JPWO2021199542A1 - - Google Patents

Info

Publication number
JPWO2021199542A1
JPWO2021199542A1 JP2022511537A JP2022511537A JPWO2021199542A1 JP WO2021199542 A1 JPWO2021199542 A1 JP WO2021199542A1 JP 2022511537 A JP2022511537 A JP 2022511537A JP 2022511537 A JP2022511537 A JP 2022511537A JP WO2021199542 A1 JPWO2021199542 A1 JP WO2021199542A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022511537A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021199542A1 publication Critical patent/JPWO2021199542A1/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
JP2022511537A 2020-03-30 2020-12-25 Pending JPWO2021199542A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020061104 2020-03-30
PCT/JP2020/048993 WO2021199542A1 (ja) 2020-03-30 2020-12-25 感光性転写材料、樹脂パターンの製造方法、及び回路配線の製造方法

Publications (1)

Publication Number Publication Date
JPWO2021199542A1 true JPWO2021199542A1 (enrdf_load_stackoverflow) 2021-10-07

Family

ID=77928438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022511537A Pending JPWO2021199542A1 (enrdf_load_stackoverflow) 2020-03-30 2020-12-25

Country Status (3)

Country Link
JP (1) JPWO2021199542A1 (enrdf_load_stackoverflow)
CN (1) CN115335771B (enrdf_load_stackoverflow)
WO (1) WO2021199542A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024070650A1 (enrdf_load_stackoverflow) * 2022-09-30 2024-04-04

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005266348A (ja) * 2004-03-18 2005-09-29 Asahi Kasei Electronics Co Ltd 感光性樹脂積層体及びその用途
JP2008058636A (ja) * 2006-08-31 2008-03-13 Fujifilm Corp パターン形成材料及びパターン形成方法
JP2013114008A (ja) * 2011-11-28 2013-06-10 Nichigo Morton Co Ltd 感光性樹脂組成物、及びこれを用いたフォトレジストフィルム
WO2017018053A1 (ja) * 2015-07-29 2017-02-02 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2018077490A (ja) * 2014-09-24 2018-05-17 旭化成株式会社 感光性樹脂組成物、感光性樹脂積層体、樹脂パターンの製造方法、硬化膜の製造方法及び表示装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002357901A (ja) * 2001-05-31 2002-12-13 Fuji Photo Film Co Ltd 感光性樹脂組成物、転写材料、及び画像形成方法
CN112368641B (zh) * 2018-08-09 2025-05-02 东丽株式会社 感光性树脂组合物、感光性片材、以及它们的固化膜及其制造方法、电子部件

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005266348A (ja) * 2004-03-18 2005-09-29 Asahi Kasei Electronics Co Ltd 感光性樹脂積層体及びその用途
JP2008058636A (ja) * 2006-08-31 2008-03-13 Fujifilm Corp パターン形成材料及びパターン形成方法
JP2013114008A (ja) * 2011-11-28 2013-06-10 Nichigo Morton Co Ltd 感光性樹脂組成物、及びこれを用いたフォトレジストフィルム
JP2018077490A (ja) * 2014-09-24 2018-05-17 旭化成株式会社 感光性樹脂組成物、感光性樹脂積層体、樹脂パターンの製造方法、硬化膜の製造方法及び表示装置の製造方法
WO2017018053A1 (ja) * 2015-07-29 2017-02-02 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Also Published As

Publication number Publication date
CN115335771B (zh) 2025-03-25
CN115335771A (zh) 2022-11-11
WO2021199542A1 (ja) 2021-10-07

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