JP2002093843A - Apparatus and method of mounting metal ball - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and method of mounting metal balls, with which the suction efficiency of metal balls by a suction head can be increased. SOLUTION: In a gas blow-up space 15 located below a ventilating partition plate 11, a plurality of straightening vanes 17 are disposed aslantedly, in parallel with each other. The gas blow-up space 15 is connected to a source of gas (not shown) via a gas entrance 19. When the suction head 1 sucks the metal balls 3, a gas flown into the space 15 through the gas entrance 9 becomes a gas flow directed upwards on the slant by means of the straightening vanes 17 to be blown against the metal balls, which are then caused to float obliquely upwardly.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an area array connection technique, which is one of techniques for mounting a semiconductor device at high density, in which a metal ball as an external electrode is provided on a semiconductor device or an electronic circuit board. The present invention relates to a metal ball mounting device and a mounting method for mounting on an electrode.

[0002]

2. Description of the Related Art There are many methods in which a metal ball is brought into close contact with a pad electrode provided on a semiconductor chip, a semiconductor package, or an electronic circuit board to form an electrode called a ball or a bump. This is to pick up a number of metal balls aligned in accordance with a predetermined arrangement,
This is a method in which, after being mounted on a pad electrode at a time, a metal ball is adhered by heat treatment or bonding with a conductive paste or a conductive adhesive.

[0003] As a metal ball mounting device to be provided for this, a plurality of metal balls are suctioned to a suction head having a plurality of suction holes provided in accordance with a predetermined arrangement on a lower surface, and are aligned and picked up. Japanese Patent Application Laid-Open No. 61-2427 discloses an apparatus for mounting a metal ball mounted on an electrode provided on a chip, a semiconductor package, or an electronic circuit board.
No. 59 is disclosed.

In this conventional metal ball mounting device,
If an adsorption error occurs in which the metal sphere is not adsorbed to the adsorption hole,
There is a problem that a pad electrode on which a metal ball is not mounted occurs. On the other hand, if a surplus ball to which a metal ball adheres due to static electricity or the like is generated in a portion where the suction hole is not formed, there is a possibility that the metal ball is mounted on a portion other than the pad electrode. Either case is a mounting error, which is a major factor in reducing the yield in the mounting process.

[0005] In order to ensure that metal spheres are adsorbed to the adsorption holes,
Japanese Patent Application Laid-Open No. 5-259224 discloses an adsorption container in which a gas is introduced into a container for storing metal spheres so that the metal spheres in the metal sphere storage container are in a semi-floating state in the adsorption step. This container is provided with a microporous plate 2 in a container 3 as shown in FIG.
Is stored, and air is introduced into the container lower part 6 by the blower 4 to float the metal sphere 1. In this state, the suction head 7 is introduced into the metal sphere storage container 3, and the metal spheres 1 are sucked into the plurality of suction holes 9 provided in the suction head 7, aligned and picked up.

In Japanese Patent Application Laid-Open No. 7-307340, a metal sphere 1 is blown out together with gas from a slit-shaped gas blowing section 72 (referred to as FIG. 8 in the present specification) provided in the upper portion of a metal sphere storage container. A device for mounting a metal ball sprayed on the lower surface of the suction head 3 is disclosed. This is provided in the lower part of the suction head 3 by blowing up the metal spheres 1 stored on the whole area of the mesh 75 from below with a gas, and further blowing a part of the metal spheres 1 upward from the blowing part 72. The suction holes 4 are to be adsorbed, and by moving the suction head 3 in the horizontal direction, metal balls are adsorbed to all of the suction holes 4 of the suction head.

JP-A-5-259224, JP-A-7-259
In any of the techniques disclosed in Japanese Patent No. 307340, the probability that the metal sphere encounters the suction hole is raised by floating and moving the metal sphere at the time of suction.

[0008] However, the above-mentioned prior art has the following problems.

When the metal sphere storage container disclosed in Japanese Patent Application Laid-Open No. 5-259224 is used, all the metal spheres stored in the metal sphere storage container simultaneously float uniformly. For this reason, there has been a problem that the metal balls rub against each other, the surface is scratched, and an oxide film is formed.

