuum holes are occupied by solder spheres, the tooling plate is moved into alignment with a wafer or substrate provided with contact pads in positions corresponding to the positions of the solder spheres on the tooling plate, i. e. the positions of the vacuum holes. By switching off or deactivating the vacuum means, the solder spheres are released from the tooling plate and placed on the contact pads. Advantageously, the contact pads have been prepared with flux. Subsequently, the solder spheres can be re- flowed, thus providing solder bumps at the desired positions.

Claims

Claims
1. Method for transporting solder spheres (110), comprising the following steps:
- providing a plurality of solder spheres (110) in a sphere chamber (102),
- blowing nitrogen gas into the sphere chamber (102) such that the solder spheres (110) are transported towards a tooling plate (104), and
- positioning the solder spheres (110) at desired positions on the tooling plate (104).
2. Method according to claim 1, wherein the nitrogen gas is blown towards the tooling plate through a porous board (120).
3. Method according to claim 1 or claim 2, wherein the solder spheres (110) are subjected to an ultrasonic vibration in the sphere chamber (102) by ultrasonic vibration means (114, 116).
4. Method according to any one of the preceding claims, wherein the nitrogen gas is blown into the sphere chamber (102) through holes (102a) in a lower side of the sphere chamber (102), and the tooling plate (104) is positioned at an upper side of the sphere chamber (102).
5. Method according to any one of the preceding claims, wherein the positioning of the solder spheres (110) on the tooling plate (104) is effected by vacuum means (106) provided with the tooling plate (104).
6. Method according to any one of the preceding claims, wherein, when the solder spheres (110) are positioned at the desired positions, the tooling plate (104) is arranged over a wafer or substrate such that the solder spheres (110) are aligned with contact pads on the wafer or substrate, the solder spheres (110) are released by the tooling plate (104), and the solder spheres are subsequently re-flowed.
7. Device for transporting solder spheres, comprising a sphere chamber (102), in which a plurality of solder spheres (110) can be provided, means (112) for blowing nitrogen gas into the sphere chamber, and a tooling plate (104), the solder spheres being transportable to desired positions on the tooling plate by means of the nitrogen gas blown into the sphere chamber (102).
8. Device according to claim 7, comprising a porous board (120) arranged between the means (112) for blowing nitrogen into the sphere chamber (102) and the tooling plate (104).
9. Device according to claim 7 or 8, wherein the tooling plate comprises vacuum means (106) for trapping solder spheres (110) on it at the desired positions, when the vacuum means (106) are switched on, the solder spheres being releasable from the tooling plate by switching the vacuum means (106) off or reducing the vacuum provided by the vacuum means (106) acting on the solder spheres.
PCT/CN2011/074378 2011-05-20 2011-05-20 Method and device for transporting solder spheres WO2012159241A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP11866365.7A EP2710630A4 (en) 2011-05-20 2011-05-20 Method and device for transporting solder spheres
PCT/CN2011/074378 WO2012159241A1 (en) 2011-05-20 2011-05-20 Method and device for transporting solder spheres
CN201180070964.8A CN103548128A (en) 2011-05-20 2011-05-20 Method and device for transporting solder spheres
TW101117874A TW201302367A (en) 2011-05-20 2012-05-18 Method and device for transporting solder spheres

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/074378 WO2012159241A1 (en) 2011-05-20 2011-05-20 Method and device for transporting solder spheres

Publications (1)

Publication Number Publication Date
WO2012159241A1 true WO2012159241A1 (en) 2012-11-29

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EP (1) EP2710630A4 (en)
CN (1) CN103548128A (en)
TW (1) TW201302367A (en)
WO (1) WO2012159241A1 (en)

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Publication number Priority date Publication date Assignee Title
CN104384656B (en) * 2014-10-22 2016-03-23 苏州大学 A kind of manipulator for laying diode solder plate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08264930A (en) * 1995-03-24 1996-10-11 Shibuya Kogyo Co Ltd Method for supplying solder ball
CN1153400A (en) * 1995-10-31 1997-07-02 松下电器产业株式会社 Conductive ball carring device
JP2002093843A (en) * 2000-09-20 2002-03-29 Ueno Seiki Kk Apparatus and method of mounting metal ball
JP2002093836A (en) * 2000-09-13 2002-03-29 Ueno Seiki Kk Apparatus and method of mounting metal ball
JP2005044984A (en) * 2003-07-28 2005-02-17 Nippon Steel Corp Container and method for housing fine conductive ball and device and method for arranging and mounting fine conductive ball

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5680984A (en) * 1994-05-13 1997-10-28 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting soldering balls onto surfaces of electronic components
US5657528A (en) * 1994-08-25 1997-08-19 Matsushita Electric Industrial Co., Ltd. Method of transferring conductive balls
EP2114608B1 (en) * 2007-01-24 2013-03-06 Pac Tech - Packaging Technologies GmbH Method of and device for contacting a solder ball formation
US8012866B2 (en) * 2008-05-30 2011-09-06 Asm Assembly Automation Ltd Method of bonding semiconductor devices utilizing solder balls

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08264930A (en) * 1995-03-24 1996-10-11 Shibuya Kogyo Co Ltd Method for supplying solder ball
CN1153400A (en) * 1995-10-31 1997-07-02 松下电器产业株式会社 Conductive ball carring device
JP2002093836A (en) * 2000-09-13 2002-03-29 Ueno Seiki Kk Apparatus and method of mounting metal ball
JP2002093843A (en) * 2000-09-20 2002-03-29 Ueno Seiki Kk Apparatus and method of mounting metal ball
JP2005044984A (en) * 2003-07-28 2005-02-17 Nippon Steel Corp Container and method for housing fine conductive ball and device and method for arranging and mounting fine conductive ball

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2710630A4 *

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