CN212874481U - Micro-channel radiator shunting integrated cooling device - Google Patents

Micro-channel radiator shunting integrated cooling device Download PDF

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CN212874481U
CN212874481U CN202021932516.7U CN202021932516U CN212874481U CN 212874481 U CN212874481 U CN 212874481U CN 202021932516 U CN202021932516 U CN 202021932516U CN 212874481 U CN212874481 U CN 212874481U
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plate
branch
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夏国栋
陈志伟
马丹丹
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Beijing University of Technology
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Beijing University of Technology
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Abstract

A micro-channel radiator shunting integrated cooling device belongs to the technical field of microelectronic device cooling. The device comprises a fixed plate (1), a flow distribution plate (2) and a base plate (3) in sequence; the front surface of the fixed plate (1) is provided with a groove (1.1) for mounting the microchannel radiator, a fluid inlet (1.2) for the working medium to pass through and a fluid outlet (1.3); a flow dividing channel (2.4) and a flow converging channel (2.3) are designed on the front surface of the flow dividing plate (2), and a plurality of circular through holes are formed on the back surface of the flow dividing plate and are respectively communicated with the flow dividing channel and the flow converging channel on the front surface; the front surface of the substrate (3) is provided with a total diversion channel (3.4) and a total flow combination channel (3.3), and the back surface is provided with a total inlet (3.1) and a total outlet (3.2) which are communicated with the total diversion channel and the total flow combination channel. The device and the micro-channel radiator are combined to form a complete radiating system for cooling a plurality of heat sources.

Description

Micro-channel radiator shunting integrated cooling device
Technical Field
The utility model belongs to the technical field of the cooling of microelectronic device, a novel reposition of redundant personnel integrated device that cools off is carried out to many heat source system is related to.
Background
With the rapid development of science and technology, electronic components are continuously developing towards the direction of miniaturization, integration and compactness, the problem of heat dissipation caused by higher and higher heat flux density becomes a key factor restricting the development of the electronic components, and if the heat cannot be rapidly and effectively taken away, the electronic components have errors or even cannot be used because the electronic components cannot be in a normal working temperature range. Therefore, a new and efficient cooling method is needed to solve the heat dissipation problem.
Aiming at the heat dissipation problem of the high heat flux density chip, a large amount of research is carried out by related scholars at home and abroad, and a relatively perfect research system is formed in the field from a heat exchange mode to a device structure to a working medium type. Since the first time, the microchannel heat sink has been proposed, and the advantages of excellent heat dissipation performance and high matching on the scale have attracted the attention of researchers, and has become one of the most potential micro cooling methods.
In the current application background, the heat dissipation problem of a single heat source is not only faced, but also the situation that a plurality of heat sources exist simultaneously is mostly faced, so that the problem that the heat dissipation of the heat dissipation device is not only required to be solved, but also the temperature consistency among components is required to be ensured, most of the current researches are focused on the heat dissipation aspect of the single component, and the researches on the cooling problem of a plurality of electronic components are less. In view of the above situation, it is desirable to integrate a microchannel heat sink with good heat dissipation performance, and simultaneously dissipate heat from multiple heat sources to ensure good operation performance of the system.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is not enough to above-mentioned prior art, temperature distribution homogeneity problem when providing a cooling device solves a plurality of electronic components of microchannel radiator cooling.
The utility model discloses a device of a plurality of electronic components system of microchannel radiator cooling, as shown in figure 1. In order to more clearly illustrate the structure of the system, fig. 2, fig. 3, fig. 4, fig. 5, fig. 6, fig. 7, fig. 8, fig. 9, fig. 10, fig. 11, fig. 12, fig. 13, and fig. 14 respectively show a front explosion schematic view, a rear explosion schematic view, a front schematic view of an upper fixing plate structure, a rear schematic view of an upper fixing plate structure, a front schematic view of a middle splitter plate structure, a rear schematic view of a middle splitter plate structure, a front schematic view of a lower substrate structure, a rear schematic view of a lower substrate structure, a front view, a top view, a cross-sectional view a-a, a cross-sectional view B-B, and a cross-sectional view C-C of.
The utility model adopts the following technical scheme:
the utility model discloses an utilize device of a plurality of electronic components systems of microchannel radiator cooling, its characterized in that: the heat exchanger sequentially comprises a fixing plate (1), a flow distribution plate (2) and a substrate (3) which are laminated together from top to bottom, wherein grooves (1.1) for embedding a micro-channel radiator are formed in the front surface, namely the upper surface, of the fixing plate (1), a rectangular array is formed by a plurality of grooves (1.1), a fluid inlet (1.2) and a fluid outlet (1.3) through which cooling working media can flow are designed at the bottom of each groove, and the fluid inlet (1.2) and the fluid outlet (1.3) are circular through holes.
The front surface of the splitter plate (2) is provided with channel modules, and each channel module is provided with a splitter channel (2.4) and a confluence channel (2.3); the flow dividing channel (2.4) comprises an H-shaped channel, a flow dividing branch is arranged in the middle of the middle connecting section of the H-shaped channel, one end of the flow dividing branch is communicated with the middle of the middle connecting section of the H-shaped channel, a round through hole is formed in the bottom of the other end of the flow dividing branch and is marked as a flow dividing branch hole (2.1), and round through holes are arranged at the bottoms of four ends of the H-shaped channel and are marked as H-shaped channel end holes (2.5); the whole converging channel (2.3) is a rectangular frame-shaped channel with an opening at one side, the diverging channel (2.4) is positioned in a rectangular frame of the converging channel (2.3), the other end of the diverging branch points to or is positioned at the opening of the rectangular frame, meanwhile, the converging channel (2.3) is provided with four converging branches, each converging branch points to four ends of the corresponding H-shaped channel from the rectangular frame-shaped channel, each converging branch is collinear with the side of the corresponding H-shaped channel and a gap is arranged between the converging branch and the side of the corresponding H-shaped channel, the bottom of the other end of the converging branch is provided with a round through hole which is marked as a converging branch end hole (2.6), each converging branch end hole (2.6) and the corresponding H-shaped channel end hole (2.5) serve as a group of matching holes to sequentially correspond to a fluid inlet (1.2) and a fluid outlet (1.3) of one groove; a round hole is arranged in the middle of the bottom of the groove on one side opposite to the opening side in the rectangular frame-shaped channel of the confluence channel (2.3) and is marked as a confluence mesopore (2.2); the front surface of each flow distribution plate (2) is provided with two transverse rows of a plurality of channel module arrays.
The front surface, namely the upper surface of the substrate (3) is provided with two right-angle U-shaped groove channels with opposite opening directions; the middle connecting section of the first right-angle U-shaped groove channel, namely the total diversion channel (3.4), is positioned at the left side edge of the substrate (3) in parallel, and the middle connecting section of the second right-angle U-shaped groove channel, namely the total diversion channel (3.3), is positioned at the right side edge of the substrate (3) in parallel; one side of the first right-angle U-shaped groove channel is positioned in the U shape of the second right-angle U-shaped groove channel; the bottom right angle of first right angle U type recess passageway is equipped with the round hole and marks as total entry (3.1), and the bottom right angle of second right angle U type recess passageway is equipped with the round hole and marks as total export (3.2).
Each group of sleeving holes of the front shunting channel (2.4) of the shunting plate (2), namely the confluence branch end hole (2.6) and the upper part of the H-shaped channel end hole (2.5) corresponding to the confluence branch end hole, are sequentially communicated with a fluid inlet (1.2) and a fluid outlet (1.3) on the back of the fixed plate (1); all the shunting branch holes (2.1) on the back surface of the shunting plate (2) are communicated with the first right-angle U-shaped groove channel; all the interflow mesopores (2.2) on the back surface of the flow distribution plate (2) are communicated with a second right-angle U-shaped groove channel, and form a closed fluid loop together with the microchannel radiator embedded in the groove position to form a complete cooling system.
The flow path of the cooling working medium is as follows: the flow-splitting plate is characterized in that the flow-splitting plate flows into a total flow-splitting channel (3.4) from a total inlet (3.1) on the back surface of a substrate (3), flows into a flow-splitting channel (2.4) on the front surface of the flow-splitting plate (2) through a flow-splitting branch hole (2.1) on the back surface of the flow-splitting plate (2) after being split, enters a fluid inlet (1.2) on the back surface of a fixed plate (1) from an H-shaped channel end hole (2.5) after being split again, flows out from a fluid outlet (1.3) on the fixed plate (1) after passing through a micro-channel radiator, enters a confluence channel (2.3) on the front surface of the flow-splitting plate (2) through a confluence branch end hole (2.6), flows out from a confluence mesopore (2.2) on the back surface of the flow-splitting plate (2) after confluence, enters a.
The utility model has the advantages that:
the utility model discloses to the condition that has a plurality of heat source cooling demands simultaneously, under the prerequisite that satisfies single heat source cooling requirement, further satisfy the maximum difference in temperature between each heat source in optimum working range. The cooling mode of combining the cold plate with the plurality of high-cooling-performance micro-channel radiators can be used for uniformly distributing flow, so that the optimal cooling effect is achieved.
The whole cold plate is composed of three plates with different structures, different structures are processed on each plate, the plates can be connected with each other by means of vacuum diffusion welding, vacuum brazing and the like, and can also be directly processed by additive manufacturing technologies such as 3D printing, direct metal powder laser sintering and the like, the deformation of the internal structure of the cold plate is caused on the premise that the sealing performance of the whole cold plate meets the requirement, and therefore the performance of the cold plate meets the design requirement.
The groove (1.1) designed on the front surface of the fixing plate (1) can be adjusted in size according to actual requirements, and a proper radiator is selected to be matched with the groove. The cooling working medium can be selected according to the cooling mode, for example, air can be selected for air cooling, and water, glycol or a mixture thereof can be selected for liquid cooling as a refrigerant; the cold plate can be made of aluminum alloy, copper or other materials with good heat-conducting property and easy processing.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic diagram of the overall structure of the present invention.
Fig. 3 is a schematic diagram of the overall structure of the present invention for back explosion.
Fig. 4 is a front schematic view of the upper fixing plate structure of the present invention.
Fig. 5 is a schematic view of the back of the upper fixing plate structure of the present invention.
Fig. 6 is a front view of the middle layer splitter plate structure of the present invention.
Fig. 7 is a schematic view of the back side of the middle layer splitter plate structure of the present invention.
Fig. 8 is a front view of the lower substrate structure of the present invention.
Fig. 9 is a schematic back view of the lower substrate structure of the present invention.
Fig. 10 is a front view of the device of the present invention.
Fig. 11 is a top view of the device of the present invention.
Fig. 12 is a cross-sectional view taken along line a-a of the device of the present invention.
Fig. 13 is a B-B cross-sectional view of the inventive device.
Fig. 14 is a C-C cross-sectional view of the inventive device.
The device comprises a fixed plate 1, a flow distribution plate 2 and a substrate 3, a groove 1.1, a fluid inlet 1.2, a fluid outlet 1.3, a flow distribution branch hole 2.1, a confluence mesopore 2.2, a confluence channel 2.3, a flow distribution channel 2.4, an H-shaped channel end hole 2.5 and a confluence branch end hole 2.6; a total inlet 3.1, a total outlet 3.2, a total combined flow channel 3.3, and a total split flow channel 3.4.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings, but the present invention is not limited to the following embodiments.
As shown in fig. 1-14, the heat exchanger comprises a fixing plate (1), a splitter plate (2) and a substrate (3), wherein a groove (1.1) capable of mounting a microchannel heat sink is formed in the front surface of the fixing plate (1), a fluid inlet (1.2) and a fluid outlet (1.3) through which a working medium can flow are designed at the bottom of the groove and are circular through holes, the fluid inlet (1.2) is communicated with an H-shaped channel end hole (2.5) of a front surface splitter channel (2.4) of the splitter plate (2), and the fluid outlet (1.3) is communicated with a confluence branch end hole (2.6) of a front surface confluence channel (2.3) of the splitter plate (2); the other surface of the flow distribution plate (2) is provided with a plurality of circular through holes (2.1/2.2) which are respectively communicated with a flow distribution channel (2.4) and a flow converging channel (2.3) on the front surface; the front surface of the substrate (3) is provided with a total diversion channel (3.4) and a total combined flow channel (3.3) which are respectively connected with a total inlet (3.1) and a total outlet (3.2).
The back surface of the fixed plate (1) is connected with the front surface of the flow distribution plate (2), the fluid inlet (1.2) is communicated with the flow distribution channel (2.4) of the flow distribution plate (2) through an H-shaped channel end hole (2.5), and the fluid outlet (1.3) is communicated with the confluence channel (2.3) of the flow distribution plate (2) through a confluence branch end hole (2.6); the branch shunting holes (2.1) on the back of the shunting plate (2) are connected with the main shunting channels (3.4) on the front of the substrate (3) and communicated with the main inlet (3.1); the confluence mesopore (2.2) is connected with the total confluence channel (3.3) and is communicated with the total outlet (3.2). The cold plates are connected by adopting a vacuum welding means or are directly processed by adopting an additive manufacturing technology, so that the integral tightness of the device is ensured to meet the requirement, and the internal structure of the cold plates is ensured not to generate larger deformation to cause performance difference. The cold plate and the micro-channel radiator embedded in the groove position jointly form a closed fluid loop to form a complete cooling system.
6063 aluminum alloy is used as a base material to be processed to obtain a required structure, and materials with high heat conduction capability and machinability, such as copper, can be used as the base material, so that the base material has high heat transfer capability and sealing property.
Example 1:
under the condition of cooling an active phased array radar, a micro-channel radiator shunting integrated cooling device is designed. The device is welded by vacuum diffusion welding, and the structure is shown in figures 1-14. The base material is 6063 aluminum alloy, water is used as a cooling working medium, a straight microchannel radiator is selected, a platinum metal film is processed on the bottom surface of the radiator to be used as a simulation heat source, and the radiator is integrally embedded into a groove (1.1) on the fixing plate (1).
Water flows into a total diversion channel (3.4) from a total inlet (3.1) on the back of a substrate (3), flows into diversion branch holes (2.1) on the back of a diversion plate (2) respectively after diversion, then flows into the diversion channel (2.4) on the front of the diversion plate (2), enters a micro-channel radiator through a fluid inlet (1.2) on the back of a fixing plate (1) through an H-shaped channel end hole (2.5) after twice diversion, takes away redundant heat of a heating film at the bottom of the radiator, then flows out from a fluid outlet (1.3) on the fixing plate (1), enters a confluence channel (2.3) on the front of the diversion plate (2) through a confluence branch end hole (2.6), then flows out through a mesopore confluence channel (2.2) on the back of the diversion plate (2), enters the total diversion channel (3.3) on the front of the substrate (3), and finally flows out from the total outlet (3.2). The cooling water uniformly flows into each radiator after being shunted for several times, so that the heat dissipation effect of each heating film is ensured to be equivalent, and the temperature uniformity of each chip is ensured to meet the requirement.

Claims (5)

1. The utility model provides a microchannel radiator reposition of redundant personnel integrated cooling device which characterized in that: the micro-channel radiator comprises a fixed plate (1), a flow distribution plate (2) and a substrate (3) which are sequentially laminated from top to bottom, wherein a groove (1.1) for embedding a micro-channel radiator is formed in the front surface, namely the upper surface of the fixed plate (1), a plurality of grooves (1.1) form a rectangular array, and the bottom of each groove is provided with a fluid inlet (1.2) and a fluid outlet (1.3) through which a cooling working medium can flow;
the front surface of the splitter plate (2) is provided with channel modules, and each channel module is provided with a splitter channel (2.4) and a confluence channel (2.3); the flow dividing channel (2.4) comprises an H-shaped channel, a flow dividing branch is arranged in the middle of the middle connecting section of the H-shaped channel, one end of the flow dividing branch is communicated with the middle of the middle connecting section of the H-shaped channel, a round through hole is formed in the bottom of the other end of the flow dividing branch and is marked as a flow dividing branch hole (2.1), and round through holes are arranged at the bottoms of four ends of the H-shaped channel and are marked as H-shaped channel end holes (2.5); the whole converging channel (2.3) is a rectangular frame-shaped channel with an opening at one side, the diverging channel (2.4) is positioned in a rectangular frame of the converging channel (2.3), the other end of the diverging branch points to or is positioned at the opening of the rectangular frame, meanwhile, the converging channel (2.3) is provided with four converging branches, each converging branch points to four ends of the corresponding H-shaped channel from the rectangular frame-shaped channel, each converging branch is collinear with the side of the corresponding H-shaped channel and a gap is arranged between the converging branch and the side of the corresponding H-shaped channel, the bottom of the other end of the converging branch is provided with a round through hole which is marked as a converging branch end hole (2.6), each converging branch end hole (2.6) and the corresponding H-shaped channel end hole (2.5) serve as a group of matching holes to sequentially correspond to a fluid inlet (1.2) and a fluid outlet (1.3) of one groove; the middle position of the bottom of the groove at one side opposite to the opening side in the rectangular frame-shaped channel of the confluence channel (2.3) is provided with a confluence mesopore (2.2) marked by a round hole; the front surface of each flow distribution plate (2) is provided with two transverse rows of a plurality of channel module arrays;
the front surface, namely the upper surface of the substrate (3) is provided with two right-angle U-shaped groove channels with opposite opening directions; the first right-angle U-shaped groove channel is a total diversion channel (3.4), the second right-angle U-shaped groove channel is a total combination channel (3.3), and one side of the first right-angle U-shaped groove channel is positioned in the U shape of the second right-angle U-shaped groove channel; a round hole is arranged at the bottom right angle of the first right-angle U-shaped groove channel and is marked as a total inlet (3.1), and a round hole is arranged at the bottom right angle of the second right-angle U-shaped groove channel and is marked as a total outlet (3.2);
each flow dividing channel (2.4) on the front surface of the flow dividing plate (2) corresponds to a group of matching holes, namely a confluence branch end hole (2.6) and an H-shaped channel end hole (2.5), and the upper parts of the confluence branch end hole (2.6) and the H-shaped channel end hole (2.5) respectively correspond to a fluid inlet (1.2) and a fluid outlet (1.3) on the back surface of the fixing plate (1); all the shunting branch holes (2.1) communicated with the back surface of the shunting plate (2) are communicated with the first right-angle U-shaped groove channel; all the interflow mesopores (2.2) on the back surface of the flow distribution plate (2) are communicated with a second right-angle U-shaped groove channel, and form a closed fluid loop together with the microchannel radiator embedded in the groove position to form a complete cooling system.
2. A microchannel heat sink flow splitting integrated cooling device as recited in claim 1, wherein: the fluid inlet (1.2) and the fluid outlet (1.3) are both circular through holes.
3. A microchannel heat sink flow splitting integrated cooling device as recited in claim 1, wherein: the middle connecting section of the first right-angle U-shaped groove channel, namely the total diversion channel (3.4), is positioned at the left side edge of the substrate (3) in parallel, and the middle connecting section of the second right-angle U-shaped groove channel, namely the total diversion channel (3.3), is positioned at the right side edge of the substrate (3) in parallel.
4. A microchannel heat sink flow splitting integrated cooling device as recited in claim 1, wherein: the flow path of the cooling working medium is as follows: the flow-splitting plate is characterized in that the flow-splitting plate flows into a total flow-splitting channel (3.4) from a total inlet (3.1) on the back surface of a substrate (3), flows into a flow-splitting channel (2.4) on the front surface of the flow-splitting plate (2) through a flow-splitting branch hole (2.1) on the back surface of the flow-splitting plate (2) after being split, enters a fluid inlet (1.2) on the back surface of a fixed plate (1) from an H-shaped channel end hole (2.5) after being split again, flows out from a fluid outlet (1.3) on the fixed plate (1) after passing through a micro-channel radiator, enters a confluence channel (2.3) on the front surface of the flow-splitting plate (2) through a confluence branch end hole (2.6), flows out from a confluence mesopore (2.2) on the back surface of the flow-splitting plate (2) after confluence, enters a.
5. A microchannel heat sink flow splitting integrated cooling device as recited in claim 1, wherein: the three plates are connected with each other by means of vacuum diffusion welding or vacuum brazing, or are directly processed by using an additive manufacturing technology of 3D printing or direct metal powder laser sintering, and the deformation of the internal structure of the cold plate is caused excessively under the premise of ensuring that the sealing performance of the whole cold plate meets the requirement.
CN202021932516.7U 2020-09-07 2020-09-07 Micro-channel radiator shunting integrated cooling device Active CN212874481U (en)

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CN202021932516.7U CN212874481U (en) 2020-09-07 2020-09-07 Micro-channel radiator shunting integrated cooling device

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Application Number Priority Date Filing Date Title
CN202021932516.7U CN212874481U (en) 2020-09-07 2020-09-07 Micro-channel radiator shunting integrated cooling device

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