CN211702804U

CN211702804U - Micro-channel radiator

Info

Publication number: CN211702804U
Application number: CN202020291167.9U
Authority: CN
Inventors: 苏永权; 黄万鹏; 魏远海; 韦祥益
Original assignee: NANNING BALING Tech Inc
Current assignee: NANNING BALING Tech Inc
Priority date: 2020-03-11
Filing date: 2020-03-11
Publication date: 2020-10-16
Anticipated expiration: 2030-03-11

Abstract

The micro-channel radiator comprises a micro-channel flat tube, a first collecting tube and a second collecting tube, wherein the first collecting tube and the second collecting tube are arranged at two ends of the micro-channel flat tube, the first collecting tube is provided with a water inlet pipe, the second collecting tube is provided with a water outlet pipe, mounting holes for fixing power electronic heating components are formed in two sides of the micro-channel flat tube, the wide surface of the micro-channel flat tube is a heating surface, the heating surface of the power electronic heating components is tightly attached to the heating surface of the micro-channel flat tube, and the micro-channel flat tube, the first collecting tube and the second collecting tube are connected into a whole through brazing. The micro-channel radiator has the advantages of simple structure, light weight and low cost, and is suitable for radiators of power electronic components.

Description

Micro-channel radiator

Technical Field

The utility model relates to a power electronics radiator technical field specifically is a microchannel radiator.

Background

The power electronic components are developed towards high integration, high density and high power, so that the heat productivity and heat flux density of the power electronic heating components are increased sharply, and the thermal design problem is increasingly prominent. At present, the traditional air cooling heat dissipation mode can not meet the heat dissipation requirement, so a liquid cooling heat dissipation mode with stronger heat dissipation capacity of various structures is present, wherein the cold plate heat dissipation is most commonly used, and the micro-channel heat dissipation application is more and more extensive. However, the cold plate or the micro-channel has the disadvantages of large material consumption, heavy volume, high cost and the like. Chinese patent 201920397139.2 discloses a flat plate type water-cooling plate with a splicable flow channel, which has a structure with a thinner thickness, but has less flow channels, small heat dissipation area and limited heat exchange capacity; another chinese patent 201920473217.2 discloses a water-cooled plate/laser and a laser system, which has a long flow channel, a high pressure drop, a small heat dissipation area, a large power consumption and a limited heat dissipation performance; chinese patent 201710928481.6 discloses a microchannel heat sink with a horizontal and vertical turbulence structure, which has large size of built-in fins, limited heat dissipation area, large thickness of material and high cost.

Disclosure of Invention

To the defect of prior art, the utility model aims to provide a microchannel radiator of simple structure, light, with low costs of quality.

In order to achieve the above purpose, the utility model adopts the technical scheme that: the utility model provides a microchannel radiator, component element includes microchannel flat pipe, first pressure manifold and second pressure manifold, the structure and the relation of connection of component element are: the micro-channel flat tube is characterized in that the first collecting pipe and the second collecting pipe are arranged at two ends of the micro-channel flat tube, the first collecting pipe is provided with a water inlet pipe, the second collecting pipe is provided with a water outlet pipe, mounting holes for fixing power electronic heating components are formed in two sides of the micro-channel flat tube, the wide surface of the micro-channel flat tube is a heating surface, the heating surface of the power electronic heating components is tightly attached to the heating surface of the micro-channel flat tube, and the micro-channel flat tube, the first collecting pipe and the second collecting pipe are connected into a whole.

The microchannel heat sink is I-shaped flow or U-shaped flow.

The micro-channel flat tube is of an extrusion type structure or a brazing type structure.

When the micro-channel flat tube is of a brazing type structure, the inner fins are in a straight-through type, a staggered tooth type or a triangular wave type.

The width of the section of a single flow channel of the micro-channel flat tube is 0.1-2.0mm, and the height perpendicular to the heated surface is 2.0-10 mm.

The wall thickness of the micro-channel flat tube is 0.3-0.5 mm.

The radiator is made of copper and aluminum alloy.

The utility model has the advantages that:

1. because the microchannel flat tube adopts an extrusion structure form or a brazing structure form, the radiator can be made thinner, thereby reducing the material consumption and the material cost, and the weight is only 1/4-1/2 of the existing microchannel radiator.

2. Because the wall thickness of the microchannel radiator is thin, the material thermal resistance is small, and the heat transfer efficiency is higher.

3. The microchannel is in a porous tube structure, so that the heat dissipation area is large, the heat dissipation efficiency is high, and particularly, when the inner fins of the brazing type microchannel radiator are in staggered tooth and triangular wave forms, the heat dissipation effect is better due to the turbulent flow effect.

Drawings

Fig. 1 is a schematic view of a microchannel heat sink assembly according to the present invention.

Fig. 2 is a cross-sectional view of a microchannel heat sink according to the present invention.

Fig. 3 is a schematic view of a type I flow of the microchannel heat sink of the present invention.

Fig. 4 is a schematic U-flow diagram of a microchannel heat sink according to the present invention.

Fig. 5 is a schematic view of a microchannel heat sink with two heating surfaces.

Fig. 6 is a schematic view of the dual heating surfaces of the microchannel heat sink of the present invention.

Fig. 7 is a schematic view of the zigzag inner fin of the microchannel flat tube.

Labeled as: the micro-channel heat exchanger comprises a first collecting pipe 1, micro-channel flat pipes 2, a second collecting pipe 3, a heating element 4, an upper heating element 4-X, a lower heating element 4-Y, a mounting hole 5, a water inlet pipe 6, a water outlet pipe 7, a flow channel 8, a partition plate 9, a sawtooth-shaped inner fin 10, a first micro-channel flat pipe 2-1 and a second micro-channel flat pipe 2-2.

