CN212413637U - Heat radiation structure - Google Patents
Heat radiation structure Download PDFInfo
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- CN212413637U CN212413637U CN202020453513.9U CN202020453513U CN212413637U CN 212413637 U CN212413637 U CN 212413637U CN 202020453513 U CN202020453513 U CN 202020453513U CN 212413637 U CN212413637 U CN 212413637U
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- heat dissipation
- bottom plate
- fins
- heat
- igbt module
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Abstract
The utility model relates to a heat radiation structure, heat radiation structure includes the bottom plate, the surface of bottom plate is provided with the recess for form the liquid cooling passageway after laminating with the IGBT module, still includes the finned radiator, the finned radiator is located in the recess, the first side of bottom plate sets up a plurality of introducing ports, each introducing port with the recess intercommunication; the second side surface of the bottom plate is provided with a plurality of discharge ports, each discharge port is communicated with the groove, and the first side surface and the second side surface are oppositely arranged. The utility model can efficiently realize the temperature reduction of the IGBT module, and ensure that the IGBT module is in the normal working temperature range; and the heat dissipation structure is simple and compact, the small-size lightweight development of the electric automobile is favorably realized, and the use cost is low.
Description
Technical Field
The utility model belongs to the technical field of electric automobile actuating system, concretely relates to heat radiation structure.
Background
The radiator water channel design of the traditional IGBT module design is generally only provided with a water inlet and a water outlet, the water flow direction linearly crosses the A, B, C three phases of the IGBT module, the heat accumulation of the module is taken away by the water temperature, the C-phase temperature of the water outlet of the module is higher and is about 10 ℃ higher than the A-phase temperature of the water inlet, and the C-phase temperature limits the overall flow capacity of the module.
In addition, the temperature of each part of the IGBT module is not uniform, only one water inlet and outlet and one water outlet are needed, the heat generated by the IGBT module is difficult to take away in time, and the heat dissipation effect is poor.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a heat dissipation structure to solve the problems set forth in the background art.
In the first aspect, the utility model provides a technical proposal that the heat dissipation structure comprises a bottom plate, the surface of the bottom plate is provided with a groove for forming a liquid cooling channel after being attached with an IGBT module,
also comprises a finned radiator which is positioned in the groove,
a plurality of introducing ports are formed in the first side face of the bottom plate, and each introducing port is communicated with the groove;
the second side surface of the bottom plate is provided with a plurality of discharge ports, each discharge port is communicated with the groove, and the first side surface and the second side surface are oppositely arranged.
The utility model can efficiently realize the temperature reduction of the IGBT module, and ensure that the IGBT module is in the normal working temperature range; and the heat dissipation structure is simple and compact, the small-size lightweight development of the electric automobile is favorably realized, and the use cost is low.
Preferably, the finned heat sink comprises a back plate and a plurality of fins, and each fin is connected to the back plate.
Preferably, a plurality of the heat dissipation fins are arranged on the back plate at equal intervals in the longitudinal and transverse directions.
Preferably, the heat dissipation fins in two adjacent rows are arranged in a staggered manner, so that a gap between two adjacent heat dissipation fins in one row is over against one heat dissipation fin in the other row.
Preferably, the first side and the second side are both perpendicular to the surface of the heat sink.
Preferably, the inlet is opposite to a gap between two adjacent rows of the radiating fins, and one inlet is arranged corresponding to one outlet.
Preferably, the first side and the second side are both parallel to a surface of the heat sink.
Preferably, the introduction ports are provided to face the heat dissipation fins of each row, and one of the introduction ports is provided to correspond to one of the discharge ports.
Preferably, the device also comprises a sealing member,
the seal is disposed between the IGBT module and the bottom plate.
Preferably, the surface of the bottom plate provided with the groove is further provided with a mounting hole for mounting the IGBT module.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
fig. 1 is a schematic view of a heat dissipation structure of the present invention;
FIG. 2 is an exploded view of FIG. 1;
fig. 3 is a schematic flow diagram of a heat sink and a coolant according to the present invention;
FIG. 4 is a schematic view of another embodiment of the present invention showing the flow of cooling fluid and heat sink;
fig. 1-4, 1, IGBT module, 2, finned heat sink, 21, back plate, 22, heat sink, 201, first heat sink bank, 202, second heat sink bank, 203, third heat sink bank, 204, fourth heat sink bank, 205, fifth heat sink bank, 206, sixth heat sink bank, 207, seventh heat sink bank,
3. bottom plate, 31, recess, 32, first side, 321, introducing port, 33, second side, 331, discharge port, 34, mounting hole.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not limiting of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
Referring to fig. 1 and 2, a heat dissipation structure includes a bottom plate 3, a groove 31 is formed on a surface of the bottom plate 3, and the groove is used for forming a liquid cooling channel after being attached to an IGBT module 1; and a finned heat sink 2, the finned heat sink 2 being located in the groove 31.