If the surface of the metal sphere is scratched or an oxide film is formed before the metal sphere is stored in the metal sphere storage container and brought into close contact with the pad electrode, an oxide film is formed between the metal sphere and the pad electrode during heating and melting. Alloying reaction, which causes poor adhesion. In addition, since the oxide film generally has a low conductivity and a large electric resistance, when formed on the surface of the metal sphere, the resistance increases and a conduction failure occurs. On the other hand, when a flaw is generated, the contact area between the metal ball and the pad electrode is reduced, the resistance is increased, and the same conduction failure as that when an oxide film is generated occurs. Similar defects also occur when metal balls are brought into close contact with a conductive paste or a conductive adhesive.

Further, since all the metal balls in the storage container float, the horizontal movement of the metal balls in the floating state is restricted. Therefore, when the metal sphere does not fly toward the suction hole, there is a problem that the suction hole cannot absorb the metal sphere.

Further, the publication (Japanese Patent Laid-Open No. 5-259224)
In the technique disclosed in Japanese Unexamined Patent Application, First Publication No. H11-268, when there are too many metal balls stored in the metal ball storage container, the metal balls float in an overcrowded state. In this case, when a plurality of metal spheres fly as one lump, a problem that the metal spheres hinder each other's course and the metal spheres are not adsorbed to some of the suction holes easily occurs. On the other hand, when there are few metal balls stored in the metal ball storage container, the metal balls float in a sparse state. In this case, the metal sphere needs to move a long distance in the horizontal direction in order to reach the suction hole, and the problem that the suction hole where the metal sphere does not reach is likely to occur. For this reason, it was necessary to strictly control the metal balls stored in the metal ball storage container.

That is, in order to prevent metal balls from floating in a sparse state, it is necessary to always store a certain amount or more of metal balls in the metal ball storage container. Since the metal spheres are floated every time the adsorption process is performed, the metal spheres are rubbed with each other, scratched, and an oxide film is formed. When the storage amount is large, the time for which the metal spheres are stored in the storage container becomes longer, and the number of times of rubbing by the adsorption process increases. As a result,
There is a problem that oxide film formation is increased.

According to the technique disclosed in the publication (JP-A-5-259224), a large amount of metal spheres stored in a metal sphere storage container are simultaneously and uniformly floated. Therefore, it was necessary to use a large amount of an inert gas such as nitrogen or argon or dry air introduced into the container. These inert gas and dry air are indispensable for suppressing the formation of an oxide film on the surface of the metal sphere, but they are expensive and have a problem of increasing running cost.

On the other hand, in the apparatus disclosed in Japanese Patent Application Laid-Open No. 7-307340, the range in which the metal sphere is sprayed is limited, so that the restriction on the movement in the horizontal direction is reduced. As a result, the adsorption yield could be increased, and the running gas could be suppressed by suppressing the amount of gas used.

However, the above publication (Japanese Patent Laid-Open No. 7-307)
No. 340), the metal sphere is blown to the suction head via the blowing section, so that the metal sphere blown to the suction head and not sucked to the suction hole is removed. , Rolls on a cover 74 provided on the upper portion of the storage section 70, and an opening 7 provided on the outer periphery of the cover 74.
8 and is collected in the metal sphere storage container through a long path. Further, when the metal sphere is ejected from the outlet, it rubs against the inner surface of the outlet at a high speed. For this reason, there is a problem that scratches on the surface of the metal sphere and formation of an oxide film are easily generated.

Further, since the metal head is moved in the horizontal direction at the time of suction in order to cause the metal ball to be sucked into all the suction holes provided in the suction head, the metal head is sealed with the metal head storage container with the suction head. I can't make a structure. As a result, the adsorption step cannot be performed in a non-oxidizing atmosphere, and an oxide film is easily formed on the surface of the metal sphere.

In addition, since a closed structure cannot be formed between the suction head and the metal sphere storage container, there is a problem that metal spheres scatter outside. In addition, since the gas introduced into the metal sphere storage container also blows out from the opening 78 on the outer periphery of the upper cover, the metal ball that has not been adsorbed is blown out, or the metal sphere inside the storage container is blown out and scattered. There is the problem of doing it.

Further, the publication (Japanese Patent Application Laid-Open No. 7-307340)
According to the method disclosed in Japanese Patent Application Laid-Open No. H11-146, the metal ball collides with the suction head at a relatively high speed, and the metal ball is repelled. As a result, there is a limit in improving the adsorption yield.

In addition to the above, new problems have arisen due to the recent development of semiconductor device manufacturing methods. That is, in recent years,
The number of electrodes per semiconductor element tends to increase. Further, for the purpose of cost reduction, a manufacturing method in which a large number of semiconductor devices are put together and metal balls are mounted collectively has been generalized. For this reason, the number of metal balls mounted at one time is constantly increasing. Further, in recent years, attention has been paid to wafer-level packaging technology for processing a semiconductor element before cutting it from a wafer, and the prospect of practical use is being established. For this reason, a metal sphere mounting device capable of mounting 30,000 to 50,000 metal spheres at a time will be required in the near future. For this reason, there is a demand for a metal ball mounting device that can increase the yield higher than the current one, realize a higher adsorption yield than before, and suppress the occurrence of factors that cause various problems such as scratch generation and oxide film formation. .

[0021]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a metal ball mounting apparatus and a mounting method capable of increasing the efficiency of metal ball suction by a suction head.

[0022]

SUMMARY OF THE INVENTION According to one aspect of the present invention, such a technical problem is solved by providing a metal sphere in a metal ball storage space which is vertically divided by an air-permeable partition wall. Metal ball storage container, and a metal ball mounting device having a suction head provided on a lower surface with a plurality of suction holes for vacuum suction of the metal balls stored in the metal ball storage container, Formed below the partition wall of the metal sphere storage container,
A plurality of straightening plates juxtaposed to each other are provided in an inclined manner in a gas blowing space connected to a gas supply source, and the gas in the gas blowing space is directed obliquely upward by the straightening plates. This is achieved by providing a mounting device for a metal sphere that does the following.

According to another aspect of the present invention, there is provided a metal sphere storage container which is vertically divided by a ventilation partition wall and stores metal spheres in a metal sphere storage space above the partition wall. A mounting apparatus for a metal sphere having a suction head provided on a lower surface with a plurality of suction holes for vacuum-sucking the metal sphere stored in the metal sphere storage container, wherein the metal sphere storage device is provided under a partition wall of the metal sphere storage container. Mounting a metal sphere in a gas blow-up space formed at a position above, wherein a gas blow-out nozzle connected to a gas supply source is swingably provided with its outlet facing upward. This is achieved by providing a device.

According to another aspect of the present invention, a suction head having a plurality of suction holes on a lower surface is prepared, and the metal balls stored in the metal ball storage container are floated. A metal ball mounted on the semiconductor package, the semiconductor chip, and an electrode on an electronic circuit board, wherein the metal ball is mounted on an electrode on a semiconductor package, a semiconductor chip, and an electronic circuit board, wherein the metal ball is stored in the metal ball storage container. This is achieved by providing a method for mounting a metal sphere, characterized in that a gas flow directed obliquely upward is applied to the metal sphere, and the metal sphere is floated diagonally upward.

According to the present invention, the metal spheres are stored in the upper part of the ventilation partition, and the gas is passed through the ventilation partition from below,
The gas flow is directed obliquely to the metal sphere through the partition plate, whereby the metal sphere can be suspended obliquely upward. This allows the metal sphere to move laterally along the lower surface of the suction head on or near the lower surface of the suction head, thereby increasing the probability that the metal ball encounters the suction hole provided on the lower surface of the suction head. it can. As a result, all of the plurality of suction holes provided on the lower surface of the suction head can surely adsorb the metal spheres, and the yield when mounting the adsorbed metal spheres on the semiconductor circuit element, the semiconductor package, and the substrate at one time. Can be improved.

Further, according to the present invention, it is possible to realize a metal ball mounting apparatus which can reduce the occurrence of scratches on the metal ball and the formation of an oxide film and can provide a metal ball mounting step with a high yield.

[0027]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings based on preferred embodiments.

First Embodiment FIG. 1 shows a metal ball mounting device according to a first embodiment of the present invention. Reference numeral 1 shown in FIG. 1 is a suction head, and a number of suction holes 5 for sucking metal balls 3 are provided on the lower surface, that is, the suction surface. The suction head 1 has an exhaust port 7 at an upper portion thereof, and is connected to a vacuum exhaust unit (not shown) through the exhaust port 7.

Reference numeral 9 denotes a metal sphere storage container for storing the metal spheres 3. The inside of the metal sphere storage container 9 is vertically divided by a ventilation partition plate 11. Partition plate 11
A storage space 13 for storing the metal spheres 3 is formed above the gas blow-up space 1 below the partition plate 11.
5 are formed. As the ventilation partition plate 11, a material such as a mesh material or a porous material made of metal or nonmetal can be used.

The gas blow-up space 15 is provided with a plurality of straightening plates 17 which are juxtaposed and inclined. The gas blow-up space 15 is connected to a gas supply source (not shown) via a gas inlet 19. Are linked.

Next, the operation will be described. The suction head 1 is shown in FIG.
The vacuum evacuation means (shown in FIG. 1) descends toward the metal sphere storage container 9 from the raised position shown in (II) to the lowered position shown in (I), that is, the suction position, and is connected to the suction head 1 through the exhaust port 7. The metal ball 3a is sucked into the suction hole 5 provided on the suction surface of the suction head 1 by operating the metal ball 3a.

The suction head 1 that has picked up the metal ball 3a moves to the mounting position (III) in FIG. 1 after rising to the raising position (II). When the suction head 1 moves to the mounting position (III) and is positioned above the semiconductor device 20, the evacuation through the exhaust port 7 is released and the metal sphere 3 a held by the suction head 1 is removed from the semiconductor device 20. It is transferred onto the pad electrode provided above.

When the adsorption head 1 adsorbs the metal ball 3, the gas flowing into the gas blowing space 15 from the gas inlet 9 is
A gas flow flowing obliquely upward by the rectifying plate 17 is sprayed on the metal spheres 3, and the metal spheres 3 are floated obliquely upward with an inclined angle. As a result, the metal ball 3 reaches the lower surface of the suction head 1 and the metal ball 3a
Is adsorbed.

According to this embodiment, the space 1 is connected to the gas inlet 9.
The gas that has flowed into 5 flows as a gas flow directed obliquely upward by the flow straightening plate 17. For this reason, as shown in FIG. 2B, the metal balls 3 stored in the storage container 9 float with an inclination angle, and easily move obliquely or laterally on the lower surface of the suction head 1 and its vicinity. Become.

That is, as shown in FIG. 2A, when the metal balls 3 are blown up obliquely upward toward the lower surface of the suction head 1 in a lump state, the metal balls 3 move to the lower surface of the suction head 1 It becomes easy to separate them individually. Furthermore, even when the suction head 1 is in contact with the lower surface, the lower surface of the suction head 1 has a tendency to move laterally, so that the probability of encountering the suction holes 5 is increased. As a result, the adsorption efficiency, that is, the adsorption yield can be increased.

A metal ball 3 is provided along the lower surface of the suction head 1.
Is moved, the probability that the metal ball 3 meets the suction hole 5 is increased, so that the time required for the suction step can be shortened. As a result, the floating time of the metal sphere 3 is shortened, and the damage to the metal sphere 3 due to the floating can be reduced, and the generation of scratches on the surface and the formation of an oxide film can be suppressed. Therefore, it is possible to eliminate the deterioration of the adhesion and the conductivity of the metal ball 3.