Detailed Description

The technical constitution of the present invention will be described in further detail below with reference to the drawings and examples.

Example 1

As shown in fig. 1 and 2, the present invention provides an example of a micro-channel heat sink. Including first pressure manifold 1, microchannel flat pipe 2, second pressure manifold 3, heating element 4, mounting hole 5, inlet tube 6 and outlet pipe 7. The concrete structure and the connection relation are as follows: first pressure manifold 1 and second pressure manifold 3 establish at the both ends of microchannel flat pipe 2, and microchannel flat pipe 2, first pressure manifold 1 and second pressure manifold 3 connect into a whole through brazing. The first collecting pipe 1 is provided with a cooling liquid inlet pipe 6, the second collecting pipe 3 is provided with a cooling liquid outlet pipe 7, a flow channel 8 for the cooling liquid to flow is arranged in the micro-channel flat pipe 2, and threaded mounting holes 5 are formed in the two side edges of the micro-channel flat pipe 2 and used for fixing the heating component 4.

Example 2

FIG. 3 is an example of a microchannel heat sink type I flow. The water heater specifically comprises a first collecting pipe 1, a water inlet pipe 6, a flow channel 8, a second collecting pipe 3 and a water outlet pipe 7. The cooling liquid flows into the first collecting pipe 1 from the water inlet pipe 6 and is divided, enters the flow passage 8 for heat exchange, and is collected to the water outlet pipe 7 from the second collecting pipe 3.

Example 3

FIG. 4 is an example of a U-flow for a microchannel heat sink. Different from the I-type flow of fig. 3, a partition plate 9 is arranged in the middle of the first collecting pipe 1, the partition plate divides the inner cavity of the first collecting pipe into two parts, one part is provided with a water inlet pipe 6, the other part is provided with a water outlet pipe 7, and the second collecting pipe 3 is not provided with a water outlet pipe. The flow pattern of the U-shaped flow is as follows: the coolant liquid gets into half microchannel flat pipe 8 from inlet tube 6, then flows to second pressure manifold 3, flows into half microchannel flat pipe 8 again, flows out from outlet pipe 7 at last. Compared with I-type flow, the flow pattern structure has higher flow velocity, better heat exchange effect and higher pressure drop.

Example 4

FIG. 5 is an example of a microchannel heat sink with two heated surfaces. The upper heating element 4-X is attached to the upper heating surface of the micro-channel flat tube 2, and the lower heating element 4-Y is attached to the lower heating surface of the micro-channel flat tube 2. When the number of heating components is large but the heating density is not high, the structure can save the installation space and has compact structure.

Example 5

Fig. 6 is an example of a microchannel heat sink with two heat emitting sides. The microchannel radiator with the structure is provided with two or a plurality of microchannel flat tubes (2-1, 2-2) which are connected in parallel, shares a first collecting pipe 1 and a second collecting pipe 3, and shares a water inlet pipe 6 and a water outlet pipe 7. And the heating element is clamped between the micro-channel flat tubes connected in parallel. Because the micro-channel flat tubes are large in quantity and strong in heat dissipation capability, the micro-channel flat tube is very suitable for heating elements with two planar surfaces, such as an IGBT inverter, a square battery pack of an electric automobile and the like.

Example 6

FIG. 7 is an example of a microchannel heat sink with microchannel flat tube zigzag inner fins. In order to strengthen the heat transfer coefficient of the microchannel radiator, the flow channel 8 of the straight-through structure can be changed into a zigzag structure or a triangular wave structure, and compared with the straight-through structure, the heat exchange effect is better because the boundary layer is damaged and the turbulent flow strength is increased, and the heat exchange structure is suitable for components with higher heating density.

The working principle and the process are as follows:

the power electronic heating element is arranged on the micro-channel radiator, and the heating surface of the power electronic heating element is attached to the heating surface of the micro-channel. The power electronic heating element conducts heat to the microchannel radiator, cooling medium enters the microchannel flat tube from the inlet tube of the first collecting pipe, receives the heat conducted from the power electronic heating element and brings the heat out of the second collecting pipe, and a heat exchange process is formed.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; those of ordinary skill in the art will understand that: modifications and equivalents of the foregoing embodiments may be made, but the invention is not to be construed as limited thereto.

Claims

1. The utility model provides a microchannel radiator, component element includes microchannel flat pipe, first pressure manifold and second pressure manifold, its characterized in that, component element's structure and relation of connection are: the micro-channel flat tube is characterized in that the first collecting pipe and the second collecting pipe are arranged at two ends of the micro-channel flat tube, the first collecting pipe is provided with a water inlet pipe, the second collecting pipe is provided with a water outlet pipe, mounting holes for fixing power electronic heating components are formed in two sides of the micro-channel flat tube, the wide surface of the micro-channel flat tube is a heating surface, the heating surface of the power electronic heating components is tightly attached to the heating surface of the micro-channel flat tube, and the micro-channel flat tube, the first collecting pipe and the second collecting pipe are connected into a whole.

2. The microchannel heat sink of claim 1, wherein the microchannel heat sink is I-flow or U-flow.

3. The microchannel heat sink of claim 1, wherein the microchannel flat tubes are extruded or brazed.

4. The microchannel heat sink of claim 1, wherein the inner fins are in the form of straight-through, staggered teeth, or triangular waves when the microchannel flat tubes are in a brazed configuration.

5. The microchannel heat sink of claim 1, wherein the width of the cross section of each flow channel of the microchannel flat tube is 0.1-2.0mm, and the height perpendicular to the heating surface is 2.0-10 mm.

6. The microchannel heat sink of claim 1, wherein the microchannel flat tube has a wall thickness of 0.3 to 0.5 mm.