CN110926255A - Double-layer heat dissipation building material structure - Google Patents
Double-layer heat dissipation building material structure Download PDFInfo
- Publication number
- CN110926255A CN110926255A CN201911353797.2A CN201911353797A CN110926255A CN 110926255 A CN110926255 A CN 110926255A CN 201911353797 A CN201911353797 A CN 201911353797A CN 110926255 A CN110926255 A CN 110926255A
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- Prior art keywords
- heat dissipation
- building material
- radiating
- material structure
- plates
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
- F28F1/16—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being integral with the element, e.g. formed by extrusion
- F28F1/18—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being integral with the element, e.g. formed by extrusion the element being built-up from finned sections
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Building Environments (AREA)
Abstract
The invention discloses a double-layer heat dissipation building material structure, which comprises two heat dissipation plates which are vertically arranged in parallel, wherein a hollow gap is reserved between the two heat dissipation plates, the left side and the right side of the hollow gap are sealed by connecting plates, the upper side and the lower side of the hollow gap are opened to form air convection channels, cold air entering an air layer exchanges heat with the heat dissipation plates to become hot air, the hot air rises from the hollow gap and is discharged to the external environment from the top, the hollow gap forms negative pressure compared with the external environment, the cold air in the environment enters from an inlet below the hollow gap again to form an air circulation loop, so that the air flows back to form a heat dissipation effect, the heat dissipation space is larger, and; a hollow space is formed between the two heating plates, so that the material consumption of the heat dissipation plate body is reduced, the heat dissipation plate body can be used as a building material, and the construction cost is reduced.
Description
Technical Field
The invention belongs to the field of new energy technology and building materials, and relates to a double-layer heat dissipation building material structure.
Background
The radiating fins are used as household products necessary for warming in winter, and are divided into pure aluminum radiators, die-cast aluminum radiators, aluminum alloy radiators, copper-aluminum composite radiators, steel-rich sheet radiators and copper-aluminum rich sheet radiators according to different materials, the composite radiators mostly pass through the space in an air convection heating chamber, the smaller the thermal resistance of the wall surfaces of the radiators is, the larger the heat transfer coefficient is, the better the heat transfer coefficient is; the simpler the heat sink structure, the more convenient mass production and assembly. Most of the existing radiator structures are of integral aluminum alloy or aluminum structures, the radiating fins are heavy in structure and large in material consumption, heat is radiated outwards mainly through two sides of the radiating fins, the air convection speed is low, and the radiating effect is attenuated quickly.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a double-layer heat dissipation building material structure with large heat dissipation capacity and simple structure, which provides air convection speed, improves the heat dissipation capacity of a heat radiator and improves the energy efficiency ratio of a system.
In order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides a double-deck heat dissipation building materials structure, includes two vertical parallel arrangement's heating panel, and two heating panels all are connected with heat transmission pipeline, and two heating panels link to each other through the connecting plate of both sides, and the interval certain distance sets up, reserve in the middle of two heating panels and have the cavity clearance, and the cavity clearance left and right sides is sealed by the connecting plate, and open formation air convection channel in both sides about the cavity clearance.
Furthermore, radiating fins for radiating are arranged on the outer side surfaces of the two radiating plates.
Further, the heat dissipation fins are arranged at a certain interval from the discrete hot plate.
Further, the radiating fins are of a strip-shaped structure, and the plurality of radiating fins are uniformly arranged on the radiating plate at intervals.
Furthermore, the heat dissipation plate, the heat dissipation fins and the connecting plate are all made of aluminum materials.
Further, the thickness of the hollow gap is not less than the thickness of the radiating plate.
The invention has the following beneficial effects:
adopt the middle structure that sets up the interval clearance of parallel arrangement heating panel, the space of reserving in the middle of two hot plates becomes the air bed of air reflux, the cold air that gets into the air bed becomes hot-air with the heating panel heat transfer, hot-air rises from the middle space clearance and discharges to the external environment in the top, the external environment forms the negative pressure is compared to the cavity clearance, cold air in the environment gets into from the import below the middle space clearance once more, form air circulation return circuit, make the air reflux form the radiating effect, the radiating space is bigger, the radiating effect of radiator is improved.
A hollow space is formed between the two heating plates, so that the material consumption of the heat dissipation plate body is reduced, the heat dissipation plate body can be used as a building material, and the construction cost is reduced.
Radiating fins for radiating are arranged on the outer side faces of the two radiating plates, and the heat exchange efficiency is further improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a sectional view taken along line A-A of FIG. 1;
FIG. 3 is a sectional view taken along line B-B of FIG. 1;
in the figure: 1-water inlet pipe, 2-heat dissipation plate, 3-heat dissipation fin, 4-connecting plate and 5-hollow gap.
Detailed Description
The present invention will be described in further detail with reference to the following examples, which are not intended to limit the invention thereto.