The first side surface 32 of the bottom plate 3 is provided with a plurality of introducing ports 321, and each introducing port 321 is communicated with the groove 31; the second side 33 of the bottom plate 3 is provided with a plurality of discharge ports 331, each discharge port 331 communicating with the recess 31. Wherein the first side 32 and the second side 33 are oppositely disposed.
The bottom plate 3 is provided with a groove 31 for forming a liquid cooling channel after being attached to the IGBT module 1, and the finned radiator 2 is located in the cold night channel. The structure is simple and compact in design, and is very suitable for arrangement of the electric automobile in a limited installation space.
The IGBT module 1 serves as a heat source and generates a large amount of heat. The heat is firstly conducted to the finned radiator 2, and the contact area of the finned radiator 2 and the surrounding environment is enlarged, namely the heat exchange area is enlarged, and the heat dissipation is facilitated.
Then, the cooling liquid enters the liquid cooling channel formed by the groove 31 and the IGBT module 1 from the plurality of inlet ports 321, and after the cooling liquid is sufficiently contacted with the finned heat sink 2, the cooling liquid carries away heat on the finned heat sink 2, and finally the cooling liquid is discharged from the groove 31 of the bottom plate 3 from the outlet port 331, so that the temperature of the IGBT module 1 is reduced.
The utility model can efficiently realize the temperature reduction of the IGBT module 1, and ensure that the IGBT module 1 is in the normal working temperature range; and the heat dissipation structure is simple and compact, the small-size lightweight development of the electric automobile is favorably realized, and the use cost is low.
Referring to fig. 2, in an embodiment of the present invention, the finned heat sink 2 includes a back plate 21 and a plurality of fins 22, and each fin 22 is connected to the back plate 21.
The back plate 21 is a rectangular plate having a contour slightly smaller than the contour of the recess 31 of the base plate 3 so that the back plate 21 can be placed in the recess 31. A plurality of the heat dissipation fins 22 may be vertically arranged along the length direction thereof such that the back plate 21 and the heat dissipation fins 22 are perpendicular to each other, and the heat dissipation fins 22 are attached to the back plate 21.
The back plate 21 of the finned radiator 2 arranged in the groove 31 is attached to the surface of the IGBT module 1, so that heat of the IGBT module 1 can be transferred to the radiating fins 22 of the finned radiator 2 at the first time.
In addition, the finned radiator 2 is an assembly welding part, and has the advantages of simple structure, convenience in manufacturing and low cost.
To further optimize the design of the solution, a plurality of fins 22 are arranged on the back plate 21 at equal intervals in the longitudinal and transverse directions.
A plurality of the radiating fins 22 are aligned in the transverse direction and arranged in a row at equal intervals, which is defined as a radiating row, and a plurality of radiating rows are arranged at equal intervals in the longitudinal direction such that the radiating fins 22 are aligned in the longitudinal direction. The distance between two adjacent heat dissipation fins 22 in a heat dissipation row may be equal to or different from the distance between two adjacent heat dissipation rows, and the design is self-designed according to actual situations.
As shown in fig. 3, the heat dissipation banks include a first heat dissipation bank 201, a second heat dissipation bank 202, a third heat dissipation bank 203, a fourth heat dissipation bank 204, and a fifth heat dissipation bank 205.
The first heat dissipation row 201, the second heat dissipation row 202, the third heat dissipation row 203, the fourth heat dissipation row 204, and the fifth heat dissipation row 205 are sequentially arranged at equal intervals in the longitudinal direction, so that the respective heat dissipation fins 22 are aligned in the longitudinal direction.
