CN115335771B - 感光性转印材料、树脂图案的制造方法及电路配线的制造方法 - Google Patents

感光性转印材料、树脂图案的制造方法及电路配线的制造方法 Download PDF

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CN115335771B
CN115335771B CN202080098703.6A CN202080098703A CN115335771B CN 115335771 B CN115335771 B CN 115335771B CN 202080098703 A CN202080098703 A CN 202080098703A CN 115335771 B CN115335771 B CN 115335771B
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China
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mass
resin layer
photosensitive resin
photosensitive
layer
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Chinese (zh)
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CN115335771A (zh
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片山晃男
有富隆志
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Fujifilm Corp
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Fujifilm Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
CN202080098703.6A 2020-03-30 2020-12-25 感光性转印材料、树脂图案的制造方法及电路配线的制造方法 Active CN115335771B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020061104 2020-03-30
JP2020-061104 2020-03-30
PCT/JP2020/048993 WO2021199542A1 (ja) 2020-03-30 2020-12-25 感光性転写材料、樹脂パターンの製造方法、及び回路配線の製造方法

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CN115335771A CN115335771A (zh) 2022-11-11
CN115335771B true CN115335771B (zh) 2025-03-25

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CN202080098703.6A Active CN115335771B (zh) 2020-03-30 2020-12-25 感光性转印材料、树脂图案的制造方法及电路配线的制造方法

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JP (1) JPWO2021199542A1 (enrdf_load_stackoverflow)
CN (1) CN115335771B (enrdf_load_stackoverflow)
WO (1) WO2021199542A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120051895A (zh) * 2022-09-30 2025-05-27 富士胶片株式会社 多层超表面结构体的制造方法及多层超表面结构体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005266348A (ja) * 2004-03-18 2005-09-29 Asahi Kasei Electronics Co Ltd 感光性樹脂積層体及びその用途
CN101135852A (zh) * 2006-08-31 2008-03-05 富士胶片株式会社 图案形成材料及图案形成方法
WO2017018053A1 (ja) * 2015-07-29 2017-02-02 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002357901A (ja) * 2001-05-31 2002-12-13 Fuji Photo Film Co Ltd 感光性樹脂組成物、転写材料、及び画像形成方法
JP5875345B2 (ja) * 2011-11-28 2016-03-02 ニッコー・マテリアルズ株式会社 ソルダーレジスト用感光性樹脂組成物、及びこれを用いたソルダーレジスト用フォトレジストフィルム
US10338468B2 (en) * 2014-09-24 2019-07-02 Asahi Kasei Kabushiki Kaisha Photosensitive resin composition, photosensitive resin laminate, resin pattern production method, cured film, and display device
JP7409087B2 (ja) * 2018-08-09 2024-01-09 東レ株式会社 感光性樹脂組成物、感光性シート、ならびにそれらの硬化膜およびその製造方法、電子部品

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005266348A (ja) * 2004-03-18 2005-09-29 Asahi Kasei Electronics Co Ltd 感光性樹脂積層体及びその用途
CN101135852A (zh) * 2006-08-31 2008-03-05 富士胶片株式会社 图案形成材料及图案形成方法
WO2017018053A1 (ja) * 2015-07-29 2017-02-02 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

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WO2021199542A1 (ja) 2021-10-07
JPWO2021199542A1 (enrdf_load_stackoverflow) 2021-10-07
CN115335771A (zh) 2022-11-11

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