As shown in fig. 1-3, the double-layer heat dissipation building material structure of the invention comprises two heat dissipation plates 2 arranged in parallel in a vertical direction, wherein the two heat dissipation plates are both connected with a heat transmission pipeline 1, the heat transmission pipeline 1 is connected with a circulation heat pipeline of the heat dissipation plates 2, the circulation heat pipelines are uniformly distributed in the heat dissipation plates 2 to dissipate heat of the heat dissipation plates 2, the two heat dissipation plates 2 are connected through connecting plates 4 at two sides and are arranged at a certain distance, a hollow gap 5 is reserved between the two heat dissipation plates 2, the left side and the right side of the hollow gap are sealed by the connecting plates 4, the connecting plates 4 and the heat dissipation plates at two sides are welded into a whole, the upper side and the lower side of the hollow gap are opened to form an air convection channel, so that cold air enters from.
As shown in fig. 2 and 3, the outer side surfaces of the two heat dissipation plates 2 are provided with heat dissipation fins 3 for heat dissipation, the heat dissipation fins 3 are arranged at a certain interval from the heat dissipation plates 2, so that cold air can enter between the fins and the heat dissipation plates 2, the heat exchange area is increased, and the heat exchange efficiency is further improved.
Radiating fin 3 is rectangular form structure, and the interval certain distance evenly arranges on heating panel 2 between a plurality of radiating fin 3, adopts regular radiating fin, convenient processing, and overall layout is simple.
In order to improve the heat dissipation efficiency, the heat dissipation plate 2, the heat dissipation fins 3 and the connecting plate 4 are all made of aluminum materials, and the thickness of the hollow gap 5 is not less than that of the heat dissipation plate 2, so that air can flow back from the hollow gap to the maximum extent, and the heat transfer effect is ensured.
Through the design of the heat collecting plate working medium flow channel in a partition mode, under the working condition that the pressure drop of the heat collecting plate is kept unchanged or even reduced, the heat absorption capacity of the heat collecting plate is improved, the power consumption of a compressor is reduced, and therefore the energy efficiency ratio is improved.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting the same, and although the present invention is described in detail with reference to the above embodiments, those of ordinary skill in the art should understand that: modifications and equivalents may be made to the embodiments of the invention without departing from the spirit and scope of the invention, which is to be covered by the claims.
Claims (6)
1. The utility model provides a double-deck heat dissipation building materials structure which characterized in that: including two vertical parallel arrangement's heating panel (2), two heating panels all are connected with heat transmission pipeline (1), and two heating panels (2) link to each other through connecting plate (4) of both sides, and the certain distance setting of interval, reserve in the middle of two heating panels (2) and have cavity clearance (5), and the cavity clearance left and right sides is sealed by connecting plate (4), and open formation air convection passageway in both sides about the cavity clearance.
2. The dual-layer heat dissipating building material structure of claim 1, wherein: radiating fins (3) for radiating are arranged on the outer side surfaces of the two radiating plates (2).
3. The dual-layer heat dissipating building material structure of claim 2, wherein: the radiating fins (3) are arranged at a certain interval from the radiating plate (2).
4. The dual-layer heat dissipating building material structure of claim 3, wherein: the radiating fins (3) are of a strip-shaped structure, and the radiating fins (3) are uniformly arranged on the radiating plate (2) at intervals.
5. The dual layer heat dissipating building material structure of any of claims 1-4, wherein: the heat dissipation plate (2), the heat dissipation fins (3) and the connecting plate (4) are all made of aluminum materials.
6. The dual layer heat dissipating building material structure of any of claims 1-4, wherein: the thickness of the hollow gap (5) is not less than that of the heat dissipation plate (2).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201911353797.2A CN110926255A (en) | 2019-12-25 | 2019-12-25 | Double-layer heat dissipation building material structure |
Applications Claiming Priority (1)
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CN201911353797.2A CN110926255A (en) | 2019-12-25 | 2019-12-25 | Double-layer heat dissipation building material structure |
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CN110926255A true CN110926255A (en) | 2020-03-27 |
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CN201911353797.2A Pending CN110926255A (en) | 2019-12-25 | 2019-12-25 | Double-layer heat dissipation building material structure |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111681982A (en) * | 2020-06-18 | 2020-09-18 | 芯米(厦门)半导体设备有限公司 | Wafer transfer device and photoresist coating and developing equipment with same |
CN111834270A (en) * | 2020-07-28 | 2020-10-27 | 芯米(厦门)半导体设备有限公司 | Wafer transmission device |
-
2019
- 2019-12-25 CN CN201911353797.2A patent/CN110926255A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111681982A (en) * | 2020-06-18 | 2020-09-18 | 芯米(厦门)半导体设备有限公司 | Wafer transfer device and photoresist coating and developing equipment with same |
CN111834270A (en) * | 2020-07-28 | 2020-10-27 | 芯米(厦门)半导体设备有限公司 | Wafer transmission device |
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