In some embodiments, as shown in FIG. 4, the heat dissipation bank includes a sixth heat dissipation bank 206 and a seventh heat dissipation bank 207, the seventh heat dissipation bank 207 having one fewer number of fins 22 than the sixth heat dissipation bank 206. The plurality of sixth heat dissipation rows 206 and the plurality of seventh heat dissipation rows 207 are alternately arranged in sequence, and the sixth heat dissipation rows 206 and the seventh heat dissipation rows 207 are staggered, so that a gap between two adjacent heat dissipation fins 22 in the sixth heat dissipation row 206 faces one heat dissipation fin 22 in the seventh heat dissipation row 207. The distance between two adjacent heat dissipation fins 22 in a heat dissipation row may be equal to or different from the distance between two adjacent heat dissipation rows, and the design is self-designed according to actual situations.
Besides the above two modes, the heat dissipation fins 22 may be uniformly distributed in a circular array, a triangular array, or the like, and heat exchange between the cooling liquid and the finned radiator 2 may be achieved.
In one embodiment of the present invention, the first side 32 and the second side 33 are perpendicular to the surface of the heat sink 22.
Referring to fig. 3, the first side 32 may be a left side of the base plate 3, and the second side 33 may be a right side of the base plate 3. The first side surface 32 is provided with a plurality of introducing ports 321, and the first side surface 32 is perpendicular to the surface of the radiating fin 22; the second side 33 is provided with a plurality of discharge ports 331, and the second side 33 is perpendicular to the surface of the heat sink 22.
The coolant is introduced into the concave grooves 31 of the base plate 3 from the plurality of introduction ports 321, and the flow direction of the coolant is parallel to the surface of the heat radiation fins 22. The coolant flows along the gap between the surfaces of the adjacent two fins 22, and the coolant sufficiently contacts the surface of each fin 22, carries away the heat of the surface of each fin 22, and is finally discharged from the discharge port 331.
The arrangement of the inlet 321, the outlet 331 and the fins 22 efficiently realizes heat exchange between the coolant and the fins 22; the plurality of inlet ports and the plurality of outlet ports increase the flow rate, improve the heat exchange efficiency between the coolant and the heat sink 22, and further lower the temperature of the IGBT module 1.
For further optimization of the design, the inlet 321 faces the gap between two adjacent rows of fins 22, and the outlet 331 is disposed corresponding to the inlet 321.
As shown in FIG. 3, an inlet 321 faces the gap between the first heat dissipation bank 201 and the second heat dissipation bank 202, and an outlet 331 is disposed corresponding to the inlet 321. The other introduction ports 321 respectively face the gap between the second heat dissipation row 202 and the third heat dissipation row 203, the gap between the third heat dissipation row 203 and the fourth heat dissipation row 204, and the gap between the fourth heat dissipation row 204 and the fifth heat dissipation row 205, and one discharge port 331 is provided corresponding to each introduction port 321.
The arrangement mode enables the cooling liquid to flow laminar and quickly pass through the gap between two adjacent radiating rows, and the heat exchange efficiency of the cooling liquid and the radiating fins 22 is improved.
In one embodiment of the present invention, the first side 32 and the second side 33 are parallel to the surface of the heat sink 22.
Referring to fig. 4, the first side 32 may be an upper side of the base plate 3, and the second side 33 may be a lower side of the base plate 3. The first side surface 32 is provided with a plurality of introducing ports 321, and the first side surface 32 and the surface of the heat radiating fin 22 are parallel to each other; the second side 33 is provided with a plurality of discharge ports 331, and the second side 33 is parallel to the surface of the heat sink 22.
The coolant is introduced into the concave grooves 31 of the base plate 3 from the plurality of introduction ports 321, and the flow direction of the coolant is perpendicular to the surface of the fins 22. The coolant is blocked by the fins 22, and turbulent flow occurs, changing the direction of the coolant, and flowing to the surfaces of the fins 22 on both sides. The turbulent flow makes the cooling liquid fully contact with the surface of each cooling fin 22, which is beneficial to improving the heat exchange efficiency of the cooling liquid and the finned radiator 2.
The arrangement of the inlet 321, the outlet 331 and the fins 22 efficiently realizes heat exchange between the coolant and the fins 22; the plurality of inlet ports and the plurality of outlet ports increase the flow rate, improve the heat exchange efficiency between the coolant and the heat sink 22, and further lower the temperature of the IGBT module 1.
To further optimize the design, the inlet 321 is provided opposite to the fins 22, and the outlet 331 is provided corresponding to the inlet 321.