In the rectifying plate 17 described in the first embodiment, a plurality of rectifying plates 17 are juxtaposed so as to be inclined at the same angle and in the same direction and pass through the rectifying plate 17. Although the generated gas flow is blown up in one direction, as a modified example, as shown in FIG. 3A or 3B, the gas flow is different from each other in the gas blow-up space 15 of the metal sphere storage container 9. A plurality of gas streams that blow up in a direction may be generated. For example,
As shown in FIG. 3A, the gas blow-up space 15 is divided into two regions, and a set 23 of a plurality of straightening plates 17 provided in one region and inclined in parallel to each other is provided in the other region. For example, the sets 25 of the flow straightening plates 17 that are arranged to be inclined in parallel with each other may be arranged to be inclined in the opposite direction at the same angle, for example.

As another modified example, as shown in FIG. 3 (b), the gas blow-up space 15 having a rectangular cross section is disposed along each of the four side walls 21 and inclined in parallel to each other. Sets 27, 29, 31, 33 of the rectifying plates 17
Of the current plate 17 belonging to each of the
When viewed toward, they may be arranged to be inclined in the same direction. According to this, the four sets 27, 29, 31, and 33 of the current plate 17 allow the gas blow-up space 1 to be formed.
A spirally rising gas stream in 5 can be generated.

Second Embodiment FIG. 4 shows a main part of a metal ball mounting apparatus according to a second embodiment of the present invention. In the second embodiment, the metal balls 3 stored on the air-permeable partition plate 11 in the metal ball storage container 9
As means for leveling the surface, a leveling plate 35 is provided in the storage space 13, and by moving the leveling plate 35 in the horizontal direction (horizontal direction), the leveling plate 35 is stored in the storage space 13. The surface of many metal spheres 3 is made uniform so that the depth of the stored metal spheres 3 is made uniform. The other configuration is the same as that of the above-described first embodiment. Therefore, the same components as those included in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

Next, the operation will be described. Before the operation described in the first embodiment is executed, that is, prior to the suction of the metal ball 3 by the suction head 1, the storage depth of the metal ball 3 is adjusted by the leveling plate 35. Uniformity. Subsequent steps are the same as those of the first embodiment described above.

According to the second embodiment, since the storage depth of the metal spheres 3 is uniform, the floating state of the metal spheres 3 does not change due to the local unevenness of the storage depth. The metal spheres 3 can be floated at the same density on the lower surface of 1, ie, the entire area of the suction surface. Thereby, the metal balls 3 can be floated under the optimum conditions at any point on the lower surface of the suction head 1, and thereby the suction efficiency, that is, the suction yield can be improved.

When the rectifying plate 17 is provided obliquely in the gas blow-up space 15 as in the first embodiment, the metal ball 3 floats obliquely upward. Although there is a possibility that the storage state of the metal spheres 3 in the storage container 9 tends to be offset, the stored metal spheres 3 are leveled by the leveling plate 35 as in the second embodiment. Thus, a uniform storage state can be always maintained.

Third Embodiment FIG. 5 shows a main part of a metal ball mounting apparatus according to a third embodiment of the present invention. In the third embodiment, a gas blowing nozzle 39 connected to a gas supply source is provided at the center of the gas blowing space 15 of the metal ball storage container 9. The gas blowing nozzle 39 has a slit-shaped outlet 39a that opens upward. The gas blowing nozzle 39 can swing about the lower end portion, and the outlet 39a swings right and left by a driving unit (not shown). In addition, the gas blowing nozzle 39
Can be moved in a horizontal direction, that is, in a direction parallel to the lower surface of the suction head 1 by another driving means (not shown). That is, the gas blowing nozzle 39 can move horizontally in the gas blowing space 15 in FIG.
The slit-shaped outlet 39a can swing right and left. The slit-shaped elongated outlet 39a extends in a direction intersecting with the moving direction of the nozzle 39, and has substantially the same length as the effective length of the suction surface of the suction head 1. Other configurations are the same as those of the first embodiment described above.

Next, the operation will be described. In the step in which the suction head 1 descends to the metal ball storage container 9 to suction the metal balls 3, the gas blowing nozzle 39 moves left and right in the gas blowing space 15 and swings the blowout port 39a left and right. Then, gas is blown toward the metal ball 3. As a result, the metal ball 3 receiving the gas flow from the outlet 39a of the gas blowing nozzle 39 floats upward, but the gas flow moves in the horizontal direction and the direction changes, so that the metal ball 3 sequentially floats. The metal ball 3 moves toward all of the many suction holes 5 provided on the suction surface of the suction head 1.

According to the third embodiment, since the metal spheres 3 in the storage space 13 are constantly moved and are sequentially blown up by the gas flow whose direction changes, the metal spheres 3 moving along the lower surface of the suction head are moved. The moving distance can be increased, thereby increasing the probability that the metal ball meets the suction hole 5. As a result, the adsorption efficiency of the metal sphere of the head 1, that is, the adsorption yield can be improved.

Further, according to the present embodiment, the number of the metal spheres 3 that are floated at the same time is small relative to all the metal spheres in the storage space 13, so that the friction between the floating metal spheres 3 is reduced. . For this reason, the damage which the metal ball 3 receives by floating can be reduced, the generation of scratches on the surface,
Oxide film formation can be suppressed. Thereby, it is possible to reduce the deterioration of the adhesion of the metal ball 3 to the semiconductor device 20 and the deterioration of the conductivity.

In the third embodiment, the gas outlet 39a is changed according to the lateral movement direction of the gas outlet nozzle 39.
May be reversed. That is, the gas blowing nozzle 39 may be tilted and horizontally moved with the angle fixed, and the tilt angle may be changed (reversed) when the moving direction is switched. To explain this point specifically, when the gas blowing nozzle 39 moves to the right, the gas blowing port 39a is maintained to be inclined rightward, and conversely, the gas blowing nozzle 39 moves to the left. When moving, the gas outlet 39a may be maintained in a state of being inclined to the left. Thereby, it is possible to prevent the metal balls 3 stored in the metal ball storage container 9 from being blown to one place and to form a pool, and to make the storage state of the metal balls 3 in the container 9 uniform.

In the third embodiment, a plurality of gas blowing nozzles 39 for the gas blowing space 15 may be provided. FIG. 6 shows an example in which two gas blowing nozzles 39 are provided in the gas blowing space 15 so as to be separated from each other in the left and right directions. In this case, the left and right gas blowing nozzles 39 are synchronously moved in a direction away from each other or in a direction approaching each other,
Alternatively, the outlets 39a of the pair of left and right gas blowing nozzles 39 may swing in directions approaching each other or moving away from each other.

As another method, the left and right gas blowing nozzles 3
The swing mechanism 9 may be omitted, the right gas blowing nozzle 39R may be arranged to be inclined leftward, and the left gas blowing nozzle 39L may be arranged to be inclined rightward. In this case, the gas blowing of the left and right gas blowing nozzles 39 is switched. For example, when the right nozzle 39R is moved rightward, the gas is blown from the right nozzle 39R and the left nozzle 39R is blown.
When moving L to the left, gas may be blown out from the left nozzle 39L. This allows
The metal spheres 3 stored in the metal sphere storage container 9 can be prevented from forming a pool, and the storage state of the metal spheres 3 in the container 9 can be made uniform.

Further, in this embodiment, as shown in FIG. 6, two gas blowing nozzles 39L and 39R can be provided with their respective gas blowing directions directed symmetrically. Here, when moving to the right, gas is blown from 39L, and when moving to the left, gas is blown from 39R. According to this configuration, the storage state of the metal spheres 3 can be made uniform as in the previous stage.

Further, the leveling plate 35 described in the second embodiment described above may be applied to the third embodiment to physically uniform the state of storing metal balls in the container 9. .

In the above description of the third embodiment, a single or a pair of gas blowing nozzles 39 has been described as an example, but three or more or a plurality of pairs of gas blowing nozzles may be employed. By providing a large number of gas blowing nozzles 39 in this way, it is possible to speed up the metal ball mounting process.

[0053]

As described above, according to the present invention,
Since the metal sphere to be sucked is locally floated and sprayed to the suction head to be sucked, it can be moved in the horizontal direction while being sprayed on the lower surface of the suction head. As a result, the probability that the metal sphere is adsorbed by the adsorption hole can be increased, and the yield in the adsorption step can be increased.

In addition, since the amount of metal spheres floating at one time can be reduced, the occurrence of scratches on the metal spheres and the formation of an oxide film can be suppressed. Can be prevented. Furthermore, since the number of floating metal spheres can be reduced, the required gas amount can be reduced, and the production cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic explanatory view of a metal ball mounting device according to a first embodiment of the present invention.

FIG. 2 is a diagram for explaining one operation of the present invention in relation to the first embodiment.

FIG. 3 is an explanatory view of a main part of a metal ball mounting device according to a second embodiment of the present invention.

FIG. 4 is a diagram for explaining a modification of the second embodiment.

FIG. 5 is an explanatory view of a main part of a metal ball mounting device according to a third embodiment of the present invention.

FIG. 6 is a diagram for explaining a modification of the third embodiment.

FIG. 7 is a schematic configuration diagram of a suction head and a metal ball storage container included in a conventional metal ball mounting device.

FIG. 8 is a schematic configuration diagram of a suction head and a metal ball storage container included in another conventional metal ball mounting device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 suction head 3, 3 a metal ball 5 suction hole 9 metal ball storage container 11 ventilating partition plate 13 metal ball storage space 15 gas blow-up space 17 rectifying plate 35 leveling means (leveling plate) 39 gas blowing nozzle 39 a gas blowing exit

Claims (7)

[Claims] 1. A metal sphere storage container which is vertically divided by a ventilating partition wall and stores metal spheres in a metal sphere storage space above the partition wall, and a metal stored in the metal sphere storage container. A mounting device for a metal sphere having a plurality of suction holes for vacuum suction of a sphere on a lower surface thereof, wherein the mounting device is formed below a partition wall of the metal sphere storage container and connected to a gas supply source. A plurality of straightening plates juxtaposed to each other are provided in an inclined manner in the gas blowing space, and the gas in the gas blowing space is directed obliquely upward by the straightening plates. . 2. The metal sphere mounting apparatus according to claim 1, further comprising: means for leveling the surface of the metal sphere stored in the metal sphere storage space of the metal sphere storage container. 3. A metal sphere storage container that is vertically divided by a ventilation partition wall and stores metal spheres in a metal sphere storage space above the partition wall, and a metal stored in the metal sphere storage container. A mounting device for a metal sphere having a plurality of suction holes for suctioning the spheres on a lower surface thereof and a suction head having a plurality of suction holes on a lower surface thereof, wherein the metal sphere storage space is formed in a gas blowing space formed under a partition wall of the metal sphere storage container. A metal ball mounting device, wherein the gas outlet is arranged to face upward and a gas blowing nozzle connected to a gas supply source is swingably provided. 4. The metal ball mounting device according to claim 3, wherein the gas blowing nozzle is movable in a direction parallel to a lower surface of the suction head. 5. The mounting of a metal sphere according to claim 3, further comprising means for leveling the surface of the metal sphere stored in the metal sphere storage space of the metal sphere storage container. apparatus. 6. The metal ball mounting device according to claim 4, wherein the outlet of the gas blowing nozzle has an elongated slit shape extending in a direction intersecting the moving direction of the gas blowing nozzle. 7. A suction head having a plurality of suction holes on a lower surface is prepared, a metal ball stored in a metal ball storage container is floated, and the floating metal ball is sucked by the suction hole of the suction head. And mounting the metal ball on an electrode on a semiconductor package, a semiconductor chip, and an electronic circuit board. The method for mounting a metal ball on a metal ball stored in the metal ball storage container, comprising: A method for mounting a metal ball, wherein the metal ball is floated obliquely upward by applying a flow.