CN115297690A - Microchannel heat dissipation integrated system of array heat source with low thermal resistance and low pumping power - Google Patents
Microchannel heat dissipation integrated system of array heat source with low thermal resistance and low pumping power Download PDFInfo
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- CN115297690A CN115297690A CN202211015823.2A CN202211015823A CN115297690A CN 115297690 A CN115297690 A CN 115297690A CN 202211015823 A CN202211015823 A CN 202211015823A CN 115297690 A CN115297690 A CN 115297690A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
Abstract
A micro-channel heat dissipation integrated system of an array heat source with low thermal resistance and low pumping power belongs to the field of heat exchange enhancement. Comprises a three-layer structure, namely a top plate (1), a flow distribution plate (2) and a bottom plate (3) in sequence. A fluid inlet (4), a liquid inlet diversion channel (6), a liquid injection hole (8), a first-stage H-shaped diversion channel branch (13), a second-stage H-shaped diversion channel branch (14) and a tail end channel (15) are machined on the back of the diversion plate; the front side processing fluid outlet (5), the liquid outlet converging channel (7), the micro channel (9), the liquid storage zone channel (10), a converging channel branch (12), a first-stage H-shaped diversion channel branch (13), a second-stage H-shaped diversion channel branch (14) and a liquid converging channel (16). A plurality of heat sources (11) are arranged on the top plate (1) in an array mode, and the flow distribution plate (2) is welded between the top plate (1) and the bottom plate (3) to form a complete system. The invention adopts a structure of 'two inlets and three outlets' for each heat source, shortens the flowing length of the fluid in the micro-channel, inhibits the accumulation of heat at the tail end of the flow channel and improves the temperature uniformity of the surface of the heat source. And each channel in the system adopts a symmetry principle, so that the distribution uniformity of fluid in the system is ensured, and the heat dissipation of multiple heat sources is facilitated.
Description
Technical Field
The invention belongs to the field of heat exchange enhancement, and designs a micro-channel heat dissipation integrated system of an array heat source with low thermal resistance and low pumping power.
Background
With the rapid development of industrial technologies, various industrial products have a trend toward high power, high integration and light weight, and the instantaneous heat flux density of microelectronic devices has exceeded 10 6 W/m 2 If the heat dissipation cannot be timely and effectively carried out, the stability and the service life of the electronic device are seriously influenced, and the heat flux density is highThe problem of heat dissipation of electronic devices has become an important factor restricting the development of high and new technologies, and the traditional heat dissipation method cannot meet the increasing heat dissipation requirement. The microchannel radiator has the advantages of larger heat transfer coefficient, large specific surface area, light dead weight, small volume, direct integration on a radiating chip and the like, and is popular with experts or scholars at home and abroad once coming out. The micro-channel is widely applied to the fields of micro-electronics industry, air conditioning, aviation industry and the like.
In the process of taking away heat by a fluid through a micro-channel, heat accumulation can occur at the tail end of the flow due to continuous heat absorption along the flow direction, so that the temperature is higher and higher along the flow direction of the fluid, a 'hot spot' is formed at the tail end of the channel, and heat transfer is deteriorated. In addition, in the application context of the mems, heat dissipation elements such as chips are often not independent, but need to dissipate heat from multiple heat sources in the system at the same time, so as to meet the higher heat dissipation requirement and maintain the temperature consistency of each device, which requires a reasonable solution to integrate the microchannel heat sink in the system. In recent years, research on microelectronic systems has focused primarily on single heat sources, with structural optimization of individual microchannel heat sinks to enhance heat transfer, and less research on integrated systems of multiple microchannel heat sinks. In order to ensure that the system can radiate well when multiple heat sources exist, a micro-channel system with good heat radiation performance needs to be integrated, and meanwhile, the multiple heat sources are radiated, so that the working performance of the system is ensured to be stable.
Disclosure of Invention
The invention aims to provide a micro-channel heat dissipation integrated system of an array heat source with low thermal resistance and low pumping power, so that when a plurality of heat dissipation element arrays exist, the system integrating a plurality of micro-channel areas can be subjected to high-efficiency heat dissipation, and the uniform temperature distribution among elements is ensured. In the system device designed by the invention, each micro-channel area adopts a 'two-in three-out' flow mode, and one micro-channel is divided into four sections, so that the flow length of fluid is reduced, the accumulation of heat at the tail end of the flow is effectively inhibited, the occurrence of 'hot spots' is reduced, and the internal thermal resistance of the system is reduced; meanwhile, as the flow length is shortened, the flow velocity of the fluid under a certain flow is reduced, the pressure drop in the system is reduced, and the pump work consumed by the external pipeline is reduced. The system adopts a symmetrical design, so that the flow flowing into each heat dissipation area is uniformly distributed, the fluid distribution uniformity is better, the heat dissipation performance of each heat dissipation area is more similar, the temperature consistency among the heat dissipation elements can be ensured, and a reliable temperature environment is provided for the stable operation of the electronic device.
The invention designs a micro-channel heat dissipation integrated system of an array heat source with low thermal resistance and low pumping work, which is shown in figure 1. In order to further clarify the system structure, fig. 2, fig. 3, fig. 4, fig. 5, fig. 6, fig. 7, fig. 8, fig. 9, fig. 10, fig. 11, fig. 12, fig. 13 and fig. 14 are respectivelybase:Sub>A schematic diagram of front explosion of the whole structure of the system,base:Sub>A schematic diagram of back explosion of the whole structure of the system,base:Sub>A schematic diagram of top flow distribution plate,base:Sub>A bottom flow distribution plate,base:Sub>A top plate axial side diagram,base:Sub>A bottom plate axial side diagram,base:Sub>A front view of the system,base:Sub>A sectional diagram ofbase:Sub>A-base:Sub>A,base:Sub>A sectional diagram ofbase:Sub>A-B,base:Sub>A sectional diagram ofbase:Sub>A-C,base:Sub>A sectional diagram ofbase:Sub>A-D,base:Sub>A sectional diagram ofbase:Sub>A-E andbase:Sub>A schematic diagram ofbase:Sub>A branch structure of an H-type flow distribution channel.
The invention designs a micro-channel heat dissipation integrated system of an array heat source with low thermal resistance and low pumping power, which is characterized in that: comprises a top plate (1), a flow distribution plate (2) and a bottom plate (3) which are sequentially stacked and packaged together; the back of the flow distribution plate (2), namely the surface attached to the bottom plate (3), is provided with a fluid inlet (4) and a liquid inlet flow distribution channel (6) of an external pipeline, the liquid inlet flow distribution channel (6) is positioned on one side of the back of the flow distribution plate (2), and the length direction of the liquid inlet flow distribution channel (6) is parallel to the length direction of the flow distribution plate (2); a fluid inlet (4) is led out from the middle position of the liquid inlet shunting channel (6) in the length direction, and the fluid inlet (4) is communicated with the outside from the side surface of the shunting plate (2); two ends of the liquid inlet diversion channel (6) are respectively communicated with a middle connecting channel in one first-level H-shaped diversion channel branch (13) through a channel parallel to the width direction of the diversion plate (2), and the total number of the two first-level H-shaped diversion channel branches (13) is two; the middle connecting channel in the first-level H-shaped shunting channel branch (13) is parallel to the length direction of the shunting plate (2); the four ends of each primary H-shaped diversion channel branch (13) are respectively communicated with a middle connecting channel in one secondary H-shaped diversion channel branch (14) through a channel parallel to the length direction of the diversion plate (2), the total number of the secondary H-shaped diversion channel branches (14) is 8, and the middle connecting channel in each secondary H-shaped diversion channel branch (14) is parallel to the width direction of the diversion plate (2); four end parts of each secondary H-shaped diversion channel branch (14) are respectively communicated with a tail end channel (15) which is parallel to the width direction of the diversion plate (2), a liquid injection hole (8) is arranged in the middle of each tail end channel (15), the total number of the liquid injection holes (8) is 32, and each liquid injection hole (8) penetrates through the thickness of the diversion plate (2) to reach the front surface of the diversion plate (2);
the front surface of the flow distribution plate (2), namely the surface attached to the top plate (1), is provided with a plurality of micro-channel regions (9), one micro-channel region (9) corresponds to one heat source (11) on the top plate (1), and a plurality of heat sources (11) arranged in an array correspond to a plurality of micro-channel regions (9) arranged in an array; the direction of the micro-channel in each micro-channel area (9) is parallel to the length direction of the flow distribution plate (2), so that the flowing direction of the liquid in the micro-channel is parallel to the length direction of the flow distribution plate (2); each micro-channel area (9) is respectively provided with a confluence channel branch (12) at the middle and two ends of the micro-channel direction, and the length direction of the confluence channel branch (12) is parallel to the width direction of the flow distribution plate (2); an independent liquid storage zone channel (10) is arranged in the middle of the micro-channel area between the adjacent confluence channel branches (12) in the same micro-channel area (9), and the length direction of the liquid storage zone channel (10) is parallel to the length direction of the confluence channel branches (12); a liquid injection hole (8) is correspondingly arranged in the middle of each liquid storage zone channel (10); each secondary H-shaped diversion channel branch (14) corresponds to two micro-channel areas (9); all the converging channel branches (12) are communicated with a converging channel (16), and the length direction of the converging channel (16) is parallel to the length direction of the flow distribution plate (2); two ends of the liquid outlet confluence channel (7) parallel to the liquid converging channel (16) are communicated with the liquid converging channel (16), a fluid outlet (5) is arranged in the middle of the liquid outlet confluence channel (7), and the fluid outlet (5) is communicated with the outside through the side surface of the flow distribution plate (2); the fluid outlet (5) and the fluid inlet (4) are respectively communicated with the outside through two opposite side surfaces of the flow distribution plate (2);
the front structures of the flow distribution plates (2) are symmetrically distributed along the center line of the middle width direction; the back structures of the flow distribution plates (2) are symmetrically distributed along the center line of the middle width direction.
The top plate (1), the splitter plate (2) and the bottom plate (3) are welded together in a vacuum brazing mode to form a closed fluid flow system.
The processing modes of the liquid injection hole (8), the liquid inlet diversion channel (6), the liquid outlet confluence channel (7) and the micro channel (9) are not limited, various additive manufacturing technologies or cutting technologies can be adopted for processing, and better processing precision is required to be ensured as far as possible. All the channels are rectangular in shape and all the holes are circular in shape.
The flow path of the cooling working medium is as follows: cooling working media flow into the system from a fluid inlet (4), are subjected to primary shunting through a T-shaped main shunting channel (6), then continuously shunt two streams of fluid through a primary H-shaped shunting channel and a secondary H-shaped shunting channel respectively, and finally are divided into 32 streams of fluid, and each stream of fluid flows into each liquid storage area channel (10) through each liquid injection hole (8); the micro-channel (9) area covered by each heat source (11) adopts a 'two-in three-out' structure, namely, fluid enters from two liquid storage areas (10) and flows out from three confluence channel branches (12); finally, the mixed gas is converged at a fluid main outlet (5) through a main converging channel (7) and flows out of the system.
In order to avoid the flow accumulation of each part of the channel to influence the flow distribution uniformity, the depth and the width of each channel are adjusted according to the principle of ensuring that the sectional areas of the channels of each part are equal to each other as much as possible.
The cooling working medium can be water, and the solid material can be a metal material with a large heat conductivity coefficient, such as aluminum.
The invention has the following advantages and effects:
1. through the structure of 'two-inlet three-outlet', one section of micro-channel is divided into four sections, the length of a flow channel is reduced, the inlet section effect is utilized to the maximum extent, the heat transfer is effectively enhanced, the thermal resistance of the system is reduced, the flow speed is reduced under the given flow rate due to the shortened flow length of the fluid, and the pumping power of the system is reduced accordingly.
2. All the branches of each channel are completely symmetrical, so that the system device is ensured to have better flow distribution uniformity, the surface temperature of each heat source is uniformly distributed, and the system has higher temperature control precision.
3. Various channels and micro-channels are directly processed on the flow distribution plate, and the top plate, the bottom plate and the flow distribution plate are welded together by a vacuum brazing technology, so that the sealing performance of the system can be ensured.
Drawings
FIG. 1: a three-dimensional schematic of the overall structure of the invention;
FIG. 2: the overall structure of the invention is a front explosion schematic diagram;
FIG. 3: the overall structure of the invention is shown as a back explosion diagram;
FIG. 4: top view of the splitter plate of the present invention;
FIG. 5: the bottom view of the splitter plate of the invention;
FIG. 6: the invention is a top plate axonometric view;
FIG. 7 is a schematic view of: axonometric view of the base plate of the invention;
FIG. 8: front view of the invention;
FIG. 9: A-A section view of the present invention;
FIG. 10: a B-B sectional view of the present invention;
FIG. 11: C-C section of the invention;
FIG. 12: D-D section view of the present invention;
FIG. 13: E-E section of the invention;
FIG. 14 is a schematic view of: a schematic diagram of a branch structure of the H-shaped diversion channel;
wherein: 1-top plate, 2-flow distribution plate, 3-bottom plate, 4-fluid inlet, 5-fluid outlet, 6-liquid inlet flow distribution channel, 7-liquid outlet flow combination channel, 8-liquid injection hole, 9-micro channel, 10-liquid storage zone channel and 11-heat source; 12-confluence channel branch, 13-first-stage H-shaped diversion channel branch, 14-second-stage H-shaped diversion channel branch, 15-tail end channel and 16-confluence channel.
Detailed description of the invention
The present invention will be further described with reference to the accompanying drawings, but the present invention is not limited to the following embodiments. In the drawings, the same components having the same structure are denoted by the same reference numerals, and the portions having the similar functions are not described repeatedly. The dimensions of each component shown in the drawings are arbitrarily set forth, and the present invention is not limited to the dimensions of each component.
As shown in fig. 1, 2 and 3, the device comprises a top plate (1), a splitter plate (2) and a bottom plate (3) which are sequentially stacked and packaged together; the back of the flow distribution plate is provided with a fluid inlet (4) and a liquid inlet flow distribution channel (6) which are externally connected with pipelines, the liquid inlet flow distribution channel (6) is divided into a T-shaped total flow distribution channel and a plurality of H-shaped flow distribution channel branches, and all the flow distribution channel branches are symmetrically distributed along the central line of the flow distribution plate; a circular through hole is formed in the bottom of the channel at the tail end of each branch and is marked as a liquid injection hole (8), and fluid flows into a liquid storage area channel (10) on the front face of the flow distribution plate; the front surface of the flow distribution plate (2) is provided with a plurality of micro-channels (9), the coverage area of the micro-channels (9) corresponds to a plurality of heat sources (11) which are arranged in an array, and two liquid storage area channels (10) are arranged in the middle of the micro-channels (9) of each heat source area at equal intervals to separate the micro-channels; and confluence channel branches for a fluid outflow system are processed at the two ends of the micro-channel and the center of the flow channel, and a plurality of confluence channel branches and a T-shaped total confluence channel form an outflow confluence channel (7) for the fluid to flow out of the system through a fluid outlet (5) connected with an external pipeline.
The liquid injection hole (8) at the tail end of each branch channel branch on the back of the flow distribution plate (2) is positioned at the center of the branch channel to achieve the purpose of bilateral symmetry, and is communicated with the liquid storage zone channel (10) on the front of the flow distribution plate (2) to ensure that fluid can flow into the liquid storage zone channel (10) on the front of the flow distribution plate (2) through the liquid injection hole (8) and flow into the microchannel (9); the top plate (1), the splitter plate (2) and the bottom plate (3) are welded together in a vacuum brazing mode to form a closed fluid flow system.
Example 1:
under the condition of arrangement of a plurality of heat source arrays, a microchannel heat dissipation integrated system of an array heat source with low thermal resistance and low pumping work is designed, and the device connects all structures by a welding technology, wherein the specific structure is shown in figure 1. The device is made of aluminum alloy, and the cooling working medium is made of water. The simulated heat source was placed on the top plate, and a total of 16 heat sources were arranged in an array covering each microchannel area. The heating value is adjusted by controlling the voltage of the external circuit. And a constant-temperature water tank is used for providing enough inlet flow for the system and controlling the temperature of the fluid inlet to be maintained at the normal temperature.
After flowing into the system from the fluid inlet, the fluid passes through the first T-shaped channel, is uniformly divided into two flows, then flows into a plurality of H-shaped channels respectively, is uniformly divided into 32 flows, then flows into the liquid storage tank on the back of the flow distribution plate through the liquid injection holes respectively, then flows to two ends of the micro-channel respectively, finally flows together through a plurality of confluence channels, and flows out of the system through the fluid outlet. Because the system adopts a strict symmetry principle, the flow distribution is relatively uniform every time in the whole flowing process, in order to prevent the accumulation of fluid at an outlet, the depth of the confluence channel can be gradually deepened along the flowing direction, the fluid distribution uniformity of the system is ensured to the maximum extent, and the temperature uniformity of the radiating element is enhanced. And because each part of the micro-channel is divided into four sections of flow channels, the heat accumulation at the tail end of the flow channel is inhibited, hot spots are prevented from being formed, and the heat exchange is further enhanced. The working stability of the radiating element is improved to a certain extent, and the service life is prolonged.
The above description is only a preferred embodiment of the method of the present invention and is not intended to limit the method of the present invention. In the practical implementation process, the system can obtain different heat transfer effects according to the difference of the depth and width of the liquid inlet diversion channel and the liquid outlet confluence channel on the diversion plate, the size and the depth-width ratio of the micro-channel and the shape and the size of the channel of the liquid storage area. The processing mode, the types of the cooling working medium and the solid material and the application environment of the device can be changed or replaced, but the change of the mode does not fundamentally change the method. Therefore, the technical solutions that can be obtained by a person skilled in the art through logical analysis, reasoning or limited experiments based on the prior art according to the concepts of the present invention should be within the scope of protection determined by the claims.
Claims (5)
1. A micro-channel heat dissipation integrated system of an array heat source with low thermal resistance and low pumping work is characterized in that: comprises a top plate (1), a flow distribution plate (2) and a bottom plate (3) which are sequentially stacked and packaged together; the back of the flow distribution plate (2), namely the surface attached to the bottom plate (3), is provided with a fluid inlet (4) and a liquid inlet flow distribution channel (6) which are externally connected with pipelines, the liquid inlet flow distribution channel (6) is positioned on one side of the back of the flow distribution plate (2), and the length direction of the liquid inlet flow distribution channel (6) is parallel to the length direction of the flow distribution plate (2); a fluid inlet (4) is led out from the middle position of the liquid inlet shunting channel (6) in the length direction, and the fluid inlet (4) is communicated with the outside from the side surface of the shunting plate (2); two ends of the liquid inlet diversion channel (6) are respectively communicated with a middle connecting channel in one first-level H-shaped diversion channel branch (13) through a channel parallel to the width direction of the diversion plate (2), and the total number of the two first-level H-shaped diversion channel branches (13) is two; the middle connecting channel in the first-level H-shaped shunting channel branch (13) is parallel to the length direction of the shunting plate (2); the four ends of each primary H-shaped diversion channel branch (13) are respectively communicated with a middle connecting channel in one secondary H-shaped diversion channel branch (14) through a channel parallel to the length direction of the diversion plate (2), the total number of the secondary H-shaped diversion channel branches (14) is 8, and the middle connecting channel in each secondary H-shaped diversion channel branch (14) is parallel to the width direction of the diversion plate (2); four end parts of each secondary H-shaped diversion channel branch (14) are respectively communicated with a tail end channel (15) parallel to the width direction of the diversion plate (2), the middle position of each tail end channel (15) is provided with a liquid injection hole (8), the total number of the liquid injection holes is 32, and each liquid injection hole (8) penetrates through the thickness of the diversion plate (2) to reach the front surface of the diversion plate (2);
the front surface of the flow distribution plate (2), namely the surface attached to the top plate (1), is provided with a plurality of micro-channel regions (9), one micro-channel region (9) corresponds to one heat source (11) on the top plate (1), and a plurality of heat sources (11) arranged in an array correspond to a plurality of micro-channel regions (9) arranged in an array; the direction of the micro-channel in each micro-channel area (9) is parallel to the length direction of the flow distribution plate (2), so that the flowing direction of the liquid in the micro-channel is parallel to the length direction of the flow distribution plate (2); each micro-channel area (9) is respectively provided with a confluence channel branch (12) at the middle and two ends of the micro-channel direction, and the length direction of the confluence channel branch (12) is parallel to the width direction of the flow distribution plate (2); an independent liquid storage zone channel (10) is arranged in the middle of the micro-channel area between the branches (12) of the adjacent confluence channels in the same micro-channel area (9), and the length direction of the liquid storage zone channel (10) is parallel to the length direction of the branches (12) of the confluence channels; a liquid injection hole (8) is correspondingly arranged in the middle of each liquid storage zone channel (10); each secondary H-shaped diversion channel branch (14) corresponds to two micro-channel areas (9); all the confluence channel branches (12) are communicated with a confluence channel (16), and the length direction of the confluence channel (16) is parallel to the length direction of the flow distribution plate (2); two ends of the liquid outlet confluence channel (7) parallel to the liquid converging channel (16) are communicated with the liquid converging channel (16), a fluid outlet (5) is arranged in the middle of the liquid outlet confluence channel (7), and the fluid outlet (5) is communicated with the outside through the side surface of the flow distribution plate (2); the fluid outlet (5) and the fluid inlet (4) are respectively communicated with the outside through two opposite side surfaces of the splitter plate (2).
2. The integrated system for microchannel heat dissipation of an array heat source with low thermal resistance and low pumping power as claimed in claim 1, wherein: the front structures of the flow distribution plates (2) are symmetrically distributed along the center line of the middle width direction; the back structures of the flow distribution plates (2) are symmetrically distributed along the center line of the middle width direction.
3. The integrated system for microchannel heat dissipation of an arrayed heat source of low thermal resistance and low pumping power as defined in claim 1, wherein: the top plate (1), the splitter plate (2) and the bottom plate (3) are welded together in a vacuum brazing mode to form a closed fluid flowing system.
4. The integrated system for microchannel heat dissipation of an array heat source with low thermal resistance and low pumping power as claimed in claim 1, wherein: all the channels are rectangular in shape and all the holes are circular in shape.
5. The integrated system for microchannel heat dissipation of an array heat source with low thermal resistance and low pumping power as claimed in claim 1, wherein: the flow path of the cooling working medium is as follows: cooling working media flow into the system from a fluid inlet (4), are subjected to primary shunting through a T-shaped main shunting channel (6), then continuously shunt two streams of fluid through a primary H-shaped shunting channel and a secondary H-shaped shunting channel respectively, and finally are divided into 32 streams of fluid, and each stream of fluid flows into each liquid storage area channel (10) through each liquid injection hole (8); the micro-channel (9) area covered by each heat source (11) adopts a 'two-in three-out' structure, namely, fluid enters from two liquid storage areas (10) and flows out from three confluence channel branches (12); finally, the fluid is converged at a fluid main outlet (5) through a main converging channel (7) and flows out of the system.
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| CN202211015823.2A CN115297690A (en) | 2022-08-23 | 2022-08-23 | Microchannel heat dissipation integrated system of array heat source with low thermal resistance and low pumping power |
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| CN202211015823.2A CN115297690A (en) | 2022-08-23 | 2022-08-23 | Microchannel heat dissipation integrated system of array heat source with low thermal resistance and low pumping power |
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