As shown in fig. 4, the finned heat sink 2 includes a sixth heat dissipation row 206 and a seventh heat dissipation row 207, and the sixth heat dissipation row 206 and the seventh heat dissipation row 207 are alternately and alternately arranged in sequence, so that a gap between any two adjacent cooling fins 22 of the sixth heat dissipation row 206 faces one cooling fin 22 of the seventh heat dissipation row 207.
The inlet 321 is provided to face the fins 22 of the sixth heat dissipation row 206, the inlet 321 is provided to face the fins 22 of the seventh heat dissipation row 207, and one inlet 321 is provided to correspond to one outlet 331.
The arrangement mode enables the flow direction of the cooling liquid to be vertical to the surface of the radiating fin 22, the cooling liquid generates turbulent flow, the cooling liquid is fully contacted with the surface of the radiating fin 22, and the reduction of the temperature of the IGBT module 1 is facilitated.
In an embodiment of the present invention, a heat dissipation structure further includes a sealing member (not labeled in the figure), which is disposed between the IGBT module 1 and the bottom plate 3.
The sealing element is arranged to be beneficial to improving the sealing performance of the liquid cooling channel formed by the groove 31 of the bottom plate 3 and the IGBT module 1, and the outflow of cooling liquid is avoided.
Referring to fig. 3 and 4, in an embodiment of the present invention, the surface of the bottom plate 3 provided with the groove 31 is further provided with a mounting hole 34 for mounting the IGBT module 1.
The bottom plate 3 is provided with a plurality of mounting holes 34 which are matched with the fixing holes of the IGBT module 1, and the connection between the bottom plate 3 and the IGBT module 1 is realized through the fastening of bolts. The bolt-up's mode, it is simple reliable, it is convenient to dismantle, is favorable to the heat radiation structure maintenance and the maintenance in later stage.
In addition to the bolt fastening method described above, a welding method, an adhesive bonding method, or the like may be used as long as the bottom plate 3 and the IGBT module 1 are connected together.
The above embodiments are merely illustrative of the technical solutions of the present invention and not restrictive, and although the present invention is described in detail with reference to the embodiments, those skilled in the art should understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (10)
1. A heat dissipation structure comprises a bottom plate, wherein a groove is arranged on the surface of the bottom plate and is used for forming a liquid cooling channel after being attached with an IGBT module,
also comprises a finned radiator which is positioned in the groove,
a plurality of introducing ports are formed in the first side face of the bottom plate, and each introducing port is communicated with the groove;
the second side surface of the bottom plate is provided with a plurality of discharge ports, each discharge port is communicated with the groove, and the first side surface and the second side surface are oppositely arranged.
2. The heat dissipating structure of claim 1, wherein the finned heat sink comprises a back plate and a plurality of fins, each fin being attached to the back plate.
3. The heat dissipating structure of claim 2, wherein a plurality of the heat dissipating fins are arranged on the back plate at equal intervals in the longitudinal and lateral directions.
4. The heat dissipating structure of claim 3, wherein the fins in two adjacent rows are staggered such that a gap between two adjacent fins in one row is aligned with one fin in the other row.
5. The heat dissipation structure of claim 2, wherein the first side and the second side are both perpendicular to a surface of the heat sink.
6. The heat dissipating structure of claim 3 or 5, wherein the inlet is opposed to a gap between two adjacent rows of the fins, and one of the inlets is provided corresponding to one of the outlets.
7. The heat dissipation structure of claim 2, wherein the first side and the second side are both parallel to a surface of the heat sink.
8. The heat dissipating structure according to claim 4 or 7, wherein the introduction port is provided opposite to the fins of each row, and one of the introduction ports is provided corresponding to one of the discharge ports.
9. The heat dissipation structure of claim 1, further comprising a seal,
the seal is disposed between the IGBT module and the bottom plate.
10. The heat dissipation structure according to claim 1, wherein the surface of the bottom plate provided with the groove is further provided with a mounting hole for mounting the IGBT module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020453513.9U CN212413637U (en) | 2020-03-31 | 2020-03-31 | Heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020453513.9U CN212413637U (en) | 2020-03-31 | 2020-03-31 | Heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212413637U true CN212413637U (en) | 2021-01-26 |
Family
ID=74378814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020453513.9U Active CN212413637U (en) | 2020-03-31 | 2020-03-31 | Heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212413637U (en) |
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2020
- 2020-03-31 CN CN202020453513.9U patent/CN212413637U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: BYD Semiconductor